JPH0641177B2 - Film splicer - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a film joining apparatus for joining films on both sides with an adhesive tape, and particularly to a TAB.
(Tape automatic bonding) The present invention relates to a film joining apparatus suitable for joining films.

[Conventional technology]

An information recording tape editing splicer has been used for editing information recording tapes such as audio magnetic tapes and projection films. This information recording tape editing splicer is, for example, as described in Japanese Patent Application Laid-Open No. 62-86592, a guide to position the cut ends of the information recording tape whose unnecessary portions have been previously cut by a cutter, but to position them. Member and a base main body having a roll on which an adhesive tape to be adhered over the cut end is wound, and an arm member provided on the base main body so that the base end is pivotally supported on the base main body. Then, the adhesive tape is pulled out from the roll and positioned on the information recording tape, and then the arm member is pressed down onto the upper surface of the base body through the handle connected to the arm member to guide it with the pressing plate attached to the lower surface of the arm member. The information recording tape on the member is pressed down, and the adhesive tape cutter is installed by sandwiching the pressing plate from the front and back. The tape was cut and the two information recording tapes to be spliced together were adhered with a thin adhesive tape for tape editing.

[Problems to be Solved by the Invention]

By the way, in recent years, TAB has been actively adopted as a method for mounting an IC on a printed circuit board in the consumer and industrial fields such as a calculator, a clock, a liquid crystal monitor, and a computer. This TAB is a method in which a wiring pattern suitable for an IC is continuously formed on a long film in the shape of a frame in the photograph, and the leads and the terminals of the IC are collectively bonded. TAB film is I
A visual inspection was performed before and after mounting C, and the coma of the wiring pattern with wiring failure, bonding failure, etc. was cut off, and the film of only the non-defective part was connected in the same way as the above-mentioned editing of the information recording tape. It is a long film. The width of this TAB film is generally 35mm, but 48m
Wider widths of m, 70 mm or more, for example 158 mm, have also been used. However, when this wide film is connected using the splicer as described above, it is only attached by attaching an adhesive tape on one side across the butting part, and the connected film is wide, so the tensile force is large. May become large and the seam may come off. At this point, the method used to join 16 mm film for movies was to cut the butting part with an adhesive tape that was folded in two, and then cut the part that hits the other end of the adhesive tape with scissors. The strength of the film is excellent because the adhesive tape is attached to surround both sides of the film. However, since the bending end of the joining tape slightly protrudes outward on one side surface of the film, it hinders the handling of the film, and it is inappropriate to apply this to the joining of the TAB film.

To do this, use two conventional splicers,
With the first splicer, the adhesive tape is attached to the upper surface of the joining portion of the TAB film, then the TAB film is turned upside down and the lower surface is directed upward, and then the second splicer is used to attach the adhesive tape at the same time. However, since it is difficult to invert in a linear flow state in terms of work, it is practically possible to send the information recording tape as an S-shaped flow from one side over the splicers arranged vertically. However, the bending of the TAB film should originally be limited to one direction, and it is not preferable to bend the front and back alternately. Further, when the adhesive tapes are separately attached and cut by two splicers, it is usual that the cut end faces of the upper and lower adhesive tapes attached are slightly displaced.
This is not preferable because part of the adhesive surface of the tape appears on the outer surface of the TAB film.

The present invention has been made to solve the above problems of the prior art, and is a film bonding method capable of easily and accurately bonding both sides of a wide film (particularly a TAB film) with a single device. The purpose is to provide a device.

[Means for Solving the Problems]

To achieve the above object, according to the present invention, a base body provided with a cutter for cutting a required film on one side,
It consists of an arm member whose base end is pivotally supported by the base body and is pressed down by the film guide member on the upper surface of the base body through the handle of the cutter holder. Is provided with a mechanism for holding the tip end portion on the tape receiving portion of the corresponding guide member that passes over the film guide member with the adhesive surfaces facing each other, and is connected to the cutter holder on the lower surface of the arm member. There is provided a film joining apparatus, characterized in that a pair of adhesive tape cutters for cutting the tip end of the film is provided.

[Work]

According to this invention, the mechanism for positioning the adhesive tape on the lower surface of the joint portion of the film, the mechanism for positioning the adhesive tape on the upper surface of the joint portion of the film, and the pair of adhesive members attached to the arm member pivotally supported by the base body. By the action of the tape cutter, both ends of the adhesive tape are cut at a stroke with the adhesive tape positioned on both sides of the film connection part, and the upper and lower parts of the film joining part can be cut with a single device that could not be done with conventional technology. The adhesive tape can be attached to both surfaces of the both surfaces to easily and accurately bond the both surfaces, and the above-mentioned problems can be achieved.

〔Example〕

 Embodiments of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1, the whole apparatus of this embodiment has an arm member 3 which is always in a standing state via a spring 4 on a base body 2 having a cutter 1 for cutting a required film on one side. Cutter holder 5 (5a, 5a, 5a, 5a
The arm member 3 is attached to the base body 2 via the handle 6 of b).
The pressing plates 11a and 11b attached to the lower surface of the arm member 3 are overlapped with the guide member 7 for the films to be joined on the base body 2 by pressing down the upper surface of the arm member 3. Two adhesive tape holders 8a and 8b are attached to the base body 2 so as to sandwich the guide member 7, and two rows of sprocket hole pins 9a and 9b and a sprocket hole die hole are provided on the guide member 7. 10a, 1
0b is provided, and two pressing plates 11a, 11b and two sprocket hole punches 12 are provided on the lower surface of the arm member 3.
Adhesive tape cutters 13a and 13b connected to a and 12b and cutter holders 5a and 5b are attached, respectively.

Of the two adhesive tape holders 8a and 8b, the adhesive tape holder 8a on the front side in the drawing is provided at a height at which the adhesive tape can be pulled out with its adhesive surface as the lower surface.
The adhesive tape holder 8b immediately below the pivotal attachment portion of the arm member 3 is provided at a height at which the roll-shaped adhesive tape to be mounted is pulled out with its adhesive surface as the upper surface, and on the base body 2 in front of the guide member 7. An adhesive tape holding arm 14 for holding the adhesive tape in a tensioned state by adhering the lower end surface thereof to the adhesive surface of the adhesive tape pulled out from the adhesive tape holder 8b is provided. As shown in FIG. 2, this adhesive tape holding arm 14 has one end movably provided on the base body 2 by a shaft 15 and has a tip formed on a tape holding piece 17 positioned so as to overlap the tape receiving portion 16a. The gripping piece 18 is gripped with a finger and the lower surface of the tape holding piece 17 is abutted against the adhesive surface of the adhesive tape to be adhered thereto, whereby the adhesive tape is held in a tensioned state. The first
In the figure, 19 is a center mark provided on the guide member 7, 20a and 20b are protective frames for covering the cutting edges of the adhesive tape cutters 13a and 13b, which are provided on the front and rear edges of the arm member for preventing injury,
Reference numeral 21 is a non-slip rubber plate attached to the upper surface of the tape receiving portion 16a. The width of the guide member 7 in the front-rear direction is set to be substantially equal to the width of the film to be joined. In the illustrated example, the sprocket hole pins 9a and 9b are arranged in two rows in the front and rear,
This may correspond to the sprocket holes provided in the films to be joined, and the number of rows and the distance between pins can be set arbitrarily. Further, if the film to be joined is one on which a projection such as an IC is mounted, it is desirable to form a groove for escaping the projection at a proper depth in the longitudinal direction on the film mounting surface of the base body 2. .

By the way, when the width of the TAB film to be edited is very wide, when the arm member 3 is pressed down onto the upper surface of the base body 2 via a normal handle, the pressing force tends to be uneven, and in particular, the Two presser plates in the device
Since 11a and 11b are pressed down to the corresponding positions of the guide member 7 of the base body 2, it is difficult to lower them simultaneously and with a uniform force. Here, the one shown in the embodiment of FIG. 1 is for processing the above-mentioned film having a width of 158 mm, and therefore, as shown in FIG. The handle 6, which is pivotally supported so as not to rotate, has a considerable total length, and as shown in FIG.
The coil springs 22a, 22b are provided on the pillar body which is provided on the arm member 3 by arranging two support rolls 24, 24 on the upper surface.
The cutter holders 5a and 5b are provided with adhesive tape cutters 13a and 13b and sprocket hole punches 12a and 12b, respectively. In this way, the tape cutters 13a and 13b, the sprocket hole punches 12a and 12b, and the arm member 3 are attached to the upper surface of the base body 2 through the two cutter holders 5a and 5b by manually pressing down the tip of the handle 6. It can be pressed with almost uniform pressure.

Further, in cutting the film, in order to prevent the middle portion of the wide film from rising upward, the cutter 1 has an arc-shaped spring piece 23 for pressing the lower surface of the wide film evenly against the fixed blade in advance. Is attached. As shown in FIG. 5, this spring piece 23 is made of elastic lines that keep an arc shape in advance. When using the cutter 1, first, the spring piece 23 presses and fixes the film on the fixed blade of the base body 2, Next, the movable blade of the cutter 1 cuts the film. That is, when the movable blade of the cutter 1 is lowered during cutting, the spring piece 23 comes into contact with the film and both ends of the spring piece 23 are pushed upward from the movable blade against elasticity, and after the cutting, the movable blade of the cutter 1 is finished. When the body is raised, both ends of the spring piece 23 are lowered again to return to the arc shape.

Next, the operation of the embodiment having the above configuration will be described with reference to FIG.

(1) First, pull out the adhesive tape of the adhesive tape holder 8b immediately below the pivotal attachment part of the arm member 3 forward with a fingertip, hold it in a tension state across the guide member 7, and depress the adhesive tape holding arm 14. As shown in FIG. 2, the tape holding piece 17 which is the tip thereof is adhered to the adhesive surface which is the upper surface of the adhesive tape, and the adhesive tape is fixed in a tension state on the tape receiving portion 16a (FIG. 6 (A)). ).

(2) A TAB film previously cut by the cutter 1 is mounted above the adhesive tape by engaging the sprocket holes with the sprocket hole pins 9a and 9b, and placing the cut portion in alignment with the center mark 19; Similarly, the portion corresponding to the front end of the TAB film from which the excised portion has been removed is mounted and locked in the same manner, and both cut portions are brought into contact with each other according to the center mark 19 (Fig. 6 (B)).

(3) Next, pull out the adhesive tape of the adhesive tape holder 8a located on the front side with a fingertip, cross the TAB film, and place the tip above the tape receiving portion 16b on the inner side of the guide member 7 of the adhesive tape. Adhesion is held on the sticky surface (Fig. 6 (C)).

(4) In this state, the handle 6 is pressed down to press the TAB film between the plates 11a and 11b and the guide member 7, and the adhesive tapes on the upper and lower surfaces are adhered to the adhesive tape cutters 13a and 13b.
The sprocket hole is punched through the sprocket hole punches 12a and 12b and the sprocket hole die holes 10a and 10b over the TAB film at the same time to complete the joining.

In this way, the cut parts where the TAB films are stuck together can be adhered by applying adhesive tape to the upper and lower surfaces, and the adhesion is reliable, and since this work is completed by one handle operation, there is no possibility that the TAB film will shift. There is no need to worry that there is no possibility that tape chips will adhere to the adhesive tape cutters 13a and 13b and hinder work, and the cut pieces of adhesive tape will remain only on the lower surface of the tape holding piece 17 of the adhesive tape holding arm 14. Since this residual piece has a length that can be picked up sufficiently with a fingertip, it is easy to remove. The adhesive tape holding arm 14 is formed in a V-shape in order to prevent a portion other than the tape holding piece 17 from being adhered to the pulled-out adhesive tape and making it difficult to operate.

〔The invention's effect〕

According to the present invention, since the film joining device is configured as described above, it is possible to easily and reliably join the both surfaces of the connecting portion of the tape to be joined together with one device. Especially, the advantage is exhibited in the joining of wide TAB films (for example, 158 mm).

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a film joining apparatus according to an embodiment of the present invention, FIG. 2 is a plan view for explaining an adhesive tape holding arm, and FIG. 3 is a plan view of the apparatus of FIG. Fourth
FIG. 5 is an exploded perspective view for explaining the arm member and members attached thereto, FIG. 5 is a side view for explaining the film cutting cutter, and FIG. 6 is an operation explanatory view of the apparatus of FIG. is there. 1 ... Cutter, 2 ... Base body 3 ... Arm member, 5 ... Cutter holder 6 ... Handle, 7 ... Guide member 8a, 8b ... Adhesive tape holder 9a, 9b ... Sprocket hole pin 10a, 10b …… Die hole, 11a, 11b …… Presser plate 12a, 12b …… Sprocket hole punch 13a, 13b …… Adhesive tape cutter 14 …… Adhesive tape holding arm 16a, 16b …… Tape receiving part, 17 …… Tape Holding piece 23 …… Spring piece, 24 …… Bearing roll

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Internal reference number FI Technical display location G11B 27/06 A 8224-5D B29L 7:00 4F (56) Reference JP-A-63-316860 ( JP, A) JP 63-273863 (JP, A) JP 62-86592 (JP, A) JP 54-112626 (JP, A) JP 60-11671 (JP, B2)

Claims (6)

[Claims] 1. A base body having a cutter for cutting a required film on one side, and an arm whose base end is pivotally supported by the base body and is pressed down by a film guide member on the upper surface of the base body through a handle of a cutter holder. Consisting of parts,
The base body is provided with a mechanism for holding the tip end portion in the tape receiving portion of the corresponding guide member, which passes through the film guide member with the adhesive surfaces of the pair of adhesive tapes facing each other across the film guide member. Also, a film joining apparatus, characterized in that a pair of adhesive tape cutters are provided on the lower surface of the arm member, the adhesive tape cutters being connected to a cutter holder and cutting the tip end portions of the adhesive tapes. 2. A cutter holder having a lower end connected to an adhesive tape cutter is provided at the front and rear, and a handle having a base end pivotally supported on an upper surface of an arm member is formed to have a considerable length.
The film joining apparatus according to claim 1, wherein the cutter holder is supported at two points thereof. 3. The film joining apparatus according to claim 1, further comprising means for forming a sprocket hole or a perforation on a lower surface of the arm member. 4. An up-and-down movable body which adheres to the upper surface of the base body to the upper surface of the tip portion of one of the pair of adhesive tapes which is pulled out with the adhesive surface facing upward and holds the adhesive tape in a tensioned state. The film bonding apparatus according to claim 1, further comprising an adhesive tape holding arm. 5. A spring piece consisting of an elastic line bent in advance so as to project downward from the blade body is provided on the inside surface of the movable blade of a cutter for film cutting provided on one side of the base body, and both ends thereof are movable blades. The film joining apparatus according to any one of claims 1 to 4, wherein the film joining apparatus is slidably supported and attached to a body. 6. The escape groove for escaping a projection such as an IC chip mounted on the film is formed in the longitudinal direction on the film mounting surface on the upper surface of the base body. The film joining apparatus according to any one of 5 above.