JPH062679U - Semiconductor material fluid supply device - Google Patents

Abstract

(57) [Summary] [Purpose] Use the gas from the general work piping for semiconductor material gas container (cylinder) replacement and residual gas purge work. [Structure] A buffer tank 11 'is provided as a semiconductor material gas purge, and the tank 11' is filled with a certain amount (pressure less than 10 kg / cm ² ) of an inert gas from a factory pipe 14, and the inert gas is used for purging. To use.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor material fluid supply device (cylinder box), and more particularly to a mechanism for replacing a container inside the device and purging residual gas in a pipe.

[0002]

[Prior art]

 FIG. 2 is a piping system diagram showing a conventional semiconductor material gas supply device.

In FIG. 2, with the main plug 2 of the container (cylinder) 1 closed, the shutoff valve 3 is opened, the pressure reducing valve 4 is passed, and the discharge valve 5 is opened to discharge the residual gas.

After that, the purge gas introduction valve 7 is opened to flow an inert gas (N ₂ gas) from the inert gas cylinder 11 to purge the residual gas in the pipe. At this time, a pressure switch 8, an automatic valve 9 and a backflow prevention valve 10 are provided in the piping system so that the residual gas of the semiconductor material gas does not flow back to the inert gas side.

[0005]

[Problems to be solved by the device]

However, if an N ₂ gas cylinder is used as the inert gas, one or two semiconductor material gas cylinders will be used at a ratio of one inert gas cylinder 11, and the amount of storage will be small in view of the High Pressure Gas Control Law. Increase (except if notified).

Further, there is a method of using piping gas in a factory, but there is a problem of a risk such as occurrence of backflow in the piping system due to an operation error or the like.

An object of the present invention is to provide a semiconductor material fluid supply device that suppresses an increase in the storage amount of an inert gas cylinder.

[0008]

In order to achieve the above object, a semiconductor material fluid supply device according to the present invention has a fluid supply piping system, a purge fluid supply piping system, and a buffer tank. Is a semiconductor material fluid supply device for use in the hazardous fluid utilization facility of, the fluid supply piping system supplies fluid such as semiconductor material gas, and the purge fluid supply piping system supplies the purging fluid to the fluid supply piping. The buffer tank connects the fluid intake port to the factory piping and the fluid intake port to the purge fluid supply piping system so that they can communicate and shut off via the valve mechanism. It temporarily stores low-pressure fluid.

[0009]

[Action]

 As shown in Fig. 1, the piping system of the gas supply system remains the same as before, but instead of the inert gas for purging, an empty container cylinder or a cylinder equivalent product is installed to temporarily store the inert gas in the factory piping and then the piping system. The gas inlet side is closed and the stored inert gas is supplied as purge gas.

[0010]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a piping diagram showing a gas supply device according to an embodiment of the present invention.

In FIG. 1, two pipes L ₁ and L ₂ are connected to the outlet of a main plug 2 attached to a semiconductor material gas cylinder 1.

[0012] piping system L ₁ of the two systems, one of L _2, the shut-off valve 3 in one of the pipeline L _1, a pressure reducing valve 4, the exhaust valve 5 is provided with air valve 6.

In the present invention, the other piping system L ₂ has an inert introduction valve 7, a pressure switch 8, an automatic valve 9 and a check valve 10, and the end of the piping system L ₂ is buffered. It is connected to the gas outlet of the tank 11 '.

Further, a factory pipe 14 is connected to the gas inlet of the buffer tank 11 '. An automatic valve 13 and a pressure switch 12 are mounted between the gas intake of the buffer tank 11 'and the factory piping 14.

Here, the factory piping 14 is laid inside the factory to perform operations such as replacement of the semiconductor material gas that is indirectly involved in the semiconductor device manufacturing process, and the gas flowing inside the factory piping 14 is It is an inert gas, and its pressure value is less than the consumption pressure value of 10 kg / cm ² determined by the High Pressure Gas Control Law.

In the buffer tank 11 ′, an inert gas having a pressure value of 10 kg / cm ² or less is introduced from the factory piping 14 with the inert gas introduction valve 7 closed. When the pressure value in the buffer tank 11 'reaches a value set to less than 10 kg / cm ² , the pressure switch 12 and the automatic valve 13 are actuated to stop the supply of the inert gas from the factory piping 14. It is configured.

In the embodiment, the main valve 2 of the semiconductor material gas cylinder 1 is closed, the shielding valve 3 and the discharge valve 5 are opened, and the residual gas is discharged from the piping system L ₁ through the pressure reducing valve 4.

Next, open a purge gas introduction valve 7, and introduced into the piping system L ₁ through the inert gas in the buffer tank 11 'to the piping system L _2, to purge the inside of the piping system L _1.

At this time, the backflow from the piping system L ₂ into the buffer tank 11 ′ is blocked by the pressure switch 8, the automatic valve 9 and the backflow prevention valve 10.

The reverse flow from the buffer tank 11 ′ to the factory pipe 14 is blocked by the pressure switch 12 and the automatic valve 13.

In the embodiment, N ₂ gas is used as the inert gas, but it is not limited to N ₂ gas. Further, the present invention has an advantage that it can also be used for pumping a chemical solution.

[0022]

[Effect of device]

 As described above, the present invention uses the inert gas in the buffer tank to store the inert gas, which is less than the consumption pressure value determined by the High Pressure Gas Control Law, by introducing it from the factory piping into the buffer tank and temporarily storing it. Since the purging is performed by using the semiconductor material gas cylinder, it is not necessary to use a high-pressure inert gas cylinder in combination with the semiconductor material gas cylinder.

[0023] are the conventional, even by lowering the pressure of an inert gas cylinder to the low pressure of the high pressure in the inert gas cylinder purge gas, but since the internal pressure of the cylinder itself is 150 kg / cm ² gutter cormorants pressure, the increase of its storage volume Notification by the High Pressure Gas Control Law is required.

On the other hand, the present invention uses the inert gas in the factory piping which is necessary for the semiconductor industry. This gas pressure is 10 kg / cm ² or less, and attention is paid to its easy handling and safety, and purging is performed using this gas.

In order to effectively use this low-pressure gas, the present invention has a structure in which the factory piping is temporarily stored in the buffer tank, the buffer tank is shut off from the factory piping, and is supplied as purge gas from the buffer tank. It has the effect that safe work can be performed by taking measures to prevent backflow into the factory piping.

[Brief description of drawings]

FIG. 1 is a piping diagram showing a gas supply device according to an embodiment of the present invention.

FIG. 2 is a piping diagram showing a gas supply device according to a conventional example.

[Explanation of symbols]

 1 semiconductor material gas cylinder 2 main stopper 3 shut-off valve 4 pressure reducing valve 5 discharge valve 6 air supply valve 7 purge gas introduction valve 8 pressure switch 9 automatic valve 10 check valve 11 inert gas cylinder 11 'buffer tank 12 pressure switch 13 automatic valve 14 factory piping

Claims (1)

[Scope of utility model registration request] 1. A semiconductor material fluid supply device having a fluid supply piping system, a purge fluid supply piping system, and a buffer tank for use in a facility for utilizing a harmful fluid such as a semiconductor material gas, wherein the fluid supply piping system is , A fluid such as semiconductor material gas, the purge fluid supply piping system supplies the purging fluid to the fluid supply piping system, and the buffer tank uses the fluid intake port to the factory piping and the fluid intake A semiconductor material fluid supply device, characterized in that the outlet is connected to a purge fluid supply pipe system via a valve mechanism so that they can communicate with each other and can be shut off, to temporarily store a low-pressure fluid in a factory pipe.