JPH0632418B2 - Microwave integrated circuit - Google Patents

Microwave integrated circuit

Info

Publication number
JPH0632418B2
JPH0632418B2 JP62290397A JP29039787A JPH0632418B2 JP H0632418 B2 JPH0632418 B2 JP H0632418B2 JP 62290397 A JP62290397 A JP 62290397A JP 29039787 A JP29039787 A JP 29039787A JP H0632418 B2 JPH0632418 B2 JP H0632418B2
Authority
JP
Japan
Prior art keywords
integrated circuit
metal cover
microwave
microwave integrated
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62290397A
Other languages
Japanese (ja)
Other versions
JPH01130593A (en
Inventor
治 山中
明夫 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62290397A priority Critical patent/JPH0632418B2/en
Publication of JPH01130593A publication Critical patent/JPH01130593A/en
Publication of JPH0632418B2 publication Critical patent/JPH0632418B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Waveguides (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はアルミナセラミツク基板等を用いて構成され
るマイクロ波集積回路における、それらの回路を収容す
る筐体の構造に関するものである。
Description: TECHNICAL FIELD The present invention relates to a structure of a housing that houses a circuit in a microwave integrated circuit configured using an alumina ceramic substrate or the like.

〔従来の技術〕[Conventional technology]

従来からマイクロ波集積回路はマイクロストリツプ線路
を主体とした回路にトランジスタ,ダイオード等の能動
素子または抵抗,コンデンサー等の受動素子を用いて構
成されるが、一定の筐体に収容され、外部との信号の接
続は、同軸ケーブルまたは導波管にて行なうため、コネ
クタ等によるマイクロストリツプ−同軸変換またはマイ
クロストリツプ−導波管変換等を用いている。
Conventionally, a microwave integrated circuit is configured by using active elements such as transistors and diodes or passive elements such as resistors and capacitors in a circuit mainly composed of a microstrip line. Since signals are connected to each other by a coaxial cable or a waveguide, microstrip-coaxial conversion or microstrip-waveguide conversion using a connector or the like is used.

さて、こうした構造を持つマイクロストリツプ線路を主
体としたマイクロ波集積回路におけるマイクロ波の伝搬
モードは当然マイクロストリツプモードであるが、本来
のマイクロストリツプモードは伝搬波長に対して十分に
広い接地面と空間がたてまえである。ところが、こうし
た一定の筐体の内にマイクロ波回路を収容した場合、筐
体自体が一定の導波管とみなせるので不要モードとして
の導波管モードによる信号の伝搬または共振等の現象が
起り、本来の動作が十分出来ない場合がある。
By the way, the microwave propagation mode in a microwave integrated circuit mainly composed of a microstrip line having such a structure is, of course, a microstrip mode, but the original microstrip mode is sufficient for the propagation wavelength. It has a wide ground contact surface and space. However, when the microwave circuit is housed in such a fixed housing, the housing itself can be regarded as a fixed waveguide, so that a phenomenon such as signal propagation or resonance in the waveguide mode as an unnecessary mode occurs, The original operation may not be performed sufficiently.

このような点に対処するために従来用いられていたの
は、筐体の構造自体をカツトオフ導波管とし、導波管モ
ードでの信号の伝搬が行なわれないようにすることであ
る。
What has been conventionally used to deal with such a point is that the structure of the housing itself is a cut-off waveguide to prevent signal propagation in the waveguide mode.

第5図はこのような従来のマイクロ波集積回路筐体を示
す断面図で、信号の伝送線路に対して直角方向の断面で
ある。図において、(1)は外部筐体、(2)はマイクロ波回
路を構成する誘電体基板、(3)は金属キヤリア、(4)は内
部金属カバー、(5)は外部蓋であり、信号の伝送線路は
誘電体基板(2)上に構成されている。内部金属カバー(4)
の相対向する壁の間隔は伝搬波長の1/2以下の長さに
設定されており、方形導波管の基本モードであるTE10
に対して十分カツトオフとなり内部金属カバー(4)の内
側において導波管モードで信号が伝搬することはない。
FIG. 5 is a cross-sectional view showing such a conventional microwave integrated circuit housing, which is a cross section in a direction perpendicular to a signal transmission line. In the figure, (1) is an outer housing, (2) is a dielectric substrate that constitutes a microwave circuit, (3) is a metal carrier, (4) is an inner metal cover, and (5) is an outer lid. The transmission line of is formed on the dielectric substrate (2). Inner Metal Cover (4)
The distance between the walls facing each other is set to 1/2 or less of the propagation wavelength, which is sufficiently cut off for TE 10 wave which is the fundamental mode of the rectangular waveguide, and inside the inner metal cover (4). In, no signal propagates in the waveguide mode.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

しかしながらこの様な構造の場合内部金属カバー(4)と
外部蓋(5)との間にはやはり一定の間隙が残り、内部金
属カバー(4)の端などから外部に洩れ出た電波はやは
り、外部筐体(1)内部で伝搬することが出来、マイクロ
波回路の特性に影響を与えうるという問題点があつた。
However, in the case of such a structure, a certain gap still remains between the inner metal cover (4) and the outer lid (5), and the radio wave leaked to the outside from the end of the inner metal cover (4) is also There is a problem in that it can propagate inside the external housing (1) and can affect the characteristics of the microwave circuit.

この発明はこのような問題点を解消する為になされたも
のでわずかの間隙での電波伝搬を防ぐことができるよう
にしたマイクロ波集積回路を得ることを目的としてい
る。
The present invention has been made to solve such a problem, and an object thereof is to obtain a microwave integrated circuit capable of preventing radio wave propagation in a slight gap.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るマイクロ波集積回路は、従来の方法と同
じように、カツトオフ導波管の原理を用いるとともに、
内部金属カバーとこれを覆う外部筐体の蓋との間に信号
の伝搬方向に沿つて所要間隔で複数個の導電弾性部材を
挿入し、両者間の電気的接続を確実ならしめたものであ
る。
The microwave integrated circuit according to the present invention uses the principle of the cutoff waveguide as in the conventional method,
A plurality of conductive elastic members are inserted between the inner metal cover and the lid of the outer casing covering the same along the signal propagation direction at required intervals to ensure electrical connection between the two. .

〔作用〕[Action]

この発明におけるマイクロ波集積回路では、内部金属カ
バーは従来と同様カツトオフ導波管として作用させると
ともに、外部筐体の蓋との間に信号の伝播方向に沿つて
所要間隔で複数個の導電弾性部材を挿入し、両者間のわ
ずかの間隙での電波の伝搬は生じない。
In the microwave integrated circuit according to the present invention, the inner metal cover acts as a cut-off waveguide as in the conventional case, and a plurality of conductive elastic members are provided between the inner metal cover and the lid of the outer casing along the signal propagation direction at a required interval. , The radio wave does not propagate in the slight gap between them.

〔発明の実施例〕Example of Invention

第1図は本発明の第1の実施例を一部破断して示す平面
図、第2図は第1図のII−II線での断面図である。この
実施例では第2図で判るように、内部金属カバー(4)と
外部蓋(5)との間にフインガー(6)と呼ばれるバネ材を挿
入することによつて、従来の構造において生じていたわ
ずかの間隙による電波伝搬をやはりカツトオフ導波管と
することにより、無くす構造としている。
FIG. 1 is a partially cutaway plan view showing a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG. In this embodiment, as can be seen in FIG. 2, by inserting a spring material called a finger (6) between the inner metal cover (4) and the outer lid (5), there is a problem in the conventional structure. The cut-off waveguide is used to eliminate the radio wave propagation due to the slight gap.

このフインガー(6)は、リン青銅のような弾性を持つた
材料で作られており、第3図(a)に平面図、同図(b)に側
面図を示すように、信号の伝搬方向に沿つて細かい間隔
で上下の電気的接触を保つのに有効な働きをしている。
This finger (6) is made of an elastic material such as phosphor bronze. As shown in the plan view of Fig. 3 (a) and the side view of Fig. 3 (b), the direction of signal propagation is shown. It works effectively to keep the upper and lower electrical contact at a fine interval.

また、本実施例に示すように内部金属カバー(4)の上面
に溝を設けることにより、このフインガー(6)を一定の
位置に固定することができる。
Further, by providing a groove on the upper surface of the inner metal cover (4) as shown in this embodiment, the finger (6) can be fixed at a fixed position.

本実施例には、マイクロストリツプ線路(2)を対向する
壁の間隔が伝搬する信号波長の1/2以下の長さとなる
ようなカバー(4)でおおうこれによりこの内部金属カバ
ー(4)での不要モードによる信号の伝搬を抑え、更に、
このカバー(4)の端などの間隙(例えば(7))などから洩
れる電波もカバー(4)と外部蓋(5)との間にバネ材をお互
いに信号の伝搬方向の直角方向にやはり伝搬波長の1/
2以下となるように構成したフインガー(6)を配し、外
部蓋(5)と内部金属カバー(4)との間の電気的接触を保つ
ことにより、伝搬しないようにしている。
In this embodiment, the microstrip line (2) is covered with a cover (4) such that the distance between the opposing walls is not more than 1/2 of the propagating signal wavelength. ) Suppresses the propagation of signals due to unnecessary modes, and
Radio waves leaking from a gap (eg (7)) at the edge of the cover (4) are also propagated by a spring material between the cover (4) and the outer lid (5) in the direction perpendicular to the signal propagation direction. 1 / wavelength
The fingers (6) configured so as to have the number of 2 or less are arranged, and the electrical contact between the outer lid (5) and the inner metal cover (4) is maintained to prevent the propagation.

又、第4図に本発明の第2の実施例を示す。この実施例
では第1の実施例と同様、外部蓋(5)と内部金属カバー
(4)との間の間隙をやはりカツトオフ導波管とするもの
であるが、溝を外部蓋(5)に設け更にその溝の中に導電
ゴム(8)などを取り付け、一方で内部金属カバー(4)側に
は外部蓋(5)の溝に沿つて突起を設け蓋をした時に内部
金属カバー(4)の突起部と導電ゴム(8)とが接触すること
により第1の実施例と同様の効果を得ることができる。
A second embodiment of the present invention is shown in FIG. In this embodiment, as in the first embodiment, the outer lid (5) and the inner metal cover are
The gap with (4) is also used as a cutoff waveguide, but a groove is provided in the outer lid (5) and a conductive rubber (8) is attached in the groove, while the inner metal cover is attached. When the protrusion is provided along the groove of the outer lid (5) on the (4) side and the lid is covered, the protrusion of the inner metal cover (4) and the conductive rubber (8) are brought into contact with each other. The same effect can be obtained.

上記実施例においてはアルミナセラミツク等を用いたマ
イクロ波集積回路について説明したが、本発明は通常の
プリント基板等を用いたマイクロ波回路等においても容
易に実現することができる。
Although the microwave integrated circuit using alumina ceramics or the like has been described in the above embodiment, the present invention can be easily realized in a microwave circuit or the like using an ordinary printed circuit board or the like.

〔発明の効果〕〔The invention's effect〕

以上のように、この発明によれば、マイクロ波回路を包
む内部金属カバーとこれを包む外部筐体の蓋との間に、
マイクロ波信号の伝搬方向に沿つて上記マイクロ波波長
の1/2以下のピツチで導電弾性体を挿入し、両者間の
導電を確実にしたので、不要モードの信号波の伝搬を除
去することができ、特性劣化のないマイクロ波集積回路
が得られる。
As described above, according to the present invention, between the inner metal cover that wraps the microwave circuit and the lid of the outer housing that wraps the inner metal cover,
Since the conductive elastic body is inserted along the propagation direction of the microwave signal with a pitch of 1/2 or less of the microwave wavelength to ensure the conductivity between the two, it is possible to eliminate the propagation of the signal wave in the unnecessary mode. Thus, a microwave integrated circuit without deterioration of characteristics can be obtained.

【図面の簡単な説明】 第1図はこの発明の第1の実施例を一部破断して示す平
面図、第2図はそのII−II線での断面図、第3図(a)は
これに用いるフインガーの平面図、同図(b)はその側面
図、第4図はこの発明の第2の実施例を示す断面図、第
5図は従来のマイクロ波集積回路を示す断面図である。 図において、(1)は外部筐体、(2)は誘電体基板、(3)は
金属キヤリア、(4)は内部金属カバー、(5)は外部蓋、
(6)はフインガー、(7)は間隙、(8)は導電性ゴムであ
る。 なお、図中同一符号は同一または相当部分をしめす。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially cutaway plan view showing a first embodiment of the present invention, FIG. 2 is a sectional view taken along line II-II, and FIG. A plan view of a finger used for this, FIG. 4 (b) is a side view thereof, FIG. 4 is a sectional view showing a second embodiment of the present invention, and FIG. 5 is a sectional view showing a conventional microwave integrated circuit. is there. In the figure, (1) is an outer housing, (2) is a dielectric substrate, (3) is a metal carrier, (4) is an inner metal cover, (5) is an outer lid,
(6) is a finger, (7) is a gap, and (8) is a conductive rubber. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】誘電体基板上に形成されたマイクロストリ
ツプ線路とトランジスタ等の回路素子とで構成される回
路、及びこの回路を収容する外部筐体からなるマイクロ
波集積回路において、 上記外部筐体の内部にあつて、マイクロ波信号の伝搬方
向に沿つて延びコの字形断面形状を有する内部金属カバ
ーによつて上記回路の少なくとも一部を覆うとともに、 上記外部筐体の蓋と上記内部金属カバーとの間に上記マ
イクロ波信号の伝搬方向に沿つて、上記マイクロ波波長
の1/2以下のピツチで導電弾性体を挿入し、上記外部
筐体の蓋と上記内部金属カバーとの間の導通を確実にし
たことを特徴とするマイクロ波集積回路。
1. A microwave integrated circuit comprising a circuit composed of a microstrip line formed on a dielectric substrate and a circuit element such as a transistor, and an external casing accommodating the circuit, wherein: At least a part of the circuit is covered with an inner metal cover having a U-shaped cross section extending along the propagation direction of the microwave signal inside the casing, and the lid of the outer casing and the inside are covered. Between the metal cover and the propagation direction of the microwave signal, a conductive elastic body is inserted with a pitch of 1/2 or less of the microwave wavelength, and between the lid of the outer casing and the inner metal cover. A microwave integrated circuit characterized by ensuring electrical continuity.
【請求項2】外部筐体の蓋と、内部金属カバーとの対向
面の一方に設けた凹部に導電弾性体を配設し、上記対向
面の他方に所要ピツチで設けた凸部で上記導電弾性体を
押圧するようにしたことを特徴とする特許請求の範囲第
1項記載のマイクロ波集積回路。
2. A conductive elastic body is disposed in a recess provided on one of the surfaces of the outer casing facing the inner metal cover and the conductive elastic body is provided on the other of the facing surface with a projection provided with a required pitch. The microwave integrated circuit according to claim 1, wherein the elastic body is pressed.
【請求項3】導電弾性体として所要ピツチの複数個の弾
性フインガーを有する金属片を用いたことを特徴とする
特許請求の範囲第1項または第2項記載のマイクロ波集
積回路。
3. The microwave integrated circuit according to claim 1 or 2, wherein a metal piece having a plurality of elastic fingers of a required pitch is used as the conductive elastic body.
【請求項4】導電弾性体として導電ゴム部材を用いたこ
とを特徴とする特許請求の範囲第1項または第2項記載
のマイクロ波集積回路。
4. The microwave integrated circuit according to claim 1, wherein a conductive rubber member is used as the conductive elastic body.
JP62290397A 1987-11-16 1987-11-16 Microwave integrated circuit Expired - Fee Related JPH0632418B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62290397A JPH0632418B2 (en) 1987-11-16 1987-11-16 Microwave integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62290397A JPH0632418B2 (en) 1987-11-16 1987-11-16 Microwave integrated circuit

Publications (2)

Publication Number Publication Date
JPH01130593A JPH01130593A (en) 1989-05-23
JPH0632418B2 true JPH0632418B2 (en) 1994-04-27

Family

ID=17755482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62290397A Expired - Fee Related JPH0632418B2 (en) 1987-11-16 1987-11-16 Microwave integrated circuit

Country Status (1)

Country Link
JP (1) JPH0632418B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747916Y2 (en) * 1990-11-22 1995-11-01 三菱電機株式会社 Microwave circuit device
JPH08186401A (en) * 1994-12-28 1996-07-16 Nec Corp Casing for high frequency signal transmission
JP5677146B2 (en) * 2011-03-14 2015-02-25 三菱電機株式会社 Microwave circuit

Also Published As

Publication number Publication date
JPH01130593A (en) 1989-05-23

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