JPH0648511Y2 - Split mask for laser marking - Google Patents
Split mask for laser markingInfo
- Publication number
- JPH0648511Y2 JPH0648511Y2 JP1986035208U JP3520886U JPH0648511Y2 JP H0648511 Y2 JPH0648511 Y2 JP H0648511Y2 JP 1986035208 U JP1986035208 U JP 1986035208U JP 3520886 U JP3520886 U JP 3520886U JP H0648511 Y2 JPH0648511 Y2 JP H0648511Y2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- marking
- window
- characters
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、レーザ捺印機の半導体製品の捺印文字を形成
するマスク部に関し、特に、半導体製品捺印文字を指定
するマスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a mask portion for forming a marking character of a semiconductor product of a laser marking machine, and more particularly to a mask for designating a marking character of a semiconductor product.
従来この種のマスクは、半導体製品捺印の1品名を1枚
のマスクで構成し半導体製品捺印表示が変わる毎に、そ
れに合った品名のマスクと交換し、レーザ捺印を行なっ
ていた。Conventionally, in this type of mask, one product name of the semiconductor product marking is composed of one mask, and whenever the semiconductor product marking display changes, the mask is replaced with a mask having the matching product name and laser marking is performed.
上述した従来のマスクは、半導体製品の1品名が1枚の
マスクで対応されているので、品種の多い製品は、それ
毎にマスクを作らなければならず、費用、納期がかか
り、マスクの管理等もやりにくいという欠点がある。Since the conventional masks described above correspond to one mask for each semiconductor product name, a mask with a large variety of products must be made for each product, which requires cost, delivery time, and mask management. It also has the drawback that it is difficult to do.
本考案の分割マスクは、レーザ光を選択的に通過させる
ことにより半導体製品に一連の捺印文字を形成するレー
ザ捺印用分割マスクであって、上記一連の捺印文字のう
ちの第1の部分及び上記レーザ光を通過させる窓が形成
された第1のマスク、及び上記一連の捺印文字のうちの
第2の部分及び上記レーザ光を通過させる窓が形成され
た第2のマスクを有し、上記第2のマスクに形成された
上記第2の部分が上記第1のマスクの上記窓内に位置
し、上記第1のマスクに形成された上記第1の部分が上
記第2のマスクの上記窓内に位置するように上記第1及
び上記第2のマスクを重ねて用いることを特徴とする。The dividing mask of the present invention is a laser marking dividing mask for forming a series of marking characters on a semiconductor product by selectively passing a laser beam, wherein the first part of the series of marking characters and the above A first mask having a window through which laser light passes, and a second portion of the series of imprinted characters and a second mask at which a window through which laser light passes are formed; The second portion formed on the second mask is located in the window of the first mask, and the first portion formed on the first mask is in the window of the second mask. The first mask and the second mask are used so as to overlap each other.
次に本考案にについて図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第1図は、本考案の一実施例の図である。本実施例で
は、レーザ捺印機に使用される半導体製品捺印文字用マ
スクにおいて、半導体製品捺印文字を品名、企画、ロッ
ト等に分割し、かつその分割した文字に半導体製品捺印
文字に必要なすべての文字を入れ、これらをマスクホル
ダーに組み込み、各位置を合わせることにより、半導体
製品の捺印を行うことを特徴としている。組み合わされ
た後のマスクは、Aであり分割マスクはB,C,D及びEで
構成される。第1のマスクに相当する分割マスクBに
は、一連の捺印文字のうちの一部10である文字「NE μP
C」を有し、また、レーザ光を通過させる四角形の窓20
が形成されている。第2のマスクに相当するマスクC
は、一連の捺印文字のうちの他の部分40を有し、また、
レーザ光を通過させる二つの窓30を有す。同様に、残り
の第2のマスクに相当するマスクD及びEも一連の文字
の一部と窓を有している。分割マスクBの窓20に分割マ
スクCの文字「1」、分割マスクDの文字「2」及び分
割マスクEの文字「A」が位置あわせされる。FIG. 1 is a diagram of an embodiment of the present invention. In this embodiment, in the mask for semiconductor product marking characters used in the laser marking machine, the semiconductor product marking characters are divided into the product name, the plan, the lot, etc. It is characterized in that a semiconductor product is imprinted by inserting characters, incorporating them into a mask holder, and aligning respective positions. The mask after combination is A and the split mask is composed of B, C, D and E. The divided mask B corresponding to the first mask has a character "NE μP" which is a part 10 of a series of marking characters.
A rectangular window 20 having a "C" and also for passing laser light.
Are formed. Mask C corresponding to the second mask
Has another portion 40 of the series of imprinted characters, and
It has two windows 30 for passing laser light. Similarly, masks D and E, which correspond to the remaining second mask, also have a portion of the series of characters and a window. The character "1" of the division mask C, the character "2" of the division mask D and the character "A" of the division mask E are aligned with the window 20 of the division mask B.
次に第2図のようにこれから分割マスクをホルダFに組
み込み、上蓋I,側板H,ベースJ,シャフトGから構成され
た治具にセットして、半導体捺印文字毎に必要な文字を
組み合わせて使用する。Next, as shown in FIG. 2, the divided mask is assembled into the holder F, set on the jig composed of the upper lid I, the side plate H, the base J, and the shaft G, and the necessary characters are combined for each semiconductor marking character. use.
第3図に他の実施例を示す。FIG. 3 shows another embodiment.
以上説明したように本考案は、半導体捺印マスクを分割
し、かつその分割したマスク毎に、半導体捺印文字に必
要な文字をすべて入れることにより、低コスト、省スペ
ース、及び管理し易い等の効果がある。As described above, the present invention divides the semiconductor imprinting mask and puts all the necessary characters in the semiconductor imprinting character for each of the divided masks, so that effects such as low cost, space saving, and easy management are achieved. There is.
第1図は本考案の分割マスク A……組み合わせた後のマスク、B……分割マスク1枚
目、C……分割マスク2枚目、D……分割マスク3枚
目、E……分割マスク4枚目、 第2図は分割マスクをホルダに組み込んだ図 F……ホルダ、G……シャフト、H……側板、I……上
蓋、J……ベース、 第3図は他の実施例の分割マスク。FIG. 1 is a split mask of the present invention A: a combined mask, B: first split mask, C: second split mask, D: third split mask, E: split mask The fourth sheet, FIG. 2 is a diagram in which a split mask is incorporated in a holder F ... Holder, G ... Shaft, H ... Side plate, I ... Top lid, J ... Base, and FIG. 3 is of another embodiment. Split mask.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 土屋 恒彦 東京都港区芝5丁目33番1号 日本電気株 式会社内 (56)参考文献 特開 昭52−81580(JP,A) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Tsunehiko Tsuchiya 5-33-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (56) References JP-A-52-81580 (JP, A)
Claims (1)
半導体製品に一連の捺印文字を形成するレーザ捺印用分
割マスクであって、前記一連の捺印文字のうちの第1の
部分(10)及び前記レーザ光を通過させる窓(20)が形
成された第1のマスク(B)、及び前記一連の捺印文字
のうちの第2の部分(40)及び前記レーザ光を通過させ
る窓(30)が形成された第2のマスク(C)を有し、前
記第2のマスクに形成された前記第2の部分が前記第1
のマスクの前記窓内に位置し、前記第1のマスクに形成
された前記第1の部分が前記第2のマスクの前記窓内に
位置するように前記第1及び前記第2のマスクを重ねて
用いることを特徴とするレーザ捺印用分割マスク。1. A laser marking division mask for forming a series of marking characters on a semiconductor product by selectively passing a laser beam, the first portion (10) and the first portion (10) of the series of marking characters. A first mask (B) having a window (20) for passing the laser beam, a second portion (40) of the series of imprinted characters, and a window (30) for passing the laser beam are provided. A second mask (C) formed, wherein the second portion formed on the second mask is the first mask.
Overlapping the first and second masks such that the first portion formed in the first mask is located in the window of the second mask and the first portion formed in the first mask is located in the window of the second mask. A divided mask for laser marking, which is used as a mask.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986035208U JPH0648511Y2 (en) | 1986-03-10 | 1986-03-10 | Split mask for laser marking |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986035208U JPH0648511Y2 (en) | 1986-03-10 | 1986-03-10 | Split mask for laser marking |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62146136U JPS62146136U (en) | 1987-09-16 |
JPH0648511Y2 true JPH0648511Y2 (en) | 1994-12-12 |
Family
ID=30844486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986035208U Expired - Lifetime JPH0648511Y2 (en) | 1986-03-10 | 1986-03-10 | Split mask for laser marking |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648511Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5447456B2 (en) * | 2011-08-19 | 2014-03-19 | 日立金属株式会社 | Identification information recording method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5281580A (en) * | 1975-12-27 | 1977-07-08 | Tatsuta Densen Kk | Method of discriminative marking on object surface |
-
1986
- 1986-03-10 JP JP1986035208U patent/JPH0648511Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62146136U (en) | 1987-09-16 |
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