JPH06278779A - Method for packing printed board block - Google Patents

Abstract

PURPOSE:To inexpensively transport a printed board block which is very sensitive to static electricity and mechanical impact without damaging the block by interposing a positioning guide pad on a peripheral rim of the printed board block held between upper and lower antistatic cushions. CONSTITUTION:A guide pad 4 completed with assembly comprises a rectangular frame with a hole 41 shaped in a parallelepipe or the like of an approximate size of a printed board block P at the center and is made into a size just to be inserted into a packing box 3. A lower antistatic cushion 1 and an upper antistatic cushion 2 are made into a size which can be just inserted into the rectangular hole 41 respectively. After the guide pad 4 is inserted into the packing box 3, the printed board block P is inserted into the rectangular hole 41 while being interposed between the upper and lower antistatic cushions 1, 2 and sealed by a sealing lid 31. Therefore even if the printed board P is subjected to acceleration in a direction of the interposing faces, only a peripheral rim comes into contact with the guide pad 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packing a printed wiring board block in which various electronic parts are mounted and which is averse to static electricity and mechanical shock.

[0002]

2. Description of the Related Art A printed wiring board block manufactured by mounting various electronic components on a printed wiring board is extremely disliked by static electricity and mechanical shock. Therefore, in the case of transporting such a printed wiring board block, conventionally, a packing method as shown in FIG. 3 has been adopted.

By the way, in FIG. 3, 1 is a lower antistatic cushion, 2 is an upper antistatic cushion, 3 is a packaging box, and P is a printed wiring board block. The lower antistatic cushion 1 is formed by forming a sponge-like material having conductivity into a rectangular thick plate shape, and is provided with a sandwiching surface on which corrugated unevenness is formed. The upper antistatic cushion 2 is made of the same material and has substantially the same shape and size as the above-described lower antistatic cushion 1, and is provided with a sandwiching surface having wavy irregularities formed below. The lower antistatic cushion 1 and the upper antistatic cushion 2 are wider than the vertical and horizontal lengths of the printed wiring board block P in plan view. The reason for this is to prevent the peripheral edge of the printed wiring board block P from coming into direct contact with the packaging box 3 as much as possible, even if the printed wiring board block P slips and causes some displacement.

The packaging box 3 is formed by bending and joining corrugated cardboard paper that has been appropriately cut into a box shape, and the packaging box 3 also includes a sealing lid 31 for sealing. The packing box 3 is sized so that the lower antistatic cushion 1 and the upper antistatic cushion 2 sandwiching the printed wiring board block P between the sandwiching surfaces can be just accommodated.
Further, the printed wiring board block P is wrapped in a thin antistatic bag (not shown) so that dust or the like does not adhere to it.

That is, in the conventional method of packing a printed wiring board block, as shown in FIG. 3, a printed wiring board block P wrapped in an antistatic bag (not shown) is provided with a lower antistatic cushion 1 and an upper antistatic charge. It is sandwiched by the cushion 2 and then stored in the packing box 3. That is, in this conventional method for packing a printed wiring board block, the printed wiring board block P is placed substantially at the center of the holding surface of the lower antistatic cushion 1 and the holding surface of the upper antistatic cushion 2 is placed from above. The printed wiring board block P is pressed and held in the packing box 3 so as to be sandwiched therebetween.

However, since the antistatic cushion is made of a material such as sponge, the printed wiring board block P is slipped by the inertial force of the sandwiched product when an acceleration in the lateral direction (direction of the sandwiching surface) is applied during transportation. The position is likely to be displaced, and the side surface of the packaging box 3 is likely to come into direct contact.

[0007]

Therefore, in the conventional method of packing a printed wiring board block, the printed wiring board block is displaced due to vibration during transportation, and many very expensive antistatic cushions are used. However, there is a problem in that the printed wiring board block is damaged due to the impact applied to the peripheral edge of the printed wiring board block when the packaging box is dropped while it is being used.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to inexpensively transport a printed wiring board block which is extremely disliked by static electricity and mechanical shock without damage. To provide various packing methods.

[0009]

In order to solve the above problems, the present invention holds a printed wiring board block on which various electronic parts are mounted by a lower antistatic cushion and an upper antistatic cushion to form a packing box. In a packaging method of a printed wiring board block adapted to be housed, between a peripheral edge of the printed wiring board block sandwiched between the lower antistatic cushion and the upper antistatic cushion and an inner peripheral side surface of the packaging box, A guide pad for positioning the printed wiring board block is interposed.

[0010]

With the above-described structure, the printed wiring board block sandwiched between the lower antistatic cushion and the upper antistatic cushion is guided by the peripheral edge of the printed wiring board block even when subjected to acceleration in the direction of the sandwiching surface. It only contacts the pad, not the packaging box itself. Therefore, the printed wiring board block is not easily damaged.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for packing a printed wiring board block according to the present invention will be described in detail below with reference to FIGS. FIG. 1 is a perspective view showing a method of packing a printed wiring board block, and FIG. 2 is a development view showing a guide pad.

In FIG. 1, 1 is a lower antistatic cushion, 2 is an upper antistatic cushion, 3 is a packaging box, 4 is a guide pad, and P is a printed wiring board block. The printed wiring board block P is wrapped in a thin antistatic bag (not shown). Since the lower antistatic cushion 1, the upper antistatic cushion 2 and the packaging box 3 are substantially the same as the conventional ones, detailed description thereof will be omitted.

The packing method for the printed wiring board block shown in FIG. 1 is different from the conventional packing method in that the guide pad 4 is provided between the peripheral edge of the printed wiring board block P and the inner peripheral side surface of the packing box 3. That is the intervening. The guide pad 4 is formed by folding and assembling a piece of corrugated paper cut into a shape as shown in FIG. In FIG. 2, a solid line indicates a cutting line, a two-dot chain line indicates a bending line, a one-dot chain line indicates a center line, and a hatched portion indicates a cutout hole. Further, in FIGS. 1 and 2, a _1, ..., A ₁₃ respectively indicate the surface elements of the guide pad 4.

The guide pad 4 shown in FIG. 2 is bent and assembled as follows to form the guide pad 4 as shown in FIG. That is, for the surface element a ₁ , the surface elements a _2, a _{2,
a 3, a 3, a 8} , a 8, a 10, bent at a right angle a ₁₂ to the rear, respectively. After that, the surface element a ₄ is at a right angle rearward with respect to the surface element a ₃ , the surface element a ₅ is at a right angle rearward with respect to the surface element a ₄ , and the surface element a ₆ is rearward relative to the surface element a ₅ . Fold it in order at right angles. Then, the surface element a ₆ overlaps with the surface element a ₁ . In addition, the surface element a ₁₁ is bent rearward at a right angle to the surface element a ₁₀ ,
The tip of ₁₁ is brought into contact with the tip of the surface element a ₂ . In addition, the surface element a ₁₃
Is bent rearward at a right angle to the surface element a ₁₂ , and the tip of the surface element a ₁₃ is brought into contact with the tip of the surface element a ₂ . Further, while inserted into the cut-out hole portion provided to the distal end portion of the surface elements a ₉ while bent at a right angle to the rear in the surface elements a ₅ to surface elements a ₉ against surface elements a _8, the surface elements a ₅ The small protrusion protruding into the cutout hole is inserted into the cutout hole provided in the surface element a ₉ . Then, the guide pad 4 as shown in FIG. 1 is completed.

The assembled guide pad 4 is in the shape of a square frame with a rectangular cylindrical hole 41 in the center, which is approximately the same size as the printed wiring board block P, is open. The guide pad 4, which has a rectangular frame shape,
It is sized so that it can be inserted into the packing box 3. The lower antistatic cushion 1 and the upper antistatic cushion 2 are each sized so that they can be inserted into the rectangular cylindrical hole 41 formed in the center of the guide pad 4.

Therefore, the printed wiring board block P is
It is packed in the packing box 3 as follows. That is, the guide pad 4 assembled as described above is inserted into the packaging box 3. Then, while sandwiching the printed wiring board block P between the sandwiching surfaces of the lower antistatic cushion 1 and the upper antistatic cushion 2 having the corrugated unevenness, the guide pad 4 is held.
It is inserted into the rectangular tubular hole 41 that is open in the center of the. then,
Surface elements 31 _a, 31 _b, 31 _b, 31 connected to the sealing lid 31
_{The c and} 31 _c are inserted between the packing box 3 and the guide pad 4 to seal the packing box 3.

In the packing box 3 in which the printed wiring board block P is housed and sealed by the above-mentioned method, the acceleration in the direction of the sandwiching surface between the lower antistatic cushion 1 and the upper antistatic cushion 2 is increased during transportation. Even if the printed wiring board block P slips due to the addition, the peripheral edge of the printed wiring board block P has four surface elements a _8, a _8, a of the guide pad 4.
_It only makes contact with _10, a ₁₂ and does not directly make contact with the side surface of the packaging box 3. Therefore, the volume of the lower antistatic cushion 1 and the upper antistatic cushion 2 (the amount of use of the antistatic cushion) made of an expensive material is reduced, and moreover,
Printed wiring board block P that dislikes static electricity and mechanical shock
Can be safely transported without damage.

[0018]

Since the method of packing a printed wiring board block according to the present invention is as described above, the volume of the lower antistatic cushion and the upper antistatic cushion (use of the antistatic cushion are made of expensive materials. Therefore, it is possible to provide an excellent method for packing a printed wiring board block, in which the printed wiring board block, which is less susceptible to static electricity and mechanical shock, can be transported inexpensively and without damage.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a method for packing a printed wiring board block according to the present invention.

FIG. 2 is a development view showing an embodiment of a guide pad used in the packing method.

FIG. 3 is a perspective view showing a conventional method for packing a printed wiring board block.

[Explanation of symbols]

 1 Lower antistatic cushion 2 Upper antistatic cushion 3 Packing box 4 Guide pad P Printed wiring board block

Claims (1)

[Claims] 1. A method of packing a printed wiring board block, wherein a printed wiring board block on which various electronic components are mounted is sandwiched by a lower antistatic cushion and an upper antistatic cushion and housed in a packing box. A guide pad for positioning the printed wiring board block is interposed between the peripheral edge of the printed wiring board block sandwiched between the antistatic cushion and the upper antistatic cushion and the inner peripheral side surface of the packaging box. A method for packing a printed wiring board block, comprising: