JPH06336690A - Production of metal transferred ornamental pattern - Google Patents

Abstract

PURPOSE:To produce a highly ornamental metal transferred pattern having a metallic highlight and ornamenting the surface of a small-sized article such as a timepiece, an ornamental box or accessories. CONSTITUTION:A fine pattern 2 having a metallic highlight is carved by a diamond cutting method in the surface 1 of a metallic substrate coated with a 1st photoresist 4 and this pattern 2 is finely adjusted with a 2nd photoresist 5. A metallic thin layer 7 is deposited by electroforming on the metal exposed part on the substrate and this deposited layer 7 is transferred to adhesive tapes 8, 10 in two steps. The rear side of the metallic highlight part used as appearance is partially coated with an adhesive 12 and bonded to a surface to be ornamented with the adhesive 12 to give an ornamental effect.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for producing a decorative metal thin layer transfer pattern for small articles.

[0002]

2. Description of the Related Art Conventionally, as shown in JP-A-59-16989 or JP-A-59-140384, a metal substrate is coated with a photoresist to decorate the surface of small articles such as watches and decorative boxes. After baking and developing the required pattern to expose the metal surface of the substrate and subjecting it to a mold release process, a metal layer is deposited and formed to an appropriate thickness only on this part by electroforming, and peeled off while sticking to the adhesive tape. There has been proposed a method for producing a transfer logo mark or the like, in which an adhesive for adhering to an article to be adhered is applied to the back side thereof and a liner for protecting the surface of the adhesive is attached. In these methods, as shown in FIG. 7B, the obtained metal layer cross-section is inevitably mushroom-shaped because it is dominated by the current distribution during metal electroforming deposition on the substrate. In order to avoid this, in JP-A-58-34194, a thick dry film is applied as a resist film.
Has proposed a method of obtaining a sharper shape such as. However, in this case as well, the cross-sectional shape of the upper surface of the electroformed precipitation product constitutes a curve, which is far from obtaining a sharp metallic highlight.

[0003]

A sharp metallic highlight is extremely effective for avoiding the surface of small decorative products such as watches, decorative boxes, and accessories, but the surface of the product itself is very effective. Since it is non-productive to perform hand-made processing one by one, a method of separately manufacturing and transferring as decorative parts has been proposed as described in the prior art. However, with these methods, it is difficult to obtain sharp metallic highlights, and there has been a demand for a new alternative method for easily obtaining the effect of appearance decoration.

[0004]

The method for producing a metal transfer pattern according to the present invention can beautifully produce a metal highlight such as a diamond bite on a substrate for electroforming deposition in order to obtain a metal highlight on the surface of the metal transfer pattern. A necessary pattern is engraved with a blade, and electroforming deposition is performed only on a necessary part of the pattern to transfer the intended highlight to the electroforming deposition layer. Unlike the conventional method, since the surface to be utilized as a decorative surface is the beautiful surface of the substrate that has been cut such as diamond cut, the transfer operation to the temporary holding adhesive tape requires two steps. That is, first, peeling transfer is performed on the first adhesive tape while maintaining the mutual positional relationship of deposition of the electroformed layer. Next, this is transferred to the second adhesive tape while also maintaining the mutual positional relationship. By these two steps, the highlight surface of the metal layer to be utilized is adhered to the adhesive of the second adhesive tape, and the adhesive for adhering to the small article to be decorated is applied to the back side of the highlight surface, It is stored until a liner for protecting the adhesive layer is attached and adhered to the small accessory product. There should be some difference between the adhesive force of the first adhesive tape and the second adhesive tape, and the adhesive force of the second adhesive tape and the adhesive for adhering to the small article to be decorated. Select to ensure that the metal transfer pattern is transferred smoothly and stably.

[0005]

【Example】

(Embodiment 1) FIG. 1, FIG. 2 and FIG. 3 show a basic process embodiment of the present invention to explain the present invention. Figure 1
FIG. 3A is a diagram showing a first step of the method for producing a metal transfer decorative pattern according to the present invention, which is a pattern positioning guide 3;
FIG. 3 is a plan view after engraving a cutting groove 2 with a spherical diamond bit on the surface portion of the metal substrate 1 which was previously formed by a photoresist method and coated with the first resist 4 based on this guide. In FIG. 1B, a second photoresist is applied to the cutting groove 2 formed in FIG. 1A by spinner coating, and a developing and exposing process is performed so that only the metal transfer decoration pattern portion exposes the substrate metal surface. At this time, the characteristics of the first resist and the second resist were made reciprocal in order to clarify the boundary between the sections separated by the resist film. In this example, a negative type photoresist was used as the first photoresist and a positive type photoresist was used as the second photoresist. Figure 1 (c)
1 is an enlarged cross-sectional view taken along the line AA 'of FIG. 1 (B), and in this embodiment, the metal exposed surface on the base is formed as 2. 2A to 2H are cross-sectional views showing a manufacturing process of a metal transfer decorative pattern, in which a pattern (B) 2 for exposing a metal surface, which is engraved on a metal substrate, is formed on a metal surface. A dip coating (b) 6 was formed by dipping in a 2% potassium chromate solution, and a nickel metal layer (d) 7 was deposited on the surface by a thickness of 50 μm by electroforming. Next, while the adhesive surface 9 of the adhesive tape is being pressed against the pattern formed by electroforming on the substrate, strain stress is applied to the substrate, and this is transferred to the adhesive tape. At this time, consideration was given to the selection of conditions such as the adhesive strength of the adhesive tape and the rigidity of the adhesive layer supporting base material 8 so that the mutual positional relationship of the entire metal transfer pattern including the positioning guide deposited at the same time was not disturbed. Subsequently, this metal transfer pattern is transferred onto the adhesive surface 11 of the second adhesive tape while also maintaining the mutual positional relationship of the patterns, and a metal transfer pattern is obtained as shown in (f). Then, the adhesive 12 for final adhesion to the adherend is applied to the back surface of the metal transfer pattern on the adhesive tape. The screen printing method was applied so that the application can be limited to only the back surface of the metal transfer pattern. Finally, in order to protect the adhesive layer on the back surface of the metal transfer pattern, a liner 13 was attached and temporarily stored. FIG. 3 is a diagram showing a process in which the metal transfer pattern obtained by the above process is applied to an actual transferred surface.
4, the positioning guide, which is transferred and held while maintaining the mutual relationship with the metal transfer pattern, is pressed as a guide for adhesive transfer. As the adhesive for final adhesion to the surface to be adhered, a pressure-sensitive adhesive whose performance has recently been remarkably improved is applied, and it is necessary to take full advantage of the property that it initially shows tackiness and cures over time to improve the adhesive strength. did. (C) is a schematic view showing a surface decorated with a metal transfer pattern obtained in this example.

(Second Embodiment) A second embodiment in which the metal transfer pattern according to the present invention is applied to a timepiece dial will be described. 4A to 4C show a cutting pattern engraving process for forming a metal transfer pattern by electroforming on a metal substrate having a first photoresist formed on its surface.
(A) Apply the first resist 4 on the entire surface of the medium metal substrate 1,
A positioning guide pattern 3 was formed on this surface, and a V-shaped cut 2 was performed with a diamond tool using this guide pattern as a guide. In the enlarged diagram (b) of the diamond cut pattern (part), reference numeral 2 is a V-shaped cut carved for the production of the time display piece of the timepiece dial, and both ends of this V-shaped cut are sensitive to the first photoresist 4. Different second photoresists 5 are applied, and patterning is performed to clearly show the boundaries. (C) is a cross-sectional view taken along the line BB ′ in (A), in which the first photoresist 4 and the second photoresist 5 are laminated on the metal substrate 1, and the V-shaped cut portion 2 has a diamond pattern. The highlight surface of the substrate metal cut by the blade is exposed, and this highlight surface is transferred and used as the decorative surface of the transfer pattern. Here, the first photoresist and the second photoresist were selected to have opposite photosensitivity characteristics, and consideration was given to securing and stabilizing the transfer pattern accuracy. 5A to 5G show a metal layer 50 to 7 formed on the exposed surface of the highlight of the substrate metal by electroforming.
It is sectional drawing for every step which shows the process from the process of depositing and forming it to the thickness of 0 micron to peeling and transferring this to an adhesive tape. The exposed portion of the highlight surface of the substrate metal is formed as a V-shaped groove by diamond cutting on (a) 2, and 10 to 30% of the dilute potassium dichromate solution is added to this exposed portion.
By the second dipping treatment, a film (b) 6 for mold release was formed. A nickel metal layer is formed on the V groove by electroforming.
The deposited metal layer is deposited to a thickness of 0 to 70 μm, and then the deposited metal layer is pressed against the adhesive surface of the first adhesive tape to apply strain stress to the substrate, and the deposited metal layer, that is, the transferred metal pattern is peeled and copied onto the adhesive tape. At this time, the adhesive strength of the pressure-sensitive adhesive and the rigidity of the pressure-sensitive adhesive support base material 8 were also taken into consideration so as not to disturb the mutual mutual positions of the patterns including the positioning guide pattern deposited simultaneously with the metal transfer pattern. Then, this metal transfer pattern is transferred onto the adhesive surface (e) 11 of the second adhesive tape to obtain the state (f).
An adhesive 12 for adhering to a surface to be adhered is applied to the back surface of the metal transfer pattern 7, and the liner 1 is provided to protect this adhesive surface.
No. 3 was affixed, and the storage form was set until it was actually used.
The application of the adhesive 12 was performed by applying the screen printing method so that the application of the adhesive 12 was limited to only the back surface of the metal transfer pattern. 6A to 6C show a process of applying the metal transfer pattern obtained in the above steps to the surface to be adhered. For the metal transfer pattern, the liner is removed just before use and the positioning guide is used as a guide to press the surface to be adhered 14 for adhesion. The adhesive used to finally bond to the surface to be bonded was a pressure-sensitive adhesive as in Example 1, so that it acts as a pressure-sensitive adhesive at the beginning of bonding, resulting in improvement in cured adhesive strength over time. The results were satisfactory in terms of both durability and quality. (C) is a layout plan view of the timepiece dial and time display piece obtained in this manner.

[0007]

The main effects obtained by the present invention are:
It was possible to provide, as a part, a highly productive decorative metal transfer pattern having a delicate and sharp metallic highlight that decorates the surface to be decorated. As a result, the decoration processing that was traditionally done by hand on the surface of the product,
It was possible to switch to a positioning and bonding process that was easy and stable in terms of quality, resulting in a dramatic improvement in productivity. In addition, even highly delicate patterns, which were difficult to process in the past, can now be included in the processable range. In terms of appearance, the convex surface formed by adhesion, in contrast to the engraved concave surface, gives a three-dimensional appearance to the product surface, providing a great potential for design development to the related industry as an unprecedented design element technology.

[Brief description of drawings]

FIG. 1 is a diagram showing steps of a pattern forming step in the case of a first embodiment of the present invention. (A) A plan view of a metal transfer pattern layout. (B) A metal transfer pattern plane layout diagram when two layers of photoresist are laminated. (C) AA 'sectional view.

FIG. 2 is a cross-sectional view of each step of the process until transfer to the pattern-forming pressure-sensitive adhesive tape according to the first embodiment of the present invention. (B) AA 'sectional drawing in FIG. (B) A cross-sectional view showing that the release coating chemical conversion treatment is applied to the exposed surface of the substrate metal. (C) A cross-sectional view showing formation of a nickel metal layer of 50 to 70 μm on the release film by electroforming. (D) A cross-sectional view showing a step of transferring the metal layer to the first adhesive tape. (E) Sectional drawing which shows the step which transfers the said metal layer to a 2nd adhesive tape again. (F) A sectional view showing the form of an adhesive tape holding a metal transfer pattern. (G) A sectional view showing a step of partially applying an adhesive to the back surface of the metal transfer pattern. (H) Sectional drawing which shows the form which stuck the liner which protects the said adhesive agent.

FIG. 3 is a diagram showing a process of a step of using a metal transfer pattern in the case of Example 1 of the present invention. (A) A cross-sectional view of the step of removing the liner and attempting to adhere to the surface to be adhered. (B) A cross-sectional view when the bonding is completed on the surface to be bonded. (C) A plan view when the bonding is completed on the surface to be bonded.

FIG. 4 is a diagram showing steps in a pattern forming stage in the case of the second embodiment of the present invention. (A) A plan view of a metal transfer pattern layout. (B) A metal transfer pattern plane layout diagram when two layers of photoresist are laminated. (C) BB 'sectional drawing.

FIG. 5 is a cross-sectional view of each step of the process until transfer to the pattern-forming adhesive tape in the case of the second embodiment of the present invention. (A) BB 'sectional drawing in FIG. (B) A cross-sectional view showing that the release coating chemical conversion treatment is applied to the exposed surface of the substrate metal. (C) A cross-sectional view showing formation of a nickel metal layer of 50 to 70 μm on the release film by electroforming. (D) A cross-sectional view showing a step of transferring the metal layer to the first adhesive tape. (E) Sectional drawing which shows the step which transfers the said metal layer to a 2nd adhesive tape again. (F) A sectional view showing the form of an adhesive tape holding a metal transfer pattern. (G) A sectional view showing a step of partially applying an adhesive to the back surface of the metal transfer pattern. (H) Sectional drawing which shows the form which stuck the liner which protects the said adhesive agent.

FIG. 6 is a diagram showing a process of using a metal transfer pattern for a timepiece dial in the case of Embodiment 2 of the present invention. (A) A cross-sectional view of a step of attempting to adhere the liner to the adherend surface to be removed. (B) A cross-sectional view when the bonding is completed on the surface to be bonded. (C) A plan view of the timepiece dial when the bonding is completed on the surface to be bonded.

FIG. 7 is a process diagram showing a method for manufacturing a metal transfer pattern according to a conventional technique. (A) A sectional view of a step of forming a resist on a substrate material. (B) A cross-sectional view of a metal electroformed deposited layer obtained on a metal exposed portion of the substrate material. (C) A sectional view of the step of transferring the metal electroformed deposition layer to the adhesive tape. (D) A cross-sectional view in which the metal electroforming deposition layer is temporarily held on an adhesive tape. (E) Sectional drawing of the step which applies an adhesive agent on the back surface of a metal electroformed deposition layer. (F) A cross-sectional view after attaching a liner for protecting the adhesive layer.

FIG. 8 is a thick film resist cross-sectional view for making a metal electroformed deposit layer sharper.

[Explanation of symbols]

 1 Metal Substrate 2 Cutting Groove 3 Positioning Guide 4 First Resist 5 Second Resist 6 Release Film 7 Electroformed Metal Layer 8 First Adhesive Tape Base Material 9 First Adhesive Tape Adhesive 10 Second Adhesive Tape Base Material 11 Second adhesive tape Adhesive 12 Adhesive 13 Adhesive layer protective liner 14 Surface of object to be decorated

Claims (1)

[Claims] 1. A first resist film is formed on a metal substrate, and then a pattern is engraved by cutting, and an unnecessary portion is covered with a second resist film, and then the exposed metal surface of the substrate is subjected to a release film treatment, 30 to 1 by electroforming
A metal layer of 00 micron is deposited and formed, and this electroformed metal layer is peeled off from the substrate while holding its mutual position on the first adhesive tape and adhering, and then on the second adhesive tape. Retaining the mutual position on the adhesive tape and copying it again while adhering, applying an adhesive for adhering to the surface of the object to be decorated on the back side of only the electroformed metal layer, and protecting the applied adhesive surface A method for producing a metal transfer decorative pattern, which comprises attaching a liner.