JPH064608Y2 - プリント配線板 - Google Patents
プリント配線板Info
- Publication number
- JPH064608Y2 JPH064608Y2 JP1987147212U JP14721287U JPH064608Y2 JP H064608 Y2 JPH064608 Y2 JP H064608Y2 JP 1987147212 U JP1987147212 U JP 1987147212U JP 14721287 U JP14721287 U JP 14721287U JP H064608 Y2 JPH064608 Y2 JP H064608Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- interface
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 239000011889 copper foil Substances 0.000 claims description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 22
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987147212U JPH064608Y2 (ja) | 1987-09-26 | 1987-09-26 | プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987147212U JPH064608Y2 (ja) | 1987-09-26 | 1987-09-26 | プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6452268U JPS6452268U (enrdf_load_html_response) | 1989-03-31 |
| JPH064608Y2 true JPH064608Y2 (ja) | 1994-02-02 |
Family
ID=31417406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987147212U Expired - Lifetime JPH064608Y2 (ja) | 1987-09-26 | 1987-09-26 | プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064608Y2 (enrdf_load_html_response) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163601A (ja) * | 1985-01-16 | 1986-07-24 | ソニー株式会社 | 高抵抗用カ−ボンペ−スト |
-
1987
- 1987-09-26 JP JP1987147212U patent/JPH064608Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6452268U (enrdf_load_html_response) | 1989-03-31 |