JPH06256934A - Holder for material for vapor deposition - Google Patents

Abstract

PURPOSE:To prevent the abnormal evaporation of a material for vapor deposition by uniformizing the temp. distribution of the material for vapor deposition at the time of vapor deposition. CONSTITUTION:The high-temp. region of a recessed part 18b of a hearth liner which generates a large quantity of heat at the time of vapor deposition is provided with heat radiating fins 20. A spacing is provided between the hearth liner 18 and a hearth 22 and further, the contact area of a supporting member 26 supporting the hearth liner 18 and the hearth liner 18 is decreased. Consequently, the temp. distribution of the material 24 for vapor deposition heated for the purpose of the vapor deposition is uniformized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for holding a vapor deposition material.

[0002]

2. Description of the Related Art Conventionally, a vacuum deposition method has been used for forming a metal thin film used for semiconductor elements, optical parts and the like. The vacuum vapor deposition method is a method of forming a metal thin film by heating and evaporating a vapor deposition material in a vacuum, and has the advantages that the device configuration can be simplified and the film thickness can be made relatively easy. As a heating method of the vapor deposition material,
There are a resistance heating method in which a heater is brought into direct contact with an evaporation material for heating, and an electron beam heating method in which an evaporation material is irradiated with an electron beam to heat the evaporation material (reference: thin film handbook, Ohmsha, December 10, 1983, p102- 105).
Electron beam heating can form highly pure metal thin film,
It is often used because it has many advantages such as the ability to form a thick metal thin film and good reproducibility.

FIG. 14 is a cross-sectional view for explaining a method of holding a vapor deposition material used when performing electron beam heating. When performing electron beam heating, the simplest method is to place the hearth 1 in a vacuum container (not shown) of the electron beam vapor deposition apparatus.
0 is provided to hold the vapor deposition material 12 in the concave portion 10 a of the hearth 10. The evaporation port 10 for the vapor deposition material 12 is formed on the upper surface of the recess 10a
b, the side surface and the bottom surface of the vapor deposition material 12 are surrounded by the recess 10a. Then, the electron beam is applied to the vapor deposition material 1 through the evaporation port 10b.
The upper surface of 2 is irradiated to evaporate the vapor deposition material 12. At this time, in order to prevent the components of the vapor deposition apparatus in the vacuum container from being deteriorated by the heat generated by the vapor deposition material 12, the hearth 10 is cooled and the heat of the vapor deposition material 12 is absorbed and blocked by the hearth 10. In this method, since the hearth 10 and the vapor deposition material 12 are in direct contact with each other, when the hearth 10 is cooled, the temperature of the side surface and the bottom surface of the vapor deposition material 12 becomes lower than the temperature of the central portion of the top surface of the vapor deposition material 12, thus The upper surface central portion 12a of the vapor deposition material 12 is mainly melted and evaporated.
In the figure, the upper surface central portion 12a is shown with dots.

However, in order to make the film quality and the film thickness uniform or to keep the vapor deposition rate constant, it is preferable to melt and vaporize the vapor deposition material 12 over the entire upper surface thereof.

Aluminum (A) is used as the vapor deposition material 12.
When a substance having a large thermal conductivity such as l) or gold (Au) is used, it is necessary to increase the power of the electron beam in order to melt the vapor deposition material 12 over the entire upper surface thereof. As a result, the amount of backscattered electrons, secondary electrons, X-rays or light generated when the electron beam collides with the vapor deposition material 12 increases. These backscattered electrons and the like cause alteration (or alteration) of the film to be deposited such as a semiconductor substrate or a film such as photoresist. Further, when the power of the electron beam is increased, abnormal evaporation, such as bumping, easily occurs in the upper surface central portion 12a of the vapor deposition material 12.
As a result, the melted vapor deposition material 12 scatters into particles and adheres to the object to be vapor-deposited, so that granular protrusions may be formed on the vapor deposition film formed on the object to be vapor deposited.

FIG. 15 is a cross-sectional view for explaining another method for holding the vapor deposition material, which is used when performing electron beam heating. According to this method, the hearth liner 1 having the concave portion 14a on the bottom surface and the evaporation port 14b for the vapor deposition material 12 on the upper surface is used.
4 is used. The hearth liner 14 is positioned in the concave portion 10a of the hearth 10 via the support material 16, and the vapor deposition material 1
2 is held in the concave portion 14a of the hearth liner 14 and heated. Since the vapor deposition material 12 is melted and vaporized over the entire upper surface thereof, a gap is provided between the hearth liner 14 and the hearth liner 10 and the contact area between the support material 16 and the hearth liner 14 is made small, whereby the hearth liner 14 and the hearth liner 10 are contacted. It reduces the amount of heat transferred to. At the same time, the electron beam is swept over the entire upper surface of the vapor deposition material 12.

[0007]

However, even with the method of FIG. 15 described above, it is difficult to prevent the temperature of the central portion of the upper surface of the vapor deposition material 12 from becoming higher than the temperatures of the side surfaces and the bottom surface of the vapor deposition material 12, and therefore, It is difficult to prevent abnormal evaporation while melting and evaporating the vapor deposition material 12 over the entire upper surface thereof.

In order to solve the above-mentioned conventional problems, an object of the present invention is to hold a vapor deposition material capable of reducing the difference between the temperature of the central portion of the vapor deposition material and the temperatures of the side and bottom surfaces of the vapor deposition material. To provide.

[0009]

The apparatus for holding a vapor deposition material according to the first aspect of the present invention comprises a hearth liner having a concave portion for holding the vapor deposition material on the bottom surface and an evaporation port for the vapor deposition material on the top surface, and a large amount of heat in the concave portion of the hearth liner. A heatsink provided in a high temperature region where heat is generated and a hearth having a heat receiving surface that surrounds the hearth liner and the heatsink around the vaporization material that has evaporated from the evaporation port of the hearth liner and that absorbs heat from the hearth liner and the heatsink. And a heat-receiving surface of the hearth, and a hearth liner and a radiator are arranged apart from each other.

The apparatus for holding a vapor deposition material according to the second aspect of the invention has a hearth liner having a concave portion for holding the vapor deposition material on the bottom surface and an evaporation hole for the vapor deposition material on the top surface, and a high temperature region where a large amount of heat is generated in the concave portion of the hearth liner. It has a temperature controller with a variable heat absorption amount and a hearth that has a heat receiving surface that surrounds the hearth liner at a position that does not block the evaporation material evaporated from the evaporation port of the hearth liner and that absorbs the heat from this hearth liner. It is characterized in that the surface and the hearth liner are arranged separately.

[0011]

According to the first invention, one or a plurality of radiators are provided.
It is provided in the high temperature region of the hearth liner recess where a large amount of heat is generated. The temperature distribution of the hearth liner when the vapor deposition material is held in the hearth liner recess and heated is preliminarily experimentally or theoretically predicted, and the hearth liner recess in the region where the temperature becomes high in the temperature distribution is set as the high temperature region. Preferably, the high temperature region includes a region where a peak at a high temperature appears in this temperature distribution.

By letting the heat in the high temperature region escape to the heat-receiving surface of the hearth through one or more radiators, the temperature distribution in the hearth liner recess can be made uniform, so that the vapor deposition material is melted over the entire upper surface thereof. It is possible to prevent abnormal evaporation of the vapor deposition material.

Further, according to the second aspect of the invention, one or a plurality of heat absorption variable temperature controllers are provided in the high temperature region of the hearth liner recess where a large amount of heat is generated. The temperature distribution of the hearth liner when the vapor deposition material is held in the hearth liner recess and heated is preliminarily experimentally or theoretically predicted, and the hearth liner recess in the region where the temperature becomes high in the temperature distribution is set as the high temperature region. Preferably, the high temperature region includes a region where a peak at a high temperature appears in this temperature distribution.

By absorbing the heat in the high temperature region with one or a plurality of temperature regulators, the temperature distribution in the hearth liner recess can be made uniform, so that the evaporation material is abnormally vaporized while melting the evaporation material over the entire upper surface thereof. Can be prevented. In the present invention, the vapor deposition rate of the vapor deposition material can be changed by variably controlling the amount of heat absorbed by the temperature controller.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings are merely schematic representations so that the invention can be understood, and therefore the invention is not limited to the illustrated examples.

1 and 2 are sectional views schematically showing the structure of the first embodiment of the first invention, and FIG. 3 is a plan view schematically showing the structure of the first embodiment of the first invention. FIG. 1 shows I- of FIG.
FIG. 2 is a sectional view taken along line I, and FIG. 2 is a sectional view taken along line II-II in FIG.

The holding device 16 for the vapor deposition material of this embodiment is
A hearth liner 18, a radiator 20 and a hearth 22 are provided. The hearth liner 18 has an evaporation port 18a for the vapor deposition material 24 on the top surface thereof and a recess 18b for holding the vapor deposition material 24 on the bottom surface thereof.
It is provided in a high temperature region where a large amount of heat is generated in the concave portion 18b of No. 8. The hearth 22 is the hearth liner 18 and the radiator 20.
Has a heat receiving surface 22a that surrounds the hearth liner 18 and absorbs heat from the radiator 20 and the heat receiving surface 22a is evaporated from the evaporation port 18a of the hearth liner 18.
Place it so that it does not block 4. Then, the heat receiving surface 22a of the hearth 22 and the hearth liner 18 and the radiator 20 are separated from each other.

In this embodiment, the hearth 2 made of copper (Cu) is used.
2, a hollow cylindrical recess having an opening 22b on the upper surface is provided, and the inner wall surface of the recess serves as the heat receiving surface 22a. This hearth 22 is a vacuum container (not shown) of an electron beam vacuum deposition apparatus.
The hearth liner 18 is disposed inside the recess formed by the heat receiving surface 22a with the support member 26 interposed therebetween.

The hearth liner 18 is a plate made of tungsten (W) and having a circular planar shape.
The concave portion 18b of No. 8 is fitted into the concave portion formed by the heat receiving surface 22a, and the evaporation port 18a of the hearth liner 18 is attached to the heat receiving surface 2
It is exposed from the opening 22b without being covered with 2a.

In addition to tungsten as the material for forming the hearth liner 18, for example, molybdenum (Mo), tantalum (Ta) or other refractory metal, or carbon, boron nitride or other heat resistant material may be used. You can In addition, the forming material of the hearth 22 is copper,
It may be a material having a high thermal conductivity or any other suitable material.

The support member 26 is made of tantalum (Ta). Although the method for positioning the heart liner 18 is not limited to this, here, the support member 26 is attached to the heat receiving surface 22a.
And the hearth liner 18, and the support member 26 supports the hearth liner 18. In order to make the temperature distribution of the vapor deposition material 24 uniform when vapor depositing the vapor deposition material 24, a gap is provided between the hearth liner 18 and the hearth 22 and the contact area between the support member 26 and the hearth liner 18 is reduced.
Preferably, the support member 26 is formed of a material having a low thermal conductivity or a heat insulating material.

Then, the hearth 22 is provided with a cooling device of any suitable configuration. Here, the hearth 22 is provided with a coolant channel 28, and a coolant, for example, water is caused to flow through the channel 28 to remove the hearth 2.
Cool 2.

The radiator 20 is a radiating fin protruding from the outer peripheral surface of the recess 18b of the hearth liner 18. In this embodiment, since the hearth liner 18 is provided in the hollow cylindrical recess formed by the heat receiving surface 22a, the recess 1 when seen in a plan view is provided.
The high temperature region where a large amount of heat is generated is in the substantially central portion of 8b. Therefore, when the vapor deposition material 24 is vapor-deposited, the temperature distribution of the vapor deposition material 24 is made uniform, so
A radiator 20 is provided substantially in the center of 8b, and the radiator 20 enhances the heat radiation efficiency in the high temperature region of the recess 18b.

According to this embodiment, when depositing the vapor deposition material 24, a vacuum is formed in the gap between the heat receiving surface 22a and the hearth liner 18 and the radiator 20, so that the hearth liner 18 and the radiator 20 are separated from each other. The heat is transferred to the heat receiving surface 22a by radiation. By shielding the radiant heat from the hearth liner 18 and the radiator 20 by the heat receiving surface 22a of the cooled hearth 22, it is possible to prevent the device components in the vacuum container of the vapor deposition device from being deteriorated by heat. Further, the radiation heat from the radiator 20 is absorbed by the cooled heat receiving surface 22a, so that the heat radiation efficiency in the high temperature region of the recess 18b is enhanced.

Further, according to this embodiment, the heat dissipation efficiency of the central portion of the recess 18b is improved by the radiator 20, a gap is provided between the hearth liner 18 and the hearth 22, and the contact area between the support member 26 and the hearth liner 18 is increased. To reduce. As a result, the vapor deposition material 24 can be heated and melted over the entire top surface thereof while preventing the temperature of the central portion of the vapor deposition material 24 from becoming higher than the temperature of the side surface of the vapor deposition material 24.

FIG. 4 shows the experimental results of examining the temperature distribution in each case where the vapor deposition material was heated and melted using the holding device 16 of this embodiment and the conventional method of FIG. A dotted curve A and a solid curve B in FIG. 4 show the experimental results for the holding device 16 of this embodiment and the conventional method of FIG. 15, respectively.

In the experiment using the holding device 16 of the embodiment,
Gold (Au) was held in the recess 18b of the hearth liner 18 as the vapor deposition material 24, and the vapor deposition material 24 was irradiated with an electron beam while cooling the hearth 22 with water to vapor deposit the vapor deposition material 24 on the substrate. At this time, the accelerating voltage and electron current of the electron beam were increased stepwise so as to gradually increase the power of the electron beam, and the temperatures of the hearth liner 18 and the vapor deposition material 24 at the position X were measured at each step. Position X is a position on the X axis which defines parallel to the plane containing the evaporation port 18a of the hearth liner 18, a hearth liner 18 leftmost, center and corresponds to the right end position X of each code X _L, X _O and X _R (See FIGS. 1 and 4). A pyrometer, which is a non-contact thermometer, was used for temperature measurement.

When the accelerating voltage and electron current of the electron beam were increased stepwise, when the accelerating voltage was 8 KV and the electron current was 0.2 A, the vapor deposition material 24 as shown by the curve A in FIG. It was possible to make the temperature distribution on the upper surface of the substrate substantially uniform and to melt the vapor deposition material 24 over almost the entire upper surface. The vapor deposition rate at this time was about 10 Å / sec. Further, in order to evaluate the quality of the gold vapor deposition film formed on the substrate, when the gold particles on the gold vapor deposition film were examined with a particle counter using a method of scattering laser light, it was confirmed that gold particles with a particle size of 0.3 μm or more were found to be There were 1000 pieces. Compared with about 30,000 gold particles having a particle size of 0.3 μm or more in the experiment using the conventional method shown in FIG. 15 described later, the number of gold particles in the example is 1/100 of that in the conventional case. It was about 30, and it was found that the film quality of the gold vapor deposition film could be improved. Considering that the generation of the gold particles is caused by abnormal evaporation of the vapor deposition material 24, for example, bumping, it can be said that the abnormal evaporation can be reduced by using the holding device 16 of the embodiment.

In the experiment using the conventional method of FIG. 15, the experiment was conducted in the same manner as the experiment of the above-described embodiment except that the radiator 20 was not provided (positions _XL , _XO and X).
See Figure 15 for _R ). In this case, as shown by the curve B in FIG. 4, the temperature distribution on the upper surface of the vapor deposition material becomes a mountainous distribution where a high temperature peak occurs at the position X _O , and it is impossible to make the temperature distribution on the upper surface of the vapor deposition material uniform. could not. The electron beam acceleration voltage is 8 KV and the electron current is 0.2
In order to evaluate the quality of the gold vapor deposition film formed when A was set, the gold particles on the gold vapor deposition film were examined with a particle counter.
There existed one. This is because the conventional method tends to cause abnormal evaporation of the vapor deposition material.

5 and 6 are sectional views schematically showing the construction of the second embodiment of the first invention. 5 shows a cross section corresponding to FIG. 1, and FIG. 6 shows a cross section taken along line VI-VI of FIG. The components corresponding to those of the first embodiment of the first invention are designated by the same reference numerals, and detailed description of the same points as those of the first embodiment of the first invention will be omitted. .

The vapor deposition material holding device 30 of this embodiment has the same structure as that of the first embodiment except that the structure of the radiator 32 is different.

In this embodiment, the concave portion 18b of the hearth liner 18 is formed in a corrugated plate shape, and the corrugated plate concave portion 18b is used as the radiator 32. Since the central portion of the recess 18b in a plan view is a high temperature region, the recess 18b in this high temperature region is formed in a corrugated plate shape and the radiator 32 is partially formed in the recess 18b. The configuration of the corrugated plate-shaped concave portion 18b forming the radiator 32 can be any suitable configuration capable of performing heat dissipation.
Here, the mountains 32 formed concentrically alternately in plan view.
The radiator 3 is provided with a corrugated plate-shaped recess 18b having a and valleys 32b.
Set to 2.

7 and 8 are sectional views schematically showing the structure of the first embodiment of the second invention, and FIG. 9 is a plan view schematically showing the structure of the first embodiment of the second invention. . FIG. 7 corresponds to FIG.
VII-VII is a cross-sectional view taken along the line VII-VII in FIG.
FIG. 8 is a cross-sectional view taken along the line VIII.

The vapor deposition material holding device 34 of this embodiment is
It comprises a hearth liner 36, a temperature controller 38 and a hearth 40. The hearth liner 36 has a vapor deposition material 42 on its upper surface.
Of the vapor deposition material 42 on the bottom surface thereof.
A temperature adjuster 38 having a concave portion 36b for holding the variable heat absorption amount is provided in a high temperature region of the concave portion 36b of the hearth liner 36 where a large amount of heat is generated. The hearth 40 has a heat receiving surface 40a that surrounds the hearth liner 36 and absorbs heat from the hearth liner 36. The heat receiving surface 40a is arranged at a position where the vapor deposition material evaporated from the evaporation port 36a of the hearth liner 36 is not blocked. Then, the heat receiving surface 40a of the hearth 40 and the hearth liner 36 are arranged separately.

In this embodiment, the hearth 4 made of copper (Cu) is used.
0 is provided with a hollow cylindrical recess having an opening 40b on the upper surface, and the inner wall surface of the recess serves as the heat receiving surface 40a. This hearth 40 is a vacuum container (not shown) of an electron beam vacuum deposition apparatus.
The hearth liner 36 is disposed inside the recess formed by the heat receiving surface 40a with the support member 44 interposed therebetween.

The hearth liner 36 is a plate made of tungsten (W) and having a circular planar shape.
The concave portion 36b of No. 6 is fitted into the concave portion formed by the heat receiving surface 40a, and the evaporation port 36a of the hearth liner 36 is attached to the heat receiving surface 4
It is exposed from the opening 40b without being covered with 0a.

In addition to tungsten as the material for forming the hearth liner 36, for example, molybdenum (Mo), tantalum (Ta) or another refractory metal, or carbon, boron nitride or another heat-resistant material may be used. You can In addition, the forming material of the hearth 40 is copper,
It may be a material having a high thermal conductivity or any other suitable material.

The support member 44 is made of tantalum (Ta). Although the method of positioning the heart liner 36 is not limited to this, here, the support member 44 is attached to the heat receiving surface 40a.
And the hearth liner 36, and the support member 44 supports the hearth liner 36. In order to make the temperature distribution of the vapor deposition material 42 uniform during vapor deposition of the vapor deposition material 42, a gap is provided between the hearth liner 36 and the hearth 40 and the contact area between the support member 44 and the hearth liner 36 is reduced.
Preferably, the support member 44 is formed of a material having a low thermal conductivity or a heat insulating material.

Then, the hearth 40 is provided with a cooling device of any suitable configuration. Here, the hearth 40 is provided with a refrigerant channel 45, and a refrigerant, for example, water is caused to flow through the channel 45 to cause the hearth 4 to flow.
Cool 0.

Further, the temperature controller 38 is a hearth liner 36.
Radiator 46 and radiator 4 provided in the high temperature region of recess 36b of
6 and a heat absorber 48 disposed so as to face each other.
8 is movably provided in the direction P along the radiator 46.

The radiator 46 is the recess 36 of the hearth liner 36.
b It is a radiation fin protruding on the outer peripheral surface. In this embodiment, since the hearth liner 36 is provided in the hollow cylindrical recess formed by the heat receiving surface 40a of the hearth liner 40, the substantially central portion of the recess 36b in a plan view is a high temperature region where a large amount of heat is generated. . Therefore, in order to make the temperature distribution of the vapor deposition material 42 uniform when the vapor deposition material 42 is vapor-deposited, a radiator 46 is provided substantially in the center of the recess 36b when viewed in plan, and the radiator 46 causes a high temperature region of the recess 36b. Improve the heat dissipation efficiency.

The heat absorber 48 is a heat sink made of copper and has a hollow cylindrical heat receiving member 48a and an operating member 48b for moving the heat receiving member 48a in the direction P. The heat receiving member 48a is arranged in the recess formed by the heat receiving surface 40a, and the radiator 46 is provided inside the hollow portion of the heat receiving member 48a. The heat receiving member 48a and the radiator 46 are separated from each other, and a gap is provided therebetween. When the vapor deposition material 42 is vapor-deposited, a vacuum is formed in the gap between the heat receiving member 48a and the radiator 46, so that the heat receiving member 48a moves from the radiator 46.
The transfer of heat to is done by radiation. Further, the operating member 48b is slidably inserted into the through hole 40c of the hearth 40, one end of the operating member 48b is connected to the heat receiving member 48a, and the other end of the operating member 48b is provided outside the hearth 40 (not shown). ).

The operating member 48b is connected to the through hole 40 of the hearth 40.
The heat receiving member 48a and the operating member 48b are cooled by bringing them into contact with c and releasing heat from the operating member 48b to the hearth 40 by heat conduction. Further, the heat receiving member 48a is moved in the direction P through the operating member 48b by operating the moving mechanism from the outside of the vacuum container of the electron beam vapor deposition apparatus.
When the heat receiving member 48a is moved, the length L (see FIG. 7) of the facing portion between the heat receiving member 48a and the radiator 46 changes, and thus the facing area of the heat receiving member 48a and the radiator 46 changes.
As a result, the amount of heat absorbed from the radiator 46 to the heat absorber 48 changes, and thus the amount of heat (heat absorption amount) absorbed from the high temperature region of the recess 36b of the hearth liner 36 to the temperature adjuster 38 changes. The temperature of the area can be variably controlled.

According to this embodiment, when the vapor deposition material 42 is vapor-deposited, a vacuum is formed in the gap between the heat-receiving surface 40a and the heat-receiving member 48a and the hearth liner 36 and the radiator 46. The heat is transferred from the radiator 46 to the heat receiving surface 40a and the heat receiving member 48a by radiation. By blocking the radiant heat from the hearth liner 36 and the radiator 46 with the heat receiving surface 40a of the cooled hearth 40, it is possible to prevent the device components in the vacuum container of the vapor deposition device from being deteriorated by heat. Further, the radiant heat from the radiator 46 is absorbed by the cooled heat receiving member 48a or the cooled heat receiving surface 40a, thereby enhancing the heat radiation efficiency in the high temperature region of the recess 36b.

Further, according to this embodiment, the temperature controller 38
This improves the heat dissipation efficiency of the central portion of the recess 36b, and
A gap is provided between the hearth liner 36 and the hearth 40, and the contact area between the support member 44 and the hearth liner 36 is reduced. As a result, the vapor deposition material 42 can be heated and melted over the entire top surface while preventing the temperature of the central portion of the vapor deposition material 42 from becoming higher than the temperature of the side surface of the vapor deposition material 42.

Further, according to this embodiment, the temperature controller 3
Since the temperature of the high temperature region of the concave portion 36b can be variably controlled by 8, the vapor deposition material 42 can be changed even if the power of the electron beam with which the vapor deposition material 42 is irradiated to change the vapor deposition rate.
It is possible to heat and melt the vapor deposition material 42 over the entire upper surface thereof while preventing the temperature of the central portion of the top surface of the above from becoming higher than the temperature of the side surface of the vapor deposition material 42.

FIG. 10 shows the experimental result of examining the temperature distribution when the vapor deposition material was heated and melted by using the holding device 34 of this embodiment.

In this experiment, gold (A
u) was held in the concave portion 36b of the hearth liner 36, and while the hearth 40 was cooled with water, the vapor deposition material 42 was irradiated with an electron beam to vapor deposit the vapor deposition material 42 on the substrate. At this time, the acceleration voltage of the electron beam is set to 8 KV and the electron current is set to 0.2 A, and the length L of the facing portion of the heat receiving member 48a and the radiator 46 (FIG. 7).
The temperature of the hearth liner 36 and the vapor deposition material 42 at the position X was measured for each step. The position X is a position on the X axis defined parallel to the surface of the hearth liner 36 including the evaporation port 36a.
The positions X corresponding to the left end, the center, and the right end of 6 are represented by symbols X _L , X _O, and X _R , respectively (see FIG. 7). A pyrometer, which is a non-contact thermometer, was used for temperature measurement. L
The temperature distributions obtained by the measurement when = 0, 5 and 10 mm are shown in FIG. 10 by a solid curve L ₀ , a dotted curve L ₅ and a dashed line L ₁₀ .

As can be understood from FIG. 10, L = 0 m
When m was set, the temperature of the central portion of the upper surface of the vapor deposition material 42 was higher than the temperature of the side surface of the vapor deposition material 42, and the temperature difference between them was large. When L = 5 mm, vapor deposition material 4
It was possible to make the temperature distribution on the upper surface of No. 2 substantially uniform and to melt the vapor deposition material 42 over almost the entire upper surface. When L = 10 mm, the temperature of the central portion of the upper surface of the vapor deposition material 42 was lower than the temperature of the side surface of the vapor deposition material 42, and the temperature difference between them was large. By adjusting the length L in this way, the temperature distribution of the vapor deposition material 42 can be made uniform. In this experiment, the electron beam acceleration voltage was set to 8 KV and the electron current was set to 0.2 A, but when the electron beam acceleration voltage and the electron current were changed to values other than these specific values to change the deposition rate. Moreover, the temperature distribution of the vapor deposition material 42 can be made uniform by adjusting the length L and / or the cooling temperature of the heat absorber 48.

11 and 12 are sectional views schematically showing the construction of the second embodiment of the second invention. 11 shows a cross section corresponding to FIG. 7, and FIG. 12 shows a cross section taken along line XII-XII of FIG. The components corresponding to those of the first embodiment of the second invention are designated by the same reference numerals, and detailed description of the same points as those of the first embodiment of the second invention will be omitted. .

The vapor deposition material holding device 50 of this embodiment has the same construction as that of the first embodiment except that the construction of the temperature controller 52 is different.

In this embodiment, the temperature controller 52 has a radiator 54 and a heat absorber 56. The radiator 54 is a radiator plate protruding from the outer peripheral surface of the concave portion 36b of the hearth liner 36. The heat absorber 56 is a copper heat sink and includes a plate-shaped heat receiving member 56a and an operating member 56b for moving the heat receiving member 56a in the direction P.

Then, the radiator 54 is slidably contacted with the heat receiving member 56a so as to be opposed thereto. When depositing the vapor deposition material 42, the heat receiving member 56 a and the radiator 46 are brought into contact with each other,
Heat is transferred from the radiator 46 to the heat receiving member 56a by heat conduction. Further, the operation member 56b is attached to the through hole 4 of the hearth 40.
0c, and one end of the operating member 56b is attached to the heat receiving member 56b.
The other end of the operating member 56b is connected to a moving mechanism (not shown) provided outside the hearth 40. Operating member 56b
An insulating material 58 is provided between the through hole 40c and the through hole 40c so that the operating member 56b can slide. Instead of the heat insulating material 58, a material having a low thermal conductivity or a gap may be provided.

Then, the operating member 56b is provided with a cooling device of any suitable configuration. Here, the operation member 56b is provided with the refrigerant flow path 60, and the operation member 56b and the heat receiving member 56a are cooled by flowing a refrigerant, for example, water through the flow path 60. A cooling device different from the cooling device provided on the hearth 40 is provided on the operating member 56.
The cooling temperature of the hearth 40 and the heat absorber 56 is controlled individually.

When the heat receiving member 56a is moved by operating the moving mechanism from the outside of the vacuum container of the vapor deposition apparatus, the heat receiving member 56a is moved.
Since the length L (see FIG. 11) of the facing portion of the heat radiator 54 changes, the temperature of the high temperature region of the recess 36b of the hearth liner 36 can be variably controlled.

In this embodiment, the conduction heat from the radiator 54 is absorbed by the cooled heat receiving member 48a, or in addition, the radiant heat from the radiator 54 is absorbed by the cooled heat receiving surface 40a. The heat dissipation efficiency of the high temperature region of the recess 36b is improved.

FIG. 13 is a sectional view schematically showing the construction of the third embodiment of the second invention. FIG. 13 shows a cross section corresponding to FIG. The constituent components corresponding to those of the second embodiment of the second invention are designated by the same reference numerals, and detailed description of the same points as those of the second embodiment of the second invention will be omitted. .

The vapor deposition material holding device 62 of this embodiment has the same structure as that of the second embodiment except that the structure of the temperature controller 64 is different.

In this embodiment, the temperature adjuster 64 comprises a heat sink 64a made of a rod-shaped member made of copper and a contact portion 64 made of tungsten protruding from one end of the heat sink 64a.
and b. Then, the contact portion 64b is connected to the high temperature region of the hearth liner recess 36b. Heat sink 64a
Is directly connected to the high temperature region of the hearth liner recess 36a, the heat sink 64a has a high thermal conductivity, so that the recess 36
The amount of heat absorbed from the high temperature region of a becomes large, and as a result, the temperature of the high temperature region becomes too low, making it difficult to adjust the temperature of the high temperature region. Therefore, the heat sink 64a is connected to the high temperature region of the recess 36a via the contact portion 64b. By setting the thermal conductivity of the contact portion 64b to any suitable value, the amount of heat absorbed from the high temperature region of the recess 36a is limited to an amount that facilitates temperature adjustment.

The heat sink 64a is inserted through the through hole 40c of the hearth 40, and the other end of the heat sink 64a is extended to the outside of the hearth 40. A heat insulating material 58 is provided between the heat sink 64a and the through hole 40c. Further, a cooling device having any suitable configuration is provided on the other end side of the heat sink 64a. Here, the temperature regulator 64 is provided with the refrigerant channel 60, and the temperature regulator 64 is provided by flowing the refrigerant through the channel 60.
To cool. A cooling device different from the cooling device provided in the hearth 40 is provided in the temperature controller 64, and the cooling temperatures of the hearth 40 and the temperature controller 64 are individually controlled.

In this embodiment, the conduction heat from the high temperature region of the recess 36b of the hearth liner 36 is absorbed by the temperature adjuster 64, so that the heat radiation efficiency of the high temperature region of the recess 36b is improved.

The invention is not limited to the above-mentioned embodiments, and therefore, the forming material of each constituent, the arrangement position,
The number, shape, cooling method, positioning method and others of the arrangement can be changed arbitrarily.

For example, in the above-described embodiment of the first invention, the high temperature region of the hearth liner recess is set to one, and one radiator is provided in this high temperature region. However, a plurality of high temperature regions of the hearth liner recess may exist. Therefore, a radiator may be provided in all or a part of the plurality of high temperature regions, or a plurality of radiators may be provided in one high temperature region.

Further, in the above-described embodiment of the second invention, the high temperature region of the hearth liner recess is set to one, and one temperature controller is provided in this high temperature region. However, a plurality of high temperature regions of the hearth liner recess may exist. Therefore, the temperature controller may be provided in all or a part of the plurality of high temperature regions. In this case, preferably, the heat absorption amount of the temperature regulator can be variably adjusted individually for each high temperature region in which the temperature regulator is provided. Further, the number of temperature regulators provided in one high temperature region may be plural.

Further, in the above-mentioned embodiments, the example in which the holding apparatus for the vapor deposition material of the first and second inventions is used in the electron beam vapor deposition apparatus has been described, but the vapor deposition apparatus which can use these inventions is not limited to this. Instead of this, for example, it may be used in an apparatus configured to vaporize a vapor deposition material by a laser beam to perform vapor deposition.

[0066]

As is clear from the above description, according to the apparatus for holding a vapor deposition material of the first invention, the heat in the high temperature region of the concave portion of the hearth liner is radiated to the heat receiving surface of the hearth via the radiator, so that the hearth liner is exposed. Since the temperature distribution of the recess can be made uniform, it is possible to prevent the evaporation material from being abnormally evaporated while melting the evaporation material over the entire upper surface thereof. Therefore, even if the vapor deposition rate is increased, a vapor-deposited film having good film quality can be formed, and the vapor deposition rate can be stably kept constant.

Further, according to the apparatus for holding a vapor deposition material of the second invention, the temperature distribution of the hearth liner recess can be made uniform by absorbing the heat in the high temperature region of the hearth liner recess by the temperature controller, so that the vapor deposition material can be applied to the entire upper surface of the recess. It is possible to prevent the abnormal evaporation of the vapor deposition material while allowing it to melt over.
Therefore, even if the vapor deposition rate is increased, a vapor-deposited film having good film quality can be formed, and the vapor deposition rate can be stably kept constant.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing the configuration of a first embodiment of the first invention.

FIG. 2 is a sectional view schematically showing a configuration of a first embodiment of the first invention.

FIG. 3 is a plan view schematically showing a configuration of a first embodiment of the first invention.

FIG. 4 is a diagram showing experimental results obtained for the first embodiment of the first invention and the conventional method.

FIG. 5 is a sectional view schematically showing a configuration of a second embodiment of the first invention.

FIG. 6 is a sectional view schematically showing the configuration of a second embodiment of the first invention.

FIG. 7 is a sectional view schematically showing a configuration of a first embodiment of the second invention.

FIG. 8 is a sectional view schematically showing a configuration of a first embodiment of the second invention.

FIG. 9 is a plan view schematically showing a configuration of a first embodiment of the second invention.

FIG. 10 is a diagram showing experimental results obtained for the first embodiment of the second invention.

FIG. 11 is a sectional view schematically showing the configuration of a second embodiment of the second invention.

FIG. 12 is a sectional view schematically showing the configuration of a second embodiment of the second invention.

FIG. 13 is a sectional view schematically showing the configuration of a third embodiment of the second invention.

FIG. 14 is a cross-sectional view for explaining a conventional vapor deposition material holding method.

FIG. 15 is a cross-sectional view provided for explaining another conventional vapor deposition material holding method.

[Explanation of symbols]

 16, 30, 34: Holding device for vapor deposition material 18, 36: Hearth liner 18a, 36a: Evaporation port for vapor deposition material 18b, 36b: Recess 20, 32: Radiator 22, 40: Hearth 22a, 40a: Heat receiving surface 24, 42 : Vapor deposition material 38: Temperature controller

Claims (5)

[Claims] 1. A hearth liner having an evaporation port for vapor deposition material on an upper surface and a concave portion for holding the vapor deposition material on a bottom surface, a radiator provided in a high temperature region of the concave portion of the hearth liner where a large amount of heat is generated, and the hearth liner. A hearth surrounding the hearth liner and the radiator at a position that does not block the vapor deposition material evaporated from the evaporation port of the hearth and having a heat receiving surface that absorbs heat from the hearth liner and the radiator, and the heat receiving surface of the hearth and the hearth liner. An apparatus for holding a vapor deposition material, characterized in that the apparatus and the radiator are separately arranged. 2. The apparatus for holding a vapor deposition material according to claim 1, wherein the radiator is a radiation fin projecting from the outer peripheral surface of the concave portion of the hearth liner. 3. The vapor deposition material holding apparatus according to claim 1, wherein the hearth liner has a corrugated plate-shaped recess, and the corrugated plate-shaped recess serves as a radiator. 4. A hearth liner having an evaporation port for vapor deposition material on an upper surface and a concave portion for holding the vapor deposition material on a bottom surface, and a temperature adjustment with a variable heat absorption amount provided in a high temperature region where a large amount of heat is generated in the concave portion of the hearth liner. And a hearth having a heat receiving surface that surrounds the hearth liner at a position that does not block the vapor deposition material evaporated from the evaporation port of the hearth liner and that absorbs heat from the hearth liner, and the heat receiving surface of the hearth and the hearth liner. An apparatus for holding a vapor deposition material, characterized by being spaced apart. 5. The apparatus for holding a vapor deposition material according to claim 4, wherein the temperature adjuster has a radiator provided in a high temperature region of the concave portion of the hearth liner and a heat absorber arranged so as to face the radiator. An apparatus for holding a vapor deposition material, wherein a heat absorber is provided so as to be movable in a direction along the radiator.