JPH0631082U - Wire bond contacts - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a wire bond contact that simplifies the manufacturing process and can contact an electrode with increased reliability. [Structure] A contact 61a is formed by arc-shaped bonding of a metal wire to a terminal 61b arranged on a contact substrate 62.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a contact, and more particularly to a contact that constitutes an electrical connection portion of a connector or a switch.

[0002]

[Prior art]

 Along with the miniaturization, thinning, and high density of electronic components, the terminal arrangements that make up these input / output parts are also becoming higher in density and definition. It is conventionally known to use an anisotropic conductive rubber connector as shown in FIG. 4 (a) as an example of connecting these fine circuits. In this connector 1, plate-shaped conductive members 1a and insulating elastic members 1b are alternately stacked, and an anisotropic conductive portion 1c and an anisotropic conductive portion 1c are formed. It is composed of insulating portions 1d provided on both side surfaces. Next, in order to connect between the plate-shaped circuit member 2 such as an LSI and the printed circuit board 3 using the connector 1, the connector 1 connects the conductive member 1a and the electrode 3a of the printed circuit board 3 as shown in FIG. 4 (b). Correspondingly, it is arranged on the printed circuit board 3, and further, the frame member 4 is arranged so as to receive the connector 1 in the square hole 4a. Next, the plate-shaped circuit member 2 is inserted into the frame member 4 so that the electrodes 2a correspond to the conductive members 1a of the connector 1. Then, after the cover 21 is covered on the frame member 4, the screws 41 are inserted into the cover 21, the frame member 4 and the printed circuit board 3 and the nut 42 is screwed on the back surface side of the printed circuit board 3. Fix it. As a result, the plate-shaped circuit member 2 is pressed against the cover 21, and the plate-shaped circuit member 2 and the corresponding electrodes 2a, 3a of the printed circuit board 3 are electrically connected to each other via the conductive member 1a. Next, FIG. 5 shows another conventional example. The connector 51 shown in FIG. 5A has a plurality of electrically conductive members 51b made of elastic metal wires or the like on a plate-shaped insulating elastic member 51a, and both ends of which are slightly projected from both sides of the insulating elastic member 51a. It was planted. The connector 52 of FIG. 2B is a sheet-shaped product in which conductive particles 52a such as copper particles are dispersed and mixed as a conductivity-imparting agent into an insulating elastic material 52b such as silicone rubber. is there. Like the connector 1, the connectors 51 and 52 are also sandwiched between the plate-like circuit member 2 and the electrodes 2a and 3a of the print substrate 3 as shown in FIG. The corresponding electrodes 2a and 3a are electrically connected to each other through the electrodes.

[0003]

[Problems to be solved by the device]

 By the way, in the connectors 1 and 51, the conductive members 1a and 51b can be accurately arranged in accordance with the fine electrode arrangement pitch of the plate-shaped circuit member 2, but the manufacturing process thereof is complicated and the cost is high. Became. On the other hand, the connector 52 was poor in reliability because the conductivity varied due to unevenness of the conductive particles 52a. Further, the conductive particles 52a exposed on the surface of the insulating elastic material 52b and contacting the electrodes 2a and 3a are likely to be oxidized or corroded, so that there is a problem that stability of contact resistance is insufficient. It was The present invention has been proposed in view of the above points, and provides a wire bond contact that can be contacted with an electrode with increased reliability while simplifying the manufacturing process.

[0004]

[Means for Solving the Problems]

 According to this invention, a metal wire is arc-shaped bonded to the plate surface of the terminals arranged on the contact substrate to form a contact. Since the wire bond contact of the present invention constructed as described above is bonded to the above-mentioned terminal by using the wire bond device, it is manufactured in a container and with higher accuracy than the contact of the connector of the conventional example. Furthermore, since the contact is formed in an arch shape with a metal wire having elasticity, it is possible to contact the electrode as the contact partner with sufficient contact pressure, and a wire bond contact with improved reliability can be obtained. .

[0005]

【Example】

 An embodiment in which the present invention is applied to a contact of a connector will be described below with reference to FIGS. 1 to 3. 1 (a) and 1 (b) are a plan view and a sectional view showing a connector using a contact of the present invention. That is, the connector 6 is composed of a contact substrate 62 in which contacts 61a and terminals 61b are arranged in accordance with the arrangement of the electrodes 2a of the plate-shaped circuit member 2, and a spacer 63 which is superposed on the contact substrate 62. The terminal 61b is, for example, machined from a Kovar material into a substantially T-shaped cross section, and has a rectangular head portion 61c and a pin-shaped portion 61d vertically extending from the center of one side surface of the head portion 61c, which are integrally formed. Have Gold or a gold alloy wire is used for the contact 61a, and the head 61c of the terminal 61b is bonded to the head 61c in an arch shape by a wire bonding device so that the contact 61a is projected in the direction opposite to the pin-shaped portion 61d. The contact substrate 62 is made of, for example, an alumina substrate material, and is formed to have substantially the same size as the connecting surface of the plate-shaped circuit member 2. An insertion hole 62a into which the pin-shaped portion 61d of the terminal 61b is press-fitted is provided on the plate surface of the contact substrate 62. A plurality of insertion holes 62a are formed in accordance with the arrangement pitch of the electrodes 2a of the plate-shaped circuit body 2. The spacer 63 is made of an insulating material and has substantially the same size as the contact substrate 62. The contact 61a and the head 61c of the terminal 61b are inserted into the plate surface to prevent the contact 61a from falling. The slot 63a is provided through. Next, when assembling the connector 6, first, the terminals 61b are fixed by press-fitting the pin-shaped portions 61d into the respective insertion holes 62a of the contact board 62. In that case, the terminals 61b are fixed in a state in which the longitudinal direction of the head portion 61c is aligned in a direction orthogonal to the arrangement direction of the insertion holes 62a and the head portion 61c is in contact with the substrate surface. To be done. The pin-shaped portion 61d projects from the opposite surface of the contact substrate 62. Next, on the surface of the head 61c of each terminal 61b, contacts 61a are formed along the longitudinal direction of the head 61c by using a known wire bonding device. By using the wire bonding device, a large number of contacts 61a can be formed on each terminal 61b at high speed with extremely high accuracy and easily. Then, the spacer 63 is superposed on the contact substrate 62, and the assembly of the connector 6 is completed with the contact 61a protruding from the groove 63a of the spacer 63. Next, as shown in FIG. 2, in order to connect the plate-shaped circuit member 2 and the printed circuit board 7 with the connector 6, the connector 6 first inserts the pin-shaped portion 61d of the terminal 61b into the through hole of the printed circuit board 7. It is attached to the printed circuit board 7 by being soldered. Then, similarly to the conventional example, the frame member 8 is arranged on the printed circuit board 7 so as to receive the connector 6 in the square hole 81. Further, the plate-shaped circuit member 2 is inserted into the rectangular hole 81 of the frame member 8, and the electrode 2a is overlapped with the contact 61a of the connector 6 facing it. Then, the electrodes 2a of the circuit member 2 and the corresponding contacts 61a of the connector 6 are positioned so as to come into contact with each other. After that, the cover 21 is put on the frame member 8, and then the screws 91 are inserted from above into the holes 21a, 8a and 7a provided at the four corners of the cover 21, the frame member 8 and the printed circuit board 7, respectively. Then, the nut 92 is screwed into the screw 91 protruding from the lower printed circuit board 7, and the nut 92 is tightened against the elasticity of the contact 61a. Therefore, the plate-shaped circuit member 2 and the connector 6 are assembled with the contact 61a elastically contacting the electrode 2a. By assembling in this way, in the present invention, the connection between the plate-shaped circuit member 2 and the printed circuit board 7 is made through the contact 61a and the terminal 61b arranged on the contact substrate 62. In that case, the contact between the electrode 2a of the plate-shaped circuit member 2 and the contact 61a is elastically bent by the contact 61a coming into contact with the electrode 2a and being pressed, and the contact with the electrode 2a is caused by the repulsive elastic force. To make sure. In the above embodiment, the contact of the present invention is applied to the connector, but the invention is not limited to this, and the contact may be used as a contact of a switch.

[0006]

[Effect of device]

 As described above, the present invention forms contacts by connecting alloy wires to terminals arranged on a contact substrate in an arch shape by a wire bonding device. Therefore, the manufacturing process can be simplified as compared with the anisotropic conductive rubber connector shown in the conventional example, and the contacts can be formed by the wire bonding device at high speed and with high density and high precision. Further, by using the metal wire for the contact, a sufficient contact pressure can be obtained when the metal wire is contacted with the electrode, and a highly reliable wire bond contact can be provided.

[Brief description of drawings]

1A and 1B are a plan view and a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a mounting state of the present invention.

FIG. 3 is an exploded perspective view of FIG.

4A is a perspective view showing a conventional example, and FIG. 4B is a sectional view showing a mounting state of the conventional example.

5A and 5B are sectional views showing another conventional example.

[Explanation of symbols]

 61a contact 61b terminal 62 contact board

Claims (1)

[Scope of utility model registration request] 1. A wire bond contact formed by bonding a metal wire in an arc shape to a plate surface of a terminal arranged on a contact substrate to form a contact.