JPH06258511A - Mold for producing diffraction grating and its production - Google Patents

Mold for producing diffraction grating and its production

Info

Publication number
JPH06258511A
JPH06258511A JP7534893A JP7534893A JPH06258511A JP H06258511 A JPH06258511 A JP H06258511A JP 7534893 A JP7534893 A JP 7534893A JP 7534893 A JP7534893 A JP 7534893A JP H06258511 A JPH06258511 A JP H06258511A
Authority
JP
Japan
Prior art keywords
diffraction grating
substrate
manufacturing
mold
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7534893A
Other languages
Japanese (ja)
Inventor
Hiroyuki Suzuki
博幸 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP7534893A priority Critical patent/JPH06258511A/en
Publication of JPH06258511A publication Critical patent/JPH06258511A/en
Pending legal-status Critical Current

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  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To reduce the production cost of the mold for producing a diffraction grating having the decreased for product deviation in blazed wavelengths. CONSTITUTION:Grooves 2 having level differences 2a are formed by etching on the surface of a substrate 1 made of quartz, etc., and thereafter, the substrate 1 is subjected to a film-forming treatment by sputtering, by which thin films 3a to 3c are formed on the bases 2b of the grooves 2, the surfaces of the level differences 2a and the remaining flat surfaces 2c of the substrate 1, respectively. The thicknesses of the respective thin films 3a to 3c are increased from the center of the length of the grooves 2 toward both ends by controlling the moving speed of a moving shutter in sputtering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ディジタルカラー読取
装置の色分解に用いるブレーズト回折格子をレプリカ法
によって製作するための回折格子製作用成形型およびそ
の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diffraction grating manufacturing mold for manufacturing a blazed diffraction grating used for color separation of a digital color reader by a replica method, and a manufacturing method thereof.

【0002】[0002]

【従来の技術】従来から、原稿面上のカラー画像情報を
光学系を介してCCD等のラインセンサ面上に結像させ
て、このときのラインセンサからの出力信号を利用して
カラー画像情報をデジタル的に読取る装置がいろいろと
提案されている。特に、特開平3−181269号に示
されているように、原稿面上のカラー画像からの光束を
結像光学系で集光し、前述のラインセンサ上に結像させ
るに際して、前記光束を、例えば、赤色、緑色および青
色の3色に色分解するための装置としては、3pプリズ
ムを用いたものや、2つの色分解用のビームスプリッタ
を用いるものや、透過型のブレーズト回折格子を用いる
ものが開発されており、最近では、装置の簡素化が容易
であり、かつ、高精度の読取りが可能であるという点
で、反射型のブレーズト回折格子を用いる装置が注目さ
れている。
2. Description of the Related Art Conventionally, color image information on a document surface is imaged on a line sensor surface such as a CCD through an optical system, and color image information is output by using an output signal from the line sensor. Various devices have been proposed for digitally reading. In particular, as disclosed in Japanese Patent Laid-Open No. 3-181269, when a light flux from a color image on the surface of a document is condensed by an imaging optical system and focused on the line sensor, the light flux is For example, as a device for color separation into three colors of red, green and blue, one using a 3p prism, one using two beam splitters for color separation, and one using a transmission type blazed diffraction grating Has recently been developed, and recently, an apparatus using a reflection type blazed diffraction grating has attracted attention because it can be easily simplified and highly accurate reading is possible.

【0003】反射型のブレーズト回折格子を用いる場合
には、色分解された光束がラインセンサに入射するとき
の入射角によって色ずれが発生するおそれがあるため、
前記入射角が常時ゼロになるような射出型テレセントリ
ック系を結像光学系に用いたり、図6に示すように、回
折格子GのピッチPを回折格子基板の中心から周辺にか
けて大きくするとともに回折格子Gの高さhおよび段差
を回折格子基板の中心から周辺にかけて低くするなどの
工夫がなされており、特に後者は、結像光学系を複雑化
する必要がないうえに、回折格子基板を曲面板とする必
要もないために製造コストが安価であり、かつ、ブレー
ズト波長ずれと回折結像位置ずれの双方を解消できると
いう大きな利点がある。また、このような回折格子を大
量にかつ安価に製作する方法として、石英製の基板等を
エッチングして回折格子製作用の成形型を作製し、これ
を用いて紫外線硬化型の樹脂材料に回折格子を転写した
うえで、その表面を反射膜で被覆するレプリカ法が開発
されている。
When a reflection type blazed diffraction grating is used, color shift may occur depending on the incident angle when the color-separated light flux enters the line sensor.
An emission type telecentric system in which the incident angle is always zero is used in the imaging optical system, or as shown in FIG. 6, the pitch P of the diffraction grating G is increased from the center to the periphery of the diffraction grating substrate and the diffraction grating is used. The height h of G and the step are reduced from the center to the periphery of the diffraction grating substrate, and in particular, in the latter case, the imaging optical system does not have to be complicated, and the diffraction grating substrate is a curved plate. Since there is no need to use the above, there is a great advantage that the manufacturing cost is low, and both the blazed wavelength shift and the diffraction imaging position shift can be eliminated. Further, as a method of mass-producing such a diffraction grating in a large amount at low cost, a molding die for manufacturing the diffraction grating is produced by etching a quartz substrate or the like, and is used to diffract an ultraviolet curable resin material. A replica method has been developed in which a grating is transferred and then its surface is covered with a reflective film.

【0004】[0004]

【発明が解決しようとする課題】しかしながら上記従来
の技術によれば、レプリカ法によって安価に回折格子を
製作するには、まず、成形型を安価に製造することが望
まれるが、前述のように、ブレーズト波長ずれを防ぐた
めには、回折格子の高さおよび段差を回折格子基板の中
心から周辺にかけて低くする必要があるため、成形型の
製造工程が複雑になり、製造コストの上昇を招くおそれ
がある。すなわち、このような成形型は通常公知のフォ
トリソグラフィによるパターニング工程とエッチング工
程によって作製されるが、エッチング深さを制御するこ
とによって回折格子転写用凹所の底面や段差に高精度の
勾配を設けるのは極めて困難であり、制御の複雑化によ
って成形型の製造コストが著しく上昇する。
However, according to the above-mentioned conventional technique, in order to inexpensively manufacture the diffraction grating by the replica method, it is desired to manufacture the molding die at low cost first. In order to prevent the blazed wavelength shift, it is necessary to lower the height and step of the diffraction grating from the center to the periphery of the diffraction grating substrate, which complicates the manufacturing process of the mold and may increase the manufacturing cost. is there. That is, although such a mold is usually manufactured by a well-known photolithography patterning process and etching process, a highly accurate gradient is provided on the bottom surface or step of the diffraction grating transfer recess by controlling the etching depth. Are extremely difficult to manufacture, and the complexity of control causes a significant increase in the manufacturing cost of the mold.

【0005】本発明は、上記従来の技術の有する問題点
に鑑みてなされたものであり、製作コストの上昇を招く
ことなく、回折格子転写用凹所の底面および段差に高精
度の勾配を設けることのできる回折格子製作用成形型お
よびその製造方法を提供することを目的とするものであ
る。
The present invention has been made in view of the above-mentioned problems of the prior art, and provides a highly accurate gradient on the bottom surface and steps of the diffraction grating transfer recess without increasing the manufacturing cost. An object of the present invention is to provide a mold for manufacturing a diffraction grating and a method for manufacturing the same.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に本発明の回折格子製作用成形型は、少くとも1個の回
折格子の形状をもつ凹所を備えた基板と、前記凹所の底
面および段差のそれぞれに成膜された薄膜からなり、前
記薄膜の膜厚が、前記凹所の長さ方向に変化しているこ
とを特徴とする。
In order to achieve the above object, a mold for manufacturing a diffraction grating according to the present invention comprises a substrate having a recess having the shape of at least one diffraction grating, and The thin film is formed on each of the bottom surface and the step, and the film thickness of the thin film changes in the length direction of the recess.

【0007】また、本発明の回折格子製作用成形型の製
造方法は、基板の表面に少くとも1個の回折格子の形状
をもつ凹所を形成する工程と、凹所を形成された基板の
表面に薄膜を蒸着する工程からなり、前記薄膜の蒸着量
を前記凹所の長さ方向に変化させることを特徴とする。
The method for manufacturing a mold for manufacturing a diffraction grating according to the present invention comprises a step of forming a recess having at least one diffraction grating shape on the surface of the substrate, and a step of forming a recess on the substrate. The method comprises depositing a thin film on the surface, and changes the deposition amount of the thin film in the length direction of the recess.

【0008】[0008]

【作用】薄膜の厚さを変化させることによって凹所の底
面および段差にそれぞれ高精度の勾配を設けることがで
きる。エッチング深さの制御等の複雑な制御を必要とし
ないために製造コストの上昇を招くおそれはない。
By changing the thickness of the thin film, it is possible to provide highly accurate gradients on the bottom and steps of the recess. Since complicated control such as control of the etching depth is not required, there is no fear of increasing the manufacturing cost.

【0009】[0009]

【実施例】本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described with reference to the drawings.

【0010】図1は、一実施例の一部分を示す部分斜視
図であって、本実施例の回折格子製作用成形型M1 は、
基板1の表面にそれぞれ段差2aを有する複数の回折格
子の形状をもつ凹所である溝2を形成し、各溝2の段差
2a、底面2bおよび各溝2の間の平坦面2cにそれぞ
れSiO2 の薄膜3a〜3cを成膜したものである。基
板1の各溝2の段差2a、底面2bおよび各溝2の間の
平坦面2cの幅は、それぞれ基板1の中央から各端縁1
eに向って徐々に拡大しており、また、基板1の裏面か
らの各溝2の底面2bの高さ、段差2aの高さおよび平
坦面2cの高さはそれぞれ一定であるが、各溝2の段差
2a、底面2bおよび平坦面2cに蒸着された薄膜3a
〜3cの膜厚は、図3に示すように、それぞれ基板1の
C−C線で示す中央から各端縁1eに向って所定の勾配
で増大している。従って、各薄膜3a〜3cの表面の高
さh1 〜h3 もそれぞれ基板1の中央から各端縁1eに
向うにつれて高くなる。すなわち、基板1と薄膜3a〜
3cからなる回折格子製作用成形型M1 の回折格子転写
用凹所S1 は、その中央から各端縁にかけて所定の勾配
で浅くなる溝と段差を有し、また、隣接する溝および段
差のそれぞれのピッチは基板1の中央から各端縁1eに
かけて徐々に拡大しており、これを用いて紫外線硬化型
の樹脂材料の回折格子基板に転写された回折格子は、そ
の中央から周辺にかけて所定の勾配で高さが減少する段
差を有し、かつ、隣接する段差のピッチは、回折格子の
中央から周辺にかけて拡大する。このような回折格子を
用いた色分解装置は、複雑な結像光学系を用いることな
く、ブレーズト波長ずれや回折格子結像位置ずれによる
色ずれを防ぐことができる。
FIG. 1 is a partial perspective view showing a part of one embodiment, in which a mold M 1 for manufacturing a diffraction grating of this embodiment is
A groove 2 having a shape of a plurality of diffraction gratings each having a step 2a is formed on the surface of a substrate 1, and a step 2a of each groove 2, a bottom surface 2b and a flat surface 2c between each groove 2 are formed with SiO. The second thin films 3a to 3c are formed. The width of the step 2a of each groove 2 of the substrate 1, the bottom surface 2b and the width of the flat surface 2c between each groove 2 are from the center of the substrate 1 to each edge 1 respectively.
The height of the bottom surface 2b of each groove 2 from the back surface of the substrate 1, the height of the step 2a, and the height of the flat surface 2c are constant from the back surface of the substrate 1. Thin film 3a deposited on step 2a, bottom surface 2b and flat surface 2c
As shown in FIG. 3, the film thicknesses of .about.3c increase with a predetermined gradient from the center of the substrate 1 indicated by the line C--C toward each edge 1e. Therefore, the heights h 1 to h 3 of the surfaces of the thin films 3a to 3c also increase from the center of the substrate 1 toward the edges 1e. That is, the substrate 1 and the thin films 3a to
The diffraction grating transfer recess S 1 of the molding die M 1 for manufacturing a diffraction grating composed of 3c has a groove and a step that become shallower with a predetermined gradient from the center to each end edge, and the adjacent groove and the step Each pitch gradually increases from the center of the substrate 1 to each edge 1e, and the diffraction grating transferred to the substrate of the ultraviolet-curing resin material diffraction grating substrate using this pitch has a predetermined distance from the center to the periphery. There is a step whose height decreases due to the gradient, and the pitch of the adjacent steps increases from the center to the periphery of the diffraction grating. A color separation device using such a diffraction grating can prevent color shift due to a blazed wavelength shift or a diffraction grating image shift position without using a complicated image forming optical system.

【0011】回折格子製作用成形型M1 は以下の方法で
製造した。
The mold M 1 for making a diffraction grating was manufactured by the following method.

【0012】まず、長さ70mm、幅30mm、厚さ3
mm、φ50でニュートン3本の面精度および表面粗さ
〜10Å(r.m.s)の石英製の基板1に、公知のフ
ォトリソグラフィによるパターニング工程およびエッチ
ング工程によって、図4の(a)および(b)に示すよ
うに、段差2aおよび底面2bを有する溝2を所定数だ
け形成した。各溝2の段差2aと底面2bおよび隣接す
る溝2との間に形成される平坦面2cのそれぞれの幅は
C−C線で示す基板1の中央から各端縁1eに向って徐
々に拡大する一方、溝2の底面2b、段差2aおよび平
坦面2cのそれぞれの基板1の裏面からの高さは一定で
ある。
First, the length is 70 mm, the width is 30 mm, and the thickness is 3.
4 (a) and FIG. 4 (a) by a known photolithographic patterning process and etching process on a quartz substrate 1 having a surface precision and a surface roughness of 10 Å (rms) of 3 Newtons in mm, φ50. As shown in (b), a predetermined number of grooves 2 having a step 2a and a bottom surface 2b were formed. The width of each flat surface 2c formed between the step 2a of each groove 2 and the bottom surface 2b and the adjacent groove 2 is gradually increased from the center of the substrate 1 indicated by the line C-C toward each edge 1e. On the other hand, the heights of the bottom surface 2b, the step 2a, and the flat surface 2c of the groove 2 from the back surface of the substrate 1 are constant.

【0013】なお、前記エッチング工程は以下の条件で
行われた。
The etching process was performed under the following conditions.

【0014】エッチング深さ 620nm 消費電力 100W エッチング時間 16分 エッチングガス CF4 エッチングガス圧 40mTorr エッチングガス流量 15SCCM 次いで、公知のスパッタリング工程によって、各溝2の
段差2a、底面2bおよび平坦面2cに、それぞれ基板
1の中央から周辺にかけて徐々に膜厚の増加するSiO
2 の薄膜3a〜3cを蒸着した。薄膜3a〜3cの膜厚
は、それぞれ、基板1の中央で20nm、両端において
それぞれ40nmである。
Etching depth 620 nm Power consumption 100 W Etching time 16 minutes Etching gas CF 4 Etching gas pressure 40 mTorr Etching gas flow rate 15 SCCM Then, the steps 2a, the bottom surface 2b and the flat surface 2c of each groove 2 are respectively formed by a known sputtering process. SiO whose thickness gradually increases from the center to the periphery of the substrate 1.
2 thin films 3a to 3c were deposited. The film thicknesses of the thin films 3a to 3c are 20 nm at the center of the substrate 1 and 40 nm at both ends, respectively.

【0015】図5は、このような薄膜3a〜3cをスパ
ッタリング蒸着によって作製するためのスパッタリング
装置を示すもので、該装置は、ガス導入口10aおよび
排気口10bを有する減圧室10と、減圧室10内に設
けられた陽極11、陰極12および移動シャッタ13か
らなり、基板1は陽極11に保持される。陰極12は水
冷ホルダ14に保持され、水冷ホルダ14は減圧室10
の壁に設けられた絶縁体15を貫通し、図示しない冷却
水の供給源に接続されている。なお、陰極12は水冷ホ
ルダ14を貫通する配線16によって高圧電源17に接
続されている。排気口10bに接続された真空ポンプに
よって減圧室10を所定の真空圧まで減圧したのち、ガ
ス導入口10aからArガス等のスパッタリングガスを
導入し、陽極11と陰極12の間に形成されたプラズマ
中で活性化して陰極12に衝突させ、陰極12の表面を
スパッタリングし、発生した粒子を、移動シャッタ13
のスリット13aを経て基板1に蒸着させる。このと
き、移動シャッタ13を基板1の幅方向に往復移動させ
るとともに、その移動速度を、スリット13aが基板1
の中央から各端縁1eに近づくにつれて所定の割合で遅
くする。これによって、前記粒子の蒸着量を、基板1の
中央から各端縁1eに向って所定の勾配で増加させる。
FIG. 5 shows a sputtering apparatus for producing such thin films 3a to 3c by sputtering deposition. The apparatus comprises a decompression chamber 10 having a gas inlet 10a and an exhaust port 10b, and a decompression chamber. The substrate 1 is held by the anode 11, which is composed of an anode 11, a cathode 12, and a movable shutter 13 which are provided inside the substrate 10. The cathode 12 is held by a water cooling holder 14, and the water cooling holder 14 is a decompression chamber 10.
Through the insulator 15 provided on the wall of the wall, and is connected to a supply source of cooling water (not shown). The cathode 12 is connected to a high voltage power supply 17 by a wiring 16 penetrating the water cooling holder 14. After the decompression chamber 10 is decompressed to a predetermined vacuum pressure by a vacuum pump connected to the exhaust port 10b, a sputtering gas such as Ar gas is introduced from the gas introduction port 10a to form a plasma formed between the anode 11 and the cathode 12. Activated and collided with the cathode 12, and the surface of the cathode 12 is sputtered.
It vapor-deposits on the board | substrate 1 through the slit 13a. At this time, the moving shutter 13 is reciprocally moved in the width direction of the substrate 1, and the moving speed is set so that the slit 13a moves to the substrate 1
It is delayed at a predetermined rate as it approaches each edge 1e from the center. Thereby, the deposition amount of the particles is increased from the center of the substrate 1 toward each edge 1e with a predetermined gradient.

【0016】本実施例によれば、各薄膜の蒸着量を変え
るだけで、回折格子転写用凹所の底面および段差に所定
の勾配を設けることができるため、エッチング工程等に
複雑な制御を必要とせず、ブレーズト波長ずれの少ない
回折格子製作用成形型を安価に製造できる。
According to this embodiment, a predetermined gradient can be provided on the bottom surface and the step of the diffraction grating transfer recess by changing the deposition amount of each thin film, so that complicated control is required for the etching process and the like. Therefore, it is possible to inexpensively manufacture a mold for manufacturing a diffraction grating with a small blaze wavelength shift.

【0017】なお、回折格子製作用成形型の段差は1個
に限らず、必要に応じて2個以上設けることができるの
は言うまでもない。
Needless to say, the number of steps of the mold for manufacturing the diffraction grating is not limited to one, and two or more steps can be provided if necessary.

【0018】[0018]

【発明の効果】本発明は上述の通り構成されているの
で、以下に記載するような効果を奏する。
Since the present invention is configured as described above, it has the following effects.

【0019】製造コストを上昇させることなく、回折格
子転写用凹所の底面および段差にそれぞれ高精度の勾配
を設けることができる。その結果、ブレーズト波長ずれ
の少ない回折格子製作用成形型の製造コストを低減でき
る。これによって、ブレーズト波長ずれの少ない回折格
子の製造コストを低減し、安価で高性能なディジタルカ
ラー読取装置を実現できる。
It is possible to provide highly accurate gradients on the bottom surface and the step of the diffraction grating transfer recess without increasing the manufacturing cost. As a result, it is possible to reduce the manufacturing cost of the molding die for manufacturing the diffraction grating with less blaze wavelength shift. As a result, it is possible to reduce the manufacturing cost of the diffraction grating having a small blazed wavelength shift and to realize an inexpensive and high-performance digital color reader.

【図面の簡単な説明】[Brief description of drawings]

【図1】一実施例の回折格子製作用成形型の一部分を示
す部分斜視図である。
FIG. 1 is a partial perspective view showing a part of a mold for manufacturing a diffraction grating according to an embodiment.

【図2】図1の回折格子製作用成形型の一部分を示す部
分断面図である。
FIG. 2 is a partial cross-sectional view showing a part of the mold for manufacturing the diffraction grating of FIG.

【図3】図1の回折格子製作用成形型の全体を示す立面
図である。
FIG. 3 is an elevational view showing the entire mold for manufacturing the diffraction grating shown in FIG.

【図4】薄膜を蒸着する前の回折格子製作用成形型を示
すもので、(a)はその一部分を示す部分断面図、
(b)は全体を示す立面図である。
FIG. 4 shows a mold for manufacturing a diffraction grating before vapor deposition of a thin film, (a) is a partial sectional view showing a part thereof,
(B) is an elevation view showing the whole.

【図5】薄膜を蒸着するスパッタリング装置を説明する
説明図である。
FIG. 5 is an explanatory diagram illustrating a sputtering apparatus that deposits a thin film.

【図6】ブレーズト回折格子を説明する説明図である。FIG. 6 is an explanatory diagram illustrating a blazed diffraction grating.

【符号の説明】[Explanation of symbols]

1 基板 2 溝 2a 段差 2b 底面 2c 平坦面 3a〜3c 薄膜 1 Substrate 2 Groove 2a Step 2b Bottom 2c Flat 3a-3c Thin film

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 少くとも1個の回折格子の形状をもつ凹
所を備えた基板と、前記凹所の底面および段差のそれぞ
れに成膜された薄膜からなり、前記薄膜の膜厚が、前記
凹所の長さ方向に変化していることを特徴とする回折格
子製作用成形型。
1. A substrate comprising a recess having at least one diffraction grating shape, and a thin film formed on each of the bottom surface and the step of the recess, wherein the thickness of the thin film is Mold for manufacturing a diffraction grating, characterized in that the recess changes in the length direction.
【請求項2】 薄膜の膜厚が、凹所の長さ方向の中央か
ら各端に向って増大していることを特徴とする請求項1
記載の回折格子製作用成形型。
2. The film thickness of the thin film increases from the center in the lengthwise direction of the recess toward each end.
Mold for manufacturing the diffraction grating described above.
【請求項3】 基板の表面に少くとも1個の回折格子の
形状をもつ凹所を形成する工程と、凹所を形成された基
板の表面に薄膜を蒸着する工程からなり、前記薄膜の蒸
着量を前記凹所の長さ方向に変化させることを特徴とす
る回折格子製作用成形型の製造方法。
3. The method comprises the steps of forming a recess having at least one diffraction grating shape on the surface of a substrate, and depositing a thin film on the surface of the substrate on which the recess is formed. A method of manufacturing a mold for manufacturing a diffraction grating, wherein the amount is changed in the length direction of the recess.
【請求項4】 凹所をエッチングによって形成すること
を特徴とする請求項3記載の回折格子製作用成形型の製
造方法。
4. The method of manufacturing a mold for manufacturing a diffraction grating according to claim 3, wherein the recess is formed by etching.
【請求項5】 薄膜をスパッタリングによって蒸着する
ことを特徴とする請求項3または4記載の回折格子製作
用成形型の製造方法。
5. The method of manufacturing a mold for manufacturing a diffraction grating according to claim 3, wherein the thin film is deposited by sputtering.
【請求項6】 薄膜を蒸着するスパッタリングにおい
て、陰極と基板の間に設けられた移動シャッタの移動速
度を制御することによって前記薄膜の蒸着量を変化させ
ることを特徴とする請求項5記載の回折格子製作用成形
型の製造方法。
6. The diffraction according to claim 5, wherein in the sputtering for depositing the thin film, the deposition amount of the thin film is changed by controlling the moving speed of a moving shutter provided between the cathode and the substrate. Manufacturing method of forming die for lattice production.
JP7534893A 1993-03-09 1993-03-09 Mold for producing diffraction grating and its production Pending JPH06258511A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7534893A JPH06258511A (en) 1993-03-09 1993-03-09 Mold for producing diffraction grating and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7534893A JPH06258511A (en) 1993-03-09 1993-03-09 Mold for producing diffraction grating and its production

Publications (1)

Publication Number Publication Date
JPH06258511A true JPH06258511A (en) 1994-09-16

Family

ID=13573658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7534893A Pending JPH06258511A (en) 1993-03-09 1993-03-09 Mold for producing diffraction grating and its production

Country Status (1)

Country Link
JP (1) JPH06258511A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059979A1 (en) * 2019-09-27 2021-04-01 Hoya株式会社 Method for producing imprint mold, imprint mold, mold blank, and method for producing optical element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059979A1 (en) * 2019-09-27 2021-04-01 Hoya株式会社 Method for producing imprint mold, imprint mold, mold blank, and method for producing optical element
US20220339826A1 (en) * 2019-09-27 2022-10-27 Hoya Corporation Method for producing imprint mold, imprint mold, mold blank, and method for producing optical element

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