JPH0641717Y2 - Heat processing equipment using optical beam - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is a light beam that uses a light beam from a heat source to melt solder by the heat and perform heating processing such as soldering electronic components. Relates to a heating processing apparatus using

[Conventional technology]

As a conventional heat processing apparatus using this type of light beam, an apparatus as shown in FIG. 19 is used.

This will be described below.

a is a heat source lamp such as a xenon lamp, b is an elliptical reflecting mirror, c is a lens such as a cylindrical lens, and d is an electronic component such as a flat package IC temporarily fixed to the printed circuit board e by cream solder.

In the heating processing apparatus having the above-described structure, the light emitted from the heat source lamp a is condensed by the reflecting mirror b and is applied to the lead row of the electronic component d as a light beam to melt the solder to the printed circuit board e. Soldering is done.

[Problems to be solved by the invention]

By the way, after the electronic component d is soldered to the printed circuit board e as described above, if the printed circuit board e is moved before the solder is solidified, the electronic component d may be displaced from the pattern of the printed circuit board e. . Further, since it takes a considerable time for the solder to solidify, the printed circuit board e cannot be moved during that time, and therefore the time until the end of soldering becomes long, which causes a problem in workability. was there.

[Purpose of device]

The present invention solves the above-mentioned problems. It takes time to solidify the solder by blowing cool air from the end of soldering electronic parts to the printed circuit board toward the back surface of the printed circuit board at the soldered portion. It is an object of the present invention to provide a heating processing apparatus using a light beam, which shortens the work efficiency and improves workability.

[Outline of device]

In order to achieve the above-mentioned object, the present invention arranges a cool air blowing means for locally ejecting cool air toward the lower surface of the soldering portion of the printed circuit board to reduce the time until the solder is solidified. That is the summary.

[Example of device]

An embodiment of a heating and processing apparatus including the apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 is a half cross-sectional view showing the overall outline, 1 is a casing, 2 is an air cooling tower mounted above the casing 1, 3 is a suction pipe for air suction connected to the air cooling tower 2,
Reference numeral 4 denotes an elliptical reflecting mirror attached to the lower end opening of the air cooling tower 2, and 5 denotes a heat source lamp such as a xenon lamp attached so that the light spot is located at the focal point of the reflecting mirror 4 (hereinafter, simply 6) supports the lamp 5 and moves the lamp 5 in the X, Y, and Z axis directions, and adjusts the light spot of the lamp 5 so that it is located at the focal point of the reflecting mirror 4. A lamp adjusting device 7 for adjusting the reflected light from the reflecting mirror 4 through a pair of mirrors 72b and 73a arranged on four surfaces, a cylindrical lens 76a (hereinafter, simply referred to as a lens).
A light irradiation adjusting device for irradiating the light to form a linearly quadrangular spot, 8 a light irradiation adjusting device for blocking or partially blocking the light from the light collecting device 7, and 9 a casing 1 It is a pillar to which the attached support frame 11 is fixed.

A is a printed circuit board on which an electronic component B such as a flat package IC is temporarily fixed by cream solder,
The lead row of the electronic component B is moved to the spot position by the XY table.

Further, the electronic component B may be temporarily fixed to the printed circuit board A with an adhesive or the like. Further, after the printed circuit board A is moved to the spot position by the movement of the XY table, the electronic component B is fixed by a chuck or the like. You can

Next, to describe the details of each device, FIGS.
The figure shows a lamp adjusting device 6, and a base 61a to which an insulating block 51 for fixing the electrodes of the lamp 5 is attached is slidably and fixedly attached to the Z-axis adjusting mechanism 61.

That is, the micrometer 61b is attached to the base 61a, and the tip end of the adjusting rod 61c of the micrometer 61b is in contact with the stopper 61e of the first sliding plate 61d. Therefore,
Since the adjusting rod 61c moves back and forth by rotating the micrometer 61b, the base 61a is moved by the first sliding plate 6a by the amount of the movement.
The height of the lamp 5 can be adjusted by moving up and down with respect to 1d. Incidentally, 61f is a spring for urging the adjusting rod 61c of the micrometer 61b toward the stopper 61e.

The first sliding plate 61d is slidably and fixedly attached to the X-axis adjusting mechanism 63.

That is, the micrometer 63a is attached to the first sliding plate 61d, and the tip end of the adjusting rod 63b of the micrometer 63a is in contact with the stopper 63d of the second sliding plate 62c. In addition, the spring 63e causes the adjustment rod 63b to move to the stopper 63d.
Spring biased to the side. Therefore, the micrometer 63a
The first sliding plate 61d moves in the X-axis direction and the lamp 5 moves in the front-rear direction in FIG. 2 by rotating and moving the adjusting rod 63b forward and backward.

Further, the second sliding plate 62c is slidably and fixedly attached to the Y-axis adjusting mechanism 62.

That is, the micrometer 62a is attached to the base 63c fixed to the support frame 11, and the micrometer 62a
The tip of the adjusting rod 62b is the stopper 62 on the second sliding plate 62c.
It is in contact with d. Further, the adjusting rod 62b is spring biased toward the stopper 62d by the spring 62e. Therefore,
By rotating the micrometer 62a and moving the adjusting rod 62b back and forth, the second sliding plate 62c moves in the Y-axis direction, and the lamp 5 moves in the front-back direction in FIG.

As described above, the three micrometers 61b, 62a,
By adjusting 63a, the lamp 5 moves in the X-, Y-, and Z-axis directions, so that when the device is installed or the lamp 5 is replaced, the light spot of the lamp 5 is placed at the focal position of the reflecting mirror 4. It can be combined.

Next, the condenser 7 located below the opening of the reflecting mirror 4
Will be described with reference to FIGS. 7 to 11.

Reference numeral 71 denotes a substrate, which is attached to the support frame 11 attached to the opening of the casing 1 described above. Reference numeral 72 designates a quadrangular pyramid-shaped mirror mount formed on the upper surface of the substrate 71, and a vertical hole 72a is formed in the center thereof, and the lamp 5
The bottom edge of is inserted. And 4 of this mirror mount 72
A fixed mirror 72b is fixed to the surface by a leaf spring 72c.

Reference numeral 73 denotes a mirror driving mechanism for four sets of movable mirrors 73a arranged at positions facing the fixed mirrors 72b described above. Since the four sets of mirror drive mechanisms 73 have the same configuration, one mirror drive mechanism 73 will be described below.

The mirror drive mechanism 73 is a bearing plate 71a formed on the substrate 71 described above.
A mirror support plate 73b that is rotatably supported, a gear 74 that meshes with an arcuate tooth portion 73c formed behind the mirror support plate 73b, a gear 74, and a drive source motor 75a. And a connecting mechanism 75 for connecting the. The mirror 73a is attached to the front surface of the mirror support plate 73b so as to face the fixed mirror 72b. The connecting mechanism 74 drives two mirror support plates 73b facing each other with one motor 75a. That is, the first rotary shaft 75c connected to the motor 75a by the timing belt 75b, and the second rotary shafts 75d and 75e that are orthogonally arranged at both ends of the first rotary shaft 75c via the worm gear 75f and the worm wheel 75g. And the second rotary shaft 7
The above-mentioned tooth shaft 74 is attached to the tips of 5d and 75e.

Reference numeral 76 is a lens driving mechanism of a lens 76a that linearly collects the reflected light from the movable mirror 73a. This lens drive mechanism 76
Are arranged corresponding to the respective movable mirrors 73a and have the same configuration, so that one lens drive mechanism 76 will be described below.

The lens drive mechanism 76 includes a lens support plate 76b that is pivotally supported on the same shaft that pivotally supports the mirror support plate 73b of the mirror drive mechanism 73 of the bearing plate 71a, and a circle formed behind the lens support plate 76b. A gear 77 meshing with the arc-shaped tooth portion 76c, and the above-mentioned coupling mechanism 75 are configured. The gear 77 is attached to the tips of the second rotating shafts 75d and 75e of the connecting mechanism 75. Furthermore, the lens 76a is an arm 76d of the lens support plate 76b.
Is attached to the tip of.

In the above-described embodiment, the pair of mirror drive mechanism 73 and the lens drive mechanism 76 arranged with the mirror mount 72 sandwiched therebetween are described, but another pair of the mirror drive mechanism 73 'and the lens drive mechanism 7 is described.
Similarly, for 6 ', the motor 75a' is connected via the connecting mechanism 75 '.
Since it is driven by, the description thereof will be omitted.

Then, when the motor 75a starts rotating now, the connecting mechanism 75
Timing belt 75b, first rotating shaft 75c, second rotating shaft 75
It is transmitted to gears 74 and 77 via d and 75e, respectively. As a result, the mirror support plate 73b and the lens support plate 76b meshed with the gears 74 and 77 are rotated. Here, the gear 74 and the mirror support plate 7
Since the tooth portion 76c of 3b is larger than the gear 77 and the lens supporting plate 76b, the mirror supporting plate 73b and the lens supporting plate 76b have different rotational speeds. Therefore, the reflected light from the fixed mirror 72b is moved by the movable mirror 7.
When reflected by 3a, it is always focused on the lens 76a.

78a and 78b are mirror support plate 73b, lens support plate 76b and substrate 7
Each support plate 7 is a spring stretched between
It prevents backlash of 3b and 76b. Further, 79a and 79a 'are rotation speed detectors attached to the motors 75a and 75a'.

Next, the light irradiation adjusting device 8 formed on the back surface of the substrate 71 will be described with reference to FIGS. 12 to 14.

81 is a second substrate, and a spacer 81a is provided on the back surface of the substrate 71.
Is installed through. Reference numerals 82 and 82 'are motors mounted at one corner on the upper surface side of the second substrate 81, and drive pulleys 83 and 83' are connected via a bevel gear 82a or a spur gear 82a '. The endless wires 83a and 83a 'are wound between the driven pulleys 84 and 84' attached to the other two corners of the drive pulleys 83 and 83 '.

85 and 86 are left and right movable plates which are guided by a guide rod 81b attached to the upper surface of the second substrate 81 and which are movable in the left and right directions.
The base ends 85a and 86a are fixed above and below the wire 83a. Further, rollers 85b and 86b are attached to the ends of the left and right moving plates 85 and 86, and these move on the upper surface of the second substrate 81.

Therefore, the left and right moving plates 85 and 86 rotate the motor 82 and the wire 8
When 3a is moved, both approaches and separates.

Further, guide bars 85c, 85d and 86c, 86d are attached to the upper surfaces of the left and right moving plates 85, 86 at two positions, respectively, and mask moving plates 87-90 with their respective grooves engaged are arranged. Therefore, the mask moving plates 87 to 90 move in the left and right direction together with the left and right moving plates 85 and 86, and can also freely move in the up and down direction with respect to the left and right moving plates 85 and 86.

91 and 92 are guide bars 81c and 8 fixed to the upper surface of the second substrate 81.
A groove is engaged with the groove 1d to form a vertically movable plate that is vertically movable, and its base ends 91a and 92a are fixed above and below the wire 83a '. Therefore, when the vertical moving plates 91 and 92 rotate the motor 82 'and move the wire 83a', the two move closer to or separate from each other.

Guide arms 87a, 88a and 89a, 90a attached to the back surfaces of the mask moving plates 87, 88, 89, 90 are guided by the arm portions 91b, 92b of the vertical moving plates 91, 92.
Therefore, when the vertical moving plates 91, 92 move, the mask moving plates 87-90 move toward the arm portions 91b, 92b and the guide rollers 87a, 88a, 89a, 9a.
It is moved in the vertical direction depending on the engagement with 0a and the guide state by the guide bars 81c and 81d.

The masks 87b to 90b are attached to the mask moving plates 87 to 90, and face the window 81e of the second substrate 81. The masks 87b to 90b are the four lenses 76a described above.
The light is blocked and the beam length is adjusted.

In FIGS. 15 to 17, reference numeral 93 denotes a shutter for opening and closing the front surface of the window 81e of the second substrate 81, which is slidable on a guide 81f mounted on the back surface of the second substrate 81 via a mounting plate 93a. Installed. Further, rack teeth 93b are attached to the attachment plate 93a and mesh with a tip gear 94b of a piston 94a in an air cylinder 94 attached to the back surface of the second substrate 81. On the other hand, rack teeth 81g are also fixed to the second substrate 81, and are meshed at positions facing the rack teeth 93b with the gear 94b interposed therebetween.

Therefore, when the piston 94a of the cylinder 94 advances and retracts, the gear 94b meshed with the rack tooth 81g is rotated, and the rack tooth 93b meshed with the gear 94b moves. As a result, the shutter 93 moves on the lower surface of the window 81e, and the cylinder 94
The shutter 93 retreats from the window 81e when is sucked, and the shutter 93 covers the window 81e when the cylinder 94 is discharged.

Glass 95 is attached to the back surface of the window 81e by four attachment plates 95a to prevent flux or the like generated during soldering from entering.

Reference numeral 96 denotes an air nozzle attached to the back surface of the second substrate 81 to eject air so that the flux generated during soldering does not adhere to the glass 95.

Next, an overall schematic operation will be described based on the above-mentioned configuration.

Now, when the lamp 5 is energized, the light emitted from the lamp 5 is reflected by the reflecting mirror 4 and focused on the four fixed mirrors 72b.

The light condensed on the fixed mirror 72b is reflected by the fixed mirror 72b toward the movable mirror 73a, and the light reflected by the movable mirror 73a is emitted toward the lens 76a. The light that has passed through the lens 76a becomes a linear beam, and
The lead row of the electronic component B on the printed circuit board A on the XY table is irradiated via the line 5. Therefore, the solder attached to the lower surface of the lead row is melted, and the lead row is soldered to the pattern of the printed board A.

FIG. 18 is a partially sectional front view of the above-mentioned heating and processing apparatus in which a warm air blowing device for heating the printed circuit board A of the present invention from the lower surface is attached.

In the figure, 101 is a heating device for melting the solder and a hot air blowing device arranged at a corresponding position with the printed circuit board A interposed therebetween, and the outer tube 101a from which hot air is blown and the lower surface of the printed circuit board A. It is composed of an inner tube 101b for sucking the warm air hit by the inner tube 101b. The opening of the inner pipe 101b is opened below the opening of the outer pipe 101a.

The outer pipe 101a is a gear device 10 of rack teeth and pinions.
It is designed to move up and down by 1c. Also, the outer tube
101a is connected to the switching valve 103 via the blower 102.
The switching valve 103 is provided with the cool air from the cool air suction pipe 104 and the heater 10
It is to switch between hot air inhaled via 5. On the other hand, the inner pipe 101b is connected to the suction device 106.

Next, to explain the operation, the printed circuit board A is X-
When it is moved by the Y table, the outer tube 101a is moved to the vicinity of the lower surface of the printed board A together with the inner tube 101b by the gear device 101c. In this state, since the switching valve 103 is switched to the heater side, the blower 102 and the suction device 106
Is driven, hot air is sucked into the outer tube 101a and is blown to the lower surface of the printed circuit board A. Then, the hot air that has come into contact with the printed circuit board A is discharged from the inner pipe 101b by the suction device 106. Therefore, the beam from the above-mentioned heating processing device is irradiated to the lead row of the electronic component B to heat the part of the lead row, and the printed board A
The portion where the electronic component B is located is also heated from the lower surface of the. As a result, the temperature of the printed board A rises faster than in the conventional case, the solder easily sticks to the pattern of the printed board A, and the pattern and the lead row of the electronic component B are soldered.

Incidentally, when the warm air blowing device in the present embodiment is arranged, the conventional solder melting time was 14 to 15 seconds.
Seconds or less (when the lamp 5 is 2 kw, the outer tube 101a is 150 w, the thickness of the printed circuit board A is 1.6 mm, and the solder melting temperature is 185 ° C.).

After the solder is melted and the lead row of the electronic component B is soldered to the pattern of the printed circuit board A, the shutter 93 is closed to block the beam from the lamp 5 and the outer tube.
101a is evacuated.

Although the above description is about the heating of the printed circuit board A, when the switching valve 103 is switched to the cold air suction pipe 104 side, the blower 102 and the suction device 106 are driven after the soldering is completed. As a result, the solder can be solidified quickly, and the workability can be improved.

In the embodiment described above, the cold air is blown out by using the warm air blowing device 101 by switching the switching valve 103 to the cold air suction pipe 104 side, but only the cold air is blown out. May be.

[Effect of device]

According to the present invention, as described above, after the lead row of the electronic component is soldered to the pattern of the printed circuit board, cool air is blown from the lower surface of the printed circuit board to rapidly solidify the solder. This has effects such as reduction of soldering time and improvement of workability.

Moreover, since the solder is solidified by the rapid cooling, coarsening of the solder crystal in the connection portion can be suppressed, and high-strength soldering can be realized.

[Brief description of drawings]

1 is a partial sectional front view of the whole, FIG. 2 is a front view of a lamp adjusting device, FIG. 3 is a plan view of the same as above, and FIG.
FIG. 5 is a view taken in the direction of arrow B in FIG. 3, FIG. 6 is a view taken in the direction of arrow C in FIG. 3, FIG. 7 is a front view of the light collecting device, and FIG. Front view, FIG. 9 is a partially enlarged front view of the same as the above, FIG.
The figure is an end view taken along the line AA of FIG. 7, FIGS. 11 (a) and 11 (b) are front and side views of the holding portion of the movable mirror, and FIG. 11 (c) is a front view of the lens holding portion. FIG. 12 is a front view of the light irradiation adjusting device,
13 is a plan view of the same as above, FIG. 14 is a bottom view of FIG. 12, and FIG.
Figure is the front view of the shutter mechanism, and Figure 16 is the plan view of the same.
FIG. 17 is a bottom view of FIG. 15, FIG. 18 is a partial cross-sectional front view of the whole state in which the warm air blowing device of the present invention is attached, and FIG. 19 is an explanatory view showing the outline of a conventional heating processing device. is there. 4 ... Ellipsoidal reflector, 5 ... Heat source lamp, 6 ... Lamp adjusting device, 7 ... Concentrating device, 8 ... Light irradiation adjusting device,
101: Warm air blowing device, 103: Warm air, cold air switching valve.

Claims (1)

[Scope of utility model registration request] 1. A heat processing apparatus using a light beam for irradiating a lead beam of an electronic component, which is temporarily fixed on a printed circuit board, with a light beam to solder the electronic component onto the printed circuit board. Ellipsoidal reflecting mirror that collects and reflects the light from the fixed mirror, a fixed mirror that reflects the reflected light from the elliptical reflecting mirror toward the movable mirror, and a reflected light from the fixed mirror toward the cylindrical lens. A movable mirror to be reflected, and a reflected light from the movable mirror is condensed only in one direction to form a linear light beam, and a heat ray is applied to the lead row of the electronic component temporarily fixed on the printed board. And a cylindrical lens forming a spot of the cooling lens, which is arranged at the lower surface side of the printed circuit board and locally blows cooling air from the lower surface side of the printed circuit board toward the lead row position of the electronic component. And a blowing means, wherein the cold wind blowing means is heating processing apparatus using a light beam, characterized in that it is adapted to eject cold air when the soldering of the lead row of the electronic component is completed.