JPH06313789A - Contact unit for auto-handler - Google Patents

Abstract

PURPOSE:To obtain an inexpensive contact unit for an auto-handler which is replaced when the kind of an IC device changes. CONSTITUTION:As for a contact mechanism 10, support rods 1A are erected on a test board 1 of an 1C tester. Holders 1B are supported elastically by the support rods 1A, a base 1C is fitted on the holders 1B, receptacles 1D are disposed on the base 1C longitudinally and laterally and the receptacles 1D and the test board 1 are connected electrically by coaxial cables 1E. As for a contact unit 20, headers 2A fitted to and removed from the receptacles 1D are fitted on the lower side of a connector board 2B, the connector board 2B and a base 2C are held by connection rods 2D and socket boards 2E are disposed on the base 2C. IC sockets 2F are mounted on the socket boards 2E and the IC sockets 2F and the headers 2A are connected electrically by coaxial cables 2G. The contact unit 20 is replaced when the kind of an IC device D to be measured differs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an autohandler contact unit arranged on a test board of an IC tester.

[0002]

2. Description of the Related Art Next, the structure of a conventional contact unit will be described with reference to FIG. 1 in FIG. 3 is a test board,
30 is a contact unit. The contact unit 30 includes the support rod 3A, the stands 3B and 3D, and the substrates 3C and 3E.
, Coaxial cable 3F, socket board 2E, IC
It is composed of a socket 2F.

In FIG. 3, a plurality of support rods 3A are erected on a test board 1 of an IC tester. Stand 3B is support rod 3A
Is held elastically by. The board 3C is mounted on the base 3B, and the base 3D is mounted on the base 3C.

The substrate 3E is fixed on the table 3D, and the substrate 3E
A plurality of socket boards 2E are arranged vertically and horizontally on the top, and IC sockets 2F are mounted on the socket boards 2E.
The IC device D is inserted into and removed from the IC socket 2F by an unillustrated insertion / extraction mechanism of an auto handler.

In FIG. 3, the IC socket 2F is mounted on the socket board 2E. The socket board 2E and the test board 1 are impedance-matched and wire-connected by the coaxial cable 3F. IC lead of IC device D
By making contact with the contact of the socket 2F, an electric signal is transmitted and received between the test board 1 and the IC device D. If the number of IC sockets 2F is increased in units, a large number of parallel measurements can be made.

[0006]

In FIG. 3, when the type of IC device D changes, the IC socket 2F and the socket board 2E need to be replaced. However, in FIG. 3, since the socket board 2E and the test board 1 are soldered to the coaxial cable 3F, the test board 1 and the test board 1 are exchanged as a unit.

Also, when the number of parallel measurements is changed, the wiring must be changed, so that the unit is completely replaced. It is necessary to prepare a unit each time the type of IC device D and the number of parallel measurements change.

According to the present invention, a contact mechanism is erected on a test board of an IC tester, a contact unit in which an IC socket is arranged is erected on the contact mechanism, and the contact mechanism and the contact unit are connected by a connector.
The purpose of the present invention is to provide a contact unit for an auto handler that replaces the contact unit if the type of C device changes.

[0009]

To achieve this object, the present invention provides a contact mechanism 10 with a plurality of support rods 1.
A, a base 1B, a substrate 1C, and a plurality of receptacles 1D
, A coaxial cable 1E and a pedestal 1F, a plurality of support rods 1A are erected on a test board 1 of an IC tester, a base 1B is elastically held by the support rods 1A, and a substrate 1C is placed on a base 1B.
, The receptacle 1D is arranged vertically and horizontally on the board 1C, the receptacle 1D and the test board 1 are electrically connected by the coaxial cable 1E, the pedestal 1F is mounted on the board 1C, and the contact unit 20 is attached to the plurality of headers 2A. When,
The connector board 2B, the board 2C, the connecting rod 2D, the socket board 2E, the IC socket 2F, and the coaxial cable 2G, the header 2A that is attached to and detached from the receptacle 1D is attached below the connector board 2B. The connector board 2B and the board 2C are held by the connecting rod 2D, a plurality of socket boards 2E are arranged on the board 2C, the IC socket 2F into which the IC device D is inserted and removed is mounted on the socket board 2E, and the IC socket 2F and the header. 2A is electrically connected by the coaxial cable 2G, and the contact unit 20 is replaced if the type of the IC device D to be measured is different.

[0010]

Next, the structure of the contact unit according to the present invention will be described with reference to FIG. In FIG. 1, 10 is a contact mechanism and 20 is a contact unit.

In FIG. 1, the contact mechanism 10 comprises a plurality of support rods 1A, a base 1B, a substrate 1C, a plurality of receptacles 1D, a coaxial cable 1E, and a receiving base 1F.

A plurality of support bars 1A are erected on a test board 1 of an IC tester. The table 1B is elastically held by the support rod 1A. The board 1C is attached to the base 1B, and the receptacle 1D is arranged vertically and horizontally on the board 1C. The receptacle 1D and the test board 1 are electrically connected by the coaxial cable 1E. The pedestal 1F is mounted on the substrate 1C.

The contact unit 20 includes a plurality of headers 2A, a connector board 2B, a board 2C, and a connecting rod 2.
D, a socket board 2E, an IC socket 2F, and a coaxial cable 2G.

The header 2A is attached to and detached from the receptacle 1D, and is divided and attached below the connector board 2B.
The connector board 2B is held on the substrate 2C by the connecting rod 2D. A plurality of socket boards 2E are arranged on the board 2C, and IC sockets 2F are mounted on the socket boards 2E. The IC device D is inserted into and removed from the IC socket 2F by an unillustrated insertion / extraction mechanism of an auto handler. The IC socket 2F and the header 2A are electrically connected by the coaxial cable 2G.

FIG. 2 is a state diagram in which only the contact unit 20 is separated from FIG. The memory ICs are of various types, and if the type of IC device D to be measured is different, the contact unit 20 of FIG. 2 is replaced. The header 2A and the connector board 2B shown in FIG. 2 are common parts connected to the contact mechanism 10. When the type of the IC device D is different, the IC socket 2F and the socket board 2E corresponding to the IC device D are mounted separately. The contact unit 20 is prepared.

[0016]

According to the present invention, the contact mechanism is erected on the test board of the IC tester, and the IC is mounted on the contact mechanism.
The contact unit arranged in a socket is erected, and the contact mechanism and the contact unit are connected by a connector.
If the type of C device changes, the contact unit is replaced, so that it is possible to provide a contact unit for an auto handler that is less expensive than the conventional unit.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a contact unit according to the present invention.

FIG. 2 is a state diagram in which only a contact unit 20 is separated from FIG.

FIG. 3 is a configuration diagram of a contact unit according to a conventional technique.

[Explanation of symbols]

 1 Test Board 1A Support Rod 1B Unit 1C Substrate 1D Receptacle 1E Coaxial Cable 1F Receptacle 2A Header 2B Connector Board 2C Substrate 2D Connecting Rod 2E Socket Board 2F IC Socket 2G Coaxial Cable 10 Contact Mechanism 20 Contact Unit

Claims (1)

[Claims] 1. A contact mechanism (10) comprising a plurality of support rods (1A).
, Pedestal (1B), first substrate (1C), and multiple receptacles
(1D), 1st coaxial cable (1E) and pedestal (1F), multiple support rods (1A) are erected on the test board (1) of the IC tester, and the pedestal (1B) Elastically held by the support rod (1A), the first board (1C) is attached to the base (1B), the receptacle (1D) is arranged vertically and horizontally on the first board (1C), and the receptacle (1D) ) And the test board (1) electrically with the first coaxial cable (1E),
The pedestal (1F) is mounted on the first board (1C), and the contact unit (20) includes a plurality of headers (2A), a connector board (2B), a second board (2C), and a connecting rod ( 2D),
It consists of a socket board (2E), an IC socket (2F), and a second coaxial cable (2G), and a receptacle (1D) and a detachable header (2A) are divided and attached under the connector board (2B). , The connector board (2B) and the second board (2C) are held by the connecting rod (2D), and the second board (2C)
Place a plurality of socket boards (2E) on the top, and the IC socket (2
F) is mounted, the IC socket (2F) and the header (2A) are electrically connected by the second coaxial cable (2G), and if the IC device (D) to be measured has a different type, the contact unit (20) A contact unit for an auto handler, which is characterized by replacing