JPH0630160U - Simple plating device - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a simple plating device that can easily perform plating in a laboratory or the like because the power supply occupies a small proportion of the whole device and its safety is high. [Structure] A simple plating apparatus using a DC power supply, wherein a solar cell 4 is used as the DC power supply.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a simple plating device. More specifically, it relates to a simple plating device that can be easily used in a laboratory or the like.

[0002]

[Prior art]

 Conventionally, the direct current used for plating in the laboratory etc. reduces the voltage of 100V alternating current from a commercial power source with a transformer, and then converts it into a direct current with a rectifier, uses dry batteries, or uses lead acid batteries. It has been obtained by using.

However, such a conventionally used power source has the following problems.

(1) When a commercial power source of 100 V is used, a transformer and a rectifier are required as described above, but since they have a relatively large volume, they require such a unique space, and It is not convenient to carry because it is not convenient to carry.

(2) When a dry battery is used, its current-voltage characteristic becomes as shown in FIG. 3 due to its internal resistance. Therefore, it is difficult to pass a large current, and the plating time becomes long. Further, if the electrodes are contaminated, the resistance increases and the efficiency decreases.

(3) When a lead storage battery is used, a large current flows because its internal resistance is very small (see FIG. 4). Therefore, a variable resistor must be inserted in the plating circuit to adjust the current, which complicates the work. Moreover, lead-acid batteries are relatively large and heavy, which makes them difficult to handle. Therefore, there is a fear of short circuit or electric shock due to mishandling.

[0007]

[Problems to be solved by the device]

 The present invention has been made in view of the above problems of the prior art.Since the power source occupies a small proportion of the entire apparatus and its safety is high, simple plating that can be easily performed in a laboratory or the like is possible. The purpose is to provide a device.

[0008]

[Means for Solving the Problems]

 As a result of earnest studies on the problems of the prior art, the present inventors have found that the solar cell has a small area and is light, and the current-voltage characteristic is as shown in FIG. Since the interelectrode resistance is about 5 to 10Ω and a constant current can be obtained from the solar cell in that range, the solar cell can be used as a power source for a simple plating device. We also found that the problem could be solved, and completed the present invention.

That is, the present invention is a simple plating apparatus using a DC power supply, characterized by using a solar cell as the direct current power supply.

[0010]

[Action]

 In the present invention, since the solar cell is used as the DC power source, the ratio of the power source to the entire device can be reduced and the weight of the entire device can be reduced. Therefore, plating can be performed easily in the laboratory. Moreover, the operating point of the solar cell is determined by the load resistance connected, and when the resistance value is about 1 kilo-ohm to 1 mega-ohm, almost no current flows. Therefore, even if a person having such a resistance value accidentally contacts a power source or the like, there is no fear of electric shock. In addition, since the change in current with respect to the change in resistance is small, the efficiency does not decrease even if the electrode becomes dirty and the resistance increases. The diagonal lines in FIG. 2 indicate load lines.

[0011]

【Example】

 Hereinafter, the present invention will be described based on embodiments with reference to the accompanying drawings, but the present invention is not limited to such embodiments.

FIG. 1 is a schematic view of an embodiment of the present invention, and FIG. 2 is a graph of current-voltage characteristics of a solar cell used in the present invention. In the figure, 1 is a container, 2 is an anode, 3 is a cathode, 4 is a solar cell, and 5 is an electrolyte solution.

In the embodiment shown in FIG. 1, the simple plating apparatus of the present invention has a container 1, an anode 2, a cathode 3, a solar cell 4, and an electrolyte solution 5 as main components.

A beaker, for example, is used as the container 1.

As the anode 2, a copper plate, a silver plate or the like is used. The anode 2 is appropriately selected according to the type of plating, as in the case of normal plating.

As the cathode 3, a plated one is used. This point is also similar to conventional plating.

As the solar cell 4, various solar cells such as an amorphous solar cell, a single crystal solar cell, and a polycrystalline solar cell are preferably used. The output characteristics are appropriately selected according to the type of plating to be performed, and there is no particular limitation.

As the electrolyte solution 5, for example, if the anode 2 is a copper plate, a copper sulfate solution is used, and if it is a silver plate, a silver nitrate solution is used. This point is also the same as the conventional one.

Next, the present invention will be described in more detail based on more specific embodiments.

Example A beaker 1 having a volume of 500 cc was filled with a copper sulfate solution having a concentration of 20% to a saturated solubility to prepare an electrolyte solution 5. A copper plate was immersed in this electrolyte solution 5 to form the anode 2, and an iron plate having a surface area of 10 cm ² was similarly immersed to form the cathode 3. A solar cell (maximum 24 V × 0.5 A) 4 was placed between the anode 2 and the cathode 3, and a wire was connected between them to fabricate a simple plating apparatus. The solar cell 4 was irradiated with sunlight to plate the iron plate of the cathode 5. It took 10 minutes to plate the entire surface area of the iron plate.

Comparative Example For comparison, a simple plating apparatus was prepared and an iron plate was plated in the same manner as in Example except that a dry battery (9 V × 2 pieces connected in series) was used as a power source. It took one hour to plate the entire surface area of the iron plate.

As is clear from the examples and comparative examples, according to the present invention, it is possible to perform plating in a short time.

[0023]

[Effect of device]

 As described above, according to the present invention, since the solar cell is used as the power source, the plating can be performed easily and efficiently and safely.

[Brief description of drawings]

FIG. 1 is a schematic view of an embodiment of the present invention.

FIG. 2 is a graph of current-voltage characteristics of the solar cell used in the present invention.

FIG. 3 is a graph of current-voltage characteristics of a dry battery used in a conventional simple plating apparatus.

FIG. 4 is a graph of current-voltage characteristics of a lead storage battery used in a conventional simple plating apparatus.

[Explanation of symbols]

 1 container 2 anode 3 cathode 4 solar cell 5 electrolyte solution

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshihiko Inoue, Konohana-ku, Osaka 3-7-2 (72) Inventor Junichi Unkita 3-7-17 Takami, Konohana-ku, Osaka

Claims (1)

[Scope of utility model registration request] 1. A simple plating apparatus using a DC power supply, wherein a solar cell is used as the DC power supply.