JPH06317539A - Laser irradiation device - Google Patents

Laser irradiation device

Info

Publication number
JPH06317539A
JPH06317539A JP5104859A JP10485993A JPH06317539A JP H06317539 A JPH06317539 A JP H06317539A JP 5104859 A JP5104859 A JP 5104859A JP 10485993 A JP10485993 A JP 10485993A JP H06317539 A JPH06317539 A JP H06317539A
Authority
JP
Japan
Prior art keywords
flaw
laser
laser scanning
laser irradiation
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5104859A
Other languages
Japanese (ja)
Inventor
Yasutaka Nawata
康隆 縄田
Yasuhide Tagata
康秀 田形
Shuichi Shiozawa
修一 塩沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP5104859A priority Critical patent/JPH06317539A/en
Publication of JPH06317539A publication Critical patent/JPH06317539A/en
Withdrawn legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To provide an efficient method for melting and removing flaws by making laser scanning by using a mirror in the direction of width and also employing a Fourier lens for a constant focal length. CONSTITUTION:Relating to a flaw removal device wherein a flaw part is, while interlocked with a surface flaw examination device, irradiated with a laser so that the flaw part is melted-cut and removed, a function wherein a surface flaw is detected by the surface flaw examination device and the position in the direction of width of the flaw part is detected and then a laser scanning mirror is rotated and controlled, in accordance with width the direction of the flaw part, and at the same time, a Fourier lens 17 is arranged in a laser scanning light path so that the variation in light path length due to laser scanning is corrected, is provided, so that the flaw part is tracked in the direction of line advancement, and laser is poured when the flaw part reaches the position. Therefore irradiation rage of the laser length becomes constant, enabling efficiently melting and removing flaws.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は金属帯板の疵補修レーザ
ー照射装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser irradiation apparatus for repairing a flaw on a metal strip.

【0002】[0002]

【従来の技術】近年、レーザによる走行ビレッドの部分
表面溶削処理として、特開平4−274892号公報の
ように、金属ビレッドの走行方向と直角の方向に移動す
るレーザー加工ヘッドとこの加工ヘッド内に組み込まれ
た振動ミラー等によるビームスキャニング光学系とスキ
ャニング幅調整装置と上記レーザー加工ヘッドに一体に
組み込まれた酸素ガスまたは酸素を含んだ混合ガスを吹
き付けることにより、金属ビレット表面のワレ等の欠陥
を溶融除去する方法およびその装置が知られている。
2. Description of the Related Art In recent years, as a partial surface ablation treatment of a traveling billet by a laser, a laser machining head which moves in a direction perpendicular to a traveling direction of a metal billet and a machining head in this machining head are disclosed in Japanese Patent Application Laid-Open No. 4-274892. Defects such as cracks on the surface of the metal billet by spraying oxygen gas or a mixed gas containing oxygen integrated into the laser processing head and the beam scanning optical system and scanning width adjusting device using a vibrating mirror etc. There is known a method and an apparatus for melting and removing.

【0003】[0003]

【発明が解決しようとする課題】上述した従来の特開平
4−274892号公報のような金属ビレット表面のワ
レ等の欠陥をレーザビームを照射して溶融・溶削除去す
るに当って、加工ヘッド内に組み込まれた振動ミラー等
によるビームスキャニング光学系によるスキャニング幅
調整は示されているが、疵部の幅方向に対して最適なレ
ーザー照射を修正する機構が明確でないために、効率良
い疵の溶融・溶削除去が行われていないと言う問題があ
る。このような問題を解消するために、本発明はレーザ
ーをミラーで幅方向にスキャニングすると共にフーリエ
レンズを採用することによって焦点距離を一定化し、効
率の良い疵の溶融・溶削除去方法を提供するものであ
る。
When a defect such as a crack on the surface of a metal billet as in the above-mentioned Japanese Patent Laid-Open No. 4-274892 is irradiated with a laser beam to be melted and melted away, a processing head is used. Although the scanning width adjustment by the beam scanning optical system by the vibrating mirror etc. built in is shown, the mechanism that corrects the optimum laser irradiation in the width direction of the flaw part is not clear, so the effective flaw There is a problem that it is not melted and removed. In order to solve such a problem, the present invention provides an efficient method for melting and removing defects by fixing the focal length by scanning a laser with a mirror in the width direction and adopting a Fourier lens. It is a thing.

【0004】[0004]

【課題を解決するための手段】本発明は上記課題を解決
したもので、その発明の要旨とするところは、表面疵検
査装置に連動して疵部にレーザーを照射し、疵部を溶融
・溶削する疵取り装置において、表面疵検査装置にて表
面疵を検出して、該疵部の幅方向位置を検出して、該疵
部の幅方向に合わせてレーザースキャニング用ミラーを
回転制御すると共に、レーザースキャニング光路内にフ
ーリエレンズを配置して、レーザースキャニングによる
光路長変化を修正する機能を持たせ、該疵部をライン進
行方向にトラッキングして、該疵部がレーザー照射位置
へ到達したタイミングでレーザーを照射することを特徴
とするレーザー照射装置にある。
Means for Solving the Problems The present invention has been made to solve the above-mentioned problems, and the gist of the invention is to irradiate a laser on a flaw portion in association with a surface flaw inspection device to melt the flaw portion. In a flaw removing device for fusing, surface flaws are detected by a surface flaw inspection device, a width direction position of the flaw portion is detected, and a laser scanning mirror is rotationally controlled in accordance with the width direction of the flaw portion. Along with this, a Fourier lens is arranged in the laser scanning optical path to have a function of correcting the change in optical path length due to laser scanning, and the flaw is tracked in the line advancing direction, and the flaw reaches the laser irradiation position. A laser irradiation device is characterized by irradiating a laser at a timing.

【0005】[0005]

【作用】以下本発明について図面に従って詳細に説明す
る。図1は本発明に係る金属帯板の溶融・溶削を示す工
程図である。図1において、熱延コイル1を巻き戻され
た後、溶接機2によって連続的に溶接し、その後、ルー
プカー3を経て酸洗槽4にて酸洗された熱延コイル1は
表面疵検査装置5により疵位置を検出し、疵部をトラッ
キング装置により、熱延コイル1を搬送するブライドル
ロールの回転数をパルス発信器にて計算して搬送された
熱延コイル1の搬送量を算出する。そして信号処理装置
にて熱延コイル表面の疵が検出された場合、確実に熱延
コイル疵をレーザー照射位置6により熱延コイル1の表
面を溶削除去された後、ループカー7を介して冷間圧延
機8にて冷間圧延された後冷間圧延済みコイル9として
巻き取られる。
The present invention will be described in detail below with reference to the drawings. FIG. 1 is a process diagram showing melting and fusing of a metal strip according to the present invention. In FIG. 1, the hot rolled coil 1 is unwound, continuously welded by a welding machine 2, and then pickled in a pickling tank 4 through a loop car 3 and the hot rolled coil 1 is a surface flaw inspection device. The flaw position is detected by 5, and the number of rotations of the bridle roll that conveys the hot-rolled coil 1 is calculated by the tracking device for the flaw portion by the pulse transmitter to calculate the conveyed amount of the hot-rolled coil 1 that has been conveyed. When the signal processing device detects a flaw on the surface of the hot-rolled coil, the flaw on the hot-rolled coil 1 is surely removed by melting the surface of the hot-rolled coil 1 by the laser irradiation position 6 and then cooled through the loop car 7. After being cold-rolled by the hot-rolling mill 8, it is wound as a cold-rolled coil 9.

【0006】図2は本発明に係る疵溶融・溶削工程の概
略図である。図2に示すように、巻き戻された熱延コイ
ル1は表面疵検査装置5により、疵位置を検出し、この
疵検出信号にてライン速度に対応して疵トラッキング装
置10により、熱延コイルの疵位置をレーザ発信制御装
置11に伝送し、このレーザ発信制御装置11の信号に
よりレーザ発信器12よりレーザ照射が行われる。一方
表面疵検査装置5によって疵の幅方向位置を検出すると
共に、疵トラッキング装置10によって、回転ミラー制
御装置13に伝送され、回転ミラー駆動モータ14によ
り目標ミラーの駆動によって疵へのレーザ照射が行われ
る。
FIG. 2 is a schematic view of a flaw melting / melting process according to the present invention. As shown in FIG. 2, the rewound hot-rolled coil 1 detects the flaw position by the surface flaw inspection device 5, and the flaw tracking device 10 detects the flaw position by the flaw detection signal and corresponds to the line speed. The defect position is transmitted to the laser emission control device 11, and the laser emission from the laser oscillator 12 is performed by the signal from the laser emission control device 11. On the other hand, the surface flaw inspection device 5 detects the position of the flaw in the width direction, and the flaw tracking device 10 transmits the flaw to the rotary mirror control device 13 and the rotary mirror drive motor 14 drives the target mirror to irradiate the flaw on the flaw. Be seen.

【0007】図3は本発明に係るレーザースキャニング
光路内にフーリエレンズを配置したレーザ照射装置の概
略図である。図3に示すように、レーザ発信器12より
レーザ照射が行われ、そのレーザー光路16は回転ミラ
ー15によりレーザー光路16は向きを変え、フーリエ
レンズ17によって熱延コイル1に対するレーザースキ
ャニングによる光路長変化を修正する機能を持たせたも
のである。すなわち、熱延コイル1での疵を検出し、オ
ンラインにおいて疵部をトラッキングし、レーザ照射位
置へ疵部が到達したときは、回転ミラー駆動モータ14
によって、回転ミラー15の回転角度を調整し、疵部に
レーザーを照射すると共に、フーリエレンズにて常に焦
点距離を一定化するものである。これによって金属帯板
の幅方向への光路長変化に伴う焦点距離の変化を修正
し、常に疵に対するレーザー光の照射距離が一定に保た
れ、溶融・溶削強度を一定に保持することが出来、高能
力の溶融・溶削が可能となる。
FIG. 3 is a schematic diagram of a laser irradiation apparatus according to the present invention in which a Fourier lens is arranged in the laser scanning optical path. As shown in FIG. 3, laser irradiation is performed from the laser oscillator 12, the laser optical path 16 changes its direction by the rotating mirror 15, and the Fourier lens 17 changes the optical path length by laser scanning of the hot rolled coil 1. It has a function to correct. That is, the flaw in the hot rolled coil 1 is detected, the flaw is tracked online, and when the flaw reaches the laser irradiation position, the rotary mirror drive motor 14
The rotation angle of the rotating mirror 15 is adjusted to irradiate the flaw with a laser beam, and the Fourier lens is used to keep the focal length constant. As a result, the change in the focal length due to the change in the optical path length in the width direction of the metal strip is corrected, the irradiation distance of the laser light to the flaw is always kept constant, and the melting / welding strength can be kept constant. It enables high-performance melting and fusing.

【0008】[0008]

【実施例】ペイオフリールより巻き戻された黒皮状態で
の熱延コイルを酸洗し、熱延コイル表面のスケールを除
去した後、疵表面が明確に判明出来る時点で表面疵検出
装置にて疵を検出すると同時に疵の幅方向位置を計測
し、レーザ照射装置に伝送する。一方ライン速度に合わ
せて表面疵検出装置からレーザ照射装置までトラッキン
グし、長手方向位置をレーザ照射装置に伝送して、疵部
の幅方向に合わせてレーザースキャニング用ミラーを回
転さるのである。そこで、例えば、回転ミラーを1°だ
け回転させれば、反射後のレーザー光路は2°変化す
る。すなわち、2倍の角度変化が行われる。その結果金
属帯板への距離に応じて2°だけの変化分だけ位置が変
化し、光路長変化が起こるのをフーリエレンズによって
常に光路長変化分を修正して疵部に対して常に焦点距離
でのレーザ照射が行われるように修正させる。その一定
焦点距離によって疵を溶融・溶削し、全くむらのない凹
み疵幅2mm、凹み深さ0.1mmの疵まで除去するこ
とが可能となり、その後酸洗し、引続き冷間圧延した金
属帯板には全く表面欠陥は見られなかった。
[Example] After pickling the hot rolled coil in the black skin state unwound from the pay-off reel and removing the scale on the surface of the hot rolled coil, the surface flaw detector detects when the flaw surface can be clearly identified. At the same time as detecting the flaw, the position in the width direction of the flaw is measured and transmitted to the laser irradiation device. On the other hand, tracking is performed from the surface flaw detection device to the laser irradiation device according to the line speed, the position in the longitudinal direction is transmitted to the laser irradiation device, and the laser scanning mirror is rotated according to the width direction of the flaw portion. Therefore, for example, if the rotating mirror is rotated by 1 °, the laser light path after reflection is changed by 2 °. That is, a double angle change is performed. As a result, the position changes by only a change of 2 ° according to the distance to the metal strip, and the change in the optical path is always corrected by the Fourier lens so that the change in the optical path is always corrected by the focal length with respect to the flaw. Modify so that the laser irradiation is performed at. The constant focal length makes it possible to melt and ablate flaws and remove even flaws with a flaw width of 2 mm and a depression depth of 0.1 mm, then pickled and then cold-rolled metal strip. No surface defects were found on the plate.

【0009】このように、レーザースキャニング光路内
にフーリエレンズを配置することによって、金属帯板の
幅方向に合わせた回転ミラーの回転と同時にフーリエレ
ンズによって、レーザースキャニングによる光路長変化
を修正し常にレーザー光の照射距離を一定に保ち、疵部
の溶融・溶削効率及び正確度を高めるものである。な
お、以上述べたのは、レーザー照射ヘッドを1個の状態
での場合であるが、幅方向に個別に照射可能な複数のレ
ーザー照射ヘッドを配設すれば、より幅方向への対応が
良好となり、高い溶融・溶削除去が可能となるものであ
る。
As described above, by disposing the Fourier lens in the laser scanning optical path, the rotation of the rotating mirror in accordance with the width direction of the metal strip is simultaneously corrected by the Fourier lens so as to correct the change in the optical path length due to the laser scanning, and the laser is constantly laser-scanned. The irradiation distance of light is kept constant, and the efficiency of melting and fusing and the accuracy of flaws are improved. It should be noted that the above description is for the case of one laser irradiation head, but if a plurality of laser irradiation heads capable of individually irradiating in the width direction are arranged, it is possible to better cope with the width direction. Therefore, it becomes possible to perform high melting / melting removal.

【0010】[0010]

【発明の効果】以上述べたように、本発明によるフーリ
エレンズを採用することにより、レーザースキャニング
による光路長変化を修正する機能によってレーザー光の
照射距離が一定化され、効率の良い疵の溶融・溶削除去
が可能になった。
As described above, by adopting the Fourier lens according to the present invention, the irradiation distance of the laser light is made constant by the function of correcting the change in the optical path length due to the laser scanning, and the efficient melting of flaws It became possible to remove by melting.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る金属帯板の溶融・溶削を示す工程
図、
FIG. 1 is a process diagram showing melting and fusing of a metal strip according to the present invention,

【図2】本発明に係る疵溶融・溶削工程の概略図、FIG. 2 is a schematic view of a flaw melting / ablation process according to the present invention

【図3】本発明に係るレーザースキャニング光路内にフ
ーリエレンズを配置したレーザ照射装置の概略図であ
る。
FIG. 3 is a schematic view of a laser irradiation apparatus according to the present invention in which a Fourier lens is arranged in a laser scanning optical path.

【符号の説明】[Explanation of symbols]

1 熱延コイル 2 溶接機 3 ループカー 4 酸洗槽 5 表面疵検査装置 6 レーザー照射位置 7 ループカー 8 冷間圧延機 9 冷間圧延済みコイル 10 疵トラッキング装置 11 レーザ発信制御装置 12 レーザ発信器 13 回転ミラー制御装置 14 回転ミラー駆動モータ 15 回転ミラー 16 レーザー光路 17 フーリエレンズ 1 Hot Rolled Coil 2 Welding Machine 3 Loop Car 4 Pickling Tank 5 Surface Defect Inspection Device 6 Laser Irradiation Position 7 Loop Car 8 Cold Rolling Machine 9 Cold Rolled Coil 10 Defect Tracking Device 11 Laser Transmission Control Device 12 Laser Transmitter 13 Rotation Mirror control device 14 Rotating mirror drive motor 15 Rotating mirror 16 Laser optical path 17 Fourier lens

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 G01B 11/30 E 9108−2F ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location G01B 11/30 E 9108-2F

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 表面疵検査装置に連動して疵部にレーザ
ーを照射し、疵部を溶融・溶削する疵取り装置におい
て、表面疵検査装置にて表面疵を検出して、該疵部の幅
方向位置を検出して、該疵部の幅方向に合わせてレーザ
ースキャニング用ミラーを回転制御すると共に、レーザ
ースキャニング光路内にフーリエレンズを配置して、レ
ーザースキャニングによる光路長変化を修正する機能を
持たせ、該疵部をライン進行方向にトラッキングして、
該疵部がレーザー照射位置へ到達したタイミングでレー
ザーを照射することを特徴とするレーザー照射装置。
1. A flaw removal device which irradiates a laser on a flaw portion in tandem with a surface flaw inspection device to melt and ablate the flaw portion, wherein the surface flaw inspection device detects the surface flaw and the flaw portion is detected. Function to detect the position in the width direction of the laser and control the rotation of the laser scanning mirror in accordance with the width direction of the flaw, and to arrange the Fourier lens in the laser scanning optical path to correct the change in optical path length due to laser scanning. And track the flaw in the line advancing direction,
A laser irradiating device which irradiates a laser at the timing when the flaw reaches the laser irradiation position.
【請求項2】 幅方向の個別に照射可能な複数のレーザ
ー照射ヘッドを有する請求項1記載のレーザー照射装
置。
2. The laser irradiation apparatus according to claim 1, comprising a plurality of laser irradiation heads capable of individually irradiating in the width direction.
JP5104859A 1993-05-06 1993-05-06 Laser irradiation device Withdrawn JPH06317539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5104859A JPH06317539A (en) 1993-05-06 1993-05-06 Laser irradiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5104859A JPH06317539A (en) 1993-05-06 1993-05-06 Laser irradiation device

Publications (1)

Publication Number Publication Date
JPH06317539A true JPH06317539A (en) 1994-11-15

Family

ID=14391990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5104859A Withdrawn JPH06317539A (en) 1993-05-06 1993-05-06 Laser irradiation device

Country Status (1)

Country Link
JP (1) JPH06317539A (en)

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Effective date: 20000801