JPH06349556A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an IC socket in which any contact part can slide favorably along the surface of an IC lead by the cooperation of the first spring and the second spring held in the contact. CONSTITUTION:A contact 4 has the first spring 6, which pushes the contact 10 against the surface of an IC lead 3, and the second spring 8, which is supported by this first spring 6, and this second spring 8 is provided with the said contact 10. In this IC socket, the elastic force is set so that the second spring 8 may flex with the elastic force of the first spring 6 after the accumulated elastic force of the first spring 6 pushes the contact 10 against the surface of the IC lead, and the contact 10 is arranged so that it may side from above to below on the surface of a lead, accompanying the flexion of this second spring 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket in which the elastic force accumulated in a contact acts on the surface of a lead to obtain a pressure contact.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. 63-34874 discloses that a contact portion is provided at an end of a spring portion of a contact and the contact is displaced rearward against the elasticity of the spring portion. By storing the elastic force and displacing the contact forward according to the stored elastic force, the contact portion is brought into pressure contact with the surface of the lead.

The socket typified by the above-mentioned conventional example has a problem that an effective wiping operation cannot be obtained after the contact portion is pressed against the lead surface by the elastic force of the spring portion, and the contact reliability is lowered.

This problem becomes more and more apparent as the leads and contacts become finer and it becomes difficult to obtain a high contact pressure, and the need for wiping is increasing.

The present invention provides an IC socket which effectively causes the above wiping operation and can expect a sound contact even with a relatively small contact pressure.

Further, the IC socket represented by the above-mentioned conventional example has a problem that the contact portion is impacted against the surface of the lead by the elastic force of the spring portion, and the lead is deformed or a dent is formed on the lead surface. .

According to the present invention, the contact pressure of the contact portion with respect to the lead in the initial process is largely relaxed, and finally the contact surface can be pressure-contacted with a sufficient contact pressure. Provide an IC socket.

[0008]

According to the present invention, the elastic force is set so that the second spring is bent by the elastic force of the first spring after the contact portion is pressed against the surface of the IC lead by the elastic force of the first spring of the contact. The contact is arranged so that the lead surface slides from the upper side to the lower side or from the lower side to the upper side in accordance with the bending of the second spring.

According to another invention, after the contact portion is pressed against the surface of the IC lead by the elastic force of the first spring, the elastic force is set so that the second spring bends by the elastic force of the first spring. Along with this, an IC socket having a pressing portion for elastically holding the contact portion by the stored elastic force of the first spring is configured.

[0010]

According to the present invention, after the contact portion starts pressure contact with the surface of the IC lead by the elastic force of the first spring,
The second spring bends due to the elastic force of the first spring, and the position of the contact portion provided on the second spring changes due to this bending movement, and the contact portion slides on the lead surface from the upper side to the lower side or from the lower side to the upper side.

According to the above structure of the present invention, the first spring and the second spring
The spring cooperates to effectively induce the sliding motion, and the second
The elastic force of the spring can be set to an elastic force suitable for wiping, and this wiping can be performed properly, and the strength of wiping can be easily adjusted. Further, the sliding position of the contact portion can be arbitrarily set without being restricted by the first spring.

According to another aspect of the present invention, the impact caused when the contact point is brought into pressure contact with the IC lead surface by the elastic force of the first spring is mitigated by the second spring, and the contact point is softened to the lead surface in the initial stage of contact. Contact, gradually increase the contact pressure,
The problems of lead deformation and dent formation are effectively prevented. Finally, the contact portion can be elastically held by the pressing portion and the elastic force of the first spring can be directly applied to the contact portion to secure the contact pressure.

[0013]

【Example】

Example 1 (see FIGS. 1 to 10) The socket body 1 has contacts 4 arranged corresponding to the leads 3 of the IC 2, and the contacts 4 have a fixing portion 5 fixed to the socket body 1. , The terminal portion 16a or 16b extending from the fixed portion 5 below the fixed portion 5.
Have.

The terminal portion 16a elastically press-contacts with the surface of the wiring pattern of the wiring board as shown by the solid line in FIG. 1, and the terminal portion 16b is in the through hole of the wiring board as shown by the phantom line in FIG. Inserted and connected.

A first spring portion 6 extending from the fixed portion 5 is provided above the fixed portion 5. The first spring portion 6 is composed of a bending spring that is bent downward below the IC lead 3, and has elasticity extending above the first spring 6 from an end portion of the first spring 6 formed of the bending spring. It has a first arm 7 having.

The first arm 7 is substantially vertical and extends upward to a position facing the side surface of the IC 2 beyond the upper surface of the pedestal 12 which supports the IC lead 3, and the second spring 8 is provided at the upper end thereof.
Support.

The second spring 8 is formed by a bending spring that bends upward, and a second arm 9 having elasticity is directed downward from the end of the second spring 8 formed by the bending spring. extend.

The second arm 9 is made substantially vertical and extends downward, and a contact portion 10 is provided at the lower end thereof. The contact portion 10 is formed by a protrusion that projects inward from the end of the second arm, in other words, projects toward the IC lead 3.

As described above, the first spring 6 and the second spring 8 project in opposite directions, and similarly, the first arm 7 and the second arm 9 extend in opposite directions, and the end portions of the respective arms are extended. 7
a and 9a are extended to a position where they face each other inward and outward.

That is, the lower end portion 9a of the second arm 9 is extended to a position facing the upper end portion 7a of the first arm 7 on the inner side thereof, and the inner side of the lower end portion 9a of the second arm 9 (I
The contact portion 10 is provided on the side opposite to the C lead), and the elastic displacement of the second spring 8 and the second arm 9 is provided between the upper end portion 7a of the first arm 7 and the lower end portion 9a of the second arm 9. A space 11 to be set is provided, and a pressing portion 15 for pressing the contact portion 10 against the IC lead 3 is formed on the upper end portion 7a of the first arm. The first spring 6 presses the contact portion 10 against the surface of the IC lead 3 by its elastic force, and flexes the second spring 8 and the second arm 9 against elasticity.

With the bending movement of the second arm 9, the contact portion 10 slides the surface of the IC lead 3 from the upper side to the lower side to clean the surface of the lead. This sliding amount is set by the interval 11.

That is, the second spring 8 and the second arm 9 are allowed to bend within the interval 11, and the lower end of the second arm 9 is brought into contact with the pressing portion 15 to prevent the bending (first After the contact, the pressing portion 15 backs up the contact portion 10 and directly applies the stored elastic force of the first spring 6 to the contact portion 10 to press it against the IC lead 3.

In the present invention, the second spring 8 is connected to the first spring 6, the contact portion 10 is provided at the lower end of the second spring 8, and the pressing portion 15 is provided at the upper end of the first spring 6. A configuration is provided in which the tension force described below is applied to the connecting portion of the first spring 6 and the second spring 8 which is provided.

The first spring 6 and the second spring 8 increase the elasticity of the former and weaken the elasticity of the latter, and set the elasticity of both so that the elasticity of the first spring 6 causes the second spring 8 to bend. To do. For example, as shown in the figure, the cross-sectional area of the first spring 6 is made large and the cross-sectional area of the second spring 8 is made small to set the elasticity.

As described above, the first arm 7 extends above the upper surface of the IC support seat 12 for supporting the IC lead 3 to a position facing the lead 3, and the second arm is provided at the upper end thereof.
The spring 8 is supported, and thus the second spring 8 is arranged above the lead 3, and the second arm 9 is extended from above the lead 3 toward the lead side surface.

As another example, the lower surface of the main body of the IC 2 can be supported on the pedestal so that the IC lead 3 is not supported.

A contact opening / closing lever 13 is provided which acts on the connecting portion of the first spring 6 and the second spring 8 to displace the contact 4 between the contact position and the contact release position. In the embodiment shown in the drawings, the upper end of the first arm 7, that is, the connecting portion of the first arm 7 and the second spring 8 is provided with a hook portion 14 projecting downward on the outside of the first arm 7. Hook part 1
The contact opening / closing lever 13 is engaged with 4.

The socket main body 1 made of an insulating material has a substantially rectangular IC accommodating portion 17 which is open upward and can accommodate the IC 2 at the center thereof, and the IC accommodating portion 17 has a bottom portion at which the IC
The support seat 12 is provided, the contacts 4 corresponding to the IC leads 3 are arranged in parallel along the two opposite sides of the IC housing portion 17, and the contacts 4 are brought into contact with the IC leads 3 housed in the IC housing portion 17. A contact opening / closing member for displacing the contact opening / closing position and the contact releasing position is provided, and the contact opening / closing lever 13 rotatably supported by the shaft 19 on the socket body 1 is provided as the contact opening / closing member.

The contact opening / closing lever 13 extends in parallel along two sides of the IC accommodating portion 17, that is, along the row of contacts 4, and has a support shaft 19 protruding leftward and rightward from both longitudinal ends of the lever 13 in the socket body 1. It is rotatably supported by the provided bearing.

The contact opening / closing lever 13 has an arcuate action portion 20 at its inner end and a pressure receiving portion 21 at the lever outer end to engage the action portion 20 with the hook portion 14.
As a result, the pressure receiving portion 21 of the lever 13 is rotated downward, so that the contact portion 10 of the contact 4 is displaced rearward toward the outer side against the elastic force of the first spring 6 to form a contact release state,
When the contact 4 is displaced forward by the restoring force of the first spring 6, the pressure receiving portion 21 of the lever 13 is rotated upward, and the contact portion 10 is brought into contact with the surface of the lead 3.

As shown in FIG. 2, when a pressing force is applied to the pressure receiving portion 21 to push down the contact opening / closing lever 13 against the elasticity of the first spring 6, the hook portion 14 of the contact 4 acts on the contact opening / closing lever 13. The part 20 pulls and the contact part 1
0 is pulled diagonally upward and rearward against the first spring 6, and is displaced to the contact release position. Then, when the IC 2 is dropped into the IC housing portion 17 in this state, the tips of the leads 3 are received on the IC support seat 12, and the IC 2 is housed in the IC housing portion 17.

Thereafter, when the pressing force of the contact opening / closing lever 13 is released, the pressure receiving portion 21 of the contact opening / closing lever 13 moves upward due to the elastic force (restoring force) of the first spring 6, as shown in FIG. At the same time, the contact portion 10 of the contact 4 is displaced obliquely downward and forward from the contact release position toward the contact position, whereby the contact portion 10 is moved to the lead 3
Pressed against the surface of.

The contact opening / closing lever 13 is directly pushed down by an automatic machine, a hand, or the like, or the contact opening / closing cover 22 is attached to the socket body 1 as a contact opening / closing member so as to be able to move up and down. By pressing down, the pressing portion 23 indirectly presses down the pressure receiving portion 21 of the contact opening / closing lever 13.

As described above, after the contact portion 10 is pressed against the surface of the lead 3 by the elastic force of the first spring 6, the second spring 8 and the second arm 9 are continuously added to the first spring 6. The pressing portion 15 bends until it comes into contact with the vicinity of the back surface of the contact portion 10 due to the elastic force, and the indirect point portion 10 that causes this bending movement is attached to the surface of the lead 3 as shown in FIGS. 4, 5 and 6. Clean the lead surface by sliding it from upper to lower. It gives a so-called wiping effect.

4 and 6, P1 shows the initial position (sliding start position) where the contact portion 10 is pressed against the surface of the lead 3, and P2 shows the position where the contact portion is sliding. P3 in FIG. 5 indicates the position where the sliding is finished, and the contact portion 10 is P
Slide from point 1 to point P3.

The pressing portion 15 is near the back surface of the contact portion 10,
That is, by contacting the outer surface of the lower end of the second arm 9, the spring force of the first spring 6 is directly applied to the contact portion 10 to press the contact portion 10 against the surface of the IC lead 3.

The IC 2 has a J-bend type lead 3 protruding from its side surface, and the contact portion 10 slides from the upper side to the lower side on the outer surface of the vertically extending portion 3a of the J-bend type lead 3. .

The present invention can be applied not only to the J-bend type lead described above, but also to an IC of a type in which the IC lead is formed of a conductive foil and closely attached to the side surface of the IC 2.

As shown in FIG. 7, the present invention also includes the case of sliding along the upper bent portion 3b of the J-bend type lead 3 to the lower P3 point from the upper P1 point. This is also the case when the IC2 is inverted and loaded, and is slid along the curved surface of the free end of the J-bend type lead.

Although not shown, the present invention can also be applied to a gull-win type lead obtained by bending the lead in two steps. That is, the case where the contact portion 10 is slid along the outer side surface or the upper bent portion of the vertically extending portion of the gull-win type lead is included.

FIG. 8 shows a contact portion 1 as an embodiment of the present invention.
The contact surface of 0 is inclined to the front and is inclined 10a.
Shows the case where the surface of the upper bent portion 3b of the lead 3 is slid from the upper side to the lower side. In this case, the pressure contact position of the contact portion 10 with respect to the lead 3 hardly changes, and the slope 10a of the contact portion 10 slides from the upper position to the lower position.

As shown in FIG. 9, when the contact point portion 10 of the contact 4 is pressed against the first spring 6, the contact point portion 10 is displaced in the direction of arrow S1, as shown in FIG. When the end portion of the first spring 6 is pressed against the spring 6, the end portion is displaced in the arrow S3 direction. On the contrary, the second spring 8
When the contact point 10 is restored, the contact portion 10 is displaced in the direction of arrow S2 in FIG. 9, while the end portion of the first spring 6 is displaced in the direction of arrow S4 when the first spring 6 is restored. And as understood from FIGS. 9 and 10, the end portion of the first spring 6, that is, the first spring 6
The pressing portion 15 supported by is displaced inside the top dead center by following a locus similar to the virtual circle locus shown in FIG.
Further, the end portion of the second spring 8, that is, the contact portion 10 supported by the second spring 8 follows a locus similar to the virtual circle locus shown in FIG. 9 and is displaced inside the bottom dead center. This causes the sliding.

Second Embodiment (See FIGS. 11 to 15) This embodiment shows a case where the contact portion 10 'of the contact slides along the surface of the lead 3 from the lower side to the upper side to obtain a wiping action.

The contact 4'has a first spring 6'and a second spring 8 ', the first spring 6'bending upward and the second spring 8'bending downward. More specifically, a column 24 that rises upward from the fixed portion 5 ′ for the socket body 1 is provided upright, and the upper end of the column 24 has a first spring 6 ′ that is curved upward.
And a first arm 7'having elasticity extending downward from the end of the first spring 6 ', and the second spring curved downward at the lower end of the first arm 7'. 8 '
And an elastic second arm 9'extending upward from the end of the second spring 8 ', and protruding toward the surface of the IC lead 3 at the upper end of the second arm 9'. A contact portion 10 'is provided.

Contrary to the first embodiment, the first spring 6'is I
The second spring 8'is arranged above the C lead 3, and the second spring 8'is
It is placed below.

The first arm 7'and the second arm 9'are extended in opposite directions to each other, and the inside of the first arm 7 '(I
A second arm 9'opposed to the C lead side), and the gap 11 'is formed between the second arms 9', and a contact portion 10 'is provided.
A pressing portion 15 'for pressing the contact portion 10' against the IC lead 3 is formed at the end of the first arm 7'opposed to the end of the arm 9 '.

Further, the hook portion 14 'is formed at the connecting portion of the first spring 6'and the second spring 8'and engages with the contact opening / closing lever 13'.

As shown in FIG. 12, when the pressure receiving portion 21 'of the contact opening / closing lever 13' is pivoted downward about the shaft 19 ', the acting portion 20' becomes the hook portion 1 of the contact 4 '.
4'is given a tensile force to bend the first spring 6'against the elastic force, and accordingly, the contact portion 10 'is rearward displaced together with the second spring 8'to move the contact portion 10' rearward. The IC 2 is moved to a position where it does not interfere with the IC lead 3, and the IC 2 is loaded into the socket body in this state. Next, as shown in FIG. 13, when the pressing force of the contact opening / closing lever 13 ′ to the pressure receiving portion 21 ′ is released, the first spring 6 ′ is restored, and the stored elastic force causes the contact portion 1 to move.
0'is pressed against the surface of the IC lead 3. Second spring 8 '
The contact spring 10 'slides along the surface of the IC lead 3 from the lower P1 point to the upper P3 point while flexing within the range allowed by the interval 11' by the stored elastic force of the first spring 6 '. Then, the pressing portion 15 'comes into contact with the back surface of the contact portion 10' to stop the sliding due to the bending of the second spring 8 ', and the pressing portion 15' then backs up the contact portion 10 'and the first spring 6'. The urging force of the above is directly applied to the contact portion 10 'and pressed against the IC lead 3.

In the present invention, the first spring 6'is provided with the second spring 8 '.
And the contact portion 10 'is provided at the upper end of the second spring 8', and the pressing portion 1 is provided at the lower end of the first spring 6 '.
5'is provided to apply a tensile force, which will be described later, to the connecting portion of the first spring 6'and the second spring 8 '.

The elastic force of the first spring 6'is set to be strong and the elastic force of the second spring 8'is set to be weak so that the elastic force of the first spring 6'bends the second spring 8'to set both elastic forces. Is the same as.

The description of the first embodiment is incorporated by reference for the description of the configuration and operation common to those of the first embodiment.

[0052]

As described above, according to the present invention, the wiping effect can be obtained by the cooperation of the first spring and the second spring so that the contact portion can be reliably slid along the surface of the IC lead. By setting the elasticity of the second spring, wiping can be properly performed and the strength of wiping can be easily adjusted.

The support position of the contact portion by the second spring can be arbitrarily set without being restricted by the first spring, and the sliding position of the contact portion can be arbitrarily set.

According to another aspect of the invention, the impact generated when the contact portion is brought into pressure contact with the IC lead by the elastic force of the first spring,
The second spring relaxes satisfactorily, and effectively prevents lead deformation and dent formation at the time of contact.

Finally, the contact portion is elastically held by the pressing portion, so that a predetermined contact pressure by the first spring can be secured.

[Brief description of drawings]

FIG. 1 is a sectional view of an IC socket showing a first embodiment of the present invention. Since the sectional view is symmetrical, the left half is omitted.

2 is an IC socket cross-sectional view showing a state in which the contact in FIG. 1 is displaced from the state of FIG. 1 to a contact release position and an IC is loaded.

3 is an IC socket cross-sectional view showing an initial stage in which the contact is displaced from the state of FIG. 2 to a contact position and the contact portion is brought into pressure contact with the lead surface.

4 is an IC socket cross-sectional view showing a stage in which the contact portion is sliding on the lead surface from the state of FIG.

5 is an IC socket cross-sectional view showing a state in which the contact portion has finished sliding after passing through the state of FIG. 4 and the contact portion has been backed up by a pressing portion.

FIG. 6 is an enlarged view showing a contact state and a backup state of a contact portion with respect to the IC lead in FIG.

FIG. 7 is an enlarged view showing another example of a sliding aspect of a contact portion with respect to an IC lead.

FIG. 8 is an enlarged view showing still another example of the sliding aspect of the contact portion with respect to the IC lead.

FIG. 9 is a diagram illustrating a displacement trajectory of a second spring end portion.

FIG. 10 is a diagram illustrating a displacement locus of a first spring end portion.

FIG. 11 is a side view showing an IC socket according to a second embodiment of the present invention with a contact and an IC. Since the side view appears symmetrically, the left half is omitted.

12 is a side view showing a state in which the contact in FIG. 11 is displaced from the state in FIG. 11 to a contact release position and an IC is loaded.

13 is a side view showing the initial stage in which the contact is displaced from the state of FIG. 12 to a contact position and the contact portion is brought into pressure contact with the lead surface.

14 is a side view showing the stage in which the contact portion slides on the lead surface from the state of FIG.

FIG. 15: The contact point has finished sliding after passing through the state of FIG.
The same side view showing the state where the contact portion was backed up by the pressing portion.

[Explanation of symbols]

 1, 1'Socket body 2 IC 3 IC lead 4 Contact 6, 6'First spring 8, 8'Second spring 10, 10 'Contact part 11, 11' Interval 13, 13 'Contact opening / closing lever 15, 15' Pressing Department

Claims (3)

[Claims] 1. A contact arranged corresponding to an IC lead, the contact having a first spring for pressing its contact portion against the surface of the IC lead, and a second spring supported by the first spring. In the IC socket in which the contact portion is provided on the second spring, the contact portion is pressed against the surface of the IC lead by the elastic force of the first spring, and then the second spring is bent by the elastic force of the first spring. An IC socket, which is elastically set so that the contact portion is slid from the upper surface to the lower surface along with the bending of the second spring. 2. A contact arranged corresponding to the IC lead, the contact having a first spring for pressing the contact portion against the surface of the IC lead, and a second spring supported by the first spring. In the IC socket in which the contact portion is provided on the second spring, the contact portion is pressed against the surface of the IC lead by the elastic force of the first spring, and then the second spring is bent by the elastic force of the first spring. An IC socket, which is elastically set so that the contact portion is slid on the lead surface from the lower side to the upper side by the bending of the second spring. 3. A contact arranged corresponding to the IC lead, the contact having a first spring for pressing the contact portion against the surface of the IC lead, and a second spring supported by the first spring. In the IC socket in which the contact portion is provided on the second spring, the contact portion is pressed against the surface of the IC lead by the elastic force of the first spring, and then the second spring is bent by the elastic force of the first spring. An IC socket characterized in that the elastic force is set so that the elastic force is set so that the elastic force of the first spring elastically holds the contact portion in accordance with this bending.