JPH06295969A - Surface treatment equipment for ic lead frame - Google Patents

Abstract

PURPOSE:To realize remarkable cost reduction while the height of an equipment is reduced and quick confirmation of treatment process is enabled. CONSTITUTION:An overflow receiver tank 20 is so formed that the plane shape can surround the treatment tank 10. The rotation retaining parts of each roller 2 which forms a roller conveyer 1 are arranged on both outsides of the tank 20. Recesses 17, 17 whose upper parts are opened are formed on both upper parts of the treatment tank 10, into which holes the roller 2 is inserted. Liquid cut franges 7, 7 for dropping downward treatment liquid flowing outside while traveling the roller 2 are fixed to the part from the recesses 17, 17 of the roller 2 inserted into the recesses 17, 17 to tank walls 23, 24 of the overflow receiver tank 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus for carrying out pretreatment, plating treatment, etc. while conveying an IC lead frame by a roller conveyor.

[0002]

2. Description of the Related Art The structure of a conventional surface treatment apparatus is shown in FIGS. In these figures, 1 is a roller conveyor, which has a plurality of rollers 2 arranged in rows at a predetermined pitch p. Further, 10 is an overflow type processing tank, and 20 is an overflow receiving tank. Further, 30A is a liquid circulation device, which comprises a supply pipe 31, a recovery pipe 32, a circulation pump 33, a management tank 35, various valves and the like.

When the circulating pump 33 of the liquid circulating device 30A is driven to circulate and supply the processing liquid in the management tank 35 to the processing tank 10 through the supply pipe 31 and the like, an ascending liquid flow is generated in the processing tank 10. As a result, the rising treatment liquid Qu having a predetermined height is formed between the both weirs 11a and 12a. The surface treatment is performed while continuously passing the IC lead frame W conveyed on each roller 2 of the roller conveyor 1 in the rising treatment liquid Qu. The overflow liquid from the processing tank 10 is discharged to the overflow receiving tank 20 and returned from the tank 20 to the management tank 35 through the recovery pipe 22 and the like.

Here, in the surface treatment apparatus, as shown in FIG. 4, the length L1 of the treatment tank 10 in the conveyance direction is determined from the relation between the conveyance speed of the roller conveyor 1 and the time required for the surface treatment. The roller pitch p of the roller conveyor 1 is determined according to the length of the IC lead frame W. Therefore, one or more rollers 2 are provided in the processing tank 10.
Will have to be placed.

As shown in FIG. 5, the rotation support portions (8, 8) of the rollers 2 arranged in the processing tank 10 are generally provided inside the processing tank 10 (inner surfaces of the tank walls 13 and 14). Target. Similarly, the rotation support portion of the roller 2 arranged in the overflow receiving tank 20 is also the overflow receiving tank 20.
It is provided inside or on the upper edges of both tank walls 23 and 24 as shown in FIG.

Here, the overflow receiving tank 20 receives the overflow liquid from the processing tank 10 and the liquid circulating device 3
Since it suffices to pour it into 0 A reliably, the mechanical strength and processing accuracy are kept to a minimum from the viewpoint of cost reduction and the like. The same applies to the processing tank 20.

By the way, it is desired to lengthen the length L2 of the overflow receiving tank 20 in the transport direction so that the overflow receiving tank 20 has a plurality of or most rollers 2 before and after the processing tank 10, but this has not been realized. Because, from the above-mentioned minimum conditions, the tank walls 23, 24 of the overflow receiving tank 20 are
Since the degree of deformation increases as the length of the IC lead frame increases, the roller feed accuracy decreases and the IC lead frame W
This is because a situation will occur that hinders smooth transportation of the paper.

Thus, the conventional overflow receiving tank 2
From the viewpoint of its original purpose, cost reduction, etc., 0 means that only one upstream or downstream roller 2 is arranged in each tank. Lengthening the overflow receiving tank 20 in the transport direction to support the rollers is not allowed from the viewpoint of layout reduction. Therefore, the overflow receiving tank 20 has a small capacity, and it is achieved by enlarging the management tank 35 to hold a large amount of the processing liquid required for facilitating the liquid circulation and stabilizing the composition of the processing liquid. is doing. For this reason, the management tank 35 is conventionally provided below the overflow tank 20.

[0009]

However, the following problems have been pointed out as the production amount of IC lead frames is increased, that is, as they are widely spread. That is, according to the above-mentioned conventional structure, the height of the entire apparatus becomes large, which is a time-consuming task in checking the processing steps, which is one of the causes of deterioration in quality. Therefore, a pedestal for inspection must be provided around the device, but in this case, high cost, difficult maintenance and inspection,
Problems such as difficulty in ensuring work safety and stains on the lower side are induced.

On the other hand, the overflow receiving tank 20
It is conceivable that the height and the management tank 35 are integrated, that is, the overflow receiving tank 20 also serves as the management tank 35 to reduce the height. As it cannot be solved all at once, eventually the overflow receiving tank 20
In reality, the management tank is divided into the management tank 35 and the management tank 35 having the above-mentioned conventional structure, and the management tank is arranged below the processing tank.

An object of the present invention is to provide a surface treatment apparatus for an IC lead frame capable of achieving a significant cost reduction while keeping the height of the apparatus as a whole short and enabling quick confirmation of the treatment process. is there.

[0012]

The applicant of the present invention arranges the rotation support portion of each roller outside both sides of the processing tank and the overflow receiving tank to ensure the required roller feeding accuracy, and If the space between the two rotation supporting parts is used to make it large in capacity and also serve as a conventional management tank, it is possible to make the height of the entire device low while ensuring smooth conveyance of the IC lead frame. Based on the idea, I made a prototype and tested it, but this method would raise the roller position, so the IC lead frame conveyed on the roller can be treated completely It could not be put to practical use because it could not be established on the tank and it would fall over. Therefore, we tried to lower the installation position of each roller by changing the tank form in the positional relationship between each roller and each tank, but this time a new troublesome problem of liquid leakage occurred and it could not be put to practical use. It was

Therefore, in the present invention, although the idea is changed and liquid leakage along the roller from the processing tank is allowed, by taking measures to forcibly drop the liquid before reaching the rotation supporting portion of the roller, The present invention relates to a surface treatment device having a structure capable of achieving the above-mentioned object for the first time.

That is, the surface treatment apparatus for an IC lead frame according to the present invention comprises a processing tank, an overflow receiving tank, a liquid circulating device for circulating the processing liquid sucked from the overflow receiving tank to the processing tank, and a roller conveyor. In a surface treatment apparatus for an IC lead frame, which comprises: and a surface treatment while continuously passing an IC lead frame conveyed by a roller conveyor into a rising treatment liquid formed on the treatment tank, In order to form the plane shape so as to surround the processing tank, the rotation supporting portions of the rollers forming the roller conveyor are arranged on both outsides of the overflow receiving tank, and the rollers are passed through the upper portions on both sides of the processing tank. Forming an upper open recess of the roller and an overflow from the upper open recess of the roller mounted through the upper open recess. Characterized in that attaching the liquid Setsutsuba body dropping the treatment liquid flowing outwardly downwardly transmitted the roller until the tank wall over tub.

[0015]

In the present invention having the above structure, when the liquid circulating device is driven, the processing liquid contained in the overflow receiving tank is circulated and supplied to the processing tank. Then, a rising liquid flow is generated in the processing tank, and a rising processing liquid is formed. Further, the overflow liquid from the processing tank is returned to the overflow receiving tank. Moreover, since the overflow receiving tank can have a large capacity, it is possible to smoothly circulate the liquid and stabilize the composition of the processing liquid.

Thus, when the IC lead frame is conveyed toward the processing tank by using the roller conveyor, the IC lead frame enters the rising processing solution formed on the processing tank, and the rollers are arranged low through the upper open concave portion. The rise processing solution can be smoothly conveyed and passed, and complete processing of the IC lead frame can be stably performed for a long period of time. During this operation, the processing liquid flows through the rollers to the outside of the processing tank, but is forcibly dropped downward by the liquid cutting collar body and collected in the overflow receiving tank. Therefore, there is no problem because the liquid leakage to the outside of the tank can be prevented.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the surface treatment device for this IC lead frame has a basic structure (roller conveyor 1,
Processing tank 10, overflow receiving tank 20, liquid circulation device 3
No. 0) is similar to the conventional example (FIG. 3), and the rotation support portions (4, 4) of each roller 2 are arranged outside both sides of the processing tank 10 and the overflow receiving tank 20 to obtain the required rollers. By ensuring the feed accuracy and by positively utilizing the space between the rotation support portions (4, 4) of the overflow receiving tank 20, the capacity can be increased and the management tank can also be used as a processing liquid. A liquid cutting collar body 7 can be used to prevent the water from flowing out of the tank, so that the overall height of the device can be lowered and the processing steps can be confirmed quickly, while achieving a significant cost reduction. It is the one. The same components as those in the conventional example (FIG. 3) are designated by the same reference numerals, and the description thereof will be omitted or simplified.

Here, as shown in FIG. 1, the overflow receiving tank 20 is formed so that it can surround the processing tank 10 in plan view. Specifically, the overflow receiving tank 20
Is to increase the width dimension (length in the direction orthogonal to the transport direction) in order to positively utilize the peripheral space in the width direction of the processing tank 10 and shorten the transport direction length in order to reduce the layout. ing. With this configuration, the overflow receiving tank 20 has a large capacity and can be used also as a management tank.
Further, not only the overflow liquid from the processing tank 10 but also the processing liquid forcibly dropped from the roller 2 by the liquid cutting collar 7 can be reliably collected in the overflow receiving tank 20. Further, the overflow receiving tank 20 has its mechanical strength and processing accuracy kept to a minimum within a range that does not hinder stable holding of the processing liquid from the viewpoint of cost reduction and the like. In addition, the tank wall 2 of the overflow receiving tank 20
The heights of 3 and 24 are determined so that the upper edges thereof are below the respective rollers 2.

Further, upper open recesses 17 and 17 for lowering the installation position of the roller 2 are formed in the upper parts of the tank walls 13 and 14 of the processing tank 10. The processing tank 10 includes tank walls 13 and 14, an upstream side tank wall (not shown), and a downstream side tank wall 12.
And the bottom portion 16, the volume of which is minimized within a range in which the rising processing liquid Qu can be stably established in order to increase the volume of the overflow receiving tank 20. Further, liquid passage holes 15 are provided in the lower portions of the tank walls 13 and 14 of the processing tank 10 so that the processing liquid can be stored in the space below the processing tank 10 (about 3 times the volume of the processing tank 10). I have to.

Further, as shown in FIG. 2, the rotation support portion of each roller 2 is formed of highly rigid roller support plates 4 and 4 which are disposed on both outer sides of the overflow receiving tank 20. Each roller support plate 4 is firmly mounted on the base 9 along the tank walls 23 and 24 of the overflow receiving tank 20, and a bearing portion 5 for rotatably supporting the end portion of each roller 2 is provided on the upper portion thereof. Two pieces of the same number are provided at the same pitch.

As a result, it is possible to secure the roller feeding accuracy required for the smooth conveyance of the IC lead frame regardless of the mechanical strength and processing accuracy of each tank 10, 20. In the present embodiment, each roller 2 is passed through the upper open recesses 17, 17 so that the surface connecting the uppermost portions (work transfer surface) is smooth and the roller position is low in the processing tank 10, and the roller support plate. The bearings 4 and 4 are rotatably supported by the bearings 5 and 5.

Further, the liquid cutting collar bodies 7 and 7 are provided with an upper open concave portion 1.
The tank wall 2 of the overflow receiving tank 20 from the upper open recesses 17 and 17 of the roller 2 mounted through the rollers 7 and 17.
It is mounted between 3 and 24, and has a function of changing the direction of the processing liquid flowing through the roller 2 to the outside of the tank and dropping it downward.

The liquid cutting collar bodies 7 and 7 can eliminate the leakage of the processing liquid caused by lowering the position of the roller 2 through the upper open recesses 17 and 17, and the overflow receiving tank 20 can have a large capacity. It is guaranteed that it is practically possible to use it as a management tank. In the present embodiment, each liquid cutting collar body 7 has a three-step shape along each roller 2 in order to prevent liquid leakage more effectively.
The upper open concave portion 17 of each roller 2 and the tank wall 23 (24)
It is attached via a packing to the center of the space.

As described above, since the overflow receiving tank 20 also serves as the control tank, the liquid circulating device 30 is provided with the supply pipe 32, the circulation pump 33, and the motor 34.
The circulation pump 33 is driven by the motor 34 to circulate the processing liquid in the large-capacity overflow receiving tank 20 to the processing tank 10 via the supply pipe 31 and the like. It should be noted that each component of the liquid circulation device 30 is centrally arranged near the overflow receiving tank 20. Further, the supply pipe 31 of the liquid circulation device 30 becomes extremely short because the processing tank 10 is included in the overflow receiving tank 20. Further, the circulation pump 33 uses a small pump because the load is significantly reduced by reducing the discharge head.

In FIG. 2, reference numeral 41 is a rotary drive mechanism. The rotation drive mechanism 41 rotates a toothed pulley 42 mounted on one end of each roller 2, a toothed belt 43 that meshes with each pulley 42 and is rotated in the direction of the arrow in the drawing, and a toothed belt 43. And a drive motor 44 for moving. Therefore, when the drive motor 44 is driven, the rollers 2 synchronously rotate in the same direction and the IC
The lead frame can be transported.

Next, the operation will be described. By driving the motor 34 of the liquid circulating device 30 to operate the circulation pump 33, the processing liquid contained in the overflow receiving tank 20 is supplied to the processing tank 10 through the supply pipe 31, and a predetermined amount is provided on the processing tank 10. A rising processing liquid Qu having a height is formed. The overflow liquid from the processing tank 10 is returned to the overflow receiving tank 20. Moreover, since the overflow receiving tank 20 has a large capacity, it is possible to smoothly circulate the liquid and stabilize the composition of the processing liquid.

Thus, using the roller conveyor 1, IC
When the lead frame is conveyed toward the processing tank 10, the lead frame enters the rising processing liquid Qu formed in the processing tank 10 and is smoothly transferred and passed through the rising processing liquid Qu by each roller 2 for surface treatment. . Here, since the composition of the processing liquid is stabilized by the overflow receiving tank 20, the complete processing of the IC lead frame can be stably performed for a long period of time.

During this operation, the processing liquid in the processing tank 10 flows outward through the rollers 2, but is forcibly dropped downward by the liquid cutting collar body 7 and collected in the overflow receiving tank 20. Therefore, there is no problem because the liquid leakage to the outside of the tank can be prevented.

Therefore, according to this embodiment, the overflow receiving tank 20 is formed so that the planar shape can surround the processing tank 10, and the rotation supporting portions (4, 4) of the respective rollers 2 forming the roller conveyor 1 are formed. Overflow receiving tank 2
The roller 2 which is disposed on both outer sides of 0, has upper opening recesses 17 and 17 for passing the roller 2 on both upper sides of the processing tank 10 and is mounted through the upper opening recesses 17 and 17.
The liquid-cutting collar body 7 for dropping the processing liquid flowing outwardly along the roller 2 between the upper open recessed portions 17, 17 to the tank walls 23, 24 of the overflow receiving tank 20 downward.
Since it is configured to have the following, the following effects can be obtained.

The overflow receiving tank 20 can also serve as a control tank, and a significant cost reduction can be achieved. In particular, since the mechanical strength and processing accuracy of each tank 10, 20 are minimized, it is possible to further reduce the cost.

Further, the rotation supporting portions (4, 4) ensure the feeding accuracy of each roller 2 and the overflow receiving tank 20 having a large capacity can stabilize the composition of the processing liquid, so that the IC lead frame can be surfaced with high quality. Can be processed.

Further, the overflow receiving tank 20 can have a large capacity and a short length in the carrying direction, and the layout can be reduced. From this point as well, a significant cost reduction can be achieved.

Furthermore, since the overflow receiving tank 20 can also serve as a management tank, the height of the entire apparatus becomes short, and the product type switching work and I can be performed without using a stand for inspection.
C Lead frame transport status can be monitored. That is, the processing steps can be confirmed quickly. From this point as well, a significant cost reduction and high quality processing can be achieved. Moreover, maintenance and inspection is easy, and accidents when getting on and off the platform can be eliminated. Furthermore, the situation that the lower side becomes dirty does not occur.

Furthermore, the supply pipe 31 of the liquid circulation device 30
The size of the pump 33 is reduced and the size of the pump 33 is reduced. Therefore, the size of the entire apparatus can be further reduced. Further, since each component of the liquid circulation device 30 is centrally arranged in the vicinity of the overflow receiving tank 20, maintenance and inspection is facilitated.

Furthermore, since the processing liquid can be stored in the space below the processing bath 10, the overflow receiving bath 20 can further stably store the processing liquid. Therefore, the liquid circulation can be further facilitated and the composition of the treatment liquid can be further stabilized. From this point as well, high quality processing of the IC lead frame W is achieved.

In the above embodiment, the liquid cutting collar body 7 is attached to the central portion between the upper open concave portion 17 of the roller 2 and the tank wall 23 (24) via the packing, but it is transmitted through the roller 2. Any configuration may be adopted as long as the treatment liquid can be forcibly turned and dropped downward. For example, the liquid cutting collar body 7 may be mounted on the roller 2 in the vicinity of the upper open concave portion 17. Further, the liquid cutting collar body 7 may be formed integrally with the roller 2.

[0037]

According to the present invention, the overflow receiving tank is formed so that the planar shape can surround the processing tank, and the rotation supporting portions of the respective rollers forming the roller conveyor are arranged on both outsides of the overflow receiving tank. Then, upper opening recesses for passing the rollers are formed on both upper sides of the processing tank, and the rollers are transmitted through the upper opening recesses from the upper opening recesses of the mounted rollers to the tank wall of the overflow receiving tank. Since a liquid cutting collar body for dropping the processing liquid flowing outward is attached, liquid leakage prevention and I
It is possible to make the overflow receiving tank a large capacity and also serve as the management tank while ensuring the complete processing of the C lead frame. This makes it possible to reduce the height of the entire apparatus and quickly confirm the processing steps, while significantly reducing the cost.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view for explaining an embodiment of the present invention.

FIG. 2 is also a perspective view for explaining the positional relationship between the roller conveyor and the roller support plate.

FIG. 3 is a diagram for explaining the configuration of a conventional surface treatment apparatus.

FIG. 4 is a plan view for explaining an arrangement state of a roller conveyor in a conventional surface treatment apparatus with respect to a processing tank and an overflow receiving tank.

FIG. 5 is a diagram for explaining a roller supporting method in a conventional surface treatment apparatus.

FIG. 6 is a diagram for explaining another example of the roller supporting method in the conventional surface treatment apparatus.

[Explanation of symbols]

 1 Roller Conveyor 2 Roller 4 Roller Support Plate (Rotation Support Part) 7 Liquid Cutting Collar Body 10 Processing Tank 17 Upper Opening Recess 20 Overflow Receiving Tank 30 Liquid Circulation Device

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/50 D

Claims (1)

[Claims] 1. A processing tank, an overflow receiving tank, a liquid circulating device for circulating the processing liquid sucked from the overflow receiving tank to the processing tank, and a roller conveyor,
In a surface treatment device for an IC lead frame, which continuously passes through an IC lead frame conveyed by a roller conveyor in a rising treatment liquid formed on a treatment tank, the overflow receiving tank has a planar shape as described above. The processing tank is formed so as to be able to be surrounded, and the rotation supporting portions of the rollers forming the roller conveyor are arranged on both outsides of the overflow receiving tank, and the upper open concave portions for passing the rollers on both upper sides of the processing tank. And a liquid-cutting collar body for dropping the processing liquid flowing outward through the roller between the upper open recess of the roller mounted through the upper open recess and the tank wall of the overflow receiving tank. A surface treatment device for an IC lead frame, characterized by being attached.