JPH0648868Y2 - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPH0648868Y2
JPH0648868Y2 JP1989071921U JP7192189U JPH0648868Y2 JP H0648868 Y2 JPH0648868 Y2 JP H0648868Y2 JP 1989071921 U JP1989071921 U JP 1989071921U JP 7192189 U JP7192189 U JP 7192189U JP H0648868 Y2 JPH0648868 Y2 JP H0648868Y2
Authority
JP
Japan
Prior art keywords
cooling
semiconductor chips
refrigerant
cooling structure
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989071921U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310548U (enrdf_load_stackoverflow
Inventor
貴志男 横内
光隆 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989071921U priority Critical patent/JPH0648868Y2/ja
Publication of JPH0310548U publication Critical patent/JPH0310548U/ja
Application granted granted Critical
Publication of JPH0648868Y2 publication Critical patent/JPH0648868Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
JP1989071921U 1989-06-20 1989-06-20 半導体装置の冷却構造 Expired - Lifetime JPH0648868Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPH0310548U JPH0310548U (enrdf_load_stackoverflow) 1991-01-31
JPH0648868Y2 true JPH0648868Y2 (ja) 1994-12-12

Family

ID=31609388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071921U Expired - Lifetime JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPH0648868Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138473A (ja) * 2010-12-27 2012-07-19 Zycube:Kk 半導体デバイス・電子部品の実装構造

Also Published As

Publication number Publication date
JPH0310548U (enrdf_load_stackoverflow) 1991-01-31

Similar Documents

Publication Publication Date Title
US12096595B2 (en) Cold plate and system for cooling electronic devices
EP1519645B1 (en) Liquid cooling module
US7515415B2 (en) Embedded microchannel cooling package for a central processor unit
JP7410146B2 (ja) 構成可能な放熱フィンを有する統合型熱拡散器
EP3089210A1 (en) Cooling module, water-cooled cooling module and cooling system
JP2009527897A (ja) 冷却システム
TWI580344B (zh) 水冷系統
TWI803336B (zh) 散熱裝置
US8230901B2 (en) Electronic device cooling apparatus
Simons The evolution of IBM high performance cooling technology
US6000125A (en) Method of heat dissipation from two surfaces of a microprocessor
CN111863740A (zh) 用于浸没式液冷系统的自诱导射流无源沸腾散热强化方法及装置
JPH05335454A (ja) 電子機器の冷却装置
JP2833999B2 (ja) Ｌｓｉの冷却モジュール
JPH0648868Y2 (ja) 半導体装置の冷却構造
TWI837610B (zh) 電子元件之熱面拉出裝置
CN116321931A (zh) 冷却板、浸泡箱及服务器系统
JP2514281B2 (ja) 回路基板冷却装置
JPH0534113Y2 (enrdf_load_stackoverflow)
CN1980560A (zh) 水冷式散热结构及其制作方法
JPH0617313Y2 (ja) 液冷形半導体パッケージ
JPH0263147A (ja) 冷却装置
JPH03273669A (ja) 冷却機構付き半導体装置
JP2746938B2 (ja) 電源回路基板用冷却装置
JPH06310626A (ja) 半導体チップ及び半導体集積回路装置