JPH0637440A - Reflow soldering - Google Patents
Reflow solderingInfo
- Publication number
- JPH0637440A JPH0637440A JP19043792A JP19043792A JPH0637440A JP H0637440 A JPH0637440 A JP H0637440A JP 19043792 A JP19043792 A JP 19043792A JP 19043792 A JP19043792 A JP 19043792A JP H0637440 A JPH0637440 A JP H0637440A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- circuit board
- reflow
- printed circuit
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品のプリント基
板への表面実装において半田付け性の良いリフロー半田
付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering method having good solderability in surface mounting electronic parts on a printed circuit board.
【０００２】[0002]
【従来の技術】近年、電子部品のプリント基板への表面
実装は、電子部品の小型化，高密度実装化にともない、
抵抗やコンデンサでは１mm×０．５mmのサイズのもの
（以下、１００５チップ部品という）が使用され始めて
いる。また、特定フロンによるプリント基板洗浄の全廃
に向け、無洗浄クリーム半田の開発が盛んに進められて
おり、これに対応する工法として従来の大気中でのリフ
ロー半田付け方法に代わり、窒素雰囲気中でのリフロー
半田付け方法が用いられつつある。2. Description of the Related Art In recent years, surface mounting of electronic parts on a printed circuit board has been accompanied by downsizing and high density mounting of electronic parts.
Resistors and capacitors having a size of 1 mm x 0.5 mm (hereinafter referred to as 1005 chip parts) are beginning to be used. In addition, the development of non-cleaning cream solder is being actively pursued toward the complete abolition of printed circuit board cleaning with specific CFCs, and as a method corresponding to this, instead of the conventional reflow soldering method in the atmosphere, a nitrogen atmosphere is used. The reflow soldering method is being used.
【０００３】以下に従来のリフロー半田付け方法につい
て説明する。まずプリント基板のランドパターンにクリ
ーム半田を印刷し、部品を搭載したプリント基板を図２
に示すような半田付け時のプリント基板の温度一時間曲
線となるリフロー炉に投入させるとプリント基板の温度
が室温から予備加熱温度Ｔ1まで上昇し、その温度Ｔ1で
約６０秒間保持される。このときクリーム半田中のフラ
ックスがにじみだし、プリント基板および部品の酸化膜
を除去する効果（活性化作用）が生じる。その後、温度
が急激に上昇し、半田溶接温度Ｔ2で半田が溶融した
後、リフロー温度Ｔ3をピークに室温まで低下し、半田
付けが完了する。大気中のリフロー半田付け方法では予
備加熱時のプリント基板および部品の再酸化を防ぐた
め、予備加熱温度Ｔ1は活性化作用の最適温度よりも２
０〜３０℃低めの１５０〜１６０℃になるように設定さ
れていた。また、半田溶融温度Ｔ2は通常１８３℃であ
り、リフロー温度Ｔ3は通常２２０〜２３０℃になるよ
うに設定されていた。A conventional reflow soldering method will be described below. First, cream solder is printed on the land pattern of the printed circuit board, and the printed circuit board on which the parts are mounted is shown in FIG.
When the temperature of the printed circuit board during soldering as shown in Fig. 1 is put into a reflow oven which has a one-hour curve, the temperature of the printed circuit board rises from room temperature to the preheating temperature T 1 and is maintained at that temperature T 1 for about 60 seconds. . At this time, the flux in the cream solder oozes out, and an effect (activation effect) of removing the oxide film of the printed circuit board and the parts occurs. After that, the temperature rapidly rises, the solder is melted at the solder welding temperature T 2 , and then the reflow temperature T 3 reaches a peak and the temperature is lowered to room temperature, and the soldering is completed. In the reflow soldering method in the atmosphere, the preheating temperature T 1 is set to 2 above the optimum activation temperature in order to prevent reoxidation of the printed circuit board and parts during preheating.
It was set to 150 to 160 ° C, which is lower than 0 to 30 ° C. Further, the solder melting temperature T 2 is usually 183 ° C., and the reflow temperature T 3 is usually set to 220 to 230 ° C.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記の従
来の方法では、予備加熱温度Ｔ1が活性化作用の最適温
度よりも低いので、半田濡れ不足が生じるという問題
点、また、予備加熱温度Ｔ 1から半田溶融温度Ｔ2にかけ
て急激に温度が上昇するので、半田溶融時のプリント基
板上の温度ばらつきが大きくなり、チップ部品の左右電
極の半田溶融に時間差が生じて、チップ立ちが生じると
いう問題点を有していた。SUMMARY OF THE INVENTION
In the conventional method, the preheating temperature T1Is the optimum temperature for activation
It is less than the degree, so insufficient solder wetting occurs
Point, preheating temperature T 1To solder melting temperature T2Nikake
As the temperature rises rapidly,
The temperature variation on the board becomes large, and
If there is a time lag in the solder melting of the poles
I had a problem.
【０００５】本発明は上記従来の問題点を解決するの
で、半田濡れ性を良化し、かつチップ立ちを防止したリ
フロー半田付け方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a reflow soldering method which improves solder wettability and prevents chip rising.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明のリフロー半田付け方法は、ランドパターンに
クリーム半田を印刷し、部品を搭載したプリント基板を
窒素雰囲気中で、かつ予備加熱温度をフラックスがプリ
ント基板および部品の酸化膜を除去する最適温度に設定
し、予備加熱温度からリフロー温度までを連続的に温度
上昇させるように設定したリフロー炉で半田付けする方
法である。In order to achieve this object, a reflow soldering method of the present invention is a method of printing cream solder on a land pattern, printing a component-mounted printed circuit board in a nitrogen atmosphere and at a preheating temperature. Is a method of soldering in a reflow furnace in which the flux is set to the optimum temperature for removing the oxide film of the printed circuit board and the parts, and the temperature is continuously raised from the preheating temperature to the reflow temperature.
【０００７】[0007]
【作用】この方法において、予備加熱時の再酸化がなく
なり、かつ半田溶融時のプリント基板上の温度ばらつき
が小さくなる。In this method, reoxidation at the time of preheating is eliminated, and temperature variation on the printed circuit board at the time of melting the solder is reduced.
【０００８】[0008]
【実施例】以下本発明の一実施例について説明する。EXAMPLE An example of the present invention will be described below.
【０００９】本実施例の特徴とするところは、前述従来
の方法に窒素雰囲気中で予備加熱温度をフラックスの活
性化作用の最適温度に設定し、図１に示すようなリフロ
ー時のプリント基板の温度−時間曲線となるリフロー炉
で処理することにある。すなわちリフロー炉に投入され
たプリント基板の温度は、予備加熱温度Ｔ1の最初から
リフロー温度Ｔ3にかけて、連続的に徐々に上昇するの
で、プリント基板上の温度ばらつきが小さくなる。The feature of the present embodiment is that the preheating temperature is set to the optimum temperature of the flux activating action in the nitrogen atmosphere in the above-mentioned conventional method, and the printed circuit board at the time of reflow as shown in FIG. It is to process in a reflow furnace that has a temperature-time curve. That is, the temperature of the printed circuit board put into the reflow furnace continuously and gradually increases from the beginning of the preheating temperature T 1 to the reflow temperature T 3 , so that the temperature variation on the printed circuit board becomes small.
【００１０】本実施例によるリフロー半田付け方法のチ
ップ立ちおよび半田濡れ不足の各発生率と比較例１およ
び２で示した従来のリフロー半田付け方法のチップ立ち
および半田濡れ不足の各発生率を（表１）に比較して示
している。The occurrence rates of chip standing and insufficient solder wetting in the reflow soldering method according to the present embodiment and the occurrence rates of chip standing and insufficient solder wetting in the conventional reflow soldering methods shown in Comparative Examples 1 and 2 are shown below. It is shown in comparison with Table 1).
【００１１】[0011]
【表１】 [Table 1]
【００１２】プリント基板上にクリーム半田を印刷し、
１００５チップコンデンサと６ピン・トランジスタを装
着し、（表１）に示したプリント基板の加熱条件を異に
した実施例と比較例１，２におけるチップ立ちおよび半
田濡れ不足の結果を示した。この（表１）から明らかな
ように、本実施例による半田付け方法は、チップ立ちと
半田濡れ不足の発生率を減少させる点で優れた効果が得
られる。Printing cream solder on the printed circuit board,
The results of chip standing and insufficient solder wetting in Examples and Comparative Examples 1 and 2 in which a 1005 chip capacitor and a 6-pin transistor were mounted and the heating conditions of the printed circuit board shown in (Table 1) were different were shown. As is clear from this (Table 1), the soldering method according to the present embodiment has an excellent effect in reducing the occurrence rate of chip standing and insufficient solder wetting.
【００１３】[0013]
【発明の効果】以上の実施例の説明からも明らかなよう
に本発明は、窒素雰囲気中で、かつ予備加熱温度をフラ
ックスがプリント基板および部品の酸化膜を除去する最
適温度に設定し、予備加熱温度からリフロー温度までを
連続的に温度上昇させるように設定したリフロー炉で処
理する方法により、半田濡れ性を良化し、かつチップ立
ちを防止した優れたリフロー半田付け方法を実現できる
ものである。As is apparent from the above description of the embodiments, the present invention provides a preliminary heating temperature in a nitrogen atmosphere at the optimum temperature at which the flux removes the oxide film of the printed circuit board and parts, It is possible to realize an excellent reflow soldering method that improves solder wettability and prevents chip standing by using a method of processing in a reflow furnace set to continuously raise the temperature from the heating temperature to the reflow temperature. .
【図１】本発明の一実施例のリフロー半田付け方法の半
田付け時のプリント基板の温度−時間曲線図FIG. 1 is a temperature-time curve diagram of a printed circuit board during soldering in a reflow soldering method according to an embodiment of the present invention.
【図２】従来のリフロー半田付け方法の半田付け時のプ
リント基板の温度−時間曲線図FIG. 2 is a temperature-time curve diagram of a printed circuit board during soldering according to a conventional reflow soldering method.
Ｔ1 予備加熱温度 Ｔ2 半田溶融温度 Ｔ3 リフロー温度T 1 preheating temperature T 2 solder melting temperature T 3 reflow temperature
Claims (1)
し、部品を搭載したプリント基板を窒素雰囲気中で、か
つ予備加熱温度をフラックスが前記プリント基板および
前記部品の酸化膜を除去する温度に設定し、予備加熱温
度からリフロー温度までを連続的に温度上昇させるよう
に設定したリフロー炉で半田付けするリフロー半田付け
方法。1. A solder paste is printed on a land pattern, a printed board on which a component is mounted is set in a nitrogen atmosphere, and a preheating temperature is set to a temperature at which flux removes an oxide film of the printed board and the component, A reflow soldering method of soldering in a reflow furnace set to continuously raise the temperature from the preheating temperature to the reflow temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043792A JPH0637440A (en) | 1992-07-17 | 1992-07-17 | Reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043792A JPH0637440A (en) | 1992-07-17 | 1992-07-17 | Reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0637440A true JPH0637440A (en) | 1994-02-10 |
Family
ID=16258125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19043792A Pending JPH0637440A (en) | 1992-07-17 | 1992-07-17 | Reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0637440A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
-
1992
- 1992-07-17 JP JP19043792A patent/JPH0637440A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
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