JPH06349725A - Developing device - Google Patents

Developing device

Info

Publication number
JPH06349725A
JPH06349725A JP16420593A JP16420593A JPH06349725A JP H06349725 A JPH06349725 A JP H06349725A JP 16420593 A JP16420593 A JP 16420593A JP 16420593 A JP16420593 A JP 16420593A JP H06349725 A JPH06349725 A JP H06349725A
Authority
JP
Japan
Prior art keywords
developing solution
substrate
developing
nozzle
supplied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16420593A
Other languages
Japanese (ja)
Inventor
Izuru Izeki
出 井関
Kazuo Kise
一夫 木瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP16420593A priority Critical patent/JPH06349725A/en
Publication of JPH06349725A publication Critical patent/JPH06349725A/en
Pending legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE:To apply a developing solution to the surface of a substrate in a uniform thickness with a simple constitution. CONSTITUTION:After supplying a developing solution L to the surface of a substrate 1 from a nozzle 2, the solution L is spread to a uniform thickness by leveling the solution L by moving a sweep bar 4 in parallel with the surface of the substrate 1 by means of a uniaxial roller 5. Therefore, uneven supply of developing solution does not occur on the surface of the substrate 1 and accurate development can be performed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体基板や液晶用又
はフォトマスク用ガラス基板等の薄板状基板(以下、単
に「基板」という。)の表面に塗布され所定のパターン
に露光されたレジスト膜を現像する現像装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a resist coated on a surface of a thin substrate (hereinafter simply referred to as "substrate") such as a semiconductor substrate or a glass substrate for liquid crystal or photomask and exposed in a predetermined pattern. The present invention relates to a developing device for developing a film.

【0002】[0002]

【従来の技術】例えば、液晶基板の製造においては、ガ
ラス基板表面に塗布されたレジスト膜を所定のパターン
に露光した後、現像液により現像するようになってい
る。このような現像工程おいて当該レジスト膜を現像液
に接触させる方法として、基板表面にノズルから現像液
を散布し、図9に示すように基板1の表面に現像液Lの
表面張力を利用して液盛り(パドル)を形成する方式が
ある(以下、「パドル方式」という。)。このパドル方
式による現像においては、多量の現像液を基板表面にシ
ャワー状に供給しながら現像を行なうシャワー方式のも
のや、また、現像液を液槽に貯溜して、当該液槽内に基
板を浸漬させるディップ方式のものに比較して、1回の
現像に要する現像液の量を大幅に節約することができ、
メンテナンスコストを低く押えることができるという利
点がある。
2. Description of the Related Art For example, in the manufacture of a liquid crystal substrate, a resist film coated on the surface of a glass substrate is exposed in a predetermined pattern and then developed with a developing solution. As a method of bringing the resist film into contact with the developing solution in such a developing step, the developing solution is sprayed from the nozzle on the surface of the substrate, and the surface tension of the developing solution L is used on the surface of the substrate 1 as shown in FIG. There is a method of forming a liquid puddle (paddle) (hereinafter referred to as "paddle method"). In the development by the paddle method, a shower method is used in which a large amount of developing solution is supplied to the surface of the substrate in a shower shape for development, or the developing solution is stored in a liquid tank and the substrate is stored in the liquid tank. Compared to the dipping method of dipping, the amount of developer required for one development can be greatly saved.
There is an advantage that the maintenance cost can be kept low.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記パ
ドル方式の現像方法にあっては、現像液がその表面張力
のみによって基板表面上に保持されるので、当該現像液
を通常のノズルにより基板表面に供給して均一な厚さに
盛るのが困難であるという問題があった。このような問
題を解決するものとして、特開平5−13320号公報
に開示された処理液塗布方法が公知である。この塗布方
法は、基板の幅とほぼ同じ長さを有する横長の液体供給
ノズルの内部に矩形容器状の液体収納部を設けるととも
に、その下方に当該液体収納部に連通する多数の細管を
配列して設け、処理液が当該多数の細管から基板表面上
に均一に滲み出すように形成されている。しかし、この
ような特殊なノズルにおいては、多数の細管の形成にお
いて高い加工精度が要求されるとともに、処理液の中に
塵埃などの異物が混入した場合には、当該細管が閉塞し
て、もはや基板表面への均一な散布は困難となる。
However, in the paddle type developing method, since the developing solution is held on the substrate surface only by its surface tension, the developing solution is applied to the substrate surface by an ordinary nozzle. There is a problem that it is difficult to supply and form a uniform thickness. As a solution to such a problem, a treatment liquid coating method disclosed in Japanese Patent Laid-Open No. 5-13320 is known. In this coating method, a rectangular container-shaped liquid storage portion is provided inside a horizontally long liquid supply nozzle having a length substantially the same as the width of the substrate, and a large number of thin tubes communicating with the liquid storage portion are arranged below the liquid storage portion. The processing liquid is formed so as to uniformly exude from the large number of thin tubes onto the surface of the substrate. However, in such a special nozzle, high processing accuracy is required in forming a large number of thin tubes, and when foreign substances such as dust are mixed in the processing liquid, the thin tubes are blocked and no longer exist. Uniform spraying on the substrate surface becomes difficult.

【0004】本発明は、上述のような問題を解消し、簡
易な構成により基板表面に現像液をムラなく均一な厚さ
に盛ることができるパドル方式の現像装置を提供するこ
とを目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide a paddle type developing device capable of depositing a developing solution on the surface of a substrate with a uniform thickness without unevenness. .

【0005】[0005]

【課題を解決するための手段】上記目的を達成するた
め、請求項1に係る現像装置は、基板上に塗布され所定
のパターンに露光されたレジスト膜を現像する現像装置
において、前記基板の表面に現像液を供給する現像液供
給手段と、前記現像液が前記基板表面の全体に均一に行
き渡るように、前記供給された現像液を拡散させる現像
液拡散手段と、を備える。
In order to achieve the above object, the developing device according to claim 1 is a developing device for developing a resist film coated on a substrate and exposed in a predetermined pattern, wherein the surface of the substrate is A developing solution supplying means for supplying a developing solution to the substrate, and a developing solution diffusing means for diffusing the supplied developing solution so that the developing solution is evenly distributed over the entire surface of the substrate.

【0006】また、請求項2に係る現像装置では、請求
項1における現像液拡散手段が、前記基板の表面と所定
の間隔をおいて前記基板表面に平行な方向に移動する棒
状のならし部材からなる。
Further, in a developing device according to a second aspect, the developing solution diffusing means in the first aspect is a rod-shaped leveling member which moves in a direction parallel to the surface of the substrate with a predetermined distance from the surface of the substrate. Consists of.

【0007】さらに、請求項3に係る現像装置は、請求
項1における現像液供給手段が、前記現像液を吐出しつ
つ基板表面に沿って移動する現像液吐出ノズルを備える
とともに、前記現像液拡散手段は、前記現像液吐出ノズ
ルによって基板表面に供給された現像液を直ちに拡散さ
せるべく、前記現像液吐出ノズルの後方をその移動方向
と同じ方向に移動するようになっている。
Further, in a developing device according to a third aspect, the developing solution supply means according to the first aspect includes a developing solution discharge nozzle which moves along the surface of the substrate while discharging the developing solution, and the developing solution diffusion means. The means is arranged to move behind the developing solution discharge nozzle in the same direction as its moving direction so as to immediately diffuse the developing solution supplied to the substrate surface by the developing solution discharge nozzle.

【0008】[0008]

【作用】請求項1の発明によれば、現像液供給手段によ
って基板表面に供給された現像液は、現像液拡散手段に
よって前記基板表面の全体に均一に行き渡るように拡散
される。
According to the first aspect of the present invention, the developing solution supplied to the surface of the substrate by the developing solution supply means is diffused by the developing solution diffusing means so as to be evenly distributed over the entire surface of the substrate.

【0009】請求項2の発明によれば、棒状のならし部
材を所定間隔をおいて基板表面に平行に移動させること
により、基板表面に供給された現像液が均一な厚さにな
らされ、ムラがなくなる。
According to the second aspect of the present invention, by moving the rod-shaped leveling members in parallel with the surface of the substrate at a predetermined interval, the developer supplied to the surface of the substrate is leveled to a uniform thickness. The unevenness disappears.

【0010】請求項3の発明によれば、現像液拡散手段
は、現像液供給手段の現像液吐出ノズルの後方を、当該
ノズルと同方向に移動し、供給された現像液を直ちに拡
散するので、レジスト膜と現像液との接触ムラが即時に
解消される。
According to the third aspect of the invention, the developing solution diffusing means moves behind the developing solution discharge nozzle of the developing solution supply means in the same direction as the nozzle, and immediately diffuses the supplied developing solution. The uneven contact between the resist film and the developing solution is immediately eliminated.

【0011】[0011]

【実施例】以下、図面を参照して本発明の実施例を詳細
に説明するが、これにより本発明の技術的範囲が制限さ
れるものではない。
Embodiments of the present invention will now be described in detail with reference to the drawings, but the technical scope of the present invention is not limited thereby.

【0012】図1は、この発明に係る現像装置の第1の
実施例の概要を示す斜視図である。水平に載置された角
型の基板1の上方には現像液Lを供給するためのノズル
2が3本配置され、現像液供給装置3から供給された適
量の現像液Lが、当該ノズル2から基板1の表面に散布
される。4は、スィープバー(ならし部材)であって、
その基板1の幅wとほぼ同じか、それより長く形成さ
れ、このスィープバー4を基板1の表面より1mm〜3
mmほどの間隔をおいて、ボールネジ送り機構で形成さ
れた一軸ローダ5により当該基板1の表面に平行に矢印
A方向に移動させるようになっている。図2は図1にお
ける基板1部分の縦断面図を示すものであって、スィー
プバー4が基板1の表面に盛られた現像液Lを順になら
して拡散させていき、基板1の表面全体に渡って現像液
Lが均一な厚さで行き渡る様子を示すものである。
FIG. 1 is a perspective view showing the outline of the first embodiment of the developing device according to the present invention. Three nozzles 2 for supplying the developing solution L are arranged above the horizontally mounted rectangular substrate 1, and an appropriate amount of the developing solution L supplied from the developing solution supply device 3 is applied to the nozzle 2. To the surface of the substrate 1. 4 is a sweep bar (leveling member),
The width w of the substrate 1 is substantially equal to or longer than the width w of the substrate 1.
The uniaxial loader 5 formed by a ball screw feeding mechanism is moved in parallel with the surface of the substrate 1 in the direction of arrow A at intervals of about mm. FIG. 2 is a vertical cross-sectional view of the substrate 1 portion in FIG. 1, in which the sweep bar 4 sequentially spreads the developing solution L deposited on the surface of the substrate 1 to diffuse it over the entire surface of the substrate 1. It shows how the developing solution L is spread over a uniform thickness.

【0013】このようなスィープバー4の作用により、
現像液Lがノズル2から基板1の表面に適当に供給され
ても、確実に均一な厚さの液盛りを形成することでき、
ムラなくレジスト膜の現像を行なうことが可能となる。
By the action of the sweep bar 4 as described above,
Even if the developing solution L is appropriately supplied from the nozzle 2 to the surface of the substrate 1, it is possible to surely form a puddle having a uniform thickness,
It is possible to develop the resist film evenly.

【0014】図3は、本発明に係る現像装置の第2の実
施例を示すものである。図1の第1の実施例においては
スィープバー4を直線方向に移動させているが、この第
2の実施例においては、スィープバー4を回転軸6によ
って保持し、この回転軸6を図示しない駆動モータによ
り回動させることにより、基板1の表面の現像液Lをな
らすようにするようにしている。この実施例において
は、スィープバー4の長さを基板1の対角線より長く形
成する必要があるが、駆動機構が第1の実施例に比較し
て簡易に構成できるという利点がある。
FIG. 3 shows a second embodiment of the developing device according to the present invention. In the first embodiment shown in FIG. 1, the sweep bar 4 is moved in the linear direction, but in the second embodiment, the sweep bar 4 is held by the rotary shaft 6, and the rotary shaft 6 is held by a drive motor (not shown). The developer L on the surface of the substrate 1 is smoothed by rotating the developing solution L. In this embodiment, the length of the sweep bar 4 needs to be formed longer than the diagonal line of the substrate 1, but there is an advantage that the drive mechanism can be configured more simply than in the first embodiment.

【0015】図4は、本発明に係る現像装置の第3の実
施例の構成を示す斜視図であり、図5は、その側面図で
ある。この第3の実施例においては、現像液供給のため
のノズルを水平方向に長い吐出部分を有するフラットノ
ズル7とし、現像液Lの基板1への供給段階においてで
きるだけ均一に盛るように工夫されている。フラットノ
ズル7は、例えば図8の縦断面図に示すように内部に現
像液Lの貯溜部71を備えてその長手方向にスリット状
の吐出部72を有しており、当該貯溜部71に図示しな
い現像液供給チューブを介して現像液供給装置3(図
1)から現像液Lを供給することにより、スリット状吐
出部72から基板1表面上に広い幅にわたり一律に現像
液Lが供給される。このフラットノズル7は、その端部
において回転軸8によって水平に保持され、図示しない
駆動モータにより回動される。基板1もスピンチャック
9(図5)で水平に保持されており、現像液Lを供給す
る際には、基板1を回転させながら、フラットノズル7
を回動させてスリット状吐出部72から基板1表面に現
像液Lを吐出することにより短時間で基板1の全面にわ
たり現像液Lの供給を行なう。基板1の回転を継続しな
がら、上記フラットノズル7による現像液供給動作と相
前後して、スィープバー4を回動させることにより、現
像液拡散動作を行なう。
FIG. 4 is a perspective view showing the structure of a third embodiment of the developing device according to the present invention, and FIG. 5 is a side view thereof. In the third embodiment, the nozzle for supplying the developing solution is a flat nozzle 7 having a discharge portion which is long in the horizontal direction, and is devised so as to be spread as uniformly as possible in the step of supplying the developing solution L to the substrate 1. There is. For example, as shown in the vertical cross-sectional view of FIG. 8, the flat nozzle 7 includes a reservoir 71 for the developer L therein and a slit-shaped discharge portion 72 in the longitudinal direction thereof, and the reservoir 71 is shown in the drawing. By supplying the developing solution L from the developing solution supply device 3 (FIG. 1) via the developing solution supply tube, the developing solution L is uniformly supplied from the slit-shaped ejection portion 72 over the surface of the substrate 1 over a wide width. . The flat nozzle 7 is held horizontally by a rotary shaft 8 at its end and is rotated by a drive motor (not shown). The substrate 1 is also held horizontally by the spin chuck 9 (FIG. 5), and when the developing solution L is supplied, the flat nozzle 7 is rotated while rotating the substrate 1.
Is rotated to eject the developing solution L from the slit-shaped ejecting portion 72 onto the surface of the substrate 1 to supply the developing solution L over the entire surface of the substrate 1 in a short time. While continuing the rotation of the substrate 1, the developer diffusion operation is performed by rotating the sweep bar 4 before and after the developer supply operation by the flat nozzle 7.

【0016】なお、この実施例においては、基板1を回
転させながら現像液供給動作および現像液拡散動作を行
なうので、スィープバー4やフラットノズル7の水平方
向の長さは、それぞれ回転軸6、8から基板1の回転中
心までの距離より若干長めに設定すればよい。また、ス
ピンチャック9は、基板1を真空吸着により保持して回
転する公知のものでよい。
In this embodiment, since the developing solution supplying operation and the developing solution diffusing operation are carried out while the substrate 1 is rotated, the horizontal lengths of the sweep bar 4 and the flat nozzle 7 are the rotating shafts 6 and 8, respectively. It may be set to be slightly longer than the distance from the center of rotation of the substrate 1. The spin chuck 9 may be a known one that holds and rotates the substrate 1 by vacuum suction.

【0017】図6は、本発明に係る現像装置の第4の実
施例の構成を示す斜視図であり、図7は、その基板1部
分での縦断面図である。この第4の実施例においては、
現像液Lを基板1表面に供給したあとに直ちにスィープ
バー4により拡散動作を行ない、これにより現像液Lの
分布が不均一である時間がほとんどないように工夫して
いる。すなわち、基板1の幅wとほぼ同じ長さを有する
フラットノズル7を図示しない一軸ローダにより基板1
に平行に移動させながら、現像液Lを基板1の表面に供
給するとともに、当該フラットノズル7の、その進行方
向に対して後方の位置には、保持部材10を介してスィ
ープバー4が付設されており、図7の縦断面図に示すよ
うにフラットノズル7により基板1上に供給された現像
液Lは、当該フラットノズル7に追随してその後方を移
動するスィープバー4によって直ちにならされて拡散さ
れるようになっている。これにより現像液Lの分布が不
均一である状態が直ぐに解消され均一性の高い現像が可
能となる。
FIG. 6 is a perspective view showing the construction of the fourth embodiment of the developing device according to the present invention, and FIG. 7 is a vertical sectional view of the substrate 1 portion thereof. In this fourth embodiment,
Immediately after the developing solution L is supplied to the surface of the substrate 1, a diffusing operation is performed by the sweep bar 4, so that the developing solution L is devised so that there is almost no uneven distribution time. That is, the flat nozzle 7 having a length substantially equal to the width w of the substrate 1 is attached to the substrate 1 by a uniaxial loader (not shown).
The developing solution L is supplied to the surface of the substrate 1 while being moved in parallel with, and a sweep bar 4 is attached via a holding member 10 at a position behind the flat nozzle 7 in the traveling direction. As shown in the longitudinal sectional view of FIG. 7, the developer L supplied onto the substrate 1 by the flat nozzle 7 is immediately smoothed and diffused by the sweep bar 4 which follows the flat nozzle 7 and moves behind the flat nozzle 7. It has become so. As a result, the state where the distribution of the developing solution L is non-uniform is immediately resolved, and highly uniform development becomes possible.

【0018】なお、この第4の実施例においては、フラ
ットノズル7が直線移動するように形成しているが、図
3に示すように回転軸に付設して回転動作を行なうよう
にしてもよい。また、スィープバー4をフラットノズル
7の後方に付設するのではなく、別の駆動手段によりフ
ラットノズル7の後方を独自に移動させるようにしても
よい。
In the fourth embodiment, the flat nozzle 7 is formed so as to move linearly. However, as shown in FIG. 3, it may be attached to a rotary shaft to perform a rotary operation. . Further, the sweep bar 4 may not be attached to the rear of the flat nozzle 7, but the rear of the flat nozzle 7 may be independently moved by another driving means.

【0019】以上の実施例においては、スィープバー4
は断面が円形のロール状のものにしているが、基板1と
平行な直線部を有するものであれば板状のものでも、ま
た、その他の形状のものでも構わない。
In the above embodiment, the sweep bar 4
Although the roll has a circular cross section, it may have a plate shape or any other shape as long as it has a linear portion parallel to the substrate 1.

【0020】また、被処理基板は角型のものに限らず、
例えば円形のウエハでも同様に適用できる。
The substrate to be processed is not limited to the rectangular type,
For example, a circular wafer can be similarly applied.

【0021】現像液拡散手段は、上述のようにスィープ
バー4を直接現像液Lに接触させるものに限らず、場合
によっては、スリット状のノズルからチッソガスなどの
不活性ガスを現像液Lの表面に吹き付ける方法や、基板
1に対して水平方向に細かな振動を加える方法により、
非接触な状態で現像液Lを拡散させるようにすることも
可能である。
The developing solution diffusing means is not limited to the one in which the sweep bar 4 is brought into direct contact with the developing solution L as described above, but in some cases, an inert gas such as nitrogen gas is applied to the surface of the developing solution L from a slit nozzle. By the method of spraying or the method of applying fine vibration to the substrate 1 in the horizontal direction,
It is also possible to diffuse the developing solution L in a non-contact state.

【0022】[0022]

【発明の効果】以上述べたように、請求項1の発明によ
れば、現像液供給手段によって基板表面に供給された現
像液は、現像液拡散手段によって前記基板表面の全体に
均一に行き渡るように拡散されるので、均一な現像液の
液盛りが確実に形成され、現像液の消費量を少なくしな
がら、均一な現像処理を可能にする。
As described above, according to the first aspect of the present invention, the developing solution supplied to the surface of the substrate by the developing solution supplying means is uniformly spread over the entire surface of the substrate by the developing solution diffusing means. As a result, the uniform developing solution puddle is surely formed, and the uniform developing process is possible while reducing the consumption of the developing solution.

【0023】請求項2の発明によれば、棒状のならし部
材を所定間隔をおいて基板表面に平行に移動させること
により、基板表面に供給された現像液が均一な厚さにな
らすようにしているので、簡易な構成でありながら均一
な厚さの現像液の液盛りが確実に実現される。
According to the second aspect of the present invention, the rod-shaped leveling members are moved in parallel with the surface of the substrate at predetermined intervals so that the developing solution supplied to the surface of the substrate has a uniform thickness. Therefore, the puddle of the developing solution having a uniform thickness can be surely realized with a simple structure.

【0024】請求項3の発明によれば、現像液拡散手段
は、現像液吐出ノズルの後方を、当外ノズルと同方向に
移動し、供給された現像液を直ぐに拡散するので、レジ
スト膜と現像液との接触ムラが即時に解消され、精度の
よい現像処理を可能にする。
According to the third aspect of the present invention, the developing solution diffusing means moves behind the developing solution discharge nozzle in the same direction as the external nozzle, and immediately diffuses the supplied developing solution. The uneven contact with the developing solution is immediately eliminated, which enables highly accurate development processing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例に係る現像装置の構成を
示す概要図である。
FIG. 1 is a schematic diagram showing a configuration of a developing device according to a first embodiment of the present invention.

【図2】図1の基板部の縦断面図である。FIG. 2 is a vertical cross-sectional view of the substrate unit shown in FIG.

【図3】本発明の第2の実施例に係る現像装置の構成を
示す斜視図である。
FIG. 3 is a perspective view showing a configuration of a developing device according to a second embodiment of the present invention.

【図4】本発明の第3の実施例に係る現像装置の構成を
示す斜視図である。
FIG. 4 is a perspective view showing a configuration of a developing device according to a third embodiment of the present invention.

【図5】図3の実施例における側面図である。FIG. 5 is a side view of the embodiment shown in FIG.

【図6】本発明の第4の実施例に係る現像装置の構成を
示す斜視図である。
FIG. 6 is a perspective view showing a configuration of a developing device according to a fourth embodiment of the present invention.

【図7】図6の基板部の縦断面図である。FIG. 7 is a vertical cross-sectional view of the substrate portion shown in FIG.

【図8】フラットノズルの内部構造を示す一部断面図で
ある。
FIG. 8 is a partial cross-sectional view showing the internal structure of a flat nozzle.

【図9】基板に現像液を液盛りした状態を示す図であ
る。
FIG. 9 is a diagram showing a state where a substrate is filled with a developing solution.

【符号の説明】[Explanation of symbols]

1 基板 2 ノズル 3 現像液供給装置 4 スィープバー 5 一軸ローダ 6、8 回転軸 7 フラットノズル 9 スピンチャック L 現像液 1 Substrate 2 Nozzle 3 Developer Supplying Device 4 Sweep Bar 5 Uniaxial Loader 6, 8 Rotating Axis 7 Flat Nozzle 9 Spin Chuck L Developer

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板上に塗布され所定のパターンに露光
されたレジスト膜を現像する現像装置において、 前記基板の表面に現像液を供給する現像液供給手段と、 前記現像液が前記基板表面の全体に均一に行き渡るよう
に、前記供給された現像液を拡散させる現像液拡散手段
と、を備えることを特徴とする現像装置。
1. A developing device for developing a resist film coated on a substrate and exposed in a predetermined pattern, comprising: a developing solution supplying means for supplying a developing solution to the surface of the substrate; A developing solution diffusing means for diffusing the supplied developing solution so that the developing solution is evenly distributed over the entire developing device.
【請求項2】 前記現像液拡散手段は、前記基板の表面
と所定の間隔をおいて前記基板表面に平行な方向に移動
する棒状のならし部材からなることを特徴とする請求項
1記載の現像装置。
2. The developing solution diffusing means comprises a rod-shaped leveling member that moves in a direction parallel to the surface of the substrate at a predetermined distance from the surface of the substrate. Development device.
【請求項3】 前記現像液供給手段は、前記現像液を吐
出しつつ基板表面に沿って移動する現像液吐出ノズルを
備えるとともに、前記現像液拡散手段は、前記現像液吐
出ノズルによって基板表面に供給された現像液を直ちに
拡散させるべく、前記現像液吐出ノズルの後方をその移
動方向と同じ方向に移動することを特徴とする請求項1
記載の現像装置。
3. The developing solution supply means includes a developing solution discharge nozzle that moves along the substrate surface while discharging the developing solution, and the developing solution diffusing means applies the developing solution discharge nozzle to the substrate surface by the developing solution discharge nozzle. 2. The rear side of the developing solution discharge nozzle is moved in the same direction as the moving direction so as to immediately diffuse the supplied developing solution.
The developing device described.
JP16420593A 1993-06-08 1993-06-08 Developing device Pending JPH06349725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16420593A JPH06349725A (en) 1993-06-08 1993-06-08 Developing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16420593A JPH06349725A (en) 1993-06-08 1993-06-08 Developing device

Publications (1)

Publication Number Publication Date
JPH06349725A true JPH06349725A (en) 1994-12-22

Family

ID=15788669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16420593A Pending JPH06349725A (en) 1993-06-08 1993-06-08 Developing device

Country Status (1)

Country Link
JP (1) JPH06349725A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182257A (en) * 2008-01-31 2009-08-13 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2015002184A (en) * 2013-06-13 2015-01-05 三菱電機株式会社 Method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182257A (en) * 2008-01-31 2009-08-13 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2015002184A (en) * 2013-06-13 2015-01-05 三菱電機株式会社 Method of manufacturing semiconductor device
US9188872B2 (en) 2013-06-13 2015-11-17 Mitsubishi Electric Corporation Method for manufacturing semiconductor device

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