JPH0638122B2 - Method for manufacturing color solid-state image sensor - Google Patents
Method for manufacturing color solid-state image sensorInfo
- Publication number
- JPH0638122B2 JPH0638122B2 JP29678987A JP29678987A JPH0638122B2 JP H0638122 B2 JPH0638122 B2 JP H0638122B2 JP 29678987 A JP29678987 A JP 29678987A JP 29678987 A JP29678987 A JP 29678987A JP H0638122 B2 JPH0638122 B2 JP H0638122B2
- Authority
- JP
- Japan
- Prior art keywords
- state image
- color solid
- pattern
- image pickup
- dye layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000000206 photolithography Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 241001428397 Taito Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Color Television Image Signal Generators (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はカラー固体撮像用素子表面にカラーフィルター
の各色素層を順次、フォトリソグラフィ法により形成
し、所定のカラーフィルターを上記カラー固体撮像用素
子表面に直接形成するカラー固体撮像素子の製造方法に
係わり、特にカラーフィルターの各色素層のパターン精
度を容易に確認し得るようにした製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention is to form each dye layer of a color filter on the surface of a color solid-state image pickup device by a photolithography method, and to form a predetermined color filter for color solid-state image pickup. The present invention relates to a method for manufacturing a color solid-state imaging device directly formed on the surface of an element, and more particularly to a manufacturing method for easily confirming the pattern accuracy of each dye layer of a color filter.
（従来の技術） ガラス等の透明基板上にカラーフィルターを形成し、こ
れを固体撮像素子表面に接着層を介して接合してカラー
固体撮像素子を製造する方式の場合は、この透明基板上
の各色素層のパターンの精度の確認が容易であるが、カ
ラーフィルターをカラー固体撮像用素子表面に直接形成
してカラー固体撮像素子を製造する方法においては、色
素層が形成される受光部の材料がポリシリコン、アルミ
ニウム、シリコン単結晶等、数種の反射率の異なる材料
で複雑に構成されているため、各色素パターンの形状、
特にエッジ部形状の確認が困難であって、フォトリソグ
ラフィ工程での露光、現像、ピント合せ等の条件制御を
困難なものとしていた。(Prior Art) In the case of a method of manufacturing a color solid-state image sensor by forming a color filter on a transparent substrate such as glass and bonding the color filter to the surface of the solid-state image sensor via an adhesive layer, the color filter on the transparent substrate is used. It is easy to check the accuracy of the pattern of each dye layer, but in the method of manufacturing a color solid-state image pickup device by directly forming a color filter on the surface of the color solid-state image pickup device, the material of the light receiving part on which the dye layer is formed is used. Is complicatedly composed of several different materials such as polysilicon, aluminum, and silicon single crystal, the shape of each dye pattern,
In particular, it is difficult to confirm the shape of the edge portion, and it is difficult to control the conditions such as exposure, development and focusing in the photolithography process.
（発明が解決しようとする問題点） 本発明はカラーフィルターの各色素パターンをカラー固
体撮像用素子上にフォトリソグラフィ法で形成する際に
各色素パターンの形状確認の容易化を図り、これによっ
てフォトリソグラフィ工程での露光、現像、ピント合せ
等の条件の制御を容易にし、カラーフィルターの各色素
パターン精度の向上を図らんとするものである。(Problems to be Solved by the Invention) The present invention aims to facilitate the confirmation of the shape of each dye pattern when forming each dye pattern of a color filter on a color solid-state imaging device by a photolithography method. It is intended to facilitate the control of conditions such as exposure, development and focusing in the lithography process and improve the accuracy of each dye pattern of the color filter.
（問題を解決するための手段） 本発明はカラー固体撮像用素子上に各色素パターンをフ
ォトリソグラフィ法で形成する際の各色素パターンの形
状を容易に確認できるようにするため、各色素パターン
の形成と同時に、カラー固体撮像用素子が形成された単
位チップの受光領域周辺の余白部に、太さの異なる複数
種類の解像度チェックパターンをを形成するようにし
た。この解像度チェックパターンが形成される上記余白
部は同一材料からなる部分が選ばれる。例えばシリコン
のみからなる部分に、全ての色素層の全ての種類の解像
度チェックパターンを形成することが好ましい。なぜな
らば、或る色素層において、解像度チェックパターンの
一部がシリコン上に、他の一部がアルミニウム層上に形
成された場合は下からの反射がこれらシリコンおよびア
ルミニウムで異なるため、解像度チェックパターン形状
の統一的判断が困難となるからである。同様に、或る色
素層の解像度チェックパターンがシリコン上に、他の色
素層の解像度チェックパターンが例えばアルミニウム層
上に形成された場合も各色素層相互間の状態又は条件の
比較が困難となる。(Means for Solving the Problem) In order to easily confirm the shape of each dye pattern when forming each dye pattern on the color solid-state imaging device by the photolithography method, Simultaneously with the formation, a plurality of types of resolution check patterns having different thicknesses are formed in the margin portion around the light receiving area of the unit chip on which the color solid-state image pickup element is formed. A portion made of the same material is selected as the blank portion where the resolution check pattern is formed. For example, it is preferable to form all kinds of resolution check patterns of all dye layers in a portion made of only silicon. This is because, in a certain dye layer, when a part of the resolution check pattern is formed on silicon and the other part is formed on the aluminum layer, the reflection from the bottom is different between these silicon and aluminum. This is because it becomes difficult to make a unified judgment of the shapes. Similarly, when the resolution check pattern of a dye layer is formed on silicon and the resolution check pattern of another dye layer is formed on, for example, an aluminum layer, it becomes difficult to compare the states or conditions between the dye layers. .
なお、形成される解像度チェックパターンの複数種のう
ちの１種類はカラーフィルターの色素層のパターンの主
たる部分と同一又は近似の太さとすることが好ましい。
解像度チェックパターンの形状について特に制限はない
が、複数方向においてパターンの膨らみ、細りが確認し
得る形状のものが好ましい。In addition, it is preferable that one of the plurality of resolution check patterns to be formed has the same or similar thickness as the main portion of the pattern of the dye layer of the color filter.
The shape of the resolution check pattern is not particularly limited, but a shape in which the pattern swelling and thinning can be confirmed in a plurality of directions is preferable.
（作用） 単位チップの受光領域周辺の余白部で同一材料から構成
される部分に形成された複数群の色素パターンは基板が
同一材料であるため、下からの反射条件が同一であり、
したがって色素パターンの形状の確認が容易であり、そ
のため、受光領域に形成されたカラーフィルター用色素
パターンの形成状態、形成条件を確認するための指針と
して極めて有用なものとなる。(Function) Since the substrates of the dye patterns of a plurality of groups formed in the portion composed of the same material in the margin portion around the light receiving area of the unit chip are the same material, the reflection condition from the bottom is the same.
Therefore, it is easy to confirm the shape of the dye pattern, and therefore it is extremely useful as a guide for confirming the formation state and formation conditions of the color filter dye pattern formed in the light receiving region.
（実施例） 第１図は半導体ウエーハ表面に、受光領域、駆動領域等
を単位チップ毎に形成させたものの一部を拡大して示す
平面図であって、各単位チップはスクライブライン１に
よって囲まれ、中央部が受光領域２となっている。本発
明に係わる解像度チェックパターンは例えば受光領域２
周辺の余白部、例えばボンディングパッド３間の適当な
余白で、全域に亘って同一材料から構成され大部分（例
えば、破線で示した例えばＳｉのみからなる区域４）に
形成される。解像度チェックパターンはパターンの太さ
を種々変えた複数種類のものを各色素毎に、受光流域へ
のカラーフィルターのフォトリソグラフィ法による形成
と同時に形成される。第２図は或る一つの色素（例え
ば、レッド、グリーン、ブルーのうちのいずれか）につ
いての解像度チェックパターンの一例を示している。即
ち図（Ａ）の如く４本の巾“ａ”の棒状パターンを短冊
状に間隔“ａ”を以って横方向および縦方向に並列させ
た組、図（Ｂ）の如く図（Ａ）より若干狭い巾“ｂ”お
よび間隔“ｂ”で棒状パターンを同様に並列させた組、
図（Ｃ）の如く図（Ｂ）より若干狭い巾“ｃ”および間
隔“ｃ”で棒状パターンを同様に並列させた組、図
（Ｄ）の如く図（Ｃ）より若干狭い巾“Ｄ”および間隔
“ｄ”で棒状パターンを同様に並列させた組から構成さ
れている。これら（Ａ）ないし（Ｄ）のうちの一つの組
（例えば図（Ｃ）の組）はカラーフィルターの色素層の
主のパターン寸法と同一又は近似の寸法にすることが実
物的に判断する手掛りとなることから好ましい。上記パ
ターンの巾および間隔“ａ”、“ｂ”、“ｃ”および
“ｄ”の寸法の具体例としてはそれぞれ２０μｍ、１０
μｍ、５．０μｍおよび３．０μｍである。これら解像
度チェックパターンは各色素層毎に、かつ、全て同一材
料上に形成される。例えば、区域４に形成しきれない場
合は同一材料からなる他の区域４′に形成する。(Embodiment) FIG. 1 is an enlarged plan view showing a part of a semiconductor wafer in which a light receiving region, a driving region and the like are formed for each unit chip. Each unit chip is surrounded by a scribe line 1. The light receiving area 2 is at the center. The resolution check pattern according to the present invention is, for example, the light receiving area 2
A peripheral marginal portion, for example, an appropriate margin between the bonding pads 3, is formed over most of the entire region and is formed of the same material (for example, a region 4 shown by a broken line and made of only Si, for example). The resolution check pattern is formed simultaneously with the formation of a color filter in the light-receiving flow area by the photolithography method, for each dye, a plurality of types in which the thickness of the pattern is variously changed. FIG. 2 shows an example of a resolution check pattern for a certain dye (for example, any one of red, green, and blue). That is, as shown in FIG. 8A, a group of four bar-shaped patterns having a width of "a" arranged in parallel in a horizontal direction and a vertical direction at intervals of "a", and as shown in FIG. A set in which rod-like patterns are similarly juxtaposed with a slightly narrower width "b" and a space "b",
A set in which rod-shaped patterns are similarly juxtaposed with a width "c" and a spacing "c" which are slightly narrower than those in FIG. (B), as shown in FIG. And a pair of rod-like patterns arranged in parallel at intervals "d". A clue to make a physical judgment that one set of these (A) to (D) (for example, the set of FIG. (C)) has the same size or a size close to the main pattern size of the dye layer of the color filter. It is preferable because Specific examples of the width of the pattern and the intervals “a”, “b”, “c” and “d” are 20 μm and 10 respectively.
μm, 5.0 μm and 3.0 μm. These resolution check patterns are formed for each dye layer and all on the same material. For example, if the area 4 cannot be formed completely, it is formed in another area 4'of the same material.
以上詳述したように、本発明はカラー固体撮像用素子表
面にカラーフィルターの各色素層を順次、写真蝕刻法に
より形成し、所定のカラーフィルターを上記カラー固体
撮像用素子表面に直接形成するカラー固体撮像素子の製
造方法において、上記各色素層の形成と同時に、上記カ
ラーの固体撮像用素子が形成された単位チップの受光領
域周辺の余白部で同一材料からなる部分に太さの異なる
複数種類のパターンを各色素層毎に形成し、これらパタ
ーンに基づいてフォトリソグラフィ工程の諸条件および
各色素層の精度を確認するようにしたから、各色素層の
形成における適正条件の選択がより容易となる。As described in detail above, the present invention is a color in which each dye layer of a color filter is sequentially formed on the surface of a color solid-state image pickup device by a photographic etching method, and a predetermined color filter is directly formed on the surface of the color solid-state image pickup device. In the method for manufacturing a solid-state image pickup device, simultaneously with the formation of each of the dye layers, a plurality of types having different thicknesses are formed in a blank portion around the light-receiving region of the unit chip in which the solid-state image pickup device of the color is formed, in the margin portion. Since the pattern of is formed for each dye layer and the conditions of the photolithography process and the accuracy of each dye layer are confirmed based on these patterns, it is easier to select the appropriate conditions in the formation of each dye layer. Become.
第１図はカラー固体撮像用素子を形成した受光領域、そ
の他駆動領域等を有する半導体ウエーハの一部を拡大し
て示す平面図、第２図は解像度チェックパターンの一例
を示す平面図である。 １…スクライブライン、２…受光領域、３…ボンディン
グパッド、４，４′…解像度チェックパターン形成区
域。FIG. 1 is an enlarged plan view showing a part of a semiconductor wafer having a light receiving region on which a color solid-state image pickup device is formed and other driving regions, and FIG. 2 is a plan view showing an example of a resolution check pattern. 1 ... scribe line, 2 ... light receiving area, 3 ... bonding pad, 4, 4 '... resolution check pattern forming area.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 伊藤 慎次 東京都台東区台東１丁目５番１号 凸版印 刷株式会社内 (56)参考文献 特開 昭57−141850（ＪＰ，Ａ) 特開 昭61−248469（ＪＰ，Ａ) 特開 昭62−83701（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shinji Ito 1-5-1 Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd. (56) Reference JP-A-57-141850 (JP, A) JP-A-SHO 61-248469 (JP, A) JP-A-62-83701 (JP, A)
Claims (3)
ターの各色素層を順次、フォトリソグラフィ法により形
成し、所定のカラーフィルターを上記カラー固体撮像用
素子表面に直接形成するカラー固体撮像素子の製造方法
において、上記フォトリソグラフィ法の諸条件下での各
色素層のパターンの精度を確認するため、上記各色素層
の形成と同時に、上記カラー固体撮像用素子が形成され
た単位チップの受光領域周辺の余白部であって、同一材
料からなる部分の上に、太さの異なる複数種類の解像度
チェックパターンを各色素層毎に形成することを特徴と
するカラー固体撮像素子の製造方法。1. A color solid-state image pickup device, wherein dye layers of a color filter are sequentially formed on a color solid-state image pickup device by a photolithography method, and predetermined color filters are directly formed on the surface of the color solid-state image pickup device. In the manufacturing method, in order to confirm the accuracy of the pattern of each dye layer under the conditions of the photolithography method, at the same time as the formation of each dye layer, the light receiving region of the unit chip in which the color solid-state imaging device is formed A method of manufacturing a color solid-state image pickup device, comprising forming a plurality of types of resolution check patterns having different thicknesses on a peripheral marginal portion made of the same material for each dye layer.
素層のパターンの主たる部分の太さと同一又は近似する
太さのものを１種類含むものからなる特許請求の範囲第
１項記載の製造方法。2. The manufacturing method according to claim 1, wherein the plurality of types of resolution check patterns include one having a thickness that is the same as or similar to the thickness of the main portion of the pattern of each dye layer.
た短冊状の組と、これに直交する方向に並列した短冊状
の組とからなる特許請求の範囲第１項記載の製造方法。3. The manufacturing method according to claim 1, which comprises a strip-shaped set in which the resolution check patterns are arranged in parallel in one direction and a strip-shaped set in which the resolution check patterns are arranged in parallel in a direction orthogonal thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29678987A JPH0638122B2 (en) | 1987-11-25 | 1987-11-25 | Method for manufacturing color solid-state image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29678987A JPH0638122B2 (en) | 1987-11-25 | 1987-11-25 | Method for manufacturing color solid-state image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01137201A JPH01137201A (en) | 1989-05-30 |
| JPH0638122B2 true JPH0638122B2 (en) | 1994-05-18 |
Family
ID=17838150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29678987A Expired - Lifetime JPH0638122B2 (en) | 1987-11-25 | 1987-11-25 | Method for manufacturing color solid-state image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638122B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1231647B1 (en) * | 2001-02-08 | 2008-07-23 | STMicroelectronics Limited | Reference data coding in solid state image sensors |
-
1987
- 1987-11-25 JP JP29678987A patent/JPH0638122B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01137201A (en) | 1989-05-30 |
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