JPH06275049A - Manufacture of magnetic recorder - Google Patents

Abstract

PURPOSE:To provide the manufacture of magnetic recorder so as to easily actualize a high-reliability magnetic recorder concerning the manufacture of magnetic recorder for which a magnetic recording medium, head and driving mechanism or the like are integrally provided on a substrate. CONSTITUTION:A magnetic recording medium 19, head 20 and driving mechanisms 22, 23, 24, 25 and 17b or the like are formed on two substrates or more while being divided. Then, the substrates are integrated so that the magnetic recording medium 19, head 20 and driving mechanisms 22, 23, 24, 25 and 17b can be set in prescribed position relation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic recording device, and more particularly, to a magnetic recording medium, a head,
The present invention relates to a method for manufacturing a magnetic recording device integrally provided with a drive mechanism and the like.

[0002]

2. Description of the Related Art Heretofore, the applicant of the present application has disclosed a magnetic recording apparatus, in which a magnetic recording medium, a head, a driving mechanism and the like are integrally provided on a substrate, for downsizing, for example, Japanese Patent Application No. 3-23843.
9, 4-135255, 4-141563, 4-144
Proposed in 533. The basic structure of this magnetic recording device is shown in FIG. In FIG. 9, a plate-shaped magnetic recording medium 2 is provided on a substrate 1 slidably in the longitudinal direction of the substrate 1. Further, the support arm 4 is the drive unit 5
The magnetic head 3 is mounted on the substrate 1 via the magnetic recording medium 2 so as to face the magnetic recording medium 2. The drive unit 5 drives the support arm 4 so that the magnetic head 3 vibrates with a predetermined amplitude in a plane parallel to the surface of the magnetic recording medium 2.

In such a magnetic recording apparatus, the magnetic recording medium 2 is moved relative to the magnetic head 3 by vibrating the magnetic head 3 in a plane parallel to the surface of the magnetic recording medium 2. While the magnetic recording medium 2 is moving relative to the magnetic head 3, information is recorded on and reproduced from the magnetic recording medium 2 via the magnetic head 3. That is, recording and reproduction of information on the magnetic recording medium 2 can be performed without rotating the magnetic recording medium 2.

In an actual magnetic recording device, the magnetic recording medium 2 is moved in the longitudinal direction of the substrate 1 and the drive unit 5 is moved in a direction perpendicular to the longitudinal direction of the substrate 1, so that the magnetic recording medium 2 is arbitrarily moved. Information can be recorded and reproduced at the position. FIG. 10 shows an appearance example of an actual magnetic recording device. 10, this magnetic recording device 11 is a recording unit 1 having the basic structure shown in FIG.
Equipped with 3. The recording unit 13 is housed in a recess 12a formed in the plastic case 12.
The magnetic recording device 11 also includes a circuit unit including a drive control circuit 14 for controlling the recording unit 13 and a processing circuit 15 for processing signals such as read and write signals. This circuit unit is stored in a recess 12b formed in the case 12. The groove 12c has two recesses 1
The case 12 is formed so as to connect 2a and 12b, and the terminal of the circuit unit and the terminal of the recording unit 13 are connected by a wire 16 passing through the groove 12c. The recesses 12a and 12b and the groove 12c are actually covered with a lid (not shown) so that the circuit unit and the recording unit 13 are magnetically and electrically shielded. A plurality of pins 18 project from the case 12, and predetermined terminals of the circuit unit and the pins 18 are connected by wires inside the case. This magnetic recording device 11 can be directly bonded to a printed circuit board. The case 12 has a size that is almost the same as or slightly larger than that of a normal DRAM.

[0005]

Although no specific manufacturing method of the above magnetic recording device has been proposed, considering that this magnetic recording device is about the size of an ordinary DRAM, Incorporating a head, a head drive mechanism, a medium moving mechanism, and the like on a single substrate complicates the process and increases the number of steps. Therefore, it is difficult to increase the yield.

[0006]

According to the present invention, there is provided a plate-shaped recording medium (19) for recording information, and a recording medium (19).
Medium drive mechanism (17b, 24) for moving the disk in a predetermined manner
A magnetic head element (20) and a magnetic head element (2
0) in a predetermined manner to move the head drive mechanism (21, 2,
2, 23, 25) and at least the medium drive mechanism (17b, 24) and the head drive mechanism (21, 22, 2).
3, 25) positions the magnetic head element (20) at a specified position on the recording medium (19),
0) and the recording medium (19) are relatively moved,
In order to solve the above problems, in a magnetic recording device which records or reproduces information on a recording medium (19) via a magnetic head element (20), two or more substrates (190, 17, 40) are provided. The recording medium (19),
Medium drive mechanism (17b, 24), magnetic head element (2
0), the head drive mechanism (21, 22, 23, 25) is divided and formed, and the recording medium (19), medium drive mechanism (17b, 24), magnetic head element (20), head drive mechanism (21). , 22, 23, 25) are integrated so that the substrates (190, 17, 40) have a predetermined positional relationship.

[0007]

Operation: Recording medium (19), medium drive mechanism (17b, 2)
4), magnetic head element (20), head drive mechanism (2
1, 22, 23, 25) are divided and formed on two or more substrates. Therefore, the manufacturing process on each substrate is facilitated. As a result, the manufacturing process as a whole becomes easy.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an outline of a method of manufacturing a magnetic recording device according to an embodiment of the present invention. In FIG. 1, a head substrate chip is patterned on a head assembly wafer 200. A head 20, a head moving mechanism 21, a part of the drive, a signal processing circuit and the like are formed on this chip. The chips of the media substrate are patterned on the media assembly wafer 210. A recess 17 is formed on this chip.
A medium substrate 17 having b, a magnetic recording plate 19 slidably fitted in the recess 17b, and a part of the drive and signal processing circuits are formed. As described above, the head assembly wafer 200 on which the chips of the head substrate are formed and the medium assembly wafer 210 on which the chips of the medium substrate are formed are bonded so that the respective chips face each other. And
Chips are cut out from the joined head assembly and medium assembly wafers 200 and 210 as recording units. Then, the cut-out recording unit 13 is stored in the package 12, and the magnetic recording device 11 is completed.

The detailed structure of the recording unit is as shown in FIG. In FIG. 2, the recording unit 1
Reference numeral 3 denotes a substrate 17, a magnetic recording plate 19 and a head support mechanism 2
It consists of 1. The length of the substrate 17 in the X-direction is about 10
mm, the length in the Y-direction is about 12 mm, and the thickness is about 2 mm. A rectangular recess 17b is formed in the center of the surface 17a of the substrate 17. The magnetic recording plate 19
It is fitted in the recess 17b so as to be slidable in the Y-direction by being guided by the longitudinal edge of the recess 17b. The magnetic recording plate 19 is formed by forming a plurality of rectangular areas coated with a magnetic film on a substrate. This rectangular area is called a data cell 18. The data cells 18 are arranged on the magnetic recording plate 19 in a matrix. A plurality of recording tracks are formed in each data cell 18 in a substantially arcuate shape at predetermined intervals.

A stator is formed on the bottom surface of the recess 17b of the substrate 17, and a mover is formed on the back surface of the magnetic recording plate 19.
With the magnetic recording plate 19 fitted in the recess 17b, the stator and the mover face each other to form the Y-direction electrostatic actuator 24. The detailed structure of the electrostatic actuator 24 is disclosed in Japanese Patent Application No. 3-507027. The Y-direction electrostatic actuator 24 enables the magnetic recording plate 19 to reciprocate in the Y-direction within the recess 17b of the substrate 17.

The head moving mechanism 21 has a support for supporting the head 21, and this support is a horizontal frame 21.
e, the arms 21c and 21d, and the arms 21c and 21d composed of the support arms 21f extend from both ends of the horizontal frame 21e in a direction substantially perpendicular to the horizontal frame 21e. The support arm 21f extends from a substantially central portion of the horizontal frame 21e in a direction substantially perpendicular to the horizontal frame 21e. The end plates 21a and 21b are arm 21c and
It is formed at the end of 21d. These end plates 21a, 2
1b is fixed to the substrate 17 and the arms 21c and 21d and the support arm 21f are parallel to the longitudinal edge of the recess 17b, and the support arm 21f is further positioned on the recess 17b. At the tip of the support arm 21f, the MR
A magnetic head 20 such as a head or a thin film head is attached. Slits 21h and 21i are provided in the arms 21c and 2 respectively to facilitate bending of the arms 21c and 21d in the X-direction.
It is formed in 1d. A slit 21j is formed in the support arm 21f to facilitate bending of the support arm 21f with respect to the horizontal frame 21e.

The magnetic head 20 may be in contact with the surface of the magnetic recording plate 19 or may be levitated by about 0.1 μm.

The support arm 21f is divided into a first support arm and a second support arm by a slit 21j. The first and second support arms have piezoelectric elements 22, respectively.
23 is attached. The piezoelectric elements 22 and 23 can be composed of thin film piezoelectric elements, piezoelectric ceramics, ZnO, PZT and the like. When an AC voltage is applied to each of the piezoelectric elements 22 and 23, the piezoelectric elements 22 and 23 respectively expand and contract in synchronization with the frequency of the AC voltage. Therefore, the piezoelectric element 2
If the phases of the AC voltage supplied to 2 and 23 are reversed, the piezoelectric elements 22 and 23 repeat expansion and contraction alternately.
As a result, the support arm 21f vibrates in a plane horizontal to the surface of the magnetic recording plate 19. That is, the vibration of the support arm causes the magnetic head 20 to move relative to the magnetic recording plate 19.

A stator is formed on the substrate 17, and a mover is formed on the rear surface of the horizontal frame 21e so as to face the stator. With these stators and movers, X
A negative direction electrostatic actuator 25 is configured. This X-
By the direction electrostatic actuator 25, the arms 21c, 2
1d is bent in the X-direction, and the lateral frame 21e can reciprocate in the X-direction. That is, the magnetic head 20 can move on the magnetic recording plate 19 in the X-direction.

In the recording unit 13 as described above, Y
The magnetic recording plate 19 is moved to the Y direction by the − direction electrostatic actuator 24.
By moving in the − direction and moving the magnetic head 20 in the X-direction by the X-direction electrostatic actuator 25, the magnetic head 20 is positioned on the designated data cell 18. Then, while the magnetic head 20 is vibrated by the piezoelectric elements 22 and 23, recording / reproducing of data to / from the data cell 18 is performed via the magnetic head.

FIG. 3 is a block diagram showing a manufacturing process of the magnetic recording device as described above.

In FIG. 3, the head assembly wafer 200 is manufactured by the process P ₁₁ for manufacturing the head moving mechanism 21 and the process P _{12 for} manufacturing the head 20. The medium assembly wafer 210 is manufactured by the process P ₂₂ of forming the medium moving mechanism and the process P ₂₁ of forming the magnetic recording plate 19. Then, the head assembly wafer 200
The recording medium 13 and the medium assembly wafer 210 are joined and then cut into chips to form a recording unit 13 as shown in FIG. 2, and the recording unit 13 and the circuit unit created in step P ₃ are stored in the case 12. , Between them are connected. As a result, the magnetic recording device 11 shown in FIG.
Is completed.

The step P ₁₁ for manufacturing the head moving mechanism 21 is performed as shown in FIG. Note that FIG. 4 shows a cross section taken along the line AA in FIG.

The sacrificial layer 5 is formed on the silicon wafer substrate 40.
A film of 0 is formed (1). Since this sacrifice layer is etched later, a film of silicon oxide (SiO ₂ ) or the like is desirable.

A structural layer 52 such as a sputtered alumina film or a polysilicon film is formed on the sacrificial layer 50 (2). The structural layer 52 needs to be lightweight and highly rigid. Since the sputtered alumina film is an insulating film, it is preferable in that the conductive film can be directly formed on the structure layer 52.

The structural layer 52 is patterned and ion-etched, and the arms 21c and 21d, the support arm 21f,
The horizontal frame 21e and the end plates 21a and 21b are formed (3). Film formation and patterning on the mover side of the X-direction electrostatic actuator 25 are performed on the structure layer 52 etched into the shape of an arm or the like (4). This allows the mover 25
b is formed on the structural layer 52. The details of the method of manufacturing the X-direction electrostatic actuator 25 are disclosed in Japanese Patent Application No. 3-507027 as described above.

A piezo beam (support arm 21f) is formed in the structural layer 52 (5). This piezo beam is manufactured as follows. First, the piezoelectric layer 22 in the structural layer 52
Etch the area to be provided. The electrode (Au or Pt) and the piezoelectric layer 2 are formed in the region formed by the etching.
2. The electrodes are laminated in this order. An insulating layer of the same quality as the structural layer 52 (a sputtered alumina film) is formed thereon, and the insulating layer and the structural layer are etched so that the upper and lower electrodes are exposed.
The etchings used here are all ion etchings. The electrodes can be formed by depositing gold or platinum. Further, the piezoelectric layer 22 can be formed of a PZT (lead zirconate titanate) film. Piezoelectric film 2
No. 2 is 50 after spin coating by the sol-gel method.
It is formed by performing sintering at 0 ° C. or higher. The piezoelectric film 22 can also be formed by high-temperature sputtering a metal target in an oxygen atmosphere.

After forming the piezoelectric film 22, wiring, terminals 55, etc. are formed on the silicon wafer substrate 40 (6). A power supply line for supplying a voltage and a signal line for transmitting a head signal are formed on the piezoelectric film 22 of the piezo beam by depositing copper (Cu) or gold (Au) by vacuum deposition and then etching. Similarly, the terminal 55 is also produced through the process of film formation and etching. The signal line is preferably made of gold (Au) to reduce the resistance value and to prevent oxidation.

The head 20 is bonded to the tip of the piezo beam with, for example, an epoxy adhesive (7). This head 20 is manufactured on another wafer by a known method. After the head 20 is bonded to the tip of the piezo beam, the output terminal of the head 20 and the terminal of the tip of the piezo beam are connected by gold wire bonding. Through the above processing, the head 20 is fixed to the tip of the piezo beam (support arm 21f) as shown in FIGS. 5 (a) and 5 (b). Figure 5
In (b), the signal line layer 54 is formed on the piezo beam (structure layer 52), and this signal line layer 54 is the head 2
0 signal line.

Next, the silicon wafer substrate 40 is immersed in a KOH aqueous solution, and KOH etching is performed while leaving the arms, terminals and four-sided frame portions (8). This is done to facilitate later alignment during bonding with the media assembly wafer 210. Alternatively, a mark for alignment may be formed and only the mark may be etched. In this case, the rigidity of the chip is improved.

Finally, the sacrificial layer 50 is etched (9) except at the base of the beam so that the piezo beam can move. The sacrificial layer 50 can be etched at any time, but preferably after the head 20 is bonded. This is because when the head 20 is bonded to the piezo beam after the sacrifice layer 50 is etched, the pressure of the bonding may damage the piezo beam in the movable state.

The head assembly wafer 200 is manufactured as described above. In addition, each film thickness is the structure layer 52.
Is about 30 μm, the signal line is about 1 to 2 μm, and the piezoelectric film 22
Is about 20 μm and the sacrificial layer 50 is about several μm.

The medium assembly wafer 210 is manufactured according to the process shown in FIG. 6 (process P ₂₂ described above). Note that FIG. 6 shows a cross section taken along line BB in FIG.

A rectangular recess 17b is formed on the wafer substrate 17 (1). The recess 17b is formed by ion trimming or KOH etching after the resist patterning. The depth of the recess 17b is preferably as small as possible, and is about 10 to 20 μm.

The stator 24a of the Y-direction electrostatic actuator is formed on the bottom surface of the recess 17b (2).

Next, the stator 25a of the X-direction electrostatic actuator 25 is formed on the wafer substrate 17 (3).
A stator 25a of the X-direction electrostatic actuator 25a,
The Y-direction electrostatic actuator 24 is different from the stator 24a only in the extending direction (X-direction, Y-direction), and can be manufactured by the same process.

After the stator 25a of the X-direction electrostatic actuator 25 is formed on the wafer substrate 17, electrodes and wiring patterns 60 are further formed on the wafer substrate 17 (4). Electrodes and wiring patterns are produced by depositing copper (Cu) and gold (Au) on the wafer substrate 17 and patterning them. The pattern thickness is about 1 μm.

After that, a magnetic recording plate 1 prepared separately was used.
9 is a stator 24a of the Y-direction electrostatic actuator 24.
It fits in the recess 17b so that it slides up (5).

The medium assembly wafer 210 is manufactured as described above.

The magnetic recording plate 19 to be fitted in the recess 17b of the wafer substrate 17 is fabricated according to step (step P ₂₁₎ shown in FIG.

A glass substrate 190 (may be a silicon substrate) is prepared (1). Since the weight of the magnetic recording plate 19 affects the required torque of the electrostatic actuator, it is desirable that the magnetic recording plate 19 be as thin as possible (100 μm).
m or less). The thickness of the glass substrate 190 is determined based on the final thickness of the magnetic recording plate 19.

The movable element 24b of the Y-direction electrostatic actuator is formed on the surface of the glass substrate 190 (2), the glass substrate 190 is turned upside down, and the magnetic layer 191 is formed on the back surface by sputtering or the like (3). Since the glass substrate 190 is easily broken, patterning may be performed with the glass substrate 190 adhered on a thick wafer. When the film formation of the magnetic layer 191 is completed, it is cut to a predetermined size so that it can be mounted on each chip on the medium assembly wafer (4).

The head assembly wafer 200 and the medium assembly 210 manufactured as described above are adhered to each other. As shown in FIG. 8, the head assembly wafer 200 is turned upside down and aligned, and then bonded to the medium assembly wafer 210. The bonding location is, for example, the peripheral portion of each chip. The bonding method may be a method of bonding both wafers 200 and 210 with an adhesive, or the Si wafer surfaces of both wafers 200 and 210 may be anodically bonded. Alternatively, a method in which a polyimide film is spin-coded on the medium assembly wafer 210 to pattern and remove the excess portion and then adhered to the head assembly wafer 200 by heat of about 200 ° C. may be used. However, since the head 20 and the magnetic recording plate 19 may be deteriorated by heat, both wafers 20
Adhesion of 0 and 210 is preferably performed at a temperature as low as possible (300 ° C. or lower).

After the head assembly wafer 200 and the medium assembly wafer 210 are bonded together, they are cut into chips to complete the recording unit 13 as shown in FIG. On the other hand, in step P ₃ shown in FIG. 3, a circuit unit including a drive circuit, a signal processing circuit, etc. is manufactured. The recording unit 13 and the circuit unit manufactured as described above are housed in the case 12, connected to each other, and then sealed.

In the above-described embodiment, the head 20, the head moving mechanism 21, the magnetic recording plate 19 (medium) and the medium moving mechanism are separately made of four wafers, and the recording unit is made by the process of integrating each of them. It Besides this,
It is also possible to form the head 20 and the head moving mechanism 21 with one wafer, and to form the magnetic recording plate 19 (medium) and the medium moving mechanism with one wafer.

[0042]

As described above, according to the present invention, the number of man-hours required for one wafer is reduced, so that the portion formed on each wafer can be easily manufactured with high reliability. . Therefore, a highly reliable magnetic recording device as a whole can be easily manufactured. Further, since the recording unit is formed of a plurality of wafers, its rigidity is also improved and the durability of the entire magnetic recording device is also improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an outline of a method of manufacturing a magnetic recording device according to the present invention.

FIG. 2 is a diagram showing a structure of a recording unit.

FIG. 3 is a diagram showing a manufacturing process of the magnetic recording device.

FIG. 4 is a diagram showing a process of manufacturing a head assembly wafer.

FIG. 5 is a diagram showing a structure of a portion to which a head is attached.

FIG. 6 is a diagram showing a program for producing a medium assembly wafer.

FIG. 7 is a diagram showing a process of producing a magnetic recording plate (medium).

FIG. 8 is a diagram showing a state in which a head assembly wafer and a medium assembly wafer are bonded together.

FIG. 9 is a diagram showing a basic structure of a magnetic recording device.

FIG. 10 is a diagram showing an example of the appearance of an actual magnetic recording device.

[Explanation of symbols]

 11 magnetic recording device 13 recording unit 19 magnetic recording plate 20 magnetic head 21 head moving mechanism 24 Y-direction electrostatic actuator 25 X-direction electrostatic actuator 220 head assembly wafer 210 medium assembly wafer

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takahiro Imamura 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Masaki Katayama 1015, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited

Claims (7)

[Claims] 1. A plate-shaped recording medium (19) for recording information, a medium driving mechanism (17b, 24) for moving the recording medium (19) in a predetermined manner, and a magnetic head element (2).
0) and a head drive mechanism (21, 22, 23, 25) for moving the magnetic head element (20) in a predetermined manner, and the medium drive mechanism (17b, 24) and the head drive mechanism (21, 22). , 23, 25) position the magnetic head element (20) at a specified position on the recording medium (19) and move the magnetic head element (20) and the recording medium (19) relatively to each other. A method of manufacturing a magnetic recording device, wherein information is recorded on or reproduced from a recording medium (19) via a recording medium (19), the recording medium (19) is provided on two or more substrates (190, 17, 40). Medium drive mechanism (17b, 24) Magnetic head element (20), Head drive mechanism (21, 22, 23, 2)
5) is formed by dividing the recording medium (19) and the medium driving mechanism (17b, 2).
4), magnetic head element (20), head drive mechanism (2
1, 22, 23, 25) and the substrates (190, 17, 40) are integrated so that they have a predetermined positional relationship. 2. The manufacturing method according to claim 1, wherein the recording medium (19), medium driving mechanism (17b, 24), magnetic head element (20), head driving mechanism (21, 22,).
23, 25) are respectively formed on different substrates, and a method of manufacturing a magnetic recording device. 3. The manufacturing method according to claim 2, wherein the substrate (190) of the recording medium (19) is mounted on the first substrate (17) on which the medium driving mechanism (17b, 24) is formed, The second substrate of the magnetic head element (20) is attached to the substrate 40 on which (21, 22, 23, 25) is formed, and the first and second substrates are joined together. Recording device manufacturing method. 4. The manufacturing method according to claim 1, wherein the magnetic head element (20) and the head drive mechanism (21, 22, 22).
23, 25) are formed by a process on one substrate. 5. The manufacturing method according to claim 1, wherein at least the magnetic head element (20) and the head drive mechanism (2).
1, 22, 23, 25) are formed on separate substrates, these substrates are integrated, and then the integrated substrate is integrated with another substrate. Manufacturing method. 6. The manufacturing method according to claim 1, wherein at least the recording medium (19) and the medium driving mechanism (17b, 2).
4) is a method for manufacturing a magnetic recording device, which is characterized in that the substrates are formed on individual substrates, these substrates are integrated, and then the integrated substrate is integrated with another substrate. 7. The manufacturing method according to claim 1, wherein a plurality of first chips made of the substrates of the recording medium (19) and the medium driving mechanism (17b, 24) are provided on the first wafer (20).
0), and the second chip composed of the magnetic head element (20) and the substrate of the head drive mechanism (21, 22, 23, 25) is formed on the plurality of second wafers (210). The wafer (200) and the second wafer (210) are bonded so that the first chip and the second chip face each other. From the bonded first wafer (200) and second wafer (210) A method of manufacturing a magnetic recording device, characterized in that a recording unit chip composed of a first chip and a second chip is cut out.