JPH06325952A - Small transformer for circuit board mount - Google Patents
Small transformer for circuit board mountInfo
- Publication number
- JPH06325952A JPH06325952A JP5136627A JP13662793A JPH06325952A JP H06325952 A JPH06325952 A JP H06325952A JP 5136627 A JP5136627 A JP 5136627A JP 13662793 A JP13662793 A JP 13662793A JP H06325952 A JPH06325952 A JP H06325952A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- coil
- terminal pins
- sub
- main insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coils Of Transformers For General Uses (AREA)
Abstract
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は、基板実装用の小型変成
器に関する。FIELD OF THE INVENTION The present invention relates to a small transformer for mounting on a board.
【０００２】[0002]
【従来の技術】基板実装用の小型変成器は、従来技術で
は、例えば図４に示すように、次のように構成されたも
のがある。すなわち、複数の巻線１・２と、それらを囲
繞し互いに組み合わせて閉磁路を形成する一対の磁芯３
・４と、上記各巻線１・２の各引出接続端子５・６とか
ら成り、プリント基板実装用に小型に構成したものであ
る。上記変成器は、図４（Ａ）に示すように、巻枠３０
に例えばトランジスタ発振回路のコレクタ用などの巻線
１を巻回し、他の巻枠３１に出力用などの巻線２を巻回
して、巻枠３０に巻枠３１を嵌合したうえ、その巻枠３
０に一対の磁芯３・４を互いに組み合わせて構成してあ
る。又は、図４（Ｂ）に示すように、巻枠３０の一分割
セクション３０ａに巻線１を、他の分割セクション３０
ｂに巻線２をそれぞれ巻回して、その巻枠３０に一対の
磁芯３・４を互いに組み合わせて構成してある。さら
に、上記巻枠３０に一体に形成された端子部３２に各引
出接続端子５・６を突出させ、この各引出接続端子５・
６に各巻線１・２の引出リード線をからげて、半田づけ
などにより接続してある。2. Description of the Related Art A small-sized transformer for mounting on a board is known in the prior art, for example, as shown in FIG. That is, a plurality of windings 1 and 2 and a pair of magnetic cores 3 which surround them and are combined with each other to form a closed magnetic circuit.
4 and the lead-out connection terminals 5 and 6 of the windings 1 and 2 described above, which are small in size for mounting on a printed circuit board. As shown in FIG. 4 (A), the transformer includes a winding frame 30.
For example, the winding 1 for the collector of the transistor oscillation circuit is wound, the winding 2 for the output is wound on the other winding frame 31, the winding frame 31 is fitted to the winding frame 30, and Frame 3
0 and a pair of magnetic cores 3 and 4 are combined with each other. Alternatively, as shown in FIG. 4B, the winding 1 is provided on one division section 30 a of the bobbin 30 and the other division section 30 a.
The winding 2 is wound around each b, and a pair of magnetic cores 3 and 4 are combined with each other on the winding frame 30. Further, the lead-out connection terminals 5 and 6 are projected to the terminal portion 32 formed integrally with the winding frame 30.
The lead wires of the windings 1 and 2 are entangled in 6 and connected by soldering or the like.
【０００３】[0003]
【発明が解決しようとする課題】上記の従来技術では次
の問題がある。前記基板実装用小型変成器は、近年の趨
勢である製品小型化に対応するため、できるだけ巻数を
減少させようとして作動周波数が高くなり、その結果特
性を確保するため各巻線間の結合係数を充分な値に保つ
必要があり、各巻線を分割して相互を重ね合わせるサン
ドイッチ構造にして、巻線間の結合係数を大きくする工
夫がなされてきた。この各巻線をサンドイッチ構造にし
ながら小型にするために、複数の巻枠にそれぞれの分割
巻線を巻回して組み合わせる方法が取り難いうえ、引出
リード線の数が増加し各部品も小さくなって引出接続端
子の間隔が狭くなるので、引出リード線のからげ作業な
どの人手に頼る工数が大きく、全自動巻線が困難になり
製造コストが上昇するようになってきた。本発明は、基
板実装用小型変成器において、各巻線をサンドイッチ構
造にしながら人手に頼る引出リード線のからげ作業など
の工数を減少させ、製造コストを低下させることを課題
とする。The above-mentioned conventional techniques have the following problems. The above-mentioned compact transformer for board mounting responds to the recent trend of product miniaturization, so that the operating frequency becomes high in an attempt to reduce the number of turns as much as possible, and as a result, the coupling coefficient between the windings is sufficient to secure the characteristics. It has been necessary to maintain a certain value, and each winding has been divided into a sandwich structure in which the windings are overlapped with each other to increase the coupling coefficient between the windings. In order to reduce the size of each winding while forming a sandwich structure, it is difficult to combine each winding by winding each split winding on multiple winding frames, and the number of lead wires increases and each component also becomes smaller, making it easier to pull out. Since the space between the connection terminals is narrowed, the man-hours required to manually bend the lead wire and the like are large, and the fully automatic winding becomes difficult and the manufacturing cost has increased. SUMMARY OF THE INVENTION It is an object of the present invention to reduce the number of man-hours such as bending of a lead wire that requires manual labor while reducing the manufacturing cost in a small-sized board mounting transformer while sandwiching each winding.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記従来技術
において、上記課題を達成するために、例えば図１乃至
図３に示すように、次の改良を行ったものである。 ○第１発明（図１・図２参照） すなわち、複数の巻線１・２のうちの一方の巻線１を、
絶縁電線のみを巻回した少なくとも１個以上の偏平中空
形状のボビンレスコイル１１・１２…として形成する。
そして、前記複数の巻線１・２のうちの他方の巻線２
を、主絶縁基板７及び少なくとも１個以上の副絶縁基板
８・９…に導電性パターンで渦巻状のプリントコイル２
１・２２・２３…として形成する。また、上記主絶縁基
板７にボビンレスコイル用端子ピン５ａ・５ｂ・５ｃ
…、及びプリントコイル用端子ピン６ａ・６ｂ・６ｃ…
を植設して、前記引出接続端子５・６を形成するととも
に、その主絶縁基板７のプリントコイル２１の引出部を
上記各端子ピン６ａ・６ｂ・６ｃ…のうちの何れかの一
対に接続する。そして、前記主絶縁基板７の各端子ピン
６ａ・６ｂ・６ｃ…の植設位置に相当する前記副絶縁基
板８・９…の相当位置に、導体穴８ａ・８ｂ・８ｃ…・
９ａ・９ｂ・９ｃ…を開口して、上記主絶縁基板７と嵌
合可能とするとともに、その各副絶縁基板８・９…の各
プリントコイル２２・２３…の引出部を、その各導体穴
８ａ・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…のうちの何れ
かの各一対に接続する。さらに、前記ボビンレスコイル
１１・１２…及び前記各プリントコイル２１・２２・２
３…をそれぞれ必要な順序で互いに積層して、前記主絶
縁基板７の各端子ピン６ａ・６ｂ・６ｃ…を前記各副絶
縁基板８・９…の各導体穴８ａ・８ｂ・８ｃ…・９ａ・
９ｂ・９ｃ…に嵌合接続するとともに、上記ボビンレス
コイル１１・１２…の引出部１１ａ・１１ｂ・１２ａ・
１２ｂ…を前記端子ピン５ａ・５ｂ・５ｃ…に接続す
る。そして、前記複数の巻線１・２と前記一対の磁芯３
・４とを互いに組み合わせて構成する。In order to achieve the above object, the present invention has the following improvements in the above prior art, as shown in FIGS. 1 to 3, for example. First invention (see FIGS. 1 and 2) That is, one of the plurality of windings 1 and 2 is
It is formed as at least one flat hollow bobbinless coil 11, 12 ...
And the other winding 2 of the plurality of windings 1 and 2
, On the main insulating board 7 and at least one or more sub-insulating boards 8 ...
It is formed as 1, 22, 23 ... Further, the bobbinless coil terminal pins 5a, 5b, 5c are provided on the main insulating substrate 7.
... and terminal pins 6a, 6b, 6c for the print coil ...
To form the lead-out connection terminals 5 and 6, and connect the lead-out portion of the printed coil 21 of the main insulating substrate 7 to any one of the terminal pins 6a, 6b, 6c ,. To do. Then, conductor holes 8a, 8b, 8c, ..., At corresponding positions of the sub-insulating substrates 8, 9, ... Corresponding to the implantation positions of the terminal pins 6a, 6b, 6c ,.
9a, 9b, 9c ... Are opened so that they can be fitted to the main insulating substrate 7, and the lead-out portions of the respective print coils 22, 23 ... of the respective sub-insulating substrates 8. 8a, 8b, 8c ..., 9a, 9b, 9c ... Are connected to each pair. Furthermore, the bobbinless coils 11, 12, ... And the respective print coils 21, 22, 2
3 are laminated in the required order, and the terminal pins 6a, 6b, 6c of the main insulating substrate 7 are connected to the conductor holes 8a, 8b, 8c, ... 9a of the sub insulating substrates 8, 9 ...・
9b, 9c, ... Fitted and connected, and the bobbinless coils 11, 12 ... Lead-out portions 11a, 11b, 12a ,.
12b ... Are connected to the terminal pins 5a, 5b, 5c. Then, the plurality of windings 1 and 2 and the pair of magnetic cores 3
・ 4 and 4 are combined with each other.
【０００５】○第２発明（図３参照） 前記第１発明の基板実装用小型変成器において、前記主
絶縁基板７のプリントコイル用端子ピン６ａ・６ｂ・６
ｃ…を、プリントコイル２１の周縁部に等間隔で円弧状
に植設する。そして、前記各副絶縁基板８・９…を、上
記円弧状に植設した各端子ピン６ａ・６ｂ・６ｃ…に沿
って回転させて互いにずらせながらそれぞれ必要な順序
で積層するとともに、上記主絶縁基板７の各端子ピン６
ａ・６ｂ・６ｃ…を、上記各副絶縁基板８・９…の各導
体穴８ａ・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…に順にず
らせて嵌合接続する。Second invention (see FIG. 3) In the small-sized board mounting transformer of the first invention, the print coil terminal pins 6 a, 6 b, 6 of the main insulating substrate 7 are provided.
c are planted in an arc shape at equal intervals on the peripheral portion of the print coil 21. The auxiliary insulating substrates 8 and 9 are rotated along the arc-shaped terminal pins 6a, 6b and 6c and are displaced from each other to be laminated in the required order, and the main insulating substrate Each terminal pin 6 of the board 7
The a, 6b, 6c, ... Are sequentially fitted into the conductor holes 8a, 8b, 8c, ..., 9a, 9b, 9c ,.
【０００６】[0006]
【作用】本発明は次のように作用する。 ○第１発明（図１・図２参照） 複数の巻線１・２のうちの一方の巻線１を少なくとも１
個以上の偏平中空形状のボビンレスコイル１１・１２…
として形成し、他方の巻線２を主絶縁基板７及び少なく
とも１個以上の副絶縁基板８・９…に渦巻状のプリント
コイル２１・２２・２３…として形成したうえ、その副
絶縁基板８・９…の各導体穴８ａ・８ｂ・８ｃ…・９ａ
・９ｂ・９ｃ…に上記主絶縁基板７の各端子ピン６ａ・
６ｂ・６ｃ…を嵌合できるようにしてある。そして、前
記各個別のコイルをそれぞれ必要な順序で互いに積層
し、上記ボビンレスコイル１１・１２…の引出部１１ｂ
・１１ｃ・１２ｂ・１２ｃ…を、上記主絶縁基板７の端
子ピン５ａ・５ｂ・５ｃ…に接続するとともに、前記各
端子ピン６ａ・６ｂ・６ｃ…を前記各導体穴８ａ・８ｂ
・８ｃ…・９ａ・９ｂ・９ｃ…に嵌合接続してある。例
えば、前記主絶縁基板７のプリントコイル２１の上に副
絶縁基板８のプリントコイル２２を、その上にボビンレ
スコイル１１を、その上に副絶縁基板９のプリントコイ
ル２３を、さらに、その最上層にボビンレスコイル１２
を順に積層して、上記ボビンレスコイル１１とボビンレ
スコイル１２との間にプリントコイル２３を挟み込むサ
ンドイッチ構造の巻線１・２を構成している。そして、
上記巻線１・２に磁芯３・４を互いに組み合わせて、基
板実装用小型変成器を構成する。The present invention operates as follows. First invention (see FIGS. 1 and 2) At least one winding 1 of the plurality of windings 1 and 2 is provided.
More than one flat hollow bobbinless coil 11, 12 ...
, And the other winding 2 is formed on the main insulating substrate 7 and at least one or more sub-insulating substrates 8 ... 9 as spiral print coils 21, 22, 23. 9 ... Conductor holes 8a, 8b, 8c, ..., 9a
9b 9c ... Each terminal pin 6a of the main insulating substrate 7
6b, 6c ... Can be fitted together. Then, the individual coils are laminated on each other in a required order, and the lead-out portions 11b of the bobbinless coils 11, 12 ...
· 11c · 12b · 12c · · · is connected to the terminal pins 5a · 5b · 5c · · · of the main insulating substrate 7, the terminal pins 6a · 6b · 6c · · · each of the conductor holes 8a · 8b
・ 8c ... ・ 9a ・ 9b ・ 9c ... For example, the print coil 22 of the sub-insulating substrate 8 is provided on the print coil 21 of the main insulating substrate 7, the bobbinless coil 11 is provided thereon, and the print coil 23 of the sub-insulating substrate 9 is provided thereon. Bobbinless coil 12 on the upper layer
Are sequentially laminated to form the sandwiched windings 1 and 2 in which the print coil 23 is sandwiched between the bobbinless coil 11 and the bobbinless coil 12. And
The windings 1 and 2 are combined with the magnetic cores 3 and 4 to form a small board mounting transformer.
【０００７】○第２発明（図３参照） 前記第１発明の基板実装用小型変成器において、前記主
絶縁基板７のプリントコイル用端子ピン６ａ・６ｂ・６
ｃ…を、プリントコイル２１の周縁部に等間隔で円弧状
に植設して、前記各副絶縁基板８・９…の各導体穴８ａ
・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…を順にずらせて嵌
合接続している。例えば、前記主絶縁基板７のプリント
コイル２１の上に、その端子ピン６ａ・６ｂの中心角θ
だけずらせて副絶縁基板８のプリントコイル２２を積層
して端子ピン６ｂ・６ｃに導体穴８ｃ・８ｄを嵌合接続
し、その上にボビンレスコイル１１を積層し、さらにそ
の上に副絶縁基板９のプリントコイル２３を中心角θだ
けずらせて積層して端子ピン６ｃ・６ｄに９ｃ・９ｄを
嵌合接続し、最上層にボビンレスコイル１２を積層して
いる。そして、上記ボビンレスコイル１１の引出部１１
ａ・１１ｂを前記主絶縁基板７の端子ピン５ａ・５ｂに
接続し、上記ボビンレスコイル１２の引出部１２ａ・１
２ｂを前記主絶縁基板７の端子ピン５ｂ・５ｃに接続し
てある。上記のように、前記各プリントコイル２１・２
２・２３は互いに中心角θだけずらせて各端子ピン６ａ
・６ｂ・６ｃ…に順に接続される結果、全体として直列
接続の１個のコイルとなり、かつ、上記ボビンレスコイ
ル１１とボビンレスコイル１２との間にプリントコイル
２３を挟み込むサンドイッチ構造の巻線１・２を構成す
る。Second invention (see FIG. 3) In the small-sized board mounting transformer of the first invention, the print coil terminal pins 6a, 6b, 6 of the main insulating substrate 7 are provided.
c are planted in a circular arc shape at equal intervals on the peripheral portion of the print coil 21 to form the conductor holes 8a of the sub-insulating substrates 8 ...
・ 8b ・ 8c ... ・ 9a ・ 9b ・ 9c. For example, on the printed coil 21 of the main insulating substrate 7, the central angle θ of the terminal pins 6a and 6b is
The printed coils 22 of the sub-insulating substrate 8 are stacked with a slight shift, the conductor holes 8c and 8d are fitted and connected to the terminal pins 6b and 6c, and the bobbinless coil 11 is stacked thereon, and the sub-insulating substrate is further stacked thereon. The printed coil 23 of 9 is stacked by shifting the central angle θ, 9c and 9d are fitted and connected to the terminal pins 6c and 6d, and the bobbinless coil 12 is stacked on the uppermost layer. Then, the lead-out portion 11 of the bobbinless coil 11
a. 11b is connected to the terminal pins 5a, 5b of the main insulating substrate 7, and the lead-out portion 12a.1 of the bobbinless coil 12 is connected.
2b is connected to the terminal pins 5b and 5c of the main insulating substrate 7. As described above, each of the print coils 21.2
2 and 23 are offset from each other by the central angle θ and each terminal pin 6a
As a result of being sequentially connected to 6b, 6c, ..., One coil is connected in series as a whole, and the winding 1 having a sandwich structure in which the print coil 23 is sandwiched between the bobbinless coil 11 and the bobbinless coil 12 is provided.・ Configure 2.
【０００８】[0008]
【発明の効果】本発明は、上記のように構成され作用す
ることから、次の効果を奏する。巻線１を偏平中空形状
のボビンレスコイル１１・１２…として形成し、巻線２
を絶縁基板上のプリントコイル２１・２２・２３…とし
て形成したうえ、各端子ピン６ａ・６ｂ・６ｃ…を各導
体穴８ａ・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…に嵌合で
きるようにしてあるから相互に積層し易い。そして、積
層したボビンレスコイル１１・１２…は、全体として直
列接続の１個のコイルとなり、かつ、その間にプリント
コイル２３を挟み込むサンドイッチ構造となるので、巻
線１・２間の結合係数が充分大きくとれる。さらに、各
副絶縁基板８・９の各導体穴８ａ・８ｂ・８ｃ…・９ａ
・９ｂ・９ｃ…と、主絶縁基板７の各端子ピン６ａ・６
ｂ・６ｃ…とを嵌合して半田づけするだけで、各プリン
トコイル２１・２２・２３…の引出部を各端子ピン６ａ
・６ｂ・６ｃ…に接続できるから、従来技術のように巻
線２の引出リード線を引出接続端子６にからげる作業は
必要が無い。第２発明では、前記主絶縁基板７のプリン
トコイル用端子ピン６ａ・６ｂ・６ｃ…をプリントコイ
ル２１の周縁部に等間隔で円弧状に植設してあるから、
各プリントコイル２１・２２・２３…を互いに中心角θ
だけずらせて各端子ピン６ａ・６ｂ・６ｃ…に順に嵌合
接続するだけで、全体として直列接続の１個のコイルを
構成することができる。上記により、各巻線をサンドイ
ッチ構造にしながら人手に頼る引出リード線のからげ作
業などの工数を減少させ、製造コストを低下させること
ができる。The present invention has the following effects because it is constructed and operates as described above. The winding 1 is formed as a flat hollow bobbinless coil 11, 12, ...
Are formed as printed coils 21, 22, 23, ... on the insulating substrate, and the terminal pins 6a, 6b, 6c, ... Can be fitted into the conductor holes 8a, 8b, 8c, ..., 9a, 9b, 9c. Therefore, it is easy to stack them on each other. Since the laminated bobbinless coils 11, 12, ... Become a single coil connected in series as a whole, and have a sandwich structure in which the print coil 23 is sandwiched between them, the coupling coefficient between the windings 1, 2 is sufficient. It can be taken big. Furthermore, the conductor holes 8a, 8b, 8c ...
9b, 9c ... and each terminal pin 6a, 6 of the main insulating substrate 7
The lead-out parts of the respective print coils 21, 22, 23, ... Can be connected to the respective terminal pins 6a by simply fitting and soldering them together.
Since it can be connected to 6b, 6c ..., there is no need for the work of twisting the lead wire of the winding wire 2 to the lead-out connection terminal 6 as in the prior art. In the second invention, since the print coil terminal pins 6a, 6b, 6c ... Of the main insulating substrate 7 are planted in an arc shape at equal intervals in the peripheral portion of the print coil 21,
The central angles θ of the respective print coils 21, 22, 23 ...
It is possible to form one coil connected in series as a whole by merely shifting and fittingly connecting the terminal pins 6a, 6b, 6c, ... In order. According to the above, it is possible to reduce the number of man-hours such as the operation of bending the lead wire that requires manual labor while making each winding a sandwich structure, and to reduce the manufacturing cost.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面で説明する。 ○第１発明（図１・図２参照） 図１は基板実装用小型変成器の組立要領図、図２（Ａ）
は同変成器の斜視図、図２（Ｂ）は図２（Ａ）のＸ−Ｘ
線矢視断面図、図２（Ｃ）は同変成器の電気回路図であ
る。図において、基板実装用小型変成器は、複数の巻線
１・２と、それらを囲繞し互いに組み合わせて閉磁路を
形成する一対の磁芯３・４と、上記各巻線１・２の各引
出接続端子５・６とから成り、プリント基板実装用に小
型に構成してある。すなわち、前記複数の巻線１・２の
うちの一方の巻線１を、絶縁電線のみを巻回した少なく
とも１個以上の偏平中空形状のボビンレスコイル１１・
１２…として形成してある。そして、前記複数の巻線１
・２のうちの他方の巻線２を、主絶縁基板７及び少なく
とも１個以上の副絶縁基板８・９…に導電性パターンで
渦巻状のプリントコイル２１・２２・２３…として形成
してある。また、上記主絶縁基板７にボビンレスコイル
用端子ピン５ａ・５ｂ・５ｃ…、及びプリントコイル用
端子ピン６ａ・６ｂ・６ｃ…を植設して、前記引出接続
端子５・６を形成するとともに、その主絶縁基板７のプ
リントコイル２１の引出部を上記各端子ピン６ａ・６ｂ
・６ｃ…のうちの何れかの一対、例えば端子ピン６ａ・
６ｄに接続してある。そして、前記主絶縁基板７の各端
子ピン６ａ・６ｂ・６ｃ…の植設位置に相当する前記副
絶縁基板８・９…の相当位置に、導体穴８ａ・８ｂ・８
ｃ…・９ａ・９ｂ・９ｃ…を開口して、上記主絶縁基板
７と嵌合可能とするとともに、その各副絶縁基板８・９
…の各プリントコイル２２・２３…の引出部を、その各
導体穴８ａ・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…のうち
の何れかの各一対、例えば導体穴８ｂ・８ｅ及び９ｃ・
９ｆに接続してある。上記主絶縁基板７及び副絶縁基板
８・９…上の各プリントコイル２１・２２・２３…は、
片面プリントで形成してある。さらに、前記ボビンレス
コイル１１・１２…及び前記各プリントコイル２１・２
２・２３…をそれぞれ必要な順序で互いに積層して、例
えば、次のように構成してある。まず、前記主絶縁基板
７のプリントコイル２１の上に副絶縁基板８のプリント
コイル２２を積層し、その導体穴９ａ・８ｂ・８ｃ…に
上記主絶縁基板７のプリントコイル用端子ピン６ａ・６
ｂ・６ｃ…を嵌合接続してある。そして、上記副絶縁基
板８の上にボビンレスコイル１１を積層し、上記主絶縁
基板７のボビンレスコイル用端子ピン５ａ・５ｂにその
ボビンレスコイル１１の引出部１１ａ・１１ｂを接続し
てある。また、そのボビンレスコイル１１の上に副絶縁
基板９のプリントコイル２３を積層し、その導体穴９ａ
・９ｂ・９ｃ…に前記主絶縁基板７のプリントコイル用
端子ピン６ａ・６ｂ・６ｃ…を嵌合接続してある。さら
に、その最上層にボビンレスコイル１２を積層し、前記
主絶縁基板７のボビンレスコイル用端子ピン５ｂ・５ｃ
にそのボビンレスコイル１２の引出部１２ａ・１２ｂを
接続してある。そして、前記複数の巻線１・２と前記一
対の磁芯３・４とを互いに組み合わせて構成してある。
尚、前記各プリントコイル２１・２２・２３…を各端子
ピン６ａ・６ｂ・６ｃ…に別々に接続して各々独立した
巻線とする事に代えて、必要に応じて、例えば同じ端子
ピン２個に並列に接続する事なども可能であり、実施例
における巻線数や積層数に限定されるものではない。Embodiments of the present invention will be described below with reference to the drawings. 1st invention (see FIGS. 1 and 2) FIG. 1 is an assembly procedure diagram of a board mounted small transformer, FIG. 2 (A)
Is a perspective view of the same transformer, and FIG. 2B is XX of FIG. 2A.
FIG. 2C is an electric circuit diagram of the same transformer as seen from the direction of the arrow. In the figure, a small-sized transformer for mounting on a board comprises a plurality of windings 1 and 2, a pair of magnetic cores 3 and 4 surrounding them to form a closed magnetic circuit, and each of the windings 1 and 2 described above. It is composed of connecting terminals 5 and 6 and is compactly mounted for mounting on a printed circuit board. That is, at least one bobbinless coil 11 having a flat hollow shape in which only one of the plurality of windings 1 and 2 is wound around an insulated wire.
12 ... And the plurality of windings 1
The other winding 2 of 2 is formed on the main insulating substrate 7 and at least one or more sub-insulating substrates 8 ... 9 as a spiral-shaped printed coil 21, 22. . Further, bobbinless coil terminal pins 5a, 5b, 5c ... And print coil terminal pins 6a, 6b, 6c ... Are planted on the main insulating substrate 7 to form the lead-out connection terminals 5 and 6. , The lead-out portion of the printed coil 21 of the main insulating substrate 7 is connected to the terminal pins 6a and 6b.
.A pair of 6c ..., for example, a terminal pin 6a.
It is connected to 6d. Then, conductor holes 8a, 8b, 8 are provided at the corresponding positions of the sub-insulating substrates 8, 9, ... Corresponding to the implantation positions of the terminal pins 6a, 6b, 6c ,.
.., 9a, 9b, 9c ... are opened so that the main insulating substrate 7 can be fitted with the sub insulating substrates 8.9.
The lead-out portion of each of the print coils 22, 23 ... Is connected to any one of the conductor holes 8a, 8b, 8c, ..., 9a, 9b, 9c, ..., For example, the conductor holes 8b, 8e and 9c.
It is connected to 9f. The printed coils 21, 22, 23, ... on the main insulating substrate 7 and the sub-insulating substrates 8, 9 ...
It is formed by single-sided printing. Further, the bobbinless coils 11, 12 ... And the respective print coils 21.
.. are laminated in the required order, for example, and are configured as follows. First, the print coil 22 of the sub-insulating substrate 8 is laminated on the print coil 21 of the main insulating substrate 7, and the print coil terminal pins 6a, 6 of the main insulating substrate 7 are placed in the conductor holes 9a, 8b, 8c ,.
b6c ... are fitted and connected. The bobbinless coil 11 is laminated on the sub-insulating substrate 8, and the bobbinless coil terminal pins 5a and 5b of the main insulating substrate 7 are connected to the lead-out portions 11a and 11b of the bobbinless coil 11. . Further, the printed coil 23 of the sub-insulating substrate 9 is laminated on the bobbinless coil 11, and the conductor hole 9a
Terminal pins 6a, 6b, 6c for print coil of the main insulating substrate 7 are fitted and connected to 9b, 9c ,. Further, the bobbinless coil 12 is laminated on the uppermost layer thereof, and the bobbinless coil terminal pins 5b and 5c of the main insulating substrate 7 are laminated.
The lead-out portions 12a and 12b of the bobbinless coil 12 are connected to the. The plurality of windings 1 and 2 and the pair of magnetic cores 3 and 4 are combined with each other.
Incidentally, instead of separately connecting the respective print coils 21, 22, 23, ... To the respective terminal pins 6a, 6b, 6c, ... And forming independent windings, for example, the same terminal pin 2 It is also possible to connect them in parallel, and the number of windings and the number of laminated layers in the embodiment are not limited.
【００１０】○第２発明（図３参照） 図３（Ａ）は基板実装用小型変成器の斜視図、図３
（Ｂ）は同変成器の組立要領部分図である。前記第１発
明の基板実装用小型変成器において、前記主絶縁基板７
のプリントコイル用端子ピン６ａ・６ｂ・６ｃ…を、プ
リントコイル２１の周縁部に等間隔で円弧状に植設して
ある。そして、前記各副絶縁基板８・９…を、上記円弧
状に植設した各端子ピン６ａ・６ｂ・６ｃ…に沿って回
転させて互いにずらせながらそれぞれ必要な順序で積層
するとともに、上記主絶縁基板７の各端子ピン６ａ・６
ｂ・６ｃ…を、上記各副絶縁基板８・９…の各導体穴８
ａ・８ｂ・８ｃ…・９ａ・９ｂ・９ｃ…に順にずらせて
嵌合接続してある。上記主絶縁基板７及び副絶縁基板８
・９…上の各プリントコイル２１・２２・２３…は、例
えば渦巻状のコイルの巻始引出部を基板裏側にプリント
してスルーホールで表面に出し、巻終引出部を基板表面
で各端子ピン又は各導体穴に接続した、両面プリントで
形成してある。例えば、前記主絶縁基板７のプリントコ
イル２１の上にその端子ピン６ａ・６ｂの中心角θだけ
ずらせて副絶縁基板８のプリントコイル２２を積層し、
上記主絶縁基板７の端子ピン６ｂ・６ｃに上記プリント
コイル２２の引出部である導体穴８ｃ・８ｄを嵌合接続
している。そして、その副絶縁基板８の上にボビンレス
コイル１１を積層し、さらにその上に副絶縁基板９のプ
リントコイル２３を中心角θだけずらせて積層してい
る。上記ボビンレスコイル１１の引出部１１ａ・１１ｂ
は前記主絶縁基板７の端子ピン５ａ・５ｂに接続し、上
記プリントコイル２３の引出部である導体穴９ｃ・９ｄ
は上記主絶縁基板７の端子ピン６ｃ・６ｄに接続してあ
る。さらに、そのプリントコイル２３の上にボビンレス
コイル１２を積層して端子ピン５ｂ・５ｃに接続してあ
る。上記のように、前記各プリントコイル２１・２２・
２３は互いに中心角θだけずらせて各端子ピン６ａ・６
ｂ・６ｃ…に順に接続される結果、全体として直列接続
の１個のコイルとなり、かつ、上記ボビンレスコイル１
１とボビンレスコイル１２との間にプリントコイル２３
を挟み込むサンドイッチ構造の巻線１・２を構成する。
尚、前記各プリントコイル２１・２２・２３…を順に直
列に接続するのに代えて、必要に応じて例えば同じ端子
ピン２個に並列に接続する事、又は、別個の端子ピン４
個に別々に接続して各々独立した巻線とする事なども可
能であり、実施例における巻線数や積層数に限定される
ものではない。Second Invention (See FIG. 3) FIG. 3A is a perspective view of a small-sized transformer for mounting on a substrate, FIG.
(B) is a partial view of the assembling procedure of the same transformer. In the small-sized board mounting transformer of the first invention, the main insulating substrate 7
The print coil terminal pins 6a, 6b, 6c ... Are planted in an arc shape at equal intervals on the peripheral edge of the print coil 21. The auxiliary insulating substrates 8 and 9 are rotated along the arc-shaped terminal pins 6a, 6b and 6c and are displaced from each other to be laminated in the required order, and the main insulating substrate Each terminal pin 6a, 6 of the board 7
b. 6c ... to the conductor holes 8 of the sub-insulating substrates 8.
a, 8b, 8c, ..., 9a, 9b, 9c, ... The main insulating substrate 7 and the auxiliary insulating substrate 8
Each of the printed coils 21, 22, 23, ... on the ... 9 ... is printed, for example, on the back side of the substrate by printing the winding start lead-out portion of a spiral coil, and is exposed on the surface through a through hole, and the winding end lead-out portion is provided on each surface of the substrate at each terminal. It is formed by double-sided printing connected to pins or conductor holes. For example, the print coil 22 of the sub-insulating substrate 8 is laminated on the print coil 21 of the main insulating substrate 7 while being displaced by the central angle θ of the terminal pins 6a and 6b.
The terminal pins 6b and 6c of the main insulating substrate 7 are fitted and connected to the conductor holes 8c and 8d which are the lead-out portions of the printed coil 22. Then, the bobbinless coil 11 is laminated on the sub-insulating substrate 8, and the print coil 23 of the sub-insulating substrate 9 is further laminated on the sub-insulating substrate 8 while being offset by the central angle θ. Lead-out parts 11a and 11b of the bobbinless coil 11
Are connected to the terminal pins 5a and 5b of the main insulating substrate 7 and are conductor holes 9c and 9d which are the lead-out portions of the printed coil 23.
Are connected to the terminal pins 6c and 6d of the main insulating substrate 7. Further, the bobbinless coil 12 is laminated on the printed coil 23 and connected to the terminal pins 5b and 5c. As described above, the print coils 21, 22 ...
23 are offset from each other by the central angle θ, and
As a result of being sequentially connected to b.6c ..., one coil is connected in series as a whole, and the bobbinless coil 1
A print coil 23 is provided between the coil coil 1 and the bobbinless coil 12.
The windings 1 and 2 having a sandwich structure sandwiching the coil are formed.
Incidentally, instead of serially connecting the respective print coils 21, 22, 23, ... In order, for example, they may be connected in parallel to two of the same terminal pins, or separate terminal pins 4 may be connected.
It is also possible to connect them individually to form independent windings, and the number of windings and the number of laminated layers in the embodiment are not limited.
【図１】第１発明実施例を示し、基板実装用小型変成器
の組立要領図である。FIG. 1 is an assembly procedure diagram of a small-sized board mounting transformer according to a first embodiment of the present invention.
【図２】第１発明実施例を示し、図２（Ａ）は同変成器
の斜視図、図２（Ｂ）は図２（Ａ）のＸ−Ｘ線矢視断面
図、図２（Ｃ）は同変成器の電気回路図である。FIG. 2 shows a first embodiment of the invention, FIG. 2 (A) is a perspective view of the same transformer, FIG. 2 (B) is a sectional view taken along line XX of FIG. 2 (A), and FIG. ) Is an electric circuit diagram of the transformer.
【図３】第２発明実施例を示し、図３（Ａ）は同変成器
の斜視図、図３（Ｂ）は同変成器の組立要領部分図であ
る。FIG. 3 shows a second embodiment of the invention, FIG. 3 (A) is a perspective view of the transformer, and FIG. 3 (B) is a partial view of an assembling procedure of the transformer.
【図４】従来例を示し、図４（Ａ）は縦型の基板実装用
小型変成器、図４（Ｂ）は横型の同変成器、図４（Ｃ）
は同変成器の電気回路図である。FIG. 4 shows a conventional example, FIG. 4 (A) is a vertical type small-sized board mounting transformer, FIG. 4 (B) is a horizontal type same transformer, and FIG. 4 (C).
Is an electric circuit diagram of the same transformer.
１・２…巻線、３・４…磁芯、５・６…引出接続端子、
７…主絶縁基板、５ａ・５ｂ・５ｃ・６ａ・６ｂ・６ｃ
…端子ピン、８・９…副絶縁基板、８ａ・８ｂ・８ｃ・
８ｄ・９ｂ・９ｃ…導体穴、１１・１２…ボビンレスコ
イル、 １１ａ・１１ｂ・１２ａ・１２ｂ…引出部、２１・２２
・２３…プリントコイル。1.2 ... Winding, 3.4 ... Magnetic core, 5/6 ... Drawing connection terminal,
7 ... Main insulating substrate, 5a, 5b, 5c, 6a, 6b, 6c
... Terminal pins, 8.9 ... Sub-insulating substrate, 8a / 8b / 8c
8d / 9b / 9c ... Conductor hole, 11/12 ... Bobbinless coil, 11a / 11b / 12a / 12b ... Lead-out part, 21/22
・ 23 ... Print coil.
Claims (2)
互いに組み合わせて閉磁路を形成する一対の磁芯(３・
４)と、上記各巻線(１・２)の各引出接続端子(５・６)
とから成り、プリント基板実装用に小型に構成した基板
実装用小型変成器において、 前記複数の巻線(１・２)のうちの一方の巻線(１)を、絶
縁電線のみを巻回した少なくとも１個以上の偏平中空形
状のボビンレスコイル(１１・１２…)として形成し、 前記複数の巻線(１・２)のうちの他方の巻線(２)を、主
絶縁基板(７)及び少なくとも１個以上の副絶縁基板(８
・９…)に導電性パターンで渦巻状のプリントコイル(２
１・２２・２３…)として形成し、 上記主絶縁基板(７)にボビンレスコイル用端子ピン(５
ａ・５ｂ・５ｃ…)、及びプリントコイル用端子ピン(６
ａ・６ｂ・６ｃ…)を植設して、前記引出接続端子(５・
６)を形成するとともに、その主絶縁基板(７)のプリン
トコイル(２１)の引出部を上記各端子ピン(６ａ・６ｂ
・６ｃ…)のうちの何れかの一対に接続し、 前記主絶縁基板(７)の各端子ピン(６ａ・６ｂ・６ｃ…)
の植設位置に相当する前記副絶縁基板(８・９…)の相当
位置に、導体穴(８ａ・８ｂ・８ｃ…)・(９ａ・９ｂ・
９ｃ…)を開口して、上記主絶縁基板(７)と嵌合可能に
するとともに、その各副絶縁基板(８・９…)の各プリン
トコイル(２２・２３…)の引出部を、その各導体穴(８
ａ・８ｂ・８ｃ…)・(９ａ・９ｂ・９ｃ…)のうちの何
れかの各一対に接続し、 前記ボビンレスコイル(１１・１２…)及び前記各プリン
トコイル(２１・２２・２３…)をそれぞれ必要な順序で
互いに積層して、前記主絶縁基板(７)の各端子ピン(６
ａ・６ｂ・６ｃ…)を前記各副絶縁基板(８・９…)の各
導体穴(８ａ・８ｂ・８ｃ…)・(９ａ・９ｂ・９ｃ…)に
嵌合接続するとともに、上記ボビンレスコイル(１１・
１２…)の引出部(１１ａ・１１ｂ・１２ａ・１２ｂ…)
を前記端子ピン(５ａ・５ｂ・５ｃ…)に接続し、 前記複数の巻線(１・２)と前記一対の磁芯(３・４)とを
互いに組み合わせて構成したことを特徴とする基板実装
用小型変成器。1. A plurality of windings (1, 2) and a pair of magnetic cores (3, 2) which surround them and are combined with each other to form a closed magnetic circuit.
4) and the respective lead-out connection terminals (5, 6) of the above-mentioned windings (1, 2)
In a small-sized board mounting transformer configured for mounting on a printed circuit board, one winding (1) of the plurality of windings (1 and 2) is wound only with an insulated wire. At least one or more flat hollow bobbinless coils (11, 12 ...) Are formed, and the other winding (2) of the plurality of windings (1, 2) is connected to the main insulating substrate (7). And at least one sub-insulating substrate (8
・ 9 ...) with a conductive pattern in a spiral print coil (2
1, 22, 23 ...), and bobbinless coil terminal pins (5) are formed on the main insulating substrate (7).
a, 5b, 5c ...), and terminal pins for the print coil (6
a, 6b, 6c ...) are planted, and the lead-out connection terminals (5.
6), and the lead-out portion of the printed coil (21) of the main insulating substrate (7) is connected to the terminal pins (6a, 6b).
.6c ...), and each terminal pin (6a, 6b, 6c ...) of the main insulating substrate (7).
At corresponding positions of the sub-insulating substrate (8, 9 ...) Corresponding to the planting positions of the conductor holes (8a, 8b, 8c ...), (9a, 9b.
9c ...) is opened so that the main insulating substrate (7) can be fitted to the main insulating substrate (7), and the lead-out portions of the print coils (22. Each conductor hole (8
a, 8b, 8c ...), (9a, 9b, 9c ...), and each bobbinless coil (11.12 ...) And each print coil (21.22.23 ... ) Are laminated on each other in a required order, and each terminal pin (6) of the main insulating substrate (7) is stacked.
a.6b.6c ...) are fitted and connected to the conductor holes (8a.8b.8c ...). (9a.9b.9c ...) of the sub-insulating substrates (8.9 ...) and the bobbinless Coil (11
12 ...) Lead-out part (11a, 11b, 12a, 12b ...)
Is connected to the terminal pins (5a, 5b, 5c ...), and the plurality of windings (1, 2) and the pair of magnetic cores (3, 4) are combined with each other to form a substrate. Small transformer for mounting.
端子ピン(６ａ・６ｂ・６ｃ…)を、プリントコイル(２
１)の周縁部に等間隔で円弧状に植設し、 前記各副絶縁基板(８・９…)を、上記円弧状に植設した
各端子ピン(６ａ・６ｂ・６ｃ…)に沿って回転させて互
いにずらせながらそれぞれ必要な順序で積層するととも
に、上記主絶縁基板(７)の各端子ピン(６ａ・６ｂ・６
ｃ…)を、上記各副絶縁基板(８・９…)の各導体穴(８ａ
・８ｂ・８ｃ…)・(９ａ・９ｂ・９ｃ…)に順にずらせ
て嵌合接続したことを特徴とする請求項１に記載の基板
実装用小型変成器。2. The printed coil terminal pins (6a, 6b, 6c ...) Of the main insulating substrate (7) are connected to the printed coil (2).
1) are planted in a circular arc shape at equal intervals in the peripheral portion, and the sub-insulating substrates (8, 9 ...) Are laid along the arc-shaped terminal pins (6a, 6b, 6c ...) The terminal pins (6a, 6b, 6) of the main insulating substrate (7) are stacked together in a necessary order while rotating and shifting each other.
c) to the conductor holes (8a) of the sub-insulating substrates (8, 9 ...)
. 8b. 8c ...). (9a. 9b. 9c ..) are shifted and fitted and connected in this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5136627A JPH088180B2 (en) | 1993-05-14 | 1993-05-14 | Small transformer for board mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5136627A JPH088180B2 (en) | 1993-05-14 | 1993-05-14 | Small transformer for board mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06325952A true JPH06325952A (en) | 1994-11-25 |
| JPH088180B2 JPH088180B2 (en) | 1996-01-29 |
Family
ID=15179732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5136627A Expired - Lifetime JPH088180B2 (en) | 1993-05-14 | 1993-05-14 | Small transformer for board mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088180B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211767B1 (en) * | 1999-05-21 | 2001-04-03 | Rompower Inc. | High power planar transformer |
| GB2371683A (en) * | 2000-11-15 | 2002-07-31 | Payton Ltd | A bobbin for hybrid coils in planar magnetic components |
| EP1319236A2 (en) * | 2000-09-22 | 2003-06-18 | Ascom Energy Systems AG | Method and apparatus for forming a magnetic component on a printed circuit board |
| US6828894B1 (en) * | 1999-09-24 | 2004-12-07 | Siemens Aktiengesellschaft | Isolation transformer arrangement |
| US7266003B2 (en) | 1994-04-26 | 2007-09-04 | Comarco Wireless Technologies, Inc. | Programmable power supply |
| JP2011159689A (en) * | 2010-01-29 | 2011-08-18 | Shindengen Electric Mfg Co Ltd | Transformer module and electronic device |
| JP5325123B2 (en) * | 2008-02-22 | 2013-10-23 | 田淵電機株式会社 | Reactor |
| JP2013225626A (en) * | 2012-04-23 | 2013-10-31 | Tdk Corp | Coil unit, board unit, and power source device |
-
1993
- 1993-05-14 JP JP5136627A patent/JPH088180B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7266003B2 (en) | 1994-04-26 | 2007-09-04 | Comarco Wireless Technologies, Inc. | Programmable power supply |
| US7613021B2 (en) | 1994-04-26 | 2009-11-03 | Comarco Wireless Technologies, Inc | Small form factor power supply |
| US6211767B1 (en) * | 1999-05-21 | 2001-04-03 | Rompower Inc. | High power planar transformer |
| US6828894B1 (en) * | 1999-09-24 | 2004-12-07 | Siemens Aktiengesellschaft | Isolation transformer arrangement |
| EP1319236A2 (en) * | 2000-09-22 | 2003-06-18 | Ascom Energy Systems AG | Method and apparatus for forming a magnetic component on a printed circuit board |
| GB2371683A (en) * | 2000-11-15 | 2002-07-31 | Payton Ltd | A bobbin for hybrid coils in planar magnetic components |
| GB2371683B (en) * | 2000-11-15 | 2005-03-02 | Payton Ltd | A bobbin for hybrid coils in planar magnetic components |
| JP5325123B2 (en) * | 2008-02-22 | 2013-10-23 | 田淵電機株式会社 | Reactor |
| JP2011159689A (en) * | 2010-01-29 | 2011-08-18 | Shindengen Electric Mfg Co Ltd | Transformer module and electronic device |
| JP2013225626A (en) * | 2012-04-23 | 2013-10-31 | Tdk Corp | Coil unit, board unit, and power source device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH088180B2 (en) | 1996-01-29 |
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