JPH06275683A - Tab tape - Google Patents

Abstract

PURPOSE:To hold reliably the interval between insulating films, on which both of overlapped first embosses are respectively formed, even if the first embosses are overlapped with each other in the overlapping fellow insulating films. CONSTITUTION:A multitude of through holes 13 are bored in an insulating film 12 of a continuous length at a constant pitch and inner leads 14 formed by making a conductive pattern provide extendedly in each through hole 13 and a semiconductor pellet 15 arranged in each through hole 13 are electrically connected to each other by thermal pressure bonding. In a TAB tape 11 made to arranged with first embosses 18 at a fine pitch along both side edges of the film 12, second embosses 19 are formed on the regions (a) of both side edges, where each through hole 13 is positioned, of the film 12 separately from the embosses 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape, and more particularly, it is used for manufacturing a TAB type semiconductor device and has a long insulating film formed with a large number of semiconductor pellets arranged at a constant pitch. Regarding tape.

[0002]

2. Description of the Related Art For example, a TAB type semiconductor device such as a TAB IC is generally manufactured from a long TAB tape.

This TAB tape (1) is shown in FIG. 8 and FIG.
As shown in Fig. 4, a large number of through holes (3) are formed in the long insulating film (2) at a constant pitch (relatively large pitch), and the conductive pattern adhered onto the insulating film (2) is formed through holes ( 3) A structure in which the tip of the inner lead (4) extending in the inside and the bump electrode (6) of the semiconductor pellet (5) arranged in the through hole (3) are electrically connected by thermocompression bonding. Have. Further, feeding holes (7) for transportation are formed at a constant pitch on both side edges along the longitudinal direction of the insulating film (2), and the insulating film (2) is provided outside the feeding holes (7). ), Embossing (8) [hereinafter referred to as first embossing] is arranged at a minute pitch.

The purpose of the TAB tape (1) is to prevent a short circuit from occurring due to contact between the tip of the inner lead (4) and the edge of the semiconductor pellet (5) due to external impact. Then, the inner lead (4) is formed as shown in the drawing so that the tip of the inner lead (4) and the edge portion of the semiconductor pellet (5) are separated from each other. As a result, the semiconductor pellet (5) is in a state of protruding from the insulating film (2) on the opposite side of the inner lead (4).

In the manufacture of this type of semiconductor device, a long T
When handling the AB tape (1), it is usual to store and ship the TAB tape (1) wound on a reel or the like as shown in FIGS.
As described above, since the semiconductor pellets (5) are in a state of projecting more than the insulating film (2), the semiconductor pellets (5) are wound between the wound insulating films (2).
The lead will be deformed by coming into contact with the overlapping insulating films (2).

Then, in order to solve this problem, the above-mentioned first embossing (8) functions. That is, this first
Since the embossing (8) of the semiconductor pellet (5) has a protruding dimension larger than that of the insulating film (2) of the semiconductor pellet (5), the embossing (8) of the The embossing (8) functions as a spacer and holds the space between the insulating films (2) so that the semiconductor pellets (5) do not abut.

[0007]

By the way, when the TAB tape (1) is wound on a reel or the like, the first embossment (8) functions as a spacer between the insulating films (2) which are overlapped with each other. By keeping the spacing,
The semiconductor pellets (5) come into contact with the overlapping insulating films (2) to prevent lead deformation.

However, especially when the TAB tape (1) is wound many times, the first embossments (8) are arranged at a comparatively small pitch, so that the insulating films (2) that overlap each other form the first embossment (8). The embossing (8) may be aligned and overlap. When the first embossments (8) are vertically overlapped with each other in this way, the distance between the insulating films (2) cannot be maintained, the semiconductor pellet (5) contacts the insulating film (2), and lead deformation occurs. In particular, when the first embossments (8) on both side edges where the semiconductor pellet (5) is located overlaps, there is a problem that the lead deformation is surely caused.

Therefore, the present invention has been proposed in view of the above problems, and an object of the present invention is to ensure the distance between both insulating films even if the first embosses overlap each other. It is to provide a TAB tape that can be held.

[0010]

As a technical means for achieving the above object, the present invention is to form a large number of through holes at a constant pitch in a long insulating film and to form a conductive pattern in each through hole. Inner leads formed by extending the, and the semiconductor pellets arranged in the through holes are electrically connected by thermocompression bonding,
In the TAB tape in which the first embossments are arranged along the both side edges of the insulating film at a fine pitch, the second emboss is formed in the regions of the both side edges where the through holes of the insulating film are located. .

The second embossing has a directional shape, and the second embossing is arranged so that the direction of the second embossing is different at a predetermined pitch, or the second embossing is arranged along the longitudinal direction of the insulating film. It is desirable to arrange so that the position in the width direction is different.

[0012]

In the TAB tape according to the present invention, when the TAB tape is wound by forming the second embossing separately from the first embossing in the regions of both side edges where the through holes of the insulating film are located, Even when the first embosses are overlapped between the overlapping insulating films, the second embossing functions as a spacer that can reliably maintain the distance between the overlapping insulating films.

[0013]

EXAMPLE An example of the TAB tape according to the present invention will be described with reference to FIGS.

The TAB tape (11) of the present invention has a long insulating film (1) as shown in FIGS.
2) A large number of through holes (1
Inner leads (14) in which the conductive pattern adhered on the insulating film (12) is extended into the through holes (13) by drilling 3).
Has a structure in which the tip of the inner lead (14) and the bump electrode (16) of the semiconductor pellet (15) arranged in the through hole (13) are electrically connected by thermocompression bonding. For the purpose of preventing the occurrence of a short circuit failure due to contact with the edge part of (15) due to external impact or the like, by forming the inner lead (14) as shown in the figure, the tip of the inner lead (14) is The edge portion of the semiconductor pellet (15) is separated from the edge portion of the semiconductor pellet (15) so that the semiconductor pellet (15) projects to the opposite side of the inner lead (14) from the insulating film (12). It should be noted that feed holes (17) for transport are formed at a constant pitch on both side edges along the longitudinal direction of the insulating film (12), and both sides of the insulating film (12) are outside the feed holes (17). The first embossments (18) are arranged along the edge at a fine pitch.

The feature of the present invention lies in this TAB.
The second embossment (19) is formed on the tape (11) at least in the regions (a) on both side edges of the insulating film (12) where the through holes (13) are located. This second emboss (1
9) is provided inside the first embossing (18),
The semiconductor pellet (15) is formed so as to protrude on the side opposite to that on which the semiconductor pellet (15) protrudes, that is, in the same direction as the first embossing (18). ) Is set to be larger than the protruding size.

When the TAB tape (11) is wound on a reel or the like for storage and shipping, the TA
In the B tape (11), the first and second embossments (18) and (19) of the insulating film (12) function as spacers by contacting the surfaces of the overlapping insulating films (12) as shown in FIG. Insulating and overlapping insulation films (12)
The distance between them is maintained so that the semiconductor pellets (15) do not come into contact with each other.

As described above, since the first embossments (18) are arranged at a relatively fine pitch, especially when the TAB tape (11) is wound many times, the insulating films (12) that overlap each other are formed. Even if the first embossing (18) overlaps with each other at the same position, the first embossing (1
By forming the second embossment (19) in addition to 8), the second embossment (19) functions as a spacer that can reliably hold the interval between the insulating films (12) that overlap each other.

Here, the second embossment (19) is formed on both side edge regions (a) where the through holes (13) of the insulating film (12) are located.
Since the semiconductor pellets (15) in the region (a) in which the second embossment (19) is located are arranged at a relatively large pitch, the second insulating film (12) is formed in the overlapping insulating film (12). The embossments (19) do not overlap each other.

That is, when M rotations are performed from the beginning of winding the TAB tape (11) around the reel to the m-th semiconductor pellet (15), the n-th [n> m] semiconductor pellet (15) ), If the two semiconductor pellets (15) are overlapped by the overlapping insulating films (12), the rotation is [M + 1] until the n-th semiconductor pellet (15) is reached. Therefore, the insulating film (1) wound up before reaching the n-th semiconductor pellet (15)
The difference between the length of 2) and the length of the insulating film (12) wound up to reach the m-th semiconductor pellet (15) is determined by the pitch interval of the semiconductor pellet (15) in the insulating film (12). If the divided value is an integer, both semiconductor pellets (15) will overlap.

Therefore, various conditions such as the pitch interval of the semiconductor pellets (15), the protruding height of the second embossment (19) and the winding core diameter of the reel are set to appropriate values so that the divided value is not an integer. . Thus, if the divided value is not an integer, the semiconductor pellets (15) do not always overlap, and if the semiconductor pellets (15) do not overlap, the second embossments (19) do not overlap.

In the above embodiment, the second embossing (1
The case where 9) has a circular shape and is provided at the same position in the width direction of the insulating film (12) has been described. A certain shape, for example, an elliptical shape as shown in FIGS. 4 and 5, is arranged so that the directions of the second embossments (19 ′) are different from each other in a predetermined pattern. Further, as another means, for example, as shown in FIGS. 6 and 7, the second embossment (19 ″) may be varied in its width direction position along the longitudinal direction of the insulating film (12). You may arrange.

[0022]

According to the present invention, since the second embossing is formed in addition to the first embossing in the regions of both side edges where the through holes of the insulating film are located, when the TAB tapes are wound, they overlap each other. Even if the first embossing overlaps between the insulating films, the second embossing functions as a spacer that can reliably hold the distance between the overlapping insulating films, so that defects such as lead deformation can be prevented, and reliability is improved. Significantly improved.

[Brief description of drawings]

FIG. 1 is a partial plan view showing an embodiment of a TAB tape according to the present invention.

FIG. 2 is a sectional view of the TAB tape shown in FIG.

3 is a cross-sectional view showing a state in which the TAB tape shown in FIG. 2 is wound around a reel or the like and overlapped with each other.

FIG. 4 is a partial plan view showing a case where the TAB tape of the present invention has an oval embossing shape.

5 is a cross-sectional view of the TAB tape of FIG.

FIG. 6 is a partial plan view showing a case where embossed positions are changed in the TAB tape of the present invention.

7 is a sectional view of the TAB tape of FIG.

FIG. 8 is a partial plan view showing a conventional example of a TAB tape.

9 is a cross-sectional view of the TAB tape of FIG.

FIG. 10 is a schematic diagram showing a state in which a conventional TAB tape is wound around a reel or the like.

FIG. 11 is a cross-sectional view showing a state in which a conventional TAB tape is wound together with an interlayer tape on a reel or the like and overlapped.

[Explanation of symbols]

 11 TAB tape 12 Insulating film 13 Through hole 14 Inner lead 15 Semiconductor pellet 18 First embossing 19 Second embossing

Claims (3)

[Claims] 1. An inner lead formed by forming a large number of through holes in a long insulating film at a constant pitch, and extending a conductive pattern in each through hole, and a semiconductor pellet arranged in the through hole. In the TAB tape in which the first embossments are arranged along the both side edges of the insulating film at a fine pitch along the two side edges of the insulating film. The TAB tape is characterized in that the embossing is formed. 2. The TAB tape according to claim 1, wherein the second embossing has a directional shape, and the direction of the second embossing is different at a predetermined pitch. 3. A TAB tape, wherein the second embossment according to claim 1 has different positions in the width direction along the longitudinal direction of the insulating film.