JPH06334296A - Mounting method for electronic part - Google Patents

Abstract

PURPOSE:To make it possible to omit a cutting process by using a spacer to lift a lead type electronic part itself in mounting the part. CONSTITUTION:With conventional methods, there is only a slight gap (x) between a multipin IC 202 for printer drive and an electrolytic capacitor 205 mounted on a print control printed board 113, which can lead to shorts. To cope with this, a spacer 206 is placed in-between to increase the gap by the thickness (y) of the spacer 206 to x+y. This increases the gap between electronic parts, and prevents such accidents as shorts between them. It also makes unnecessary a process for cutting the excess of lead terminals, and can reduce man-hour. Further, the disuse of the cutting process eliminates the disposal of chips, and makes unnecessary cleaning processes involving CFCs, which contributes to the preservation of environment. Risk of shorts due to chips is naturally eliminated, and the reliability of printed boards is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting electronic components on a printed circuit board in an internal control circuit of an information processing apparatus.

[0002]

2. Description of the Related Art Conventionally, a lead type electronic component inserted into a printed circuit board through hole in mounting a printed circuit board of an information processing apparatus is soldered after mounting, and thereafter, an excess lead portion is cut in a cutting process.

[0003]

However, in the above-mentioned conventional example, there is a need for a cutting process, and a cleaning process using CFCs, which is said to destroy the ozone layer for environmental protection in the recent mounting process, is abolished. There is a drawback that lead scraps cut after the cutting process may adhere to the substrate and cause an accident such as a short circuit.

[0004]

SUMMARY OF THE INVENTION According to the present invention, there is provided a mounting method capable of omitting a cutting step by using a spacer for floating a component itself when mounting a lead type electronic component.

[0005]

Embodiments of the present invention will now be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view showing a personal computer (hereinafter abbreviated as personal computer) as a system device of the present invention. PC 1 is the device body 10
1, a keyboard 102, an upper cover 104 including a display unit 103, a printer 2, and the like.
The upper cover 104 is rotatably attached to the apparatus main body 101 via hinges 104a provided at both ends of its rear edge. As a result, when using this device,
The upper cover 104 can be opened to a position where the display 103 can be easily seen by the rotation thereof, and can be closed when not in use to function as a cover. As the display element of the display section 103, a liquid crystal display element is used because the display section can be made thin.

A printer unit 2 using an ink jet recording head is arranged in front of the display unit 103,
It is stored in the apparatus main body 101. Further, the printer unit 2 has an opening (not shown) that can be opened and closed by the operator, so that the recording head can be replaced.

The recording paper 3 is inserted from a paper feed opening 101a provided in the lower part of the keyboard 102, conveyed in a conveyance path penetrating the inside of the apparatus main body 101, and ejected from a paper ejection opening (not shown) at the rear of the apparatus. It The keyboard 102 is the device body 1
01 is rotatably attached via hinges 102a provided on both sides of 01. Thereby, even when a relatively short length of recording paper such as an envelope or a postcard is used, the keyboard 102 can be opened at the top and the recording paper 3 can be inserted deep inside the transport path. Since the conveyance path for the recording paper 3 is provided below the keyboard 102, the keyboard 102 and the display unit 103 are set even when the recording paper is set.
Also, various operations using the printer operation SW 105 are possible.

The printer is connected to the host computer by a general-purpose parallel interface,
Data transmission / reception is performed at the register level of the I / O port, and the image of the connection is the same as when exchanged with an external printer.

FIG. 2 is a perspective view for explaining the internal structure of the printer unit 2 using the ink jet recording system to which the present invention is applied. In FIG. 2, 5001 is an ink tank, and 5012 is a recording head coupled thereto. The ink tank 5001 and the recording head 5012 form an integral replaceable cartridge. Reference numeral 5014 is a carriage for attaching the cartridge to the printer body, and reference numeral 5003 is a guide for scanning the carriage in the sub-scanning direction.

Reference numeral 5000 is a platen roller for scanning the recording paper 3 in the scanning direction. Reference numeral 5024 is a paper feed motor for rotating the platen roller. The carriage 5014 has a flexible cable (not shown) for supplying a signal pulse current for driving and a current for head temperature control to the recording head 5012, and a printed board provided with an electric circuit for controlling the printer. It is connected to (203).

Due to space limitations, high-density mounting is required for mounting on a printed circuit board of a personal computer having the above structure.

FIG. 3 shows a mounting arrangement relationship of the present invention. Reference numeral 110 denotes a main printed board on which the control circuit section of the host computer is mounted, and is connected to the printer control printed board 113 by a connector 111.
The printed board 203 is mounted with a printer power supply and a printer drive circuit, and is connected to the printer control printed board 113 by connectors 114 and 115. The reason for the two-story structure is that such a method is adopted in order to efficiently arrange tall electronic components such as electrolytic capacitors in a limited space.

FIG. 4 is a view showing a conventional example in which electronic components are mounted on a printed circuit board. In the figure, 200 is an electronic component
This is an example and is shown mounted on the printed circuit board 201. After the soldering process, the lead portion of the component is cut along the line AA, and the chips 200a, 200b are cut off.
Is cut off. Due to these chips, there is a great possibility that various problems such as short circuit will occur.

FIG. 5 is an enlarged view showing the relationship between the printed board 203 and the printer control printed board 113 shown in FIG. Reference numeral 202 denotes a multi-PIN printer drive IC, which is mounted on the printed board 203. An electrolytic capacitor 205 is mounted on the printer control printed board 113. As is clear from the figure, I for printer drive
There is only a small gap (x) between C202 and the electrolytic capacitor 205 and there is a risk of short circuit.

Therefore, according to the present invention, as shown in FIG. 6, the spacer 206 is sandwiched so that the gap (x + y) is increased by the thickness (y) of the spacer 206.

Although this embodiment is described for a personal computer device, it can be used for all devices on which electronic parts are mounted. The same applies to the following examples.

(Embodiment 2) A dummy electronic component, for example, a surface mount type chip resistor or the like is previously mounted on the spacer 206 in advance, and the printer drive IC is mounted in a later process to lead the printer drive IC. I tried to make a gap between and the electrolytic capacitor.

(Embodiment 3) A spacer 206 as shown in FIG.
Instead of the above, a surface mount type check pin 207 is used to make a gap between the lead of the printer drive IC and the electrolytic capacitor.

(Embodiment 4) A heat insulating sheet was used in place of the spacer 206 to form a gap between the lead of the printer drive IC and the electrolytic capacitor.

(Embodiment 5) A spacer 206 as shown in FIG.
Instead of the heat sink 208, a gap between the lead of the printer drive IC and the electrolytic capacitor is provided.

[0022]

As described above in detail, according to the present invention, the gap between the electronic parts is increased and the accident such as the short circuit between the electronic parts can be prevented, and the extra work of cutting the terminals is unnecessary. Therefore, the number of man-hours can be reduced, and because the cutting process is eliminated, the chip disposal is also eliminated and the cleaning process using CFCs is not required, which contributes to environmental protection. Of course, the risk of short circuit due to chips is eliminated and the reliability of the printed circuit board is improved.

If the surface mount type dummy electronic component is used, the automatic mounting becomes possible and the mounting is stabilized.

When a check pin is used, it can also be used as a check pin. This also applies to the dummy electronic components described above, but may be used as a component in an electric circuit.

The use of the heat insulating sheet has an effect that heat from the printed circuit board is not transmitted to the printer driver IC.

On the other hand, the use of the heat sink has the effect of radiating the heat generated from the printer driver IC to the printed circuit board or the outside air.

[Brief description of drawings]

FIG. 1 is a perspective view showing a personal computer embodying the present invention.

FIG. 2 is a perspective view of a printer internal unit.

FIG. 3 is a layout diagram of a printed circuit board inside a personal computer.

FIG. 4 is a conventional printed circuit board mounting diagram.

FIG. 5 is a detailed view of component mounting inside a conventional personal computer.

FIG. 6 is a detailed view of component mounting inside the personal computer of the present invention.

FIG. 7 is a detailed view of component mounting of another embodiment inside the personal computer of the present invention.

FIG. 8 is a detailed view of component mounting of still another embodiment inside the personal computer of the present invention.

[Explanation of symbols]

 113 Printer Control Printed Board 202 Printer Drive IC 203 Printed Board 205 Electrolytic Capacitor 206 Spacer 207 Check Pin 208 Heat Sink

Claims (5)

[Claims] 1. An electronic circuit comprising a lead terminal forming an electronic circuit and a printed circuit board for mounting the same, wherein a spacer is used to mount the electronic circuit with lead terminal above the printed circuit board. A characteristic electronic component mounting method. 2. The electronic component mounting method according to claim 1, wherein a component that constitutes an electronic circuit or a dummy electronic component is used for the spacer. 3. Use of a check pin for the spacer,
The electronic component mounting method according to claim 1, wherein the electronic component mounting method is also used as a function of a check pin. 4. The electronic component mounting method according to claim 1, wherein a heat insulating sheet is used for the spacer. 5. The electronic component mounting method according to claim 1, wherein a heat sink is used for the spacer.