JPH0628860U - Semi-conductive roll - Google Patents

Semi-conductive roll

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Publication number
JPH0628860U
JPH0628860U JP2840991U JP2840991U JPH0628860U JP H0628860 U JPH0628860 U JP H0628860U JP 2840991 U JP2840991 U JP 2840991U JP 2840991 U JP2840991 U JP 2840991U JP H0628860 U JPH0628860 U JP H0628860U
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JP
Japan
Prior art keywords
semiconductive
conductive
roll
layer
semiconductive roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2840991U
Other languages
Japanese (ja)
Inventor
正明 犬伏
隆史 山本
三郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Riko Co Ltd
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Sumitomo Riko Co Ltd
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Publication date
Application filed by Sumitomo Riko Co Ltd filed Critical Sumitomo Riko Co Ltd
Priority to JP2840991U priority Critical patent/JPH0628860U/en
Publication of JPH0628860U publication Critical patent/JPH0628860U/en
Pending legal-status Critical Current

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  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Rolls And Other Rotary Bodies (AREA)

Abstract

(57)【要約】 【目的】 半導電性ロールの軸心方向の両端の外径が大
径化しても、寿命を長くすることができる。 【構成】 芯金2と、この芯金2の外周に円周に沿つて
形成された導電ゴム層3と、この導電ゴム層3の外周面
に形成された半導電性薄膜層4とを備えた半導電性ロー
ル1である。上記導電ゴム層3の左右の両端面に、所定
深さの溝5を芯金2に沿つて周設する。
(57) [Summary] [Purpose] The life can be extended even if the outer diameters of both ends of the semiconductive roll in the axial direction are increased. [Structure] A cored bar 2, a conductive rubber layer 3 formed along the circumference of the cored bar 2, and a semiconductive thin film layer 4 formed on the outer peripheral surface of the conductive rubber layer 3. It is a semiconductive roll 1. Grooves 5 having a predetermined depth are circumferentially provided along the core metal 2 on both left and right end surfaces of the conductive rubber layer 3.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は、電子写真複写機等に用いられる半導電性ロールに関するものであ る。 The present invention relates to a semiconductive roll used in electrophotographic copying machines and the like.

【0002】[0002]

【従来の技術】[Prior art]

一般に、電子写真複写機には感光ドラムが設けられており、この感光ドラムに 静電潜像を形成させ、これに、現像ロールからトナー粒子を飛翔させて付着させ 、この形成画像を複写紙等に転写するようになつている。この種の感光ドラムで は、その表面に静電潜像を形成する必要上、表面を帯電させる必要があり、この 帯電にはコロナ帯電が従来から行われている。しかし、コロナ帯電は、高濃度の オゾンを発生させ、その周辺の感光ドラムを始め、機能性有機材料部品の性能低 下および材料劣化を促進させると同時に、環境を悪化させるという難点がある。 Generally, an electrophotographic copying machine is provided with a photosensitive drum, and an electrostatic latent image is formed on the photosensitive drum, and toner particles are made to fly from a developing roll and attached to the electrostatic latent image. It is designed to be transferred to. In this type of photosensitive drum, since it is necessary to form an electrostatic latent image on the surface of the photosensitive drum, it is necessary to charge the surface, and corona charging has been conventionally performed for this charging. However, the corona charging has a drawback that it generates a high concentration of ozone, accelerates the performance deterioration and material deterioration of the functional organic material parts including the photosensitive drum around it, and at the same time, deteriorates the environment.

【0003】 そこで最近では、上記感光ドラムに半導電性ロールを接触回転させることによ り感光ドラムを帯電させることが試みられている。より詳しく述べると、この帯 電法では、図6に示すように半導電性ロール1を感光ドラム6に摺擦させてつれ 回りさせ、その状態で半導電性ロール1に電圧を印加し感光ドラム6を帯電する ことが行われている。この場合、感光ドラム6に対する帯電は、摩擦帯電,電荷 注入,気中放電による帯電が主として行われる。このような帯電法においては、 半導電性ロール1に対する印加電圧を高くすると、帯電電位を高くできることか ら、一般に半導電性ロール1に対して1〜3キロボルトの直流ないしは交流を印 加することが行われている。したがつて、上記半導電性ロール1は、高電圧に耐 えることが求められており、通常、図8に示すように、回転軸となる芯金2の外 周に、ポリノルボーネンゴム配合物等の導電ゴム層3を形成し、この導電ゴム層 3の外周に、酸化錫やカーボンブラツク等の導電粒子を混入した弾性ゴムからな る半導電性薄膜層4を形成して構成されている。Therefore, recently, it has been attempted to charge the photosensitive drum by rotating the semiconductive roller in contact with the photosensitive drum. More specifically, in this electrification method, as shown in FIG. 6, the semiconductive roll 1 is rubbed against the photosensitive drum 6 so that the semiconductive roll 1 is rotated around the photosensitive drum 6, and a voltage is applied to the semiconductive roll 1 in that state. 6 is being charged. In this case, the photosensitive drum 6 is mainly charged by frictional charging, charge injection, and air discharge. In such a charging method, if the applied voltage to the semiconductive roll 1 is increased, the charging potential can be increased. Therefore, in general, a DC or AC voltage of 1 to 3 kV is applied to the semiconductive roll 1. Is being done. Therefore, the semiconductive roll 1 is required to withstand a high voltage, and normally, as shown in FIG. 8, a polynorbornene rubber compound is added to the outer periphery of the cored bar 2 serving as a rotating shaft. 1 is formed by forming a conductive rubber layer 3 such as an object, and a semiconductive thin film layer 4 made of elastic rubber mixed with conductive particles such as tin oxide or carbon black on the outer periphery of the conductive rubber layer 3. There is.

【0004】 このような半導電性ロール1は、一般につぎのようにして製造される。すなわ ち、まず、パイプ金型を使用して、芯金2の外周上に接着剤を介して外径が均一 な導電ゴム層3を形成する。ついで、図7に示すように、上記導電ゴム層3の左 右の両端面をAで示すようにカツター刃で直角にカツトし角部をBで示すように カツター刃で面取りする。そののち、上記導電ゴム層3の外周面を必要に応じて 研磨し、デイツピングにより半導電性液を付着させ、ついで乾燥して上記付着半 導電性液を薄膜化して半導電性薄膜層4を形成し、必要に応じて架橋のための加 熱処理を行う。Such a semiconductive roll 1 is generally manufactured as follows. That is, first, using a pipe mold, the conductive rubber layer 3 having a uniform outer diameter is formed on the outer periphery of the core metal 2 with an adhesive. Then, as shown in FIG. 7, the left and right end surfaces of the conductive rubber layer 3 are cut at right angles with a cutter blade as indicated by A, and the corners are chamfered by a cutter blade as indicated by B. After that, the outer peripheral surface of the conductive rubber layer 3 is polished as necessary, a semiconductive liquid is attached by dipping, and then dried to make the attached semiconductive liquid into a thin film to form the semiconductive thin film layer 4. It is formed and, if necessary, heat treatment for crosslinking is performed.

【0005】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、このようにして得られた半導電性ロール1では、導電ゴム層3 の左右両端角部3aが盛り上がることから半導電性ロール1の全体が均一な径に ならないという難点がある。すなわち、上記半導電性ロール1の製造過程におい て、芯金2に形成した導電ゴム層3の左右の両端面を直角にカツトする際に、カ ツター刃の押圧力によつて切断面近傍の導電ゴム層3が圧縮され、切断後に復元 することから切断後の導電ゴム層3の左右両端角部3aは上記復元により盛り上 がる。この部分3aは図7においてBで示すようにカツトしても充分に除去する ことは困難である。しかも、デイツピングによる半導電性液のコーテイングは、 通常、半導電性ロール1を垂直方向に立てて行うため、半導電性液が下方にたれ て下端部に溜まつて盛り上がりその外径が大径化する。この下端部の大径化を低 減させるため、乾燥の過程で半導電性ロール1を逆さに立てることが行われるが 、このようにすることにより、半導電性液のたれで一方の端部3aのみならず左 右の両端部3aで外径が大径化する。このため、半導電性ロール1を感光ドラム 6に押し付けた時に、その押圧力が半導電性ロール1の両端部3aでは高圧にな り、両端部間では低圧になる。したがつて、均一な押圧力が得られない結果、感 光ドラム6の外周面を均一に帯電させることができないという不都合を招く。ま た、上記半導電性ロール1の両端部が偏摩耗する結果、半導電性ロールの耐久性 が低下し寿命が短くなる。 However, the semiconductive roll 1 thus obtained has a drawback that the semiconductive roll 1 does not have a uniform diameter as a whole because the left and right corners 3a of the conductive rubber layer 3 are raised. That is, in the process of manufacturing the semi-conductive roll 1, when the left and right end surfaces of the conductive rubber layer 3 formed on the cored bar 2 are cut at right angles, the pressing force of the cutter blade is applied to the vicinity of the cut surface. Since the conductive rubber layer 3 is compressed and restored after cutting, the left and right end corners 3a of the conductive rubber layer 3 after cutting rise due to the restoration. It is difficult to sufficiently remove this portion 3a even if it is cut as shown by B in FIG. Moreover, since the coating of the semiconductive liquid by dipping is usually performed by standing the semiconductive roll 1 in the vertical direction, the semiconductive liquid hangs downward and accumulates at the lower end portion and rises to have a large outer diameter. Turn into. In order to reduce the increase in the diameter of the lower end, the semiconductive roll 1 is set upside down during the drying process. By doing so, one end of the semiconductive liquid is dropped by the dripping of the semiconductive liquid. The outer diameter is increased not only at 3a but also at both left and right ends 3a. Therefore, when the semiconductive roll 1 is pressed against the photosensitive drum 6, the pressing force becomes high at both ends 3a of the semiconductive roll 1 and becomes low between both ends. Therefore, as a result of not being able to obtain a uniform pressing force, there arises a disadvantage that the outer peripheral surface of the photosensitive drum 6 cannot be uniformly charged. Further, as a result of uneven wear of both ends of the semiconductive roll 1, the durability of the semiconductive roll is reduced and the life is shortened.

【0006】 この考案は、このような事情に鑑みなされたもので、左右両端部の外径の大径 化によつても、長寿命を維持することのできる半導電性ロールの提供をその目的 とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a semi-conductive roll that can maintain a long life even if the outer diameters of the left and right ends are increased. And

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

上記の目的を達成するため、この考案の半導電性ロールは、軸体と、この軸体 の外周に円周に沿つて形成された導電性弾性体層と、この導電性弾性体層の外周 面に形成された半導電性薄膜層とを備えた半導電性ロールであつて、上記導電性 弾性体層の左右の両端面に、所定深さの溝を軸体に沿つて周設したという構成を とる。 In order to achieve the above-mentioned object, the semiconductive roll of the present invention comprises a shaft body, a conductive elastic body layer formed along the circumference of the shaft body, and an outer circumference of the conductive elastic body layer. A semi-conductive roll having a semi-conductive thin film layer formed on a surface thereof, wherein grooves having a predetermined depth are circumferentially provided along the shaft body on both left and right end surfaces of the conductive elastic layer. Take composition.

【0008】[0008]

【作用】[Action]

すなわち、この考案の半導電性ロールは、導電性弾性体層の左右の両端面に、 所定深さの溝を軸体に沿つて周設したため、半導電性ロールを感光ドラムに押し 付けた時に、半導電性ロールの左右両端部の大径化部分(半導電性薄膜層形成時 等に生じる)に対応する導電性弾性体層の部分が、上記溝によつて内方に撓み、 それによつて上記左右両端部の大径化部分の盛り上がりが吸収され、その結果半 導電性ロールの外周面の全体が感光ドラムに対して均一な圧力で押し付けられる ようになり、感光ドラムの外周面に対する均一な帯電を可能ならしめると同時に 半導電性ロールの左右両端部の偏摩耗の発生も防止できるようになる。 That is, the semiconductive roll of the present invention has grooves of a predetermined depth formed along the shaft on both left and right end surfaces of the conductive elastic layer, so that when the semiconductive roll is pressed against the photosensitive drum, The portions of the conductive elastic body layer corresponding to the large-diameter portions at the left and right ends of the semi-conductive roll (which occur when the semi-conductive thin film layer is formed, etc.) are bent inward by the grooves, and As a result, the swells of the larger diameter portions on both the left and right ends are absorbed, and as a result, the entire outer peripheral surface of the semi-conductive roll is pressed against the photosensitive drum with a uniform pressure, and the outer peripheral surface of the photosensitive drum is evenly pressed. It also makes it possible to prevent uneven wear at the left and right ends of the semi-conductive roll at the same time.

【0009】 つぎに、この考案を詳細に説明する。Next, this invention will be described in detail.

【0010】 この考案の半導電性ロールは、軸体と、この軸体の外周に円周に沿つて形成さ れた導電性弾性体層と、この導電性弾性体層の外周面に形成された半導電性薄膜 層とから構成されている。The semiconductive roll of the present invention is formed on a shaft body, a conductive elastic body layer formed along the circumference of the shaft body, and an outer peripheral surface of the conductive elastic body layer. And a semiconductive thin film layer.

【0011】 上記軸体としては、特に限定するものではなく、例えば金属製の中実体からな る芯金や、内部を中空にくりぬいた金属製の円筒体が使用される。The shaft body is not particularly limited, and for example, a cored bar made of a solid metal body or a metal cylindrical body having a hollow hollow inside is used.

【0012】 また、上記軸体の外周に形成される導電性弾性体層の形成材料としては、特に 限定するものではなく、ポリノルボルネンゴム単独品か、またはポリノルボルネ ンゴムとエチレン−プロピレン−ジエンゴム(EPDM)等とのブレンドゴムに カーボンブラツク等の導電材を混ぜ、導電性を付与したものが用いられる。この ような導電性弾性体層は、通常は、その導電性が、100 〜104 Ωcm程度に設 定される。そして、その厚みは、通常1〜5mm程度に設定される。The material for forming the conductive elastic body layer formed on the outer periphery of the shaft is not particularly limited, and polynorbornene rubber is used alone, or polynorbornene rubber and ethylene-propylene-diene rubber (EPDM) are used. ) And the like are blended with a conductive material such as carbon black in a blended rubber to give conductivity. Such conductive elastic layer is usually its conductivity is set to 10 0 - 10 4 about [Omega] cm. And the thickness is usually set to about 1 to 5 mm.

【0013】 上記導電性弾性体層の外周面に形成される半導電性薄膜層の構成材料としては 、その母材として、ヒドリンゴム,アクリルゴム,シリコンゴム等の合成ゴムな いしナイロン,ウレタン,ポリエステル等の合成樹脂を用い、これに酸化錫,カ ーボンブラツク等の導電材を配合してなるものが用いられる。この場合、母材と 導電材の使用割合は、通常、母材に対して導電材が5〜30容積%の範囲内に選 ばれる。このような半導電性薄膜層は、その厚みが、通常0.005〜0.30 0mm程度に設定される。As a constituent material of the semiconductive thin film layer formed on the outer peripheral surface of the conductive elastic body layer, as its base material, synthetic rubber such as hydrin rubber, acrylic rubber, silicon rubber or the like, nylon, urethane or polyester is used. A synthetic resin such as the above is used, and a conductive material such as tin oxide or carbon black is mixed therein. In this case, the use ratio of the base material and the conductive material is usually selected within the range of 5 to 30% by volume of the conductive material with respect to the base material. The thickness of such a semiconductive thin film layer is usually set to about 0.005 to 0.300 mm.

【0014】 この考案の半導電性ロールには、溝が上記導電性弾性体層の左右の両端面に軸 体に沿つて周設されている。この溝は、その幅が3〜10mm程度に、深さが0. 5〜3.0mm程度に設定される。この溝は、上記軸体の外周に導電性弾性体層を 金型により形成する時に、同時に形成することができる。また、上記溝はナイフ 等を用いて切欠き形成することもできる。In the semiconductive roll of the present invention, grooves are circumferentially provided along both ends of the conductive elastic layer along the shaft. This groove has a width of about 3 to 10 mm and a depth of 0. It is set to about 5 to 3.0 mm. This groove can be formed at the same time when the conductive elastic layer is formed on the outer circumference of the shaft body by a mold. Further, the groove may be formed as a notch using a knife or the like.

【0015】 上記のような半導電性ロールは、上記の原料を用い、例えばつぎのようにして 製造することができる。すなわち、軸体の左右両端部に溝形成用のリングを装着 し、残る軸体の外周面の部分に接着剤を塗布する。ついで、これを円筒状成形空 間を有する金型内に入れ、軸体の外周面と上記成形空間との間に先に述べたゴム 組成物を充填し金型加硫して導電性弾性体層を形成する。ついで、導電性弾性体 層の形成された軸体を金型から取り出し、リングを除去する。この除去跡が導電 性弾性体層の左右両端面の溝となる。つぎに、この導電性弾性体層の左右の両端 面をカツトし、面取り加工する。そののち、導電性弾性体層の外周面を必要に応 じて従来公知の方法で研磨し、左右の両端面をマスキングした状態で、デイツピ ングにより半導電性液を付着させ、ついで乾燥して上記付着半導電性液を薄膜化 して半導電性薄膜層を形成し、必要に応じて架橋のための加熱処理を行う。この ようにして半導電性ロールを得ることができる。The semiconductive roll as described above can be manufactured using the above raw materials, for example, as follows. That is, rings for groove formation are attached to both left and right ends of the shaft, and an adhesive is applied to the outer peripheral surface of the remaining shaft. Then, this is placed in a mold having a cylindrical molding space, the rubber composition described above is filled between the outer peripheral surface of the shaft body and the molding space, and the mold is vulcanized to form a conductive elastic body. Form the layers. Next, the shaft body on which the conductive elastic layer is formed is taken out from the mold and the ring is removed. The removed traces become grooves on the left and right end surfaces of the conductive elastic layer. Next, the left and right end surfaces of this conductive elastic layer are cut and chamfered. After that, if necessary, the outer peripheral surface of the conductive elastic layer is polished by a conventionally known method, and while the left and right end surfaces are masked, a semiconductive liquid is attached by a dateing and then dried. The attached semiconductive liquid is thinned to form a semiconductive thin film layer, and if necessary, heat treatment for crosslinking is performed. In this way, a semiconductive roll can be obtained.

【0016】 つぎに、この考案の実施例を説明する。Next, an embodiment of the present invention will be described.

【0017】[0017]

【実施例】【Example】

直径7mmに形成された金属製の芯金2を準備し、この芯金2の左右両端部に溝 形成用のリングを装着し、残る芯金2の外周面の部分に接着剤を塗布した。つい で、これを円筒状成形空間を有する金型内に入れ、芯金2の外周面と上記成形空 間との間に先に述べたゴム組成物を充填し金型加硫して、外径が15mmとなるよ うに導電ゴム層3を形成した。ついで、導電ゴム層3の形成された芯金2を金型 から取り出し、上記リングを除去した。この除去跡が導電ゴム層3の左右両端面 の溝5となる。この溝5は上記芯金2の外周に沿つて幅0.5mm,深さ5mmに形 成した。ついで、上記導電ゴム層3の外周に、デイツピングにより上記ゴム組成 物をコーテイングして乾燥し、厚み100μmの半導電性薄膜層4を形成した。 このようにして図1およびその側面図である図2に示す半導電性ロール1を得た 。そして、この状態では、上記導電ゴム層3の両端部には、幅5mm,厚み0.2 mmの膨らみが生じていたが、この半導電性ロール1を感光ドラムに押し付けた時 には、均一な圧力で押し付けることができた。 A metal cored bar 2 having a diameter of 7 mm was prepared, rings for groove formation were attached to both left and right ends of the cored bar 2, and an adhesive was applied to the outer peripheral surface of the remaining cored bar 2. Then, this is placed in a mold having a cylindrical molding space, the rubber composition described above is filled between the outer peripheral surface of the cored bar 2 and the molding space, and the mold is vulcanized, and The conductive rubber layer 3 was formed so that the diameter was 15 mm. Next, the cored bar 2 having the conductive rubber layer 3 formed thereon was taken out of the mold and the ring was removed. The removed traces become the grooves 5 on the left and right end surfaces of the conductive rubber layer 3. The groove 5 is formed along the outer circumference of the core metal 2 to have a width of 0.5 mm and a depth of 5 mm. Then, the rubber composition was coated on the outer periphery of the conductive rubber layer 3 by dipping and dried to form a semiconductive thin film layer 4 having a thickness of 100 μm. Thus, the semiconductive roll 1 shown in FIG. 1 and the side view of FIG. 2 was obtained. In this state, a bulge having a width of 5 mm and a thickness of 0.2 mm was formed at both ends of the conductive rubber layer 3, but when the semiconductive roll 1 was pressed against the photosensitive drum, the bulge was uniform. I was able to press it with just enough pressure.

【0018】 図3はこの考案の他の実施例が示されている。この実施例では、導電性弾性体 層3に形成される溝5を芯金2の外周から離して形成している。それ以外の部分 は上記実施例と同様であり、同様の作用効果を奏する。FIG. 3 shows another embodiment of the present invention. In this embodiment, the groove 5 formed in the conductive elastic layer 3 is formed apart from the outer circumference of the cored bar 2. The other parts are the same as those in the above-described embodiment, and have the same effects.

【0019】 図4はこの考案のさらに他の実施例が示されている。この実施例では、図3の ものにおいて、溝5の形状を楔形に形成している。それ以外の部分は図1に示す 実施例と同様であり、同様の作用効果を奏する。FIG. 4 shows still another embodiment of the present invention. In this embodiment, the groove 5 in FIG. 3 is formed in a wedge shape. The other parts are similar to those of the embodiment shown in FIG. 1 and have the same effects.

【0020】[0020]

【考案の効果】[Effect of device]

以上のように、この考案の半導電性ロールは、導電性弾性体層の左右の両端面 に、所定深さの溝を軸体に沿つて周設したため、半導電性ロールを感光ドラムに 押し付けた時に、半導電性ロールの左右両端部の大径化部分(半導電性薄膜層形 成時等に生じる)に対応する導電性弾性体層の部分が、上記溝によつて内方に撓 み、それによつて上記左右両端部の大径化部分の盛り上がりが吸収され、その結 果半導電性ロールの外周面の全体が感光ドラムに対して均一な圧力で押し付けら れるようになり、感光ドラムの外周面に対する均一な帯電を可能ならしめると同 時に半導電性ロールの左右両端部の偏摩耗の発生も防止できるようになる。 As described above, in the semiconductive roll of the present invention, the semiconductive roll is pressed against the photosensitive drum because the grooves having a predetermined depth are provided along the shaft on the left and right end surfaces of the conductive elastic layer. When this occurs, the part of the conductive elastic body layer corresponding to the large-diameter part at the left and right ends of the semi-conductive roll (which occurs when forming the semi-conductive thin film layer) is bent inward by the groove. As a result, the swelling of the larger diameter portion at the left and right ends is absorbed, and as a result, the entire outer peripheral surface of the semiconductive roll is pressed against the photosensitive drum with a uniform pressure. By making it possible to uniformly charge the outer peripheral surface of the drum, it is also possible to prevent uneven wear at the left and right ends of the semiconductive roll at the same time.

【提出日】平成5年3月3日[Submission date] March 3, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0020[Correction target item name] 0020

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0020】[0020]

【考案の効果】[Effect of device]

以上のように、この考案の半導電性ロールは、導電性弾性体層の左右の両端面 に、所定深さの溝を軸体に沿つて周設したため、半導電性ロールを感光ドラムに 押し付けた時に、半導電性ロールの左右両端部の大径化部分(半導電性薄膜層形 成時等に生じる)に対応する導電性弾性体層の部分が、上記溝によつて内方に撓 み、それによつて上記左右両端部の大径化部分の盛り上がりが吸収され、その結 果半導電性ロールの外周面の全体が感光ドラムに対して均一な圧力で押し付けら れるようになり、感光ドラムの外周面に対する均一な帯電を可能ならしめると同 時に半導電性ロールの左右両端部の偏摩耗の発生も防止できるようになる。 As described above, in the semiconductive roll of the present invention, the semiconductive roll is pressed against the photosensitive drum because the grooves having a predetermined depth are provided along the shaft on the left and right end surfaces of the conductive elastic layer. When this occurs, the part of the conductive elastic body layer corresponding to the large-diameter part at the left and right ends of the semi-conductive roll (which occurs when forming the semi-conductive thin film layer) is bent inward by the groove. As a result, the swelling of the larger diameter portion at the left and right ends is absorbed, and as a result, the entire outer peripheral surface of the semiconductive roll is pressed against the photosensitive drum with a uniform pressure. By making it possible to uniformly charge the outer peripheral surface of the drum, it is also possible to prevent uneven wear at the left and right ends of the semiconductive roll at the same time.

【図面の簡単な説明】[Brief description of drawings]

【図1】この考案の一実施例を示す半導電性ロールの断
面図である。
FIG. 1 is a sectional view of a semiconductive roll showing an embodiment of the present invention.

【図2】その側面図である。FIG. 2 is a side view thereof.

【図3】この考案の他の実施例を示す半導電性ロールの
断面図である。
FIG. 3 is a sectional view of a semiconductive roll according to another embodiment of the present invention.

【図4】その側面図である。FIG. 4 is a side view thereof.

【図5】この考案のさらに他の実施例を示す半導電性ロ
ールの断面図である。
FIG. 5 is a cross-sectional view of a semiconductive roll showing still another embodiment of the present invention.

【図6】接触帯電を説明する説明図である。FIG. 6 is an explanatory diagram illustrating contact charging.

【図7】半導電性ロールの製造過程を示す説明図であ
る。
FIG. 7 is an explanatory diagram showing a manufacturing process of a semiconductive roll.

【図8】従来例を示す半導電性ロールの断面図である。FIG. 8 is a cross-sectional view of a semiconductive roll showing a conventional example.

【符号の説明】[Explanation of symbols]

1 半導電性ロール 2 芯金 3 導電ゴム層 4 半導電性薄膜層 5 溝 1 semiconductive roll 2 core metal 3 conductive rubber layer 4 semiconductive thin film layer 5 groove

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成5年3月3日[Submission date] March 3, 1993

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief description of the drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図面の簡単な説明】[Brief description of drawings]

【図1】この考案の一実施例を示す半導電性ロールの断
面図である。
FIG. 1 is a sectional view of a semiconductive roll showing an embodiment of the present invention.

【図2】その側面図である。FIG. 2 is a side view thereof.

【図3】この考案の他の実施例を示す半導電性ロールの
断面図である。
FIG. 3 is a sectional view of a semiconductive roll according to another embodiment of the present invention.

【図4】その側面図である。FIG. 4 is a side view thereof.

【図5】この考案のさらに他の実施例を示す半導電性ロ
ールの断面図である。
FIG. 5 is a cross-sectional view of a semiconductive roll showing still another embodiment of the present invention.

【図6】接触帯電を説明する説明図である。FIG. 6 is an explanatory diagram illustrating contact charging.

【図7】半導電性ロールの製造過程を示す説明図であ
る。
FIG. 7 is an explanatory diagram showing a manufacturing process of a semiconductive roll.

【図8】従来例を示す半導電性ロールの断面図である。FIG. 8 is a cross-sectional view of a semiconductive roll showing a conventional example.

【符号の説明】 1 半導電性ロール 2 芯金 3 導電ゴム層 4 半導電性薄膜層 5 溝[Explanation of symbols] 1 semi-conductive roll 2 core metal 3 conductive rubber layer 4 semi-conductive thin film layer 5 groove

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 軸体と、この軸体の外周に円周に沿つて
形成された導電性弾性体層と、この導電性弾性体層の外
周面に形成された半導電性薄膜層とを備えた半導電性ロ
ールであつて、上記導電性弾性体層の左右の両端面に、
所定深さの溝を軸体に沿つて周設したことを特徴とする
半導電性ロール。
1. A shaft body, a conductive elastic body layer formed along the circumference on the outer circumference of the shaft body, and a semiconductive thin film layer formed on the outer peripheral surface of the conductive elastic body layer. A semi-conductive roll provided with, on the left and right end surfaces of the conductive elastic layer,
A semiconductive roll characterized in that a groove having a predetermined depth is provided around a shaft body.
JP2840991U 1991-03-30 1991-03-30 Semi-conductive roll Pending JPH0628860U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2840991U JPH0628860U (en) 1991-03-30 1991-03-30 Semi-conductive roll

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2840991U JPH0628860U (en) 1991-03-30 1991-03-30 Semi-conductive roll

Publications (1)

Publication Number Publication Date
JPH0628860U true JPH0628860U (en) 1994-04-15

Family

ID=12247861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2840991U Pending JPH0628860U (en) 1991-03-30 1991-03-30 Semi-conductive roll

Country Status (1)

Country Link
JP (1) JPH0628860U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013195667A (en) * 2012-03-19 2013-09-30 Bridgestone Corp Oa roller
JP2014170046A (en) * 2013-03-01 2014-09-18 Ricoh Co Ltd Developing device, process unit, and image forming apparatus
US20150023698A1 (en) * 2013-07-22 2015-01-22 Kyocera Document Solutions Inc. Conductive roller and image forming apparatus having the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134477A (en) * 1987-11-20 1989-05-26 Canon Inc Electrically conductive elastic roller and its manufacture
JPH02198470A (en) * 1989-01-28 1990-08-06 Tokai Rubber Ind Ltd Semiconductive roll
JPH02289880A (en) * 1989-04-28 1990-11-29 Nec Niigata Ltd Fixing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134477A (en) * 1987-11-20 1989-05-26 Canon Inc Electrically conductive elastic roller and its manufacture
JPH02198470A (en) * 1989-01-28 1990-08-06 Tokai Rubber Ind Ltd Semiconductive roll
JPH02289880A (en) * 1989-04-28 1990-11-29 Nec Niigata Ltd Fixing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013195667A (en) * 2012-03-19 2013-09-30 Bridgestone Corp Oa roller
JP2014170046A (en) * 2013-03-01 2014-09-18 Ricoh Co Ltd Developing device, process unit, and image forming apparatus
US20150023698A1 (en) * 2013-07-22 2015-01-22 Kyocera Document Solutions Inc. Conductive roller and image forming apparatus having the same
US9188898B2 (en) 2013-07-22 2015-11-17 Kyocera Document Solutions Inc. Conductive roller and image forming apparatus having the same

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