JPH06252532A - Manufacture of wiring board - Google Patents

Manufacture of wiring board

Info

Publication number
JPH06252532A
JPH06252532A JP3703593A JP3703593A JPH06252532A JP H06252532 A JPH06252532 A JP H06252532A JP 3703593 A JP3703593 A JP 3703593A JP 3703593 A JP3703593 A JP 3703593A JP H06252532 A JPH06252532 A JP H06252532A
Authority
JP
Japan
Prior art keywords
wiring board
wiring pattern
printing
wiring
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3703593A
Other languages
Japanese (ja)
Inventor
Atsushi Kitahara
篤 北原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sega Corp
Original Assignee
Sega Enterprises Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sega Enterprises Ltd filed Critical Sega Enterprises Ltd
Priority to JP3703593A priority Critical patent/JPH06252532A/en
Publication of JPH06252532A publication Critical patent/JPH06252532A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To create a wiring board quickly and easily by creating a specific wiring pattern using a computer and then printing a wiring pattern with original size on a flexible insulation member based on that information. CONSTITUTION:A computer 11 is constituted of a body 11a, an input part 11b, and a display 11c and then the body 11a and a printer 12 which is a printing device are mutually connected. The computer 11 inputs data to the body 11a from the input part 11b while confirming the display 11c and creates the wiring pattern of a specific circuit, thus playing a role of a CAD system. Then, the information of the created wiring pattern is transmitted to a printer 12. The printer 12 prints a wiring pattern 13b with original size on a flexible insulation material 13a according to a conductive printing member and then delivers it as a wiring board 13. thus manufacturing the wiring board quickly and easily and at the same time verifying circuit operation easily.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、絶縁基板上に配線パタ
ーンを形成する配線基板の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board manufacturing method for forming a wiring pattern on an insulating substrate.

【0002】[0002]

【従来の技術】近年、電子機器の高機能化により、使用
されるプリント配線板に形成される配線パターンが高密
度化、微細化してきている。そのため、配線パターンを
CAD(Computer Aided Design)システムにより作画す
ることが行われている。
2. Description of the Related Art In recent years, wiring patterns formed on printed wiring boards used have become higher in density and finer due to higher functionality of electronic equipment. Therefore, a wiring pattern is drawn by a CAD (Computer Aided Design) system.

【0003】そこで、従来の配線基板の製造を簡単に説
明する。まず、配線回路のパターンのアートワークがC
ADシステムにより作成される。このCADシステムに
入力された回路の情報に基づいて製版が行われる。
Therefore, the manufacturing of a conventional wiring board will be briefly described. First, the artwork of the wiring circuit pattern is C
Created by AD system. Plate making is performed based on the circuit information input to the CAD system.

【0004】製版には例えばCADシステムからプリン
タにより紙上にプリントアウトし、これを撮影してフィ
ルム原版を作製する場合、またはCADシステムからフ
ォトプロッタによりフィルム上に描画して原版を作製す
る場合がある。
For the plate making, for example, there is a case where a CAD system prints out on paper by a printer and the film is photographed to produce a film original plate, or a CAD system draws on a film by a photoplotter to produce an original plate. .

【0005】製版により作製されたフィルム原版は生産
パネルのサイズに殖版され、これに基づいて印刷用のス
クリーン版が作製される。この印刷用スクリーン版を用
いて、エポキシ系のプリントボードやポリエチレン系等
のフィルムなどの絶縁基板上に回路パターンが印刷さ
れ、適宜パンチング加工等により配線基板が作製され
る。
The original film film produced by plate making is stencil-sized to the size of a production panel, and a screen plate for printing is produced based on this. Using this printing screen plate, a circuit pattern is printed on an insulating substrate such as an epoxy-based print board or a polyethylene-based film, and a wiring board is appropriately produced by punching or the like.

【0006】このように、CADシステムによるパター
ンの作成から種々の工程により配線基板が作製され、外
観検査が行われるものである。
As described above, the wiring board is manufactured by various steps from the creation of the pattern by the CAD system, and the appearance inspection is performed.

【0007】[0007]

【発明が解決しようとする課題】ところで、配線基板の
回路的な動作確認を行う場合、配線基板の作製前に、ユ
ニバーサルプリント基板等を用いて、電子部品を搭載し
てそれぞれをコード配線を行って動作させることにより
行われ、必要があれば設計変更等がなされる。
By the way, when confirming the circuit operation of a wiring board, a universal printed circuit board or the like is used to mount electronic components and perform code wiring for each of them before manufacturing the wiring board. It is carried out by operating the system, and the design is changed if necessary.

【0008】このように、配線基板は上述のように種々
の工程により作製されることから、回路動作の確認を配
線基板の作製前に、手作業により実装基板を作製しなけ
ればならず、煩雑あると共に、長時間を要するという問
題がある。
As described above, since the wiring board is manufactured by various steps as described above, the mounting board must be manually manufactured to confirm the circuit operation before the wiring board is manufactured, which is complicated. There is also a problem that it takes a long time.

【0009】そこで、本発明は上記課題に鑑みなされた
もので、短時間かつ簡易に配線基板を作成する配線基板
の製造方法を提供することを目的とする。
Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a wiring board, which is capable of easily forming the wiring board in a short time.

【0010】[0010]

【課題を解決するための手段】本発明は、まず、所定回
路の配線パターンをコンピュータにより作成する。続い
て、該コンピュータより、該作成した配線パターンの情
報を印刷装置に送出する。そして、該印刷装置におい
て、該情報に基づいて、可撓性の絶縁部材上に導電性の
印刷部材により原寸大の前記配線パターンの印刷を行う
ことにより上記課題が解決される。
According to the present invention, first, a wiring pattern of a predetermined circuit is created by a computer. Then, the information of the created wiring pattern is sent from the computer to the printing apparatus. Then, in the printing apparatus, based on the information, the above-mentioned problem is solved by printing the wiring pattern of the full size on the flexible insulating member by the conductive printing member.

【0011】[0011]

【作用】上述のように、配線基板は、コンピュータによ
り所定回路の配線パターンを作成し、その情報を印刷装
置に送出し、そして印刷装置で該情報に基づいて可撓性
の絶縁部材上に導電性の印刷部材により原寸大の配線パ
ターンの印刷を行う。
As described above, the wiring board prepares a wiring pattern of a predetermined circuit by the computer, sends the information to the printing device, and the printing device conducts the conductive pattern on the flexible insulating member based on the information. A full-scale wiring pattern is printed with a flexible printing member.

【0012】すなわち、印刷装置により、既に絶縁部材
上に原寸大の導体配線パターンが形成された配線基板が
排出されるものである。このように、短時間かつ簡易に
配線基板を作製することが可能になる。
That is, the wiring board on which the conductor wiring pattern of the original size is already formed on the insulating member is discharged by the printing device. In this way, the wiring board can be easily manufactured in a short time.

【0013】そして、回路の検証を行う場合、この配線
基板の配線パターン上に定められた電子部品を固着させ
ることにより容易に検証することが可能になる。
When a circuit is to be verified, it is possible to easily verify it by fixing a predetermined electronic component on the wiring pattern of the wiring board.

【0014】[0014]

【実施例】図1に、本発明方法の一実施例の構成図を示
す。図1は、本発明方法を実施するためのシステムを示
したもので、本体11a、入力部11b、ディスプレイ
11cによりコンピュータ11が構成され、本体11a
と印刷装置であるプリンタ(例えばページプリンタ)1
2が相互接続される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a block diagram of an embodiment of the method of the present invention. FIG. 1 shows a system for carrying out the method of the present invention. A computer 11 comprises a main body 11a, an input section 11b, and a display 11c.
And a printer that is a printing device (for example, a page printer) 1
Two are interconnected.

【0015】コンピュータ11は、ディスプレイ11c
を確認しながら本体11aに入力部11bよりデータを
入力して所定回路の配線パターンを作成するもので、い
わゆるCADシステムとしての役割をなす。そして、作
図した配線パターンの情報をプリンタ12に送出する。
The computer 11 has a display 11c.
While confirming the above, data is input from the input unit 11b to the main body 11a to create a wiring pattern of a predetermined circuit, which serves as a so-called CAD system. Then, the information on the printed wiring pattern is sent to the printer 12.

【0016】プリンタ12は、コンピュータ11からの
情報に基づいて、可撓性の絶縁部材(後述する)13a
上に、導電性の印刷部材(後述する)により原寸大の配
線パターン13bを印刷し、配線基板13として排出す
る。
The printer 12 has a flexible insulating member (described later) 13a based on information from the computer 11.
A wiring pattern 13b of a full size is printed on the upper surface by a conductive printing member (described later), and the printed wiring board 13 is discharged.

【0017】ここで、図2に、図1のプリンタにおける
印刷原理の説明図を示す。図2において、プリンタ12
は、光導電性絶縁体(感光ドラム)21が、所定値の正
電圧を供給する帯電部22により正電荷を帯電させなが
ら、図中時計方向に回転する。この感光ドラム21上に
原寸大の配線パターンの情報に対応する光像が光源23
より照射される。光源23は、例えば、所定数のドット
のLED(発光ダイオード)素子を1チップとしてセラ
ミック基板上に述べたLEDアレイが使用される。
Here, FIG. 2 shows an explanatory view of the printing principle in the printer of FIG. In FIG. 2, the printer 12
The photoconductive insulator (photosensitive drum) 21 rotates clockwise in the drawing while being charged with positive charges by the charging unit 22 which supplies a positive voltage of a predetermined value. On the photosensitive drum 21, an optical image corresponding to the information of the wiring pattern of the original size is formed by the light source 23
More illuminated. As the light source 23, for example, the LED array described above on the ceramic substrate is used with one LED (light emitting diode) element having a predetermined number of dots as one chip.

【0018】そして、現像部24の現像ロール24aよ
り、印刷部材であるトナー25が感光ドラム21の光源
23より露光された光像部分(静電潜像)に付着する。
この場合、トナー25は、例えば鉄粉等の磁性粉が混入
された導電性のもので、感光ドラム21と同極性に帯電
されている。また、図示しないが、感光ドラム21と現
像ロール24a間には所定電圧値でバイアスされる。
Then, the toner 25, which is a printing member, adheres to the optical image portion (electrostatic latent image) exposed by the light source 23 of the photosensitive drum 21 from the developing roller 24a of the developing section 24.
In this case, the toner 25 is a conductive one in which magnetic powder such as iron powder is mixed, and is charged to the same polarity as the photosensitive drum 21. Although not shown, the photosensitive drum 21 and the developing roller 24a are biased with a predetermined voltage value.

【0019】導電性のトナー25が付着された感光ドラ
ム21は、所定値の負電圧を供給する転写部26におい
て、送られてくる可撓性の絶縁部材13aに転写する。
絶縁部材13aは定着部27において導電性のトナー画
像として配線パターン13bが定着され、原寸大の配線
基板13として排出される。
The photosensitive drum 21 to which the conductive toner 25 is attached is transferred to the sent flexible insulating member 13a in the transfer portion 26 which supplies a negative voltage of a predetermined value.
The insulating member 13a is fixed with the wiring pattern 13b as a conductive toner image in the fixing section 27, and is discharged as a full-sized wiring board 13.

【0020】ここで、絶縁部材13aは、紙又は合成樹
脂としてのフィルムにより形成される。例えば、紙は一
般的な普通紙や適当な厚みを有するもの、または適宜耐
熱性を有するもの等が使用される。フィルムの場合に
は、耐熱性のもので、例えばポリエチレン系のものが選
択される。
Here, the insulating member 13a is formed of paper or a film of synthetic resin. For example, as the paper, general plain paper, paper having an appropriate thickness, or paper having appropriate heat resistance is used. In the case of a film, a heat resistant one, for example, a polyethylene one is selected.

【0021】また、配線パターン13bは、上述の印刷
方式で形成されることから、パターンの線幅やパターン
ピッチを数μmから、いわゆるベタ塗りまで自在に形成
することができる。
Since the wiring pattern 13b is formed by the above-mentioned printing method, the line width and pattern pitch of the pattern can be freely formed from a few μm to what is called solid coating.

【0022】なお、感光ドラム21は、交流電源が供給
される除電部28により余分の電荷が取り除かれた後、
清掃部29で表面が清掃され、光除電部30により再度
除電される。
It should be noted that the photosensitive drum 21 is removed of excess charges by the charge eliminating portion 28 to which an AC power is supplied,
The surface is cleaned by the cleaning unit 29, and the charge is removed again by the optical charge removing unit 30.

【0023】そこで、図3に、本発明による配線基板の
回路的動作確認の説明図を示す。図3(A)において、
上述のように製造された配線基板13(配線パターンは
省略する)上の定められた位置に、IC31aや抵抗、
コンデンサなどのチップ部品31b等の表面実装用の電
子部品が載置される。
Therefore, FIG. 3 shows an explanatory diagram for confirming the circuit operation of the wiring board according to the present invention. In FIG. 3 (A),
The IC 31a, the resistor, the IC 31a, the resistor,
An electronic component for surface mounting such as a chip component 31b such as a capacitor is placed.

【0024】そして、図3(B)に示すように、接着材
32により、配線パターン13b上の各電子部品の端子
部分が固着される。接着材32は、一般に使用されてい
る絶縁性のもので、例えばゴム系、エポキシ系のものが
使用される。
Then, as shown in FIG. 3B, the terminal portion of each electronic component on the wiring pattern 13b is fixed by the adhesive 32. The adhesive 32 is an insulating material that is generally used, and for example, a rubber-based or epoxy-based adhesive is used.

【0025】このように、配線基板13に電子部品が実
装され、通電により回路動作の検証を行うものである。
そして、回路動作に不都合があれば適宜設計変更を行
い、不都合がなければ従来と同様にボード等の絶縁基板
の量産に移行するものである。なお、本発明方法で製造
される配線基板13において、絶縁部材にフィルムを用
いる場合、上述のように回路動作の検証として使用して
もよく、また例えばフレキシブルプリント基板としての
実用上の基板としてもよい。
In this way, the electronic components are mounted on the wiring board 13 and the circuit operation is verified by energization.
If there is any inconvenience in the circuit operation, the design is appropriately changed, and if there is no inconvenience, the production shifts to the production of an insulating substrate such as a board as in the conventional case. When a film is used for the insulating member in the wiring board 13 manufactured by the method of the present invention, it may be used as a verification of the circuit operation as described above, or may be a practical board as a flexible printed board, for example. Good.

【0026】上述のように、コンピュータ11で作成し
た配線パターンをプリンタ12により原寸大で導電性の
トナー25により紙又はフィルム上に印刷し、プリンタ
12から排出されたものを配線基板とすることにより、
短時間かつ簡易に配線基板13を作製することができ、
容易に回路動作の検証を行うことができるものである。
As described above, the wiring pattern created by the computer 11 is printed on the paper or film by the printer 12 with the conductive toner 25 having a full-scale size, and the one discharged from the printer 12 is used as the wiring board. ,
The wiring board 13 can be easily manufactured in a short time,
The circuit operation can be easily verified.

【0027】ところで、上記実施例では、印刷装置とし
て、印刷部材にトナーの粉状部材を用いる形式のプリン
タ12について説明したが、液状の印刷部材としてのイ
ンクをペン書きで印刷する形式のプロッタや、インクを
絶縁部材に噴き付けるインクジェット形式のプリンタを
使用してもよい。この場合、油性のインクに磁性粉を混
入させた導電性の高いインク、又は電解質の溶液等の導
電流体に着色したインク等が用いられる。
By the way, in the above embodiment, the printer 12 of the type in which the powdery member of the toner is used as the printing member has been described as the printing device. Alternatively, an inkjet printer that ejects ink onto the insulating member may be used. In this case, an oil-based ink having a high electroconductivity mixed with magnetic powder, or an ink colored with a conductive fluid such as an electrolyte solution is used.

【0028】[0028]

【発明の効果】以上のように、本発明によれば、コンピ
ュータで作製した配線パターンを印刷装置により導電性
の印刷部材により絶縁部材上に原寸大で印刷して、排出
されたものを配線基板とすることにより、短時間かつ簡
易に配線基板を作製することができると共に、容易に回
路動作の検証を行うことができるものである。
As described above, according to the present invention, a wiring pattern produced by a computer is printed at a full size on an insulating member by a conductive printing member by a printing device, and the discharged one is a wiring board. By doing so, the wiring board can be easily manufactured in a short time, and the circuit operation can be easily verified.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の構成図である。FIG. 1 is a configuration diagram of an embodiment of the present invention.

【図2】図1のプリンタにおける印刷原理の説明図であ
る。
FIG. 2 is an explanatory diagram of a printing principle in the printer of FIG.

【図3】本発明による配線基板の回路的動作確認の説明
図である。
FIG. 3 is an explanatory diagram of circuit operation confirmation of the wiring board according to the present invention.

【符号の説明】[Explanation of symbols]

11 コンピュータ 11a 本体 11b 入力部 11c ディスプレイ 12 プリンタ 13 配線基板 13a 絶縁部材 13b 配線パターン 25 トナー 32 接着材 11 computer 11a main body 11b input section 11c display 12 printer 13 wiring board 13a insulating member 13b wiring pattern 25 toner 32 adhesive

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 所定回路の配線パターンをコンピュータ
により作成する工程と、 該コンピュータより、該作成した配線パターンの情報を
印刷装置に送出する工程と、 該印刷装置において、該情報に基づいて、可撓性の絶縁
部材上に導電性の印刷部材により原寸大の前記配線パタ
ーンの印刷を行う工程と、 を含むことを特徴とする配線基板の製造方法。
1. A step of creating a wiring pattern of a predetermined circuit by a computer, a step of sending information of the created wiring pattern from the computer to a printing apparatus, and the printing apparatus based on the information. A method of manufacturing a wiring board, comprising: a step of printing the wiring pattern of a full size on a flexible insulating member by a conductive printing member.
【請求項2】 前記絶縁部材は、紙製又は合成樹脂製に
より形成されていることを特徴とする請求項1記載の配
線基板の製造方法。
2. The method for manufacturing a wiring board according to claim 1, wherein the insulating member is made of paper or synthetic resin.
【請求項3】 前記印刷部材は、導電性の粉状部材又は
液状部材により構成されることを特徴とする請求項1又
は2記載の配線基板の製造方法。
3. The method for manufacturing a wiring board according to claim 1, wherein the printing member is made of a conductive powdery member or a liquid member.
JP3703593A 1993-02-25 1993-02-25 Manufacture of wiring board Withdrawn JPH06252532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3703593A JPH06252532A (en) 1993-02-25 1993-02-25 Manufacture of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3703593A JPH06252532A (en) 1993-02-25 1993-02-25 Manufacture of wiring board

Publications (1)

Publication Number Publication Date
JPH06252532A true JPH06252532A (en) 1994-09-09

Family

ID=12486372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3703593A Withdrawn JPH06252532A (en) 1993-02-25 1993-02-25 Manufacture of wiring board

Country Status (1)

Country Link
JP (1) JPH06252532A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060829A2 (en) * 1998-05-20 1999-11-25 Intermec Ip Corp. Method and apparatus for making electrical traces, circuits and devices
US6831604B2 (en) 2001-06-25 2004-12-14 Communications Research Laboratory Independent Administrative Institution Optical control electromagnetic wave circuit
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060829A2 (en) * 1998-05-20 1999-11-25 Intermec Ip Corp. Method and apparatus for making electrical traces, circuits and devices
WO1999060829A3 (en) * 1998-05-20 2003-04-17 Intermec Ip Corp Method and apparatus for making electrical traces, circuits and devices
US6831604B2 (en) 2001-06-25 2004-12-14 Communications Research Laboratory Independent Administrative Institution Optical control electromagnetic wave circuit
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors

Similar Documents

Publication Publication Date Title
CN100586254C (en) Printed circuit board printing system and method
US8497057B2 (en) Method of producing electronic circuit boards using electrophotography
US20120110843A1 (en) Printed electronic circuit boards and other articles having patterned conductive images
US7877871B2 (en) Method of manufacturing an electronic circuit formed on a substrate
US5011758A (en) Use of a liquid electrophotographic toner with an overcoated permanent master in electrostatic transfer
JPH06252532A (en) Manufacture of wiring board
US20100159648A1 (en) Electrophotograph printed electronic circuit boards
CN104319990A (en) Power supply apparatus
JPS5743493A (en) Method of producing printing block or printed circuit
JPH02132463A (en) Preparation of color-toned pattern on image receiving surface isolated electrically
US8580331B2 (en) Digital manufacture of an electrical circuit
JPH11265089A (en) Electrifying powder for formation of circuit and multilayered wiring board using that
JPH08153947A (en) Method and device for forming wiring film on printed board
US4851320A (en) Method of forming a pattern of conductor runs on a dielectric sheet
AU603108B2 (en) Permanent master with a persistent latent image for use in electrostatic transfer to a receiving substrate
JP4363488B2 (en) Chargeable powder for circuit formation and multilayer wiring board using the same
JP2005302955A (en) Image forming apparatus
JPH11340607A (en) Method for forming circuit and multilayer wiring substrate formed there by
JPH02257696A (en) Manufacture of wiring board
JPH11312859A (en) Formation of circuit pattern and multilayer wiring board formed the method
JPS63180952A (en) Formation of resist pattern of printed circuit board
JP2001060024A (en) Composite high-voltage power source board
JPH0983110A (en) Method for forming conductor circuit
CN1148186A (en) Plate-making method by electrostatic printing plate
JPH11346056A (en) Ceramic multilayered board with cavity and manufacture thereof

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20000509