JPH0628881B2 - Hot wire mounting structure for hot runner chip equipment - Google Patents
Hot wire mounting structure for hot runner chip equipmentInfo
- Publication number
- JPH0628881B2 JPH0628881B2 JP11056590A JP11056590A JPH0628881B2 JP H0628881 B2 JPH0628881 B2 JP H0628881B2 JP 11056590 A JP11056590 A JP 11056590A JP 11056590 A JP11056590 A JP 11056590A JP H0628881 B2 JPH0628881 B2 JP H0628881B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- gate
- hot
- tip
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 14
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000000465 moulding Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は射出成形装置におけるホットランナーチップ装
置のゲート開閉用熱線取付構造に関する。The present invention relates to a hot wire mounting structure for opening and closing a gate of a hot runner chip device in an injection molding device.
射出成形機のキャビティへ溶融樹脂を射出するためのホ
ットランナーチップ装置において、ゲート部の外周から
加熱するいわゆる外部加熱式の構造については、本願発
明者がさきに出願した特開平１−２５７０１９号公報が
知らされている。In a hot runner chip device for injecting a molten resin into a cavity of an injection molding machine, a so-called external heating type structure in which heating is performed from the outer periphery of a gate portion is disclosed in Japanese Patent Application Laid-Open No. 1-257019 previously filed by the present inventor. Is informed.
そして上記公報の技術は、温度に比例して抵抗値が増加
し、かつ細小加工性が高く、しもか耐酸化性のある金属
線材を用いて細小径の熱線を作り、成形用樹脂が流通す
る中心孔を穿ったホットランナー体の先端に形成される
ゲート部の外周にコイル状に捲回してゲートに対して外
部から加熱するようにしたことを特徴としたものであ
る。And the technology of the above-mentioned publication increases the resistance value in proportion to the temperature, has a high fine workability, and produces a small-diameter hot wire by using a metal wire material having a resistance to oxidation, and the molding resin is distributed. It is characterized in that a coil is wound around the outer periphery of the gate portion formed at the tip of the hot runner body having the center hole formed therein to heat the gate from the outside.
ここで、前記熱線関連部分の構成について第３図に基づ
きさらに詳述すると、ゲート部１を加熱する熱線ａ
１は、白金線を用い同一径をもってコイル状に捲回して
形成される。そして、ゲート部１１、ゲート１２及びラ
ンナー１３を中心孔として同一軸線上に設置した円筒状
のホットランナー体１４の前記ゲート部１１の外周にセ
ラミックスなどの絶縁材料１５と共に絶縁処理して捲回
固定されている。Here, the configuration of the heat ray-related portion will be described in more detail with reference to FIG. 3. The heat ray a for heating the gate portion 1
1 is formed by winding a platinum wire into a coil with the same diameter. Then, the cylindrical hot runner body 14 having the gate portion 11, the gate 12 and the runner 13 as a central hole and arranged on the same axis is insulated around the outer periphery of the gate portion 11 together with an insulating material 15 such as ceramics and fixed by winding. Has been done.
ところで、熱線ａ１用の一方の導線は、ホットランナー
体１４にボディアースされ、他方の導線１６は、ゲート
部１１の外周を通り、さらにホットランナー体１４の外
周を経てセラミックスなどの絶縁材料１５により絶縁処
理されて外部に導出されている。By the way, one conducting wire for the heating wire a 1 is body-grounded to the hot runner body 14, and the other conducting wire 16 passes through the outer periphery of the gate portion 11 and further passes through the outer periphery of the hot runner body 14 to pass through the insulating material 15 such as ceramics. Is subjected to insulation treatment and led to the outside.
また、前記ホットランナー体１４には、ランナー１３を
加熱するためのボディヒータ１７が前記絶縁材料１５に
より絶縁処理されてホットランナー体１４の外周に被冠
される筒体１８内に捲装されており、ランナー１３内を
流通する樹脂の保温溶融を図っている。さらに筒体１８
の先端には円錐状笠部１９を備えホットランナー体１４
の先端に空間部２０を形成して断熱用のエアギャップを
設けてある。In addition, a body heater 17 for heating the runner 13 is insulated from the hot runner body 14 by the insulating material 15 and wound in a tubular body 18 that is crowned on the outer circumference of the hot runner body 14. Therefore, the resin flowing through the inside of the runner 13 is melted while retaining the heat. Further cylinder 18
A hot runner body 14 is provided with a conical cap portion 19 at the tip of the
An air gap for heat insulation is provided by forming a space portion 20 at the tip of the.
なお、符号２１はマニホールドで、ホットランナー体１
４の後端の膨出部２２に当接し、流通孔２３とランナー
１３とが連通できるように配設されている。また、２４
はホットランナー体１４が環状ホルダ２６を介して装着
される金型部、２５は該金型部２４に穿った必要数の冷
却孔で、冷却媒体が導入される。Reference numeral 21 is a manifold, which is a hot runner body 1.
4 is arranged so as to contact the bulging portion 22 at the rear end of the No. 4 and the communication hole 23 and the runner 13 can communicate with each other. Also, 24
Is a mold part to which the hot runner body 14 is mounted via the annular holder 26, and 25 is a required number of cooling holes formed in the mold part 24, into which a cooling medium is introduced.
また、２７はボディ温度センサー線を示す。Further, 27 indicates a body temperature sensor line.
上記構成となっているので、熱線ａ１に通電して発熱さ
せればゲート部１１内の固化樹脂は直ちに加熱溶融され
てゲート１２が、いわゆる「開」となり、射出成形が行
われる。通電が解かれれば、ゲート部１１内の温度は低
下し溶融樹脂は直ちに冷却固化するためゲート１２はい
わゆる「閉」となる。With the above-described structure, when the heating wire a 1 is energized to generate heat, the solidified resin in the gate portion 11 is immediately heated and melted, the gate 12 is opened, and injection molding is performed. When the energization is released, the temperature in the gate portion 11 is lowered and the molten resin is immediately cooled and solidified, so that the gate 12 is closed.
ところで従来の熱線取付構造は第４図及び第５図に示す
ように、ホットランナー体１４の先端に形成されるゲー
ト部１１は、小さな円錐台部分から細長い円筒部分を突
設した形状となっていて金型２４の孔２４ａから極めて
わずかに突出した状態で設定されている。そして、円錐
状笠部１９の内側に、白金線を用いた熱線（チップヒー
タ線）ａ１が円筒部分の外周に絶縁材料１５により絶縁
されて捲回してあり、先端部は、ゲート部１１にスポッ
ト溶接されてボディアースされており一方、基端部は、
ゲート部１１外周に軸方向に付設したアルミナパイプ２
８の先端からほぼ直角に折り曲げられて挿入され円錐台
部分の斜面位置で導線（ニクローム線）１６の先端に溶
着されたうえジョイントカバー２９で被覆し固定してあ
る。By the way, in the conventional heat wire mounting structure, as shown in FIG. 4 and FIG. 5, the gate portion 11 formed at the tip of the hot runner body 14 has a shape in which a slender cylindrical portion is projected from a small truncated cone portion. Is set so as to project extremely slightly from the hole 24a of the mold 24. Inside the conical cap portion 19, a heating wire (chip heater wire) a 1 using a platinum wire is wound around the outer periphery of the cylindrical portion while being insulated by the insulating material 15, and the tip end portion is provided on the gate portion 11. The body is grounded by spot welding, while the base end is
Alumina pipe 2 attached to the outer periphery of the gate portion 11 in the axial direction
8 is bent and inserted at a substantially right angle from the tip of the wire 8, is welded to the tip of the conductor wire (nichrome wire) 16 at the slope position of the truncated cone portion, and is covered and fixed by the joint cover 29.
なお、第５図において符号３０は熱線スポット位置、３
１は熱線接続部、３２はセンサースポット位置である。In FIG. 5, reference numeral 30 indicates a heat ray spot position, 3
Reference numeral 1 is a heat ray connecting portion, and 32 is a sensor spot position.
ところで、ゲート部１１のランナー先端部１３ｓを熱線
ａ１により制御する方法として、 （１）常時ＯＮとする方法、 （２）間欠的にＯＮ，ＯＦＦを繰り返しゲートの開閉を
行う方法、 （３）電流又は電圧を変化して発熱量を調節する方法、 の３種類があり、上記（２）項の方法はすでに本願発明
者がスピアシステムとして世界特許を取得しており、本
願においてもこれを適用している。By the way, as a method of controlling the runner tip portion 13s of the gate portion 11 by the heat ray a 1 , (1) a method of always turning on, (2) a method of intermittently turning on and off repeatedly to open and close the gate, (3) There are three methods of adjusting the amount of heat generation by changing the current or voltage. The method of the above (2) has already obtained the world patent as a spear system by the inventor of the present application, and this method is also applied to the present application. is doing.
いわゆる外部加熱式のホットランナーチップにおけるゲ
ートの間欠加熱によるゲート開閉を確実に作用させるた
めには、冷却孔２５により常に冷却されている金型２４
の孔２４ａと密に嵌装されているゲート部１１の冷却用
接触部１１ｓによって熱伝導により所望の温度に冷却て
おく必要がある。また、射出成形のつどの加熱時にはゲ
ート１２と熱線ａ１との間のゲート先端バンド（熱伝導
距離）ｌを極端まで短くしなければならない。In order to surely operate the gate opening / closing by the intermittent heating of the gate in the so-called external heating type hot runner chip, the mold 24 which is always cooled by the cooling hole 25.
It is necessary to cool to a desired temperature by heat conduction by the cooling contact portion 11s of the gate portion 11 which is closely fitted to the hole 24a. In addition, the gate tip band (heat conduction distance) 1 between the gate 12 and the heating wire a 1 must be extremely shortened during heating in injection molding.
しかしながら、従来、上記の問題に対する配慮には若干
欠ける点があった。However, heretofore, there has been some lack of consideration for the above problems.
また、熱線ａ１の基端を導線に接続する手段において
は、熱線ａ１の基端部をほぼ直角に曲げてアルミナパイ
プ２８内へ嵌挿してゲート部１１の円錐台部分の斜面ま
で導き導線に溶着してジョイントカバー２９で被覆固定
する手段を採っていたため、熱線ａ１の基端部が熱で伸
びても逃げ場がなく成形操作のつど数万〜数１０万回の
伸縮動作が繰り返されるので、金属疲労が屈曲部に集中
し断線するという惧れも予想される。Further, in the means for connecting the base end of the heat wire a 1 to the conductor wire, the base end portion of the heat wire a 1 is bent substantially at a right angle and inserted into the alumina pipe 28 to guide the wire to the slope of the truncated cone portion of the gate portion 11. Since the means for welding and fixing with the joint cover 29 is adopted, there is no escape even if the base end of the heat wire a 1 extends due to heat, and the expansion and contraction operation is repeated tens of thousands to several hundreds of thousands each time the molding operation is performed. Therefore, it is expected that metal fatigue will concentrate on the bend and break.
本発明は、叙上の事情に着目してなされたもので、ゲー
トにおける成形用樹脂の冷却と加熱とをバランスよく制
御することのできる熱線の捲回位置を設定する一方、熱
線の発熱・冷却に伴う基端部の伸縮に対しても破断する
ことのないホットランナーチップ装置の熱線取付構造を
提供することも目的としている。The present invention has been made by paying attention to the above circumstances, and while setting the winding position of the heating wire capable of controlling cooling and heating of the molding resin in the gate in a well-balanced manner, heat generation / cooling of the heating wire. Another object of the present invention is to provide a hot-wire mounting structure for a hot runner chip device that does not break even when the base end portion expands or contracts due to the above.
本発明に係る熱線取付構造は、ゲート部に先端部をボデ
ィアースし密接してコイル状に捲回した細小径の耐酸化
性で高温発熱性の金属線を用いた熱線の最前面とゲート
前面との間隔、いわゆるゲート先端バンドを極小値に設
定することにより、また、ゲート部まで延伸させた導線
の先端部に、熱線基端部に形成した密着コイル部を外嵌
して熱線と導線とを接続することにより、上記課題を解
決した。The hot wire mounting structure according to the present invention is a front surface of a hot wire and a front surface of the gate, which uses a small-diameter, oxidation-resistant, high-temperature-exothermic metal wire in which the tip is body-grounded to the gate and closely wound in a coil shape. By setting the spacing between the so-called gate tip band to a minimum value, and by fitting the contact coil formed at the base end of the heat wire to the tip of the conductor wire extended to the gate portion, the heat wire and the conductor wire are The above problem was solved by connecting the.
上記構成によれば、熱線はボディ温度センサー線の信号
により電源ＯＮ．ＯＦＦ動作を受けて発熱・冷却の動作
を繰り返す。このとき金型による冷却と熱線による加熱
とがバランスよく行われるので、成形用樹脂は急速溶融
と急速固化とを適切に繰り返しゲートを開閉するため間
欠加熱に必要な６０℃以上の上下幅を有する温度が得ら
れる。According to the above configuration, the heat wire is turned on by the signal from the body temperature sensor wire. Receiving the OFF operation, the operation of heat generation and cooling is repeated. At this time, the cooling by the mold and the heating by the heating wire are performed in a well-balanced manner, so that the molding resin has a vertical width of 60 ° C. or more required for intermittent heating in order to open and close the gate by appropriately repeating rapid melting and rapid solidification. The temperature is obtained.
また、熱線の基端部は形成された密着小コイル部を導線
先端部に外嵌するだけで接着固定されていないため、温
度上昇により伸長しても逃げの余裕があるばかりか、応
力の集中する箇所が無いので断線することはない。In addition, since the base end of the heat wire is not adhesively fixed by simply fitting the formed small contact coil to the tip of the conductor, it not only has room for escape even if it expands due to temperature rise, but also stress concentration. Since there is no part to do, there is no disconnection.
以下、本発明の実施例を図面と共に説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図及び第２図に示すように、成形用樹脂を射出する
このゲート部２は、ホットランナー体３の先端に突出し
た高い高さの円錐台部２ｓと短い円筒部２ｔとを連結し
て形成されており、前記ゲート部２の先端をわずかに突
出するように嵌挿させる金型４の孔４ａ内面（ゲート部
冷却用接触部）の厚みｔは１mmに形成してある。１mm以
下であると冷却機能が低下し、１mm以上であると加熱機
能が低下することが実験上判明している。As shown in FIG. 1 and FIG. 2, this gate part 2 for injecting the molding resin connects the high truncated cone part 2s protruding at the tip of the hot runner body 3 and the short cylindrical part 2t. The thickness t of the inner surface (contact portion for cooling the gate portion) 4a of the die 4 into which the tip of the gate portion 2 is inserted so as to slightly project is formed to be 1 mm. It has been experimentally proved that if it is 1 mm or less, the cooling function is deteriorated, and if it is 1 mm or more, the heating function is deteriorated.
そして、耐酸化性で高温発熱性の金属線としてロジゥム
を１％含有した白金線を用いた熱線１は、絶縁材として
用いたセラミック系絶縁接着剤６を介し前記ゲート部２
の円筒部２ｔに所要回数コイル状に近接して捲回されて
おり、先端部を円筒部２ｔ外周面に複数のスポット溶接
を施してボディアースされる。また、熱線１、円錐台部
２ｓを越えた辺りの、円筒部２ｔ外周に導かれた導線
（ニクロム線）５の先端部に、基端部１ｋの末端に形成
する密着した小コイル部１ｃを嵌着することにより接続
されている。なお、熱線１はさらにセラミック系絶縁接
着剤７により全面被覆して絶縁される。The heating wire 1 using a platinum wire containing 1% of rhodium as a metal wire having oxidation resistance and high temperature exothermicity is provided with the gate portion 2 through the ceramic insulating adhesive 6 used as an insulating material.
It is wound around the cylindrical portion 2t in a coil shape a required number of times, and the tip end portion is subjected to a plurality of spot weldings on the outer peripheral surface of the cylindrical portion 2t to be body-grounded. Further, a small coil portion 1c closely attached to the end of the base end portion 1k is formed at the tip of the lead wire (nichrome wire) 5 guided to the outer periphery of the cylindrical portion 2t around the heat wire 1 and the truncated cone portion 2s. They are connected by fitting. The heating wire 1 is further covered with a ceramic insulating adhesive 7 for insulation.
なお、熱線１の最前面１ｆとゲート２ｇとの間のゲート
先端バンドｌは可能な限り極限まで短縮する必要がある
が、エアギャップ８や円錐状笠部９の関係から極小値は
２mmとなり、その位置に熱線１を位置決めさせている。The gate tip band 1 between the forefront 1f of the heat wire 1 and the gate 2g needs to be shortened as much as possible, but the minimum value is 2 mm due to the relationship of the air gap 8 and the conical cap portion 9, The heating wire 1 is positioned at that position.
また、符号３ｒは成形用樹脂を流通させるランナー、１
０は金型４に穿設されている冷却孔である。Reference numeral 3r is a runner for circulating the molding resin,
Reference numeral 0 is a cooling hole formed in the mold 4.
上記構成となっているので、導線５に通電すれば、熱線
１はボディ温度センサー線の信号を介して制御される電
源のＯＮ，ＯＦＦ動作を受けて発熱，冷却の動作を繰り
返し成形用樹脂の溶融、固化を行わせてゲート２ｇを開
閉する。この際、金型４の孔４ａの厚みｔを１mmとして
いるので、冷却孔１０により冷却されている金型４の孔
４ａ内面とゲート部２との冷却用接触部が適切な面積と
なっていて、極小値をもってゲート先端バンドｌを設定
した熱線１の急速発熱，急速冷却をバランスよく行わせ
るとともに間欠加熱に必要な温度の上下幅６０℃以上が
確保され、製品に溶融部分を生じない射出成形ができ
る。With the above-described configuration, when the conducting wire 5 is energized, the heating wire 1 repeats the heat generation and cooling operations by receiving the ON / OFF operation of the power source controlled through the signal of the body temperature sensor wire, and the heating resin 1 The gate 2g is opened and closed by melting and solidifying. At this time, since the thickness t of the hole 4a of the mold 4 is 1 mm, the cooling contact portion between the inner surface of the hole 4a of the mold 4 cooled by the cooling hole 10 and the gate portion 2 has an appropriate area. In this way, rapid heating and rapid cooling of the heating wire 1 with the gate tip band 1 set with a minimum value are performed in a well-balanced manner, and the upper and lower widths of the temperature required for intermittent heating of 60 ° C or more are secured, and the product is not melted. Can be molded.
また、熱線１の導線５への接続は、基端部１ｋに形成す
る密着した小コイル部１ｃを導線５の先端部に嵌着して
セラミック系絶縁接着剤７により絶縁被覆しているに過
ぎないため、発熱により温度上昇して基端部１ｋが延伸
しても逃げる余裕があり、また、延伸による応力の集中
箇所も無いため断線することはあり得ない。Further, the connection of the heating wire 1 to the conducting wire 5 is merely performed by fitting the closely attached small coil portion 1c formed at the base end portion 1k to the tip end portion of the conducting wire 5 and insulatingly coating with the ceramic insulating adhesive 7. Since there is no heat, there is room for the base end 1k to escape even if the temperature rises due to heat generation and the base end portion 1k is stretched, and there is no stress concentration portion due to stretching, so there is no possibility of disconnection.
本発明は叙上のように、熱線材料に耐酸化性で高温発熱
性の金属線を採用したので、極超微小径の線材により熱
線を形成し得るため、捲数を多くすることができ、好み
の高温制御が可能となるばかりか、ゲート先端バンドも
極小値にまで短縮することができたので、間欠加熱に必
要な温度の上下幅も所望の値を確保でき、成形用樹脂の
急速加熱，急速固化がバランスよく行われることとなり
製品の溶融を招くことがなく品質と歩留りの向上が図れ
た。As described above, since the present invention employs a metal wire having high temperature heat resistance and oxidation resistance as the heat wire material, it is possible to form the heat wire with a wire having an extremely small diameter, and thus the number of turns can be increased. Not only was it possible to control the high temperature to your liking, but since the gate tip band could also be shortened to a minimum value, the desired upper and lower width of the temperature required for intermittent heating could be secured, and the rapid heating of the molding resin. However, rapid solidification was performed in a well-balanced manner, and the quality and yield were improved without melting the product.
一方、熱線の基端部の導線との接続を熱線のコイル巻き
を導線に外嵌することにより行うようにしたため、熱線
の発熱に伴う延伸の影響を受けることがなく断線を招く
惧れが消失した。On the other hand, the connection with the conducting wire at the base end of the heating wire is performed by externally fitting the coil winding of the heating wire to the outside of the conducting wire, so there is no fear of drawing due to the heat generation of the heating wire. did.
第１図は、本発明に係るホットランナーチップ装置の熱
線取付構造の実施例の要部を一部断面して示す拡大図、
第２図は、同じくホットランナーチップの前半部を示す
概略図で、同図Ｉは一部断面正面図、同図IIは、半断面
側面図、第３図は、従来のホットランナーチップ装置の
使用状態の縦断面図、第４図は、従来の第１図相当図、
第５図は、同じく第２図の相当図である。 １……熱線 １ｆ……熱線最前面 １ｋ……基端部 ２……ゲート部 ２ｇ……ゲート ２ｔ……円筒部 ５……導線FIG. 1 is an enlarged view showing a partial cross section of a main part of an embodiment of a hot wire mounting structure of a hot runner chip device according to the present invention,
2 is a schematic view showing the front half of the hot runner chip, FIG. 1 is a partial sectional front view, FIG. 2 is a half sectional side view, and FIG. 3 is a conventional hot runner chip device. FIG. 4 is a vertical cross-sectional view of a state of use, which is equivalent to FIG.
FIG. 5 is also a view equivalent to FIG. 1 ... Hot wire 1f ... Front of hot wire 1k ... Base end 2 ... Gate part 2g ... Gate 2t ... Cylindrical part 5 ... Conductor wire
Claims (1)
用いゲート部の先端部に先端部をボディアースし、コイ
ル状に近接して巻き付けた熱線を、熱線最前面とゲート
前面との間隔を極小値となるように位置決めさせるとと
もに、熱線基端部に形成した密着小コイル部を導線の先
端部に外嵌することにより、熱線と導線とを接続したこ
とを特徴とするホットランナーチップ装置の熱線取付構
造。1. A thin and small diameter metal wire having oxidation resistance and high temperature exothermicity, the tip of which is body-grounded at the tip of the gate portion, and the heating wire wound close to a coil is used as the forefront of the heating wire and the front surface of the gate. A hot wire characterized by connecting the heating wire and the conducting wire by externally fitting the close contact small coil portion formed at the heating wire base end portion while positioning the distance between Heat wire mounting structure for runner tip device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11056590A JPH0628881B2 (en) | 1990-04-27 | 1990-04-27 | Hot wire mounting structure for hot runner chip equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11056590A JPH0628881B2 (en) | 1990-04-27 | 1990-04-27 | Hot wire mounting structure for hot runner chip equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH048521A JPH048521A (en) | 1992-01-13 |
| JPH0628881B2 true JPH0628881B2 (en) | 1994-04-20 |
Family
ID=14539057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11056590A Expired - Lifetime JPH0628881B2 (en) | 1990-04-27 | 1990-04-27 | Hot wire mounting structure for hot runner chip equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0628881B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008090882A1 (en) | 2007-01-23 | 2008-07-31 | Nec Corporation | Voltage-controlled oscillator, phase-locked loop circuit and clock data reproducing circuit |
-
1990
- 1990-04-27 JP JP11056590A patent/JPH0628881B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048521A (en) | 1992-01-13 |
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