JPH0625992Y2 - Shield cap for light receiving module - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] This invention is a shield cap of a light-receiving module covered with a metal case so that noise from other parts does not mix into a photodiode used for an optical sensor. It is about. In particular, when switching channels or volume of TV etc., the position from the TV is as far as possible,
In addition, the present invention relates to a light receiving module configured to be capable of receiving light from a wide angle range.

[Problems to be Solved by Conventional Techniques and Inventions] A shield cap of a light receiving module used in a conventional optical sensor will be described with reference to FIG.
The bare IC 2 and the capacitor are provided at appropriate places on the substrate 1.
3,3. ． ． Is attached, and the photodiode 4 is fixed to the corner. The photodiode 4 senses an incoming light beam and converts it into an electric signal. The capacitors 3,3. ． ． When noise from other components is mixed in, the photodiode 4 may cause abnormal oscillation. In order to prevent this abnormal oscillation, the vicinity of the photodiode 4 is shielded by a metal shield plate 5. However, the work of accurately disposing the shield plate 5 at a predetermined position on the surface of the substrate 1 and soldering it is very troublesome,
Moreover, the space occupied by the shield plate 5 was also large. For this reason, there are drawbacks such that the attachment of the photodiode 4 to the substrate 1 is limited, and a long labor is required for assembling the light receiving module. Further, the main body of the light receiving element is covered with a metal case, an opening is opened at a position corresponding to the light receiving portion of the light receiving element, and the side plate of the case covers the main body of the light receiving element. The shield cap is disclosed in Japanese Utility Model Publication No. 59-23755.

Thus, in the device described in this publication, the light receiving portion of the light receiving element is also housed inside the case, and a large space is provided between the case and the light receiving element. Therefore, the directivity of the light receiving portion is narrow, the case becomes large, and the attachment to the substrate is limited. Therefore, there arise technical problems that must be solved to overcome these deficiencies.

[Means for Solving the Problems] The present invention has been proposed in view of the above problems and has been proposed as a solution to the problems. A metal case for encasing the body of a photodiode is provided. A hemisphere of the photodiode in a shield cap of a light receiving module which is formed by opening an opening at a position corresponding to the light receiving portion of the photodiode and further covering the body of the photodiode with a side plate of the case. A light-receiving portion of the shape is projected outward from the opening formed in the case, and the photodiode is covered with the case while the photodiode is in close contact with the upper plate and left and right side plates of the case. The shield cap of the light receiving module, which is characterized in that Is intended to be provided.

[Operation] According to the present invention, the light-receiving portion of the photodiode is inserted into the opening formed in the metal case so that the light-receiving portion projects outward, and the metal case is exteriorly mounted on the main body of the photodiode. Thus, each side surface of the body of the photodiode is covered with the upper plate and the left and right side plates of the metal case in close contact with each other, and only the light-receiving portion is covered with the opening of the metal case. Since it is protruding, the entire structure is extremely small, and there are few restrictions on attachment to the substrate. Further, the metal case can be packaged by simply fitting it to the photodiode, and further, the projection of the light receiving portion increases the directivity, and the performance of the photodiode is increased.

[Embodiment] An embodiment of the present invention will be described below in detail with reference to the attached drawings. FIG. 1 and FIG. 2 show a photodiode, which is conventionally known, but for convenience of explanation, this structure will be described. Reference numeral 10 denotes a body of the photodiode, which is formed in a substantially rectangular shape, and a hemispherical light receiving portion 12 is provided on a front surface portion 11 thereof so as to project therefrom. Between the upper surface portion 13 of the main body 10 and the left and right side surface portions 14, 15, respectively, oblique portions 16,
16 is provided, and the lower surface 17 of the main body 10 has terminals 18a,
18b is projected.

Next, referring to FIGS. 3 to 5, the shield cap 19 of the present invention will be described. The shield cap 19 is about 0.2 mm
Is formed by bending four sides of the metal plate, and is formed to correspond to the shape of the photodiode and slightly larger than the external dimensions of the photodiode. That is, a circular opening 21 is formed in the front plate 20 that is substantially rectangular in a front view. Then, the upper side plate 22 is extended by bending the upper side of the front plate 20, and the left side plate 23 and the right side plate 24 are extended by bending the right and left sides of the front plate 20 respectively. Here, the upper side plate 22 is provided with notches 26, 26 at both left and right ends of the folding curve 25 with the front plate 20, and the oblique portion 1 of the photodiode described above is provided.
The hypotenuse portions 27, 27 are formed by bending obliquely in accordance with the shapes of 6, 16. Further, the lower part of the front plate 20 is partially opened, and a lower plate 28 is extended in the vicinity of the left side plate 23.
The lower plate 29 is extended with a predetermined gap S therebetween. The width and the gap S of the lower plate 28 are formed corresponding to the position and width of the terminal 18a of the photodiode described above. In order to facilitate the attachment / detachment to / from the photodiode, the lower right corner portion 30 of the front plate 20 can be obliquely cut out as shown in FIG.

6 and 7, the shield cap 19 is shown in FIG.
Shows a state in which the above is packaged on the photodiode. The body 10 of the photodiode is covered by each side plate of the shield cap 19, and the light receiving portion 12 projects outward from the opening 21 of the front plate 20. Then, one terminal 18a is fitted and inserted in the gap S portion between the lower plates 28 and 29, and is electrically connected to the shield cap 19 as ground. Further, FIG. 8 shows a photodiode in which the shield cap 19 is packaged,
It shows the state of being attached to the light receiving module 31. The terminal 18a,
The electrodes 18b are soldered to the electrodes 32, 32, respectively, and the photodiode is provided in a substantially central portion of the light receiving module 31.
Each component such as the chip capacitors 34 and 35 and the tantalum capacitor 36 is attached to the light receiving module 31.

Thus, in this embodiment, by covering the photodiode with the metal shield cap 19, signals from other components constituting the light-receiving module 31 are prevented from being mixed into the photodiode. It can be prevented. Since the shield cap 19 is fitted to the body 10 of the photodiode and is externally mounted, it is not bulky and the installation space can be reduced. Therefore, when attaching to the light receiving module 31, it is not necessary to separately install a shield plate, and the attachment position is not limited, and the shield plate can be attached to any position. The shield cap 19 can be inexpensively formed by press working, and since one terminal 18a of the photodiode is fitted and temporarily fixed in the gap S portion between the lower plates 28 and 29, It becomes extremely easy to attach to the light receiving module 31. Further, if one terminal 18a temporarily fixed as described above is subjected to a soldering process, the shield cap 19 and the terminal 18a are brought into conduction and are connected to the ground. Thus,
The work of attaching to the light receiving module 31 and the shield work can be shortened, and the workability can be improved.

[Effects of the Invention] As described in detail in the above-mentioned one embodiment, the present invention is to package a metal case to the body of a photodiode with the upper plate and the left and right side plates in close contact with each other. Since only the light receiving portion of the above is projected outward from the opening formed in the metal case, the whole is formed in a very small size. Therefore, there are few restrictions on attachment to the substrate.

Further, since the metal case can be packaged by simply fitting it to the photodiode, the packaging operation is easy, and the process is shortened without requiring skilled workers. Further, since the light-receiving portion is projected outward from the opening, the directivity of the light-receiving portion is increased, the performance of the photodiode is improved, and noise can be surely blocked, which is highly reliable. At the same time, it can contribute to cost reduction.

[Brief description of drawings]

1 to 8 show an embodiment of the present invention. 1 is a front view of a photodiode, FIG. 2 is a left side view of the same, FIG. 3 is a front view of a shield cap, FIG. 4 is a sectional view taken along the line AA of FIG. 3, and FIG. 5 is a shield cap. Fig. 6 is a bottom view, Fig. 6 is a front view showing a state in which the photodiode cap is shielded, Fig. 7 is a left side view of the cutaway portion of the same portion, and Fig. 8 is a plan view of a light receiving module. FIG. 9 shows a conventional example and is a plan view of a light receiving module. Reference numeral 10: Main body, 12: Light receiving part 19: Shield cap, 20: Front plate 21: Opening part, 22: Upper plate 23: Left plate, 24: Right plate 28: Lower plate, 31: Light receiving module

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Motonobu Numata 4-8-11 Nakamachi, Atsugi-shi, Kanagawa Mitsumitami Heights (56) References JP, U) Actual development Sho 56-156016 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A metal case for enclosing the body of a photodiode, wherein an opening is opened at a position corresponding to a light receiving portion of the photodiode of the case, and the photodiode is formed on a side plate of the case. In a shield cap of a light receiving module formed by covering the main body of the above, the hemispherical light receiving portion of the photodiode is projected outward from the opening formed in the case, and further, the upper plate and left and right sides of the case are provided. A shield cap for a light-receiving module, wherein the photodiode is covered with the case in a state where the photodiode is in close contact with the side plate.