JPH0650577B2 - Disk laminating device - Google Patents
Disk laminating deviceInfo
- Publication number
- JPH0650577B2 JPH0650577B2 JP60150704A JP15070485A JPH0650577B2 JP H0650577 B2 JPH0650577 B2 JP H0650577B2 JP 60150704 A JP60150704 A JP 60150704A JP 15070485 A JP15070485 A JP 15070485A JP H0650577 B2 JPH0650577 B2 JP H0650577B2
- Authority
- JP
- Japan
- Prior art keywords
- disk
- adhesive
- disc
- vacuum
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
- B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
Description
【発明の詳細な説明】 産業上の利用分野 本発明はオーディオレコード，ビデオディスク，情報フ
ァイル等のディスク状情報記録担体を貼合わせて製造す
るディスク貼合せ装置に関する。TECHNICAL FIELD The present invention relates to a disc laminating apparatus for laminating and manufacturing disc-shaped information recording carriers such as audio records, video discs, and information files.
従来の技術 近年、オーディオレコード，ビデオディスク，情報ファ
イル等のディスクに貼合せ構造が広く利用されている。2. Description of the Related Art In recent years, a laminating structure has been widely used for discs such as audio records, video discs, and information files.
以下、図面第２図を参照しながら、上述した従来のディ
スクの貼合せ装置の一例について説明する。Hereinafter, an example of the above-mentioned conventional disc bonding apparatus will be described with reference to FIG.
第２図において、１は貼合わされる２枚のディスクで、
中央にセンタ孔を有する。２は例えば紫外線硬化型の接
着剤である。３はディスク１を真空吸着し平面性を保つ
保持台である。４はセンタピンで保持台３の中心に設置
されている。５はばね、６はセンタボスで、センタピン
４と嵌合しばね５にてディスク１のセンタ孔のエッジを
押圧して位置決めする。７は押圧板７でディスク１を押
圧して接着剤２を圧延する。In FIG. 2, 1 is two discs to be bonded,
It has a center hole in the center. 2 is, for example, an ultraviolet curable adhesive. Reference numeral 3 is a holding table that holds the disk 1 in a vacuum to maintain its flatness. A center pin 4 is installed at the center of the holding table 3. Reference numeral 5 is a spring, and 6 is a center boss, which is fitted with the center pin 4 to press the edge of the center hole of the disc 1 for positioning. A pressing plate 7 presses the disk 1 to roll the adhesive 2.
上記従来例の貼合せ装置では、まず１枚のディスク１を
保持台３にセンタボス６をガイドにして真空吸着する。
次に、ディスク１上に接着剤２を塗布した後、もう一枚
のディスクを重合せる。最後に、押圧板７にてディスク
１を押圧し接着剤２を貼合せ、面合体に圧延した後、接
着剤２を硬化させてディスクを一体化する。In the pasting device of the above-mentioned conventional example, first, one disk 1 is vacuum-sucked on the holding table 3 with the center boss 6 as a guide.
Next, after the adhesive 2 is applied on the disk 1, another disk is polymerized. Finally, the disc 1 is pressed by the pressing plate 7 to bond the adhesive 2 to each other and rolled into a face-to-face combination, and then the adhesive 2 is cured to integrate the disc.
発明が解決しようとする問題点 しかしながら、上記のような構成では、押圧板７にてデ
ィスク１を押圧して接着剤２を圧延する際にディスク１
の端面から接着剤２がはみ出してしまい、ディスク１の
表面に回り込んで汚してしまうことがあるため歩留りが
良くないという欠点を有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the above-described configuration, the disc 1 is pressed when the disc 1 is pressed by the pressing plate 7 to roll the adhesive 2.
There is a drawback that the yield is not good because the adhesive 2 may squeeze out from the end surface of the disk 1 and may get around the surface of the disk 1 and become dirty.
本発明は、貼合せ面から接着剤がはみ出してもディスク
の表面へ回り込むことがなく、ディスクを歩留り良く製
造することのできるディスク貼合せ装置を提供すること
を目的とする。It is an object of the present invention to provide a disc laminating apparatus that can manufacture discs with high yield without wrapping around to the surface of the disc even if the adhesive sticks out from the laminating surface.
問題点を解決するための手段 本発明の、ディスク貼合せ装置においては、ディスクの
貼合せ面の内周部と外周部とにそれぞれ相対向させては
み出した接着剤を真空吸引する吸取機構を設けたことを
特徴とするものである。Means for Solving the Problems In the disc laminating apparatus of the present invention, a suction mechanism for vacuum-sucking the protruding adhesive is provided on the inner peripheral portion and the outer peripheral portion of the disc bonding surface so as to face each other. It is characterized by that.
作用 このような構成によれば、ディスクの貼合せ面からはみ
出した接着剤を吸取機構で真空吸引して除去してしまう
ため、接着剤がディスクの表面に誤って回り込むおそれ
をなくすることができ、良好な貼合せを行うことができ
る。また、これにより、周囲の温度が変化したりディス
クに厚さムラがあっても塗布すべき接着剤の量を変える
必要がある場合でも、塗布量の調整が不要で、不要な接
着剤は全て吸取除去でき、高品質のディスクを容易に歩
留りよく製造できるものである。With such a configuration, the adhesive protruding from the bonding surface of the disc is removed by vacuum suction by the suction mechanism, so that there is no risk of the adhesive accidentally wrapping around the surface of the disc. Good bonding can be performed. In addition, even if the ambient temperature changes or the disk has uneven thickness, the amount of adhesive that needs to be applied does not need to be adjusted. It can be sucked and removed, and high quality discs can be easily manufactured with high yield.
実施例 以下、本発明の一実施例について第１図を参照しながら
説明する。第１図中、第２図の各部と同様の作用をなす
ものには同一符号を付している。８は内周吸取機構で、
センタボス６の中心軸に対して垂直に、センタボス６の
側面でディスク貼合せ面の高さに円周上にスリットを設
け、真空ポンプに接続して、ディスク貼合せ面からはみ
合した接着剤２をこのスリットを介して内周吸取機構８
で真空吸取する。９は外周吸取機構で、ディスク１の外
周端面から１００〜２００μｍの間隔で対向させてディ
スク貼合せ面の高さに円周状にスリットを設置し真空ポ
ンプに接続して、ディスク貼合せ面からはみ出した接着
剤２をこのスリットを介して外周吸取機構９で真空吸取
して除去する。Embodiment An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same reference numerals are given to the same parts as those in FIG. 8 is an inner peripheral suction mechanism,
An adhesive which is perpendicular to the central axis of the center boss 6 and has a slit formed on the circumference of the side of the center boss 6 at the height of the disc bonding surface and which is connected to a vacuum pump and fitted from the disc bonding surface. 2 through this slit, the inner peripheral suction mechanism 8
Vacuum suck with. Reference numeral 9 denotes an outer peripheral sucking mechanism, which is arranged facing the outer peripheral end surface of the disc 1 at a distance of 100 to 200 μm and has circular slits provided at the height of the disc bonding surface and is connected to a vacuum pump so that the disk bonding surface The protruding adhesive 2 is vacuumed and removed by the outer peripheral suction mechanism 9 through the slit.
かかる本ディスク貼合せ装置によりディスク１を貼合わ
せて製造するときには、まず、第１図に示すように、１
枚のディスク１を保持台３にセンタボス６をガイドにし
て位置決めして載置し、真空吸着する。次に、ディスク
１上に接着剤２を塗布した後、もう一枚のディスク１を
重ね合せる。When manufacturing by laminating the discs 1 with the present disc laminating apparatus, first, as shown in FIG.
The disk 1 is positioned and mounted on the holding table 3 with the center boss 6 as a guide, and is vacuum-sucked. Next, after applying the adhesive 2 on the disk 1, another disk 1 is overlaid.
次に、内周吸取機構８と外周吸取機構９による真空吸引
を開始した後、押圧板７でディスクを上下から押圧して
接着剤２を貼合せ面の全面に圧延する。このとき、ディ
スク１の貼合せ面の内外周の端面からはみ出した接着剤
２は内周吸取機構８と外周吸取機構９とによって吸取っ
て除去する。それぞれの真空度は−６００〜−６５０mH
g程度、スリットの巾は0.5mm程度で良好な実験結果が得
られた。また、内周吸取機構８および外周吸取機構９
は、それぞれディスク１の内外の周端面から隙間Ｓを介
して設置されている。Ｓの値は、実験では５０〜２００
μｍで良好な結果が得られている。これは、もし接触し
てしまうと、ディスク１の内部の必要な接着剤２まで吸
取ってしまうおそれがあるからである。Next, after vacuum suction by the inner peripheral suction mechanism 8 and the outer peripheral suction mechanism 9 is started, the pressing plate 7 presses the disc from above and below to roll the adhesive 2 on the entire bonding surface. At this time, the adhesive 2 protruding from the inner and outer peripheral end surfaces of the bonding surface of the disk 1 is sucked and removed by the inner peripheral suction mechanism 8 and the outer peripheral suction mechanism 9. Each vacuum degree is -600 to -650 mH
Good experimental results were obtained with a width of about g and a slit width of about 0.5 mm. In addition, the inner peripheral suction mechanism 8 and the outer peripheral suction mechanism 9
Are installed from the inner and outer peripheral end surfaces of the disc 1 with a gap S therebetween. The value of S is 50 to 200 in the experiment.
Good results have been obtained at μm. This is because if they come into contact with each other, the necessary adhesive 2 inside the disk 1 may be sucked up.
最後に、押圧板７による押圧を終了した後に真空吸引を
解除し、接着剤２を硬化させて２枚のディスクを一体化
する。Finally, after the pressing by the pressing plate 7 is completed, the vacuum suction is released and the adhesive 2 is cured to integrate the two disks.
接着剤２としては、紫外線硬化型、熱硬化型、嫌気性等
の接着剤を用いることができる。As the adhesive 2, an ultraviolet curable adhesive, a thermosetting adhesive, an anaerobic adhesive or the like can be used.
また、センタボス６の外側面はテーパ状にし、そのテー
パ角度３゜以下に設定することにより、位置決め精度お
よび下方への接着剤の漏れ防止に効果的である。Further, the outer surface of the center boss 6 is tapered and the taper angle is set to 3 ° or less, which is effective for positioning accuracy and prevention of leakage of the adhesive downward.
また、センタボス６をステンレス鋼などの金属で作成
し、表面にフッ化エチレン樹脂コーティングを施してお
けば、後工程での接着剤の清掃が容易となる。If the center boss 6 is made of metal such as stainless steel and the surface thereof is coated with a fluorinated ethylene resin, the adhesive can be easily cleaned in a later step.
発明の効果 以上のように、本発明のディスク貼合せ装置は、センタ
ボスの側面にディスク貼合せ面の高さに相対向させて円
周状にスリットを設けて内周吸取機構を設け、ディスク
の外周のディスク貼合せ面に沿って相対向させてスリッ
トを設けて外周吸取機構を設けるように構成したので、
ディスク貼合せ面の内周および外周の端面からはみ出た
接着剤を効率良く直ちに真空吸取して除去することがで
き、接着剤がたれ落ちたりディスク表面に回り込むおそ
れをなくすることができる。さらに、これにより、接着
剤の塗布を微妙な調整をすることなく行うことができ、
高品質のディスクを歩留り良く容易にかつ効率的に製造
することができるものである。EFFECTS OF THE INVENTION As described above, the disc laminating apparatus of the present invention is provided with the inner peripheral suctioning mechanism by providing the circumferential slits on the side surfaces of the center boss so as to face each other at the height of the disc laminating surface. Since the slits are provided so as to face each other along the disc bonding surface of the outer periphery and the outer peripheral suction mechanism is provided,
The adhesive protruding from the inner and outer end surfaces of the disk bonding surface can be efficiently and immediately vacuum-absorbed and removed, and the risk of the adhesive dripping off or wrapping around the disk surface can be eliminated. In addition, this allows the application of the adhesive to be done without any subtle adjustments,
It is possible to easily and efficiently manufacture a high quality disk with a high yield.
第１図は本発明のディスク貼合せ装置の一実施例を示す
断面図、第２図は従来例のディスク貼合せ装置の断面図
である。 １……ディスク、２……接着剤、３……保持台、４……
センタピン、５……ばね、６……センタボス、７……押
圧板、８……内周吸取機構、９……外周吸取機構。FIG. 1 is a cross-sectional view showing an embodiment of a disk bonding apparatus of the present invention, and FIG. 2 is a cross-sectional view of a conventional disk bonding apparatus. 1 ... Disk, 2 ... Adhesive, 3 ... Holding stand, 4 ...
Center pin, 5 ... Spring, 6 ... Center boss, 7 ... Press plate, 8 ... Inner circumference suction mechanism, 9 ... Outer circumference suction mechanism.
Claims (3)
吸着して平担に保持する保持台と、前記保持台の中央に
位置して前記ディスクのセンタ穴のエッジを位置決めす
るセンタボスと、前記センタボスの側面でディスク貼合
せ面の高さに円周状に形成されたスリットから前記接着
剤を真空吸引する内周吸取機構と、前記ディスクの外周
と対向する位置でディスク貼合せ面に沿って形成された
スリットから前記接着剤を真空吸引する外周吸取機構
と、前記ディスクを上下面から押圧する押圧機構とを備
えたことを特徴とするディスク貼合せ装置。1. A holding base for vacuum-sucking and holding flatly a disk to be bonded with an adhesive, a center boss for positioning the edge of a center hole of the disk at the center of the holding base, An inner peripheral suction mechanism that vacuum-sucks the adhesive from a slit formed in a circular shape on the side surface of the center boss at the height of the disc bonding surface, and along the disc bonding surface at a position facing the outer periphery of the disk. A disc laminating apparatus comprising: a peripheral suction mechanism that vacuum-sucks the adhesive from the formed slits; and a pressing mechanism that presses the disc from above and below.
度を３゜以下に設定した特許請求の範囲第１項記載のデ
ィスク貼合せ装置。2. The disk laminating apparatus according to claim 1, wherein the center boss is tapered and the taper angle is set to 3 ° or less.
エチレン樹脂コーティングを施した特許請求の範囲第１
項または第２項記載のディスク貼合せ装置。3. A fluorinated ethylene resin coating is applied to the surface of the center boss made of metal.
Item 2. The disk laminating apparatus according to Item 2 or Item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60150704A JPH0650577B2 (en) | 1985-07-09 | 1985-07-09 | Disk laminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60150704A JPH0650577B2 (en) | 1985-07-09 | 1985-07-09 | Disk laminating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6212940A JPS6212940A (en) | 1987-01-21 |
| JPH0650577B2 true JPH0650577B2 (en) | 1994-06-29 |
Family
ID=15502590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60150704A Expired - Lifetime JPH0650577B2 (en) | 1985-07-09 | 1985-07-09 | Disk laminating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650577B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4907956A (en) * | 1988-04-27 | 1990-03-13 | Dainippon Ink And Chemicals, Inc. | Apparatus for manufacturing optical information recording medium |
| DE69634030T2 (en) * | 1995-10-13 | 2005-05-19 | Kitano Engineering Co., Ltd., Komatsushima | Rotating holding table, with pen, for holding on and turning an information disc |
| TW330288B (en) | 1996-04-19 | 1998-04-21 | Matsushita Denki Sanguo Kk | Bonding method and apparatus for optical disk |
| DE69731707T2 (en) * | 1996-07-31 | 2006-03-02 | Kitano Engineering Co., Ltd., Komatsushima | Method for correcting the unequal position of an information disc |
| WO1999024239A1 (en) * | 1997-11-12 | 1999-05-20 | First Light Technology, Inc. | System and method for distributing a resin disposed between a top substrate and a bottom substrate |
| US6214412B1 (en) | 1998-05-19 | 2001-04-10 | First Light Technologies, Inc. | System and method for distributing a resin disposed between a top substrate and a bottom substrate |
| JP3559535B2 (en) * | 2001-05-16 | 2004-09-02 | 北野エンジニアリング株式会社 | Optical disk adhesive curing device |
-
1985
- 1985-07-09 JP JP60150704A patent/JPH0650577B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6212940A (en) | 1987-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |