JPH0647894A - Method for applying resist ink to thin printed circuit board - Google Patents

Abstract

PURPOSE:To enhance the working efficiency of the whole of a process applying resist ink to both surfaces of a thin printed circuit board to form resist patterns to the thin printed circuit board without cleaning a printing table at each time when the resist ink is applied to the thin printed circuit board from the single surface thereof to the other surface thereof. CONSTITUTION:The roll paper 4 wound around the roll bar 2 on a deep side of the printing table 1 of a plane type screen printing machine is drawn out to be placed on the printing table 1 and a thin printed circuit board 6 is placed on the roll paper 4 and, after the thin printed circuit board 6 coated with the resist ink is removed, the roll bar 3 on this side is rotated to take up the roll paper 4 corresponding to one board having ink bonded thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of applying a resist ink to a printed board having a thin plate thickness in a step of applying a resist ink by screen printing a photographic solder resist onto a printed board.

[0002]

2. Description of the Related Art FIG. 2 is an explanatory view showing a normal process of forming a photographic solder resist pattern. This pattern forming method applies a resist ink to the front surface of the printed circuit board, dries it, then applies a resist ink to the back surface of the printed circuit board, and after drying, exposes the front and back surfaces to the required pattern, and then the front and back surfaces. After removing the unexposed ink portion, the required patterns are developed on the front and back surfaces, and finally dried.

In the resist ink applying step in this pattern forming method, a printed circuit board 6 is placed on a printing table 1 of a flat screen printing machine as shown in FIG. When the printed circuit board 6 having a large thickness is coated with the resist 7, the resist ink 7 does not reach the printing table 1 because the resist ink 7 reaches only halfway through the through hole of the printed circuit board 6. It does not adhere to the other surface, that is, the back surface.

However, in the case of a thin printed circuit board 6 having a thickness of less than 0.5 mm, when the resist ink 7 is applied to one side, for example, the surface of the printed circuit board 6 as shown in FIG. 3B, the resist ink 7 is printed. It adheres to the printing table 1 through the through holes of the substrate 6. Printing table 1
The resist ink 7 adhered to the surface of the printed circuit board 6 will be reattached to the other surface of the printed circuit board 6 to be continuously operated, that is, the back surface of the printed circuit board 6 when the resist ink is applied to the rear surface.

[0005]

In the prior art, therefore, the solder resist pattern is formed on a thin printed circuit board one by one as shown in FIG. 4 or every time a resist ink is applied. The printing table needs to be cleaned.

[0006]

The present invention is applied to a printing table generated when a photographic solder resist ink is applied to one side of a thin printed circuit board having a plate thickness of less than 0.5 mm using a flat screen printing machine. It is intended to prevent the resist ink from adhering to the other surface of the next substrate and improve the work efficiency of the entire resist pattern forming process. That is, the method of the present invention is such that the back side end and the front side end of the printing table 1 of the flat screen printing machine are respectively on the back side
The front side roll bars 2 and 3 are pivotally installed, the roll paper 4 wound around the back side roll bar 2 is drawn out onto the printing table 1, a thin printed circuit board 6 is placed on the roll paper 4, and resist ink is applied. Then, after removing the thin printed circuit board 6 coated with the resist ink, the front roll bar 3
It is characterized in that the roll paper 4 for one substrate to which the ink is attached is wound up by rotating.

[0007]

The thin printed circuit board 6 is placed on the roll paper 4 pulled out from the back side roll bar 2 on the printing table 1 in this way.
The resist ink is applied to one surface of the printed circuit board 6, the roll paper 4 to which the resist ink is adhered is wound, the substrate is dried, and then the resist ink is applied to the other surface of the thin printed circuit board 6. , Thin printed circuit board 6
Printing table 1 when resist ink is applied to one side of
Since the roll paper 4 on which the resist ink does not adhere to and the resist ink adheres onto the other side of the thin printed circuit board 6 winds up the resist ink on the front side roll bar 3 just before it adheres to the thin printed circuit board 6, It is not necessary to form the resist pattern of the thin printed circuit board 6 on each side as shown in FIG. 4, and as shown in FIG.
Thus, it is possible to perform the operations of double-sided exposure, double-sided development and final drying without cleaning the printing table 1 each time the resist ink is applied from one side to the other side.

[0008]

1 is a perspective view around a printing table for carrying out the method of the present invention. In FIG. 1, 1 is a printing table of a flat screen printing machine, 2 and 3 are back and front roll bars pivotally installed at the back and front ends of the printing table 1, respectively. It has a winding handle 3A for winding. A roll paper 4 having a width substantially equal to the width of the thin printed board 6 is wound around the inner roll bar 2, and is pulled out and passed over the printing table 1 and wound on the front roll bar 3. In order to prevent the roll paper 4 on the table 1 from floating, presser plates 5 and 5 longer than the width of the roll paper 4 are provided on the back and front sides of the printing table 1,
In the meantime, the thin printed circuit board 6 is placed.

In the above construction, when the thin printed circuit board 6 is placed on the roll paper 4 on the printing table 1 and the resist ink is applied (printed) to the printed circuit board 6, the roll paper 4 is pressed by the pressing plates 5 and 5. Resist ink is applied to the thin printed circuit board 6. After that, the thin printed circuit board 6 is removed from the roll paper 4, the press plates 5 and 5 are released, and the roll paper 4 with the ink adhered to the front side roll bar 3 is wound by the handle 3A for one substrate. .

On the other hand, one surface of the thin printed circuit board 6 that has been removed is dried, and after drying, resist ink is applied to the other surface of the thin printed circuit board 6 as described above. Alternatively, while drying one side of the removed thin printed circuit board 6, the resist ink is applied to one side of the next thin printed circuit board 6, and while the printed circuit board 6 is removed and one side is dried, The resist ink may be applied to the other surface of the thin printed circuit board 6.

In this way, the resist ink can be applied to both sides of the thin printed circuit board 6 without cleaning the printing table 1, and the working efficiency of the entire process of forming the resist pattern on the thin printed circuit board 6 is improved. be able to.

[0012]

As described above, according to the present invention, the roll paper 4 wound around the back side roll bar 2 of the printing table 1 of the flat screen printing machine is pulled out onto the printing table 1 and the roll paper 4 The thin printed circuit board 6 is placed on top of this, resist ink is applied, and after removing the thin printed circuit board 6 applied with this resist ink, the front roll bar 3
Since the roll paper 4 for one substrate on which ink is adhered is rolled up by rotating the printing table 1, the printing table 1 is cleaned every time the resist ink is applied from one side to the other side of the thin printed circuit board 6. The operations of double-sided exposure, double-sided development, and final drying can be performed without having to do so, and the work efficiency of the entire process of forming a resist pattern on a thin printed circuit board 6 can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view around a printing table for carrying out the method of the present invention.

FIG. 2 is an explanatory diagram showing a normal process of forming a solder resist pattern by a photographic method.

FIG. 3A is an explanatory diagram showing a state in which resist ink is applied to a thick printed board placed on a printing table. (B) is an explanatory view showing a state in which resist ink is applied on a printed board having a thin thickness.

FIG. 4 is an explanatory diagram of a photographic method solder resist pattern forming process for a thin printed circuit board.

[Explanation of symbols]

 1 Printing table 2 Back roll bar 3 Front roll bar 3A Rotating handle for winding 4 Roll paper 5 Presser plate 6 Printed circuit board

Claims (2)

[Claims] 1. A back side roll bar (2) is provided by pivoting back side and front side roll bars (2, 3) at the back side end and the front side end of a printing table (1) of a flat screen printing machine, respectively. The roll paper (4) wound around the paper is drawn out onto the printing table (1), a thin printed circuit board (6) is placed on the roll paper (4), resist ink is applied, and the resist ink is applied thinly. After removing the printed circuit board (6), the front roll bar (3) is rotated to wind up the roll paper (4) for one substrate on which the ink is adhered, and the resist ink for a thin printed circuit board. Application method. 2. The thin printed circuit board according to claim 1, characterized in that, when ink is applied to the thin printed circuit board (6), the back side and the front side of the roll paper (4) are pressed by pressing plates (5, 5), respectively. Resist ink application method.