JPH0623982A - Ink jet recording head and its manufacture - Google Patents
Ink jet recording head and its manufactureInfo
- Publication number
- JPH0623982A JPH0623982A JP17790192A JP17790192A JPH0623982A JP H0623982 A JPH0623982 A JP H0623982A JP 17790192 A JP17790192 A JP 17790192A JP 17790192 A JP17790192 A JP 17790192A JP H0623982 A JPH0623982 A JP H0623982A
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- substrate
- cavity
- projection
- piezoelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インク吐出ノズルの高
密度化と、小型化を図った、インクジェット記録ヘッド
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head in which the density of ink ejection nozzles and the size thereof are reduced.
【０００２】[0002]
【従来の技術】微細なノズルより液滴を飛翔させて記録
を行う原理の一つとして、電気機械変換素子を用いるカ
イザー方式がある。この方式を用いて、ノズル３、キャ
ビティ４の間隔を狭少化し、かつ電気機械変換素子の発
生力を確実にキャビティ４に伝達するための手法が特開
平３−１５５５５に提案されている。この手法の断面図
を図１０に示す。図中の圧電素子７はバイモルフ型であ
る。ノズル３とキャビティ４が垂直に連通した方式で、
平面上に極めて多数のノズル３を形成し、キャビティ４
の極めて薄い（１．４μｍ）ダイヤフラム部の外側に突
起５を設け、この突起５の端面を圧電素子７で押圧させ
るという手法である。圧電素子７に電圧を印加すると、
圧電素子７がキャビティ４側に変位して、突起を押圧す
る。これに伴ってダイヤフラム部も変形して、キャビテ
ィ４の体積を変化させるので、この体積変化分の約１／
２（吐出効率５０％の場合。通常、インクジェットヘッ
ドではキャビティの体積変化の約５０％がノズルから吐
出する）に相当するインクがノズル２から吐出すること
になる。2. Description of the Related Art As one of the principles of recording by ejecting liquid droplets from a fine nozzle, there is a Kaiser method using an electromechanical conversion element. Japanese Patent Laid-Open No. 15555/1993 proposes a method for narrowing the interval between the nozzle 3 and the cavity 4 and reliably transmitting the generated force of the electromechanical conversion element to the cavity 4 by using this method. A cross-sectional view of this technique is shown in FIG. The piezoelectric element 7 in the figure is a bimorph type. A method in which the nozzle 3 and the cavity 4 communicate vertically,
An extremely large number of nozzles 3 are formed on a plane, and cavities 4 are formed.
In this method, the protrusion 5 is provided on the outside of the extremely thin (1.4 μm) diaphragm portion, and the end face of the protrusion 5 is pressed by the piezoelectric element 7. When a voltage is applied to the piezoelectric element 7,
The piezoelectric element 7 is displaced toward the cavity 4 and presses the protrusion. Along with this, the diaphragm portion is also deformed and the volume of the cavity 4 is changed.
Ink corresponding to 2 (when the ejection efficiency is 50%. Normally, about 50% of the volume change of the cavity is ejected from the nozzle in the inkjet head) is ejected from the nozzle 2.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来技
術では、突起は第２基板２に対してエッチング等で形成
されているため、大きな位置ずれはないが、第１基板１
と第２基板２を接合する際にキャビティ４の中心軸と突
起５の中心軸は、ずれる可能性がある。ノズルを高密度
化し、キャビティ４の幅を狭めていけば、その位置ずれ
は僅かであってもインク吐出特性に大きな影響を与え
る。キャビティ４の中心軸と突起５の中心軸がずれる
と、第２基板２の変形能力が劣化するからである。However, in the prior art, since the protrusion is formed on the second substrate 2 by etching or the like, there is no large displacement, but the first substrate 1
When the second substrate 2 and the second substrate 2 are bonded to each other, the central axis of the cavity 4 and the central axis of the protrusion 5 may deviate from each other. If the density of the nozzles is increased and the width of the cavity 4 is narrowed, even if the positional deviation is slight, the ink ejection characteristics are greatly affected. This is because if the central axis of the cavity 4 and the central axis of the protrusion 5 are deviated, the deformability of the second substrate 2 is deteriorated.
【０００４】また、ノズルの高密度化に伴いキャビティ
４を小型化していくと、所望のインク吐出量を得るため
には、必然的にノズル列（各ノズルを結んだ直線方向）
と直交する方向にキャビティ４を伸ばし、それと同時に
第２基板２上の突起５を伸ばして、キャビティ４上の第
２基板２の面積を稼ぎ、バイモルフ型圧電素子あるい
は、積層型圧電素子の変位をキャビティ４上の第２基板
２全体に伝えるようにしなければならない。Further, as the densities of the nozzles are increased and the size of the cavity 4 is reduced, in order to obtain a desired ink ejection amount, the nozzle row is inevitably formed (the straight line connecting the nozzles).
The cavity 4 is extended in the direction orthogonal to the direction, and at the same time, the protrusion 5 on the second substrate 2 is extended to increase the area of the second substrate 2 on the cavity 4 to displace the bimorph type piezoelectric element or the laminated piezoelectric element. It must be transmitted to the entire second substrate 2 on the cavity 4.
【０００５】しかし、突起をノズル列と直交する方向に
伸ばし、圧電素子７に変位を与えると、集中的な印加荷
重により、図１１に示すごとく突起５はたわみ、第２基
板２全体に圧電素子の変位を効率よく伝達できなくな
る。積層型圧電素子の場合、積層数を増し、キャビティ
４の長手方向全域を押圧できるものにすれば良いが、極
端な圧電素子コストの上昇を招いてしまう。However, when the projections are extended in the direction orthogonal to the nozzle row and the piezoelectric element 7 is displaced, the projections 5 are deflected by the concentrated applied load as shown in FIG. It becomes impossible to efficiently transmit the displacement of. In the case of a laminated piezoelectric element, the number of laminated layers may be increased so that the entire area of the cavity 4 in the longitudinal direction can be pressed, but this leads to an extreme increase in cost of the piezoelectric element.
【０００６】そこで、集中的な荷重の印加による突起５
のたわみを小さくする方法が必要である。そのために
は、図１２中のａ寸法（幅）を大きくするか、ｂ寸法
（高さ）を大きくすれば良いのであるが、ａ寸法は大き
くし過ぎると第２基板の反力が増大し変形しにくくな
る。そこで、ｂ寸法を大きくすると、突起５の高さが高
くなり、突起の重心が高くなる。そうなると、圧電素子
７の中心軸が突起５の中心軸と僅かにずれただけで、圧
電素子７と突起５の接合時に突起５が傾き、突起５は傾
いたまま圧電素子７に接合されてしまう。この場合、突
起の中心軸がキャビティ４の中心軸と僅かにずれた場合
も同様である。また、エッチングによって突起を形成す
る場合は、突起の幅に対して高さは２倍程度でしか成形
できないので、ノズルの高密度化に伴い突起の剛性はさ
らに小さくなる。Therefore, the protrusion 5 is formed by applying a concentrated load.
There is a need for a way to reduce the deflection of the. For that purpose, it suffices to increase the a dimension (width) or the b dimension (height) in FIG. 12, but if the a dimension is too large, the reaction force of the second substrate increases and the deformation occurs. Hard to do. Therefore, when the b dimension is increased, the height of the protrusion 5 is increased and the center of gravity of the protrusion is increased. Then, the central axis of the piezoelectric element 7 is slightly deviated from the central axis of the projection 5, and the projection 5 tilts when the piezoelectric element 7 and the projection 5 are bonded, and the projection 5 is bonded to the piezoelectric element 7 while being tilted. . In this case, the same applies when the central axis of the protrusion is slightly deviated from the central axis of the cavity 4. Further, when the protrusions are formed by etching, the height of the protrusions can only be about twice as large as the width of the protrusions. Therefore, the rigidity of the protrusions is further reduced as the nozzle density is increased.
【０００７】そこで、インクジェット記録ヘッドの小型
化、及びノズル高密度化を実現するために、圧電素子の
変位を効率よく第２基板に伝達する方法として、突起の
位置合わせ精度の向上と、組立公差内で圧電素子と突起
を接合し、かつ突起の剛性を高める方法が必要となる。Therefore, as a method of efficiently transmitting the displacement of the piezoelectric element to the second substrate in order to realize the miniaturization of the ink jet recording head and the high density of the nozzles, the positioning accuracy of the protrusions and the assembly tolerance are improved. There is a need for a method of joining the piezoelectric element and the protrusion inside and increasing the rigidity of the protrusion.
【０００８】[0008]
【課題を解決するための手段】そのために、本発明で
は、 １．複数のインク吐出ノズルと、前記ノズルの各々に連
通するキャビティと、前記ノズルから液滴を飛翔させる
ために前記キャビティに体積変化を付加する部材が、前
記キャビティのダイヤフラムの外側に形成された第１突
起に接続されているインクジェット記録ヘッドにおい
て、前記キャビティ内側に前記第１突起と対向する第２
突起が、前記ダイヤフラムに形成されていること。Therefore, according to the present invention, A plurality of ink ejection nozzles, cavities communicating with each of the nozzles, and a member for adding a volume change to the cavities so as to fly droplets from the nozzles are formed on the outside of the diaphragm of the cavities. In the inkjet recording head connected to the protrusion, a second inner surface of the cavity facing the first protrusion
The protrusion is formed on the diaphragm.
【０００９】２．前記第２突起の剛性が前記第１突起の
剛性よりも大きいこと。2. The rigidity of the second protrusion is greater than the rigidity of the first protrusion.
【００１０】３．前記ダイヤフラムに対する前記第１突
起の投影面積が、前記ダイヤフラムに対する前記第２突
起の投影面積より小さいこと。3. A projected area of the first protrusion on the diaphragm is smaller than a projected area of the second protrusion on the diaphragm.
【００１１】４．複数のインク吐出ノズルと、前記ノズ
ルの各々に連通するキャビティと、前記ノズルから液滴
を飛翔させるために、前記キャビティに体積変化を付加
する部材が、前記キャビティのダイヤフラムの外側に形
成された第１突起に接合されているインクジェット記録
ヘッドにおいて、前記キャビティ内側に前記第１突起と
対向する第２突起と、前記キャビティを形成する壁が同
時に形成されること。4. A plurality of ink discharge nozzles, cavities communicating with each of the nozzles, and a member for applying a volume change to the cavities for ejecting droplets from the nozzles are formed outside the diaphragm of the cavities. In an ink jet recording head joined to one protrusion, a second protrusion facing the first protrusion and a wall forming the cavity are simultaneously formed inside the cavity.
【００１２】を特徴とする。[0012] is characterized.
【００１３】[0013]
【実施例】以下に、図面に基づき本発明の実施例を説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１は本発明の実施例の斜視断面図であ
る。射出成形によりノズル３、キャビティ４が形成され
た第１基板１に、高分子樹脂の薄膜である第２基板２が
接合されている。第２基板２は、キャビティ４部におい
てダイヤフラムとして作用している。第２基板２のキャ
ビティ４部の外側に金属製の第１突起５が形成されてお
り、キャビティ４の内側に第１突起５と対向する金属製
の第２突起が形成されている。第２基板２を第一基板１
に接合する際、第二突起６は必ずキャビティ４にはまる
ことになり、大まかな位置決めができ、微調整がしやす
くなる。同時に突起の剛性向上も図れる。第１突起５に
は、キャビティ４に体積変化を付加する部材である圧電
素子７が接合されており、圧電素子７に電圧を印加する
と、圧電素子７は変位し、第１突起５、第２突起６を変
位させ、第２基板２を変形させる。これによって、キャ
ビティ４に体積変化が生じ、ノズル３よりインク滴が飛
翔する。圧電素子７は従来公知である、バイモルフ型、
積層型の何れでも良い。本実施例においては電界方向に
垂直に変形する圧電横効果を用いた積層型圧電素子を使
用している。電界方向に平行に変形する圧電縦効果を用
いた変位を利用しても本発明の適用範囲に入る。FIG. 1 is a perspective sectional view of an embodiment of the present invention. A second substrate 2, which is a thin film of polymer resin, is bonded to a first substrate 1 having a nozzle 3 and a cavity 4 formed by injection molding. The second substrate 2 acts as a diaphragm in the cavity 4 part. A metal first protrusion 5 is formed outside the cavity 4 of the second substrate 2, and a metal second protrusion that faces the first protrusion 5 is formed inside the cavity 4. Second substrate 2 to first substrate 1
The second protrusion 6 is always fitted into the cavity 4 when it is joined to the base plate, and the rough positioning can be performed and the fine adjustment can be easily performed. At the same time, the rigidity of the protrusion can be improved. A piezoelectric element 7, which is a member that adds a volume change to the cavity 4, is joined to the first protrusion 5, and when a voltage is applied to the piezoelectric element 7, the piezoelectric element 7 is displaced, and the first protrusion 5 and the second protrusion 5 The protrusion 6 is displaced to deform the second substrate 2. As a result, the volume of the cavity 4 changes, and the ink droplets fly from the nozzle 3. The piezoelectric element 7 is a conventionally known bimorph type,
Any of a laminated type may be used. In this embodiment, a laminated piezoelectric element using the piezoelectric lateral effect that deforms perpendicularly to the electric field direction is used. Even if the displacement using the piezoelectric longitudinal effect that deforms parallel to the electric field direction is used, it is within the applicable range of the present invention.
【００１５】尚、第１基板１の流路（キャビティ４およ
びそれに連通する液体の流れる路）はガラス、金属、高
分子樹脂等のエッチング、または感光製樹脂によっても
形成できる。又、ノズル３は第１基板１にレーザー加
工、あるいは機械加工等で形成しても良い。加えて、ノ
ズル３を開けたノズル板を第１基板１に接合しても形成
できる。第２基板２の材質は耐インク性を有し、塑性変
形しにくく、変位能力の高い高分子樹脂フィルムであれ
ば良く、ポリサルホン，ポリイミド，ポリエーテルイミ
ド，ポリカーボネイト，ポリエーテルサルホン等が挙げ
られる。第２基板２の厚みは、第１突起５のみならず、
第２突起６が形成されていても、第２基板２の変形に伴
って発生する反力を極小にし、突起がたわみにくくなる
ように、できるだけ薄い方が良い。本実施例において
は、厚さ７．５μｍのポリイミドフィルムを使用した。
また、第２基板の材質には耐インク性を有するニッケ
ル、ステンレス、チタン、シリコン、ガラス等の薄膜を
利用しても本発明の適用範囲に入る。The flow path of the first substrate 1 (the cavity 4 and the path through which the liquid communicating with the cavity 4) can be formed by etching glass, metal, polymer resin or the like, or by using photosensitive resin. Further, the nozzle 3 may be formed on the first substrate 1 by laser processing or mechanical processing. In addition, it can also be formed by joining a nozzle plate with the nozzle 3 opened to the first substrate 1. The material of the second substrate 2 may be a polymer resin film that has ink resistance, is hard to be plastically deformed, and has a high displacement ability, and examples thereof include polysulfone, polyimide, polyetherimide, polycarbonate, and polyethersulfone. . The thickness of the second substrate 2 is not limited to the first protrusions 5,
Even if the second protrusion 6 is formed, it is preferable that it is as thin as possible so that the reaction force generated due to the deformation of the second substrate 2 is minimized and the protrusion is less likely to bend. In this example, a 7.5 μm thick polyimide film was used.
Further, even if a thin film of ink-resistant nickel, stainless steel, titanium, silicon, glass or the like is used as the material of the second substrate, it is within the applicable range of the present invention.
【００１６】第１突起５、第２突起６は、樹脂フィルム
にニッケルを鍍金し、パターンエッチングを施すことに
よって、フィルムの両面に形成した。この突起の材質
は、樹脂フィルムに鍍金でき、エッチングし易く、耐イ
ンク性を有するものであれば本発明の適用範囲に入る。The first protrusion 5 and the second protrusion 6 were formed on both sides of the film by plating the resin film with nickel and performing pattern etching. The material of the protrusions falls within the scope of the present invention as long as it can be plated on a resin film, is easily etched, and has ink resistance.
【００１７】第２突起６の幅（図２中ｂ）は第１突起５
の幅（図２中ａ）より狭い。その理由は、両面に突起を
設けることにより、必ず両面間の位置ずれが僅かながら
も生ずることと、圧電素子７と第１突起５の接合に接着
剤を用いた場合は、接着剤が第２基板２上にたれる恐れ
があるからである。第１突起と第２突起の位置がずれる
と実際の第２基板２のダイヤフラムとして作用する面積
は減少して、第２基板２の変形能力は極度に落ちる。ま
た、図９に示すように、第１突起５と第２突起６の幅が
正確に一致している場合でも、圧電素子７と第１突起５
の接合時に接着剤が第２基板２上にたれると（図９中イ
部）見かけ上、第一突起５の幅が広くなり、第２基板２
の剛性を上げてしまい、第２基板２の変形能力が極度に
落ちる。第２基板２は変形能力を高めるために極端に薄
くしてあるので、僅かな接着剤の付着が第２基板２の変
形を阻害するのである。The width of the second protrusion 6 (b in FIG. 2) is equal to that of the first protrusion 5.
Width (a in FIG. 2). The reason is that the provision of protrusions on both surfaces inevitably causes a slight positional deviation between the two surfaces, and when an adhesive is used to bond the piezoelectric element 7 and the first protrusion 5, the adhesive is second This is because there is a risk that the substrate 2 will sag. If the positions of the first protrusion and the second protrusion deviate from each other, the area of the second substrate 2 that actually acts as a diaphragm decreases, and the deformability of the second substrate 2 drops extremely. Further, as shown in FIG. 9, even when the widths of the first protrusion 5 and the second protrusion 6 are exactly the same, the piezoelectric element 7 and the first protrusion 5 are
When the adhesive drips on the second substrate 2 during the joining of (see (a) in FIG. 9), the width of the first protrusion 5 apparently becomes wide, and the second substrate 2
The rigidity of the second substrate 2 is increased, and the deformability of the second substrate 2 is extremely reduced. Since the second substrate 2 is extremely thin in order to enhance the deformability, a slight adhesion of the adhesive hinders the deformation of the second substrate 2.
【００１８】尚、本実施例においては、図３に示す様
に、両面エッチングを実施したときに生ずる両面の突起
間の位置ずれを許容できる範囲で、第１突起の第２基板
２に対する投影面積が、第２突起の第２基板に対する投
影面積より小さくなるようにしてある。これは、両面の
突起が長さ方向（図３中ａ）にずれたとき、見かけ上の
突起の長さは長くなり、突起はよりたわみ易くなってし
まい、突起の幅方向（図３中ｂ）に両面の突起がずれた
場合と合わせて、ヘッドとして組み立てたときにインク
吐出特性のバラツキとして現れ、製造歩留まり不良の一
因となるからである。In the present embodiment, as shown in FIG. 3, the projected area of the first projection on the second substrate 2 is within a range in which the positional deviation between the projections on both surfaces caused when the double-sided etching is performed can be allowed. Is smaller than the projected area of the second protrusion on the second substrate. This is because when the protrusions on both sides are displaced in the length direction (a in FIG. 3), the apparent length of the protrusion becomes longer and the protrusion becomes more easily bent, and the protrusion in the width direction (b in FIG. 3). In addition to the case where the protrusions on both sides are deviated, the variation appears in the ink ejection characteristics when assembled as a head, which is a cause of defective manufacturing yield.
【００１９】また、図４（第２基板２をキャビティ４方
向に見た図、圧電素子は図中斜線部）に示すように、第
１突起５の圧電素子７を接着する部分のみ、くびれさせ
ても、本実施例の効果は期待できる。第２突起６はくび
れていないので、第１突起５のくびれた部分に、応力集
中が発生する度合は極めて少なく、接着剤のたれによる
第２基板２の変形能力の低下を防止できる。Further, as shown in FIG. 4 (a view of the second substrate 2 viewed in the direction of the cavity 4, the piezoelectric element is a hatched portion in the drawing), only the portion of the first protrusion 5 to which the piezoelectric element 7 is bonded is made to be constricted. However, the effect of this embodiment can be expected. Since the second protrusion 6 is not constricted, the degree of stress concentration occurring in the constricted portion of the first protrusion 5 is extremely small, and the deterioration of the deformability of the second substrate 2 due to the dripping of the adhesive can be prevented.
【００２０】また、第１突起５の剛性が落ちた分、第２
突起６の高さ（図２中ｃ）を増して補強することも有効
である。第２突起６の高さを高くして突起の剛性を上げ
ても圧電素子７と、第１突起５の公差内の位置ずれが起
きることによる圧電素子７と第１突起５の接合面およ
び、第２基板２と第１突起５の境界面に応力集中がかか
る心配はないからである。Further, since the rigidity of the first protrusion 5 is reduced,
It is also effective to increase the height of the protrusion 6 (c in FIG. 2) for reinforcement. Even if the height of the second protrusion 6 is increased to increase the rigidity of the protrusion, the piezoelectric element 7 and the first protrusion 5 are displaced from each other within the tolerance, and the joint surface between the piezoelectric element 7 and the first protrusion 5 and This is because there is no risk of stress concentration on the boundary surface between the second substrate 2 and the first protrusion 5.
【００２１】図５は本発明の第２実施例を示す断面図で
ある。本発明が第１実施例と異なる点は、第２突起が二
段形状になっている点である。突起の剛性を高め、かつ
第２基板２の変形を阻害しないように、第２突起が第２
基板２に接合している部分を単位圧力を加えたときに最
大体積変化する幅に設定し、二段目はそれより広い幅に
するのである。本実施例によれば、キャビティ４の最大
変化体積を得ることのできる突起幅にすると、突起の剛
性が足りなくなるということはない。本実施例において
は、金属の電鋳法によって図５に示す形状を得た。FIG. 5 is a sectional view showing a second embodiment of the present invention. The present invention is different from the first embodiment in that the second protrusion has a two-step shape. The second protrusion has the second protrusion so as to increase the rigidity of the protrusion and not hinder the deformation of the second substrate 2.
The width of the portion bonded to the substrate 2 is set so that the maximum volume changes when a unit pressure is applied, and the width of the second step is wider than that. According to the present embodiment, when the projection width is such that the maximum change volume of the cavity 4 can be obtained, the rigidity of the projection does not become insufficient. In this example, the shape shown in FIG. 5 was obtained by the metal electroforming method.
【００２２】図６は本発明の、第３実施例を示す断面図
である。本実施例が第１実施例と異なる点は、第２基板
２を両面エッチングすることで、第１突起５、第２基板
２のダイヤフラム部、第２突起６を形成する点である。
第２基板２の材質はエッチングできるもので、耐インク
性を持つものであれば、金属、非金属を問う必要はな
い。例を挙げると、ニッケル、ステンレス，金，銀，チ
タン，シリコンおよび、ポリイミド，ポリサルホン，ポ
リエーテルイミド，ポリカーボネイト，ポリエーテルサ
ルホン等がある。本実施例においては腐食に強く、エッ
チングに最適であるニッケル（Ｎｉ）を用いた。本実施
例の方法によれば、Ｎｉの片面にエッチングを施して、
第２基板２のダイヤフラム部と第１突起５のみ形成する
場合と比べて、第１突起５、第２基板２のダイヤフラム
部、第２突起６を両面エッチングによって同時に形成す
ると突起部分のエッチング時間は大幅に削減でき、作業
工程時間を短縮できるという利点がある。加えて、第１
突起５と第２突起６が一体で成形されるがゆえに、第２
基板２との境界面はなくなり、それぞれを接合して形成
したものの突起と第２基板２の境界面と比べ、飛躍的に
信頼性が向上する。FIG. 6 is a sectional view showing a third embodiment of the present invention. This embodiment is different from the first embodiment in that the second substrate 2 is double-sided etched to form the first protrusion 5, the diaphragm portion of the second substrate 2, and the second protrusion 6.
The material of the second substrate 2 is not limited to metal or non-metal as long as it can be etched and has ink resistance. Examples include nickel, stainless steel, gold, silver, titanium, silicon, polyimide, polysulfone, polyetherimide, polycarbonate, and polyethersulfone. In this embodiment, nickel (Ni), which is resistant to corrosion and most suitable for etching, is used. According to the method of this embodiment, one surface of Ni is etched,
Compared to the case where only the diaphragm portion of the second substrate 2 and the first protrusion 5 are formed, when the first protrusion 5, the diaphragm portion of the second substrate 2, and the second protrusion 6 are simultaneously formed by double-sided etching, the etching time of the protrusion portion is reduced. There is an advantage that it can be significantly reduced and the work process time can be shortened. In addition, the first
Since the projection 5 and the second projection 6 are integrally molded, the second
The boundary surface with the substrate 2 is eliminated, and the reliability is dramatically improved as compared with the boundary surface between the protrusion and the second substrate 2 which are formed by joining them.
【００２３】その他の効果として、第２基板２を金属に
することにより、キャビティ４から外部への水蒸気透過
を防止することができる。これにより、高湿に対して信
頼性の乏しい（高湿時に電極間が導通してしまうマイグ
レーション等の不良が発生する。）圧電素子７、および
接着部の膨潤等による接着力の劣化に対する完全なる保
護となる。As another effect, when the second substrate 2 is made of metal, the permeation of water vapor from the cavity 4 to the outside can be prevented. As a result, the reliability is poor with respect to high humidity (a defect such as migration that causes electrical continuity between electrodes occurs at high humidity) and deterioration of the adhesive force due to swelling of the piezoelectric element 7 and the adhesive portion is completed. Be protected.
【００２４】第２基板２にＳｉを使用した場合は、前記
効果の他に、その表面を酸化しＳｉＯ2 皮膜を形成する
ことにより、濡れ性が向上する。ここで、濡れ性とは、
固体表面に液滴が付着した時の接触面積の度合であり、
接触面積が大きいほど濡れが良いという。ＳｉＯ2 の濡
れが良いということは、圧力室４内に気泡が浸入して
も、気泡が付着することはなく、気泡排出性の向上を図
れる。また、第１突起５に対する接着剤の濡れが良くな
り、圧電素子７と第１突起５の接着性向上につながる。When Si is used for the second substrate 2, the wettability is improved by oxidizing the surface of the second substrate 2 to form a SiO 2 film in addition to the above effects. Here, the wettability is
It is the degree of contact area when droplets adhere to the solid surface,
The larger the contact area, the better the wetting. The good wetting of SiO 2 means that even if air bubbles enter the pressure chamber 4, the air bubbles do not adhere to the pressure chamber 4 and the air bubble discharging property can be improved. In addition, the wettability of the adhesive to the first protrusions 5 is improved, which leads to an improvement in the adhesiveness between the piezoelectric element 7 and the first protrusions 5.
【００２５】また、Ｎｉ等の金属ではその弾性係数が大
きいため、圧電素子７の変位を効率よく変形に変換する
ために、極めて薄くしなければならず、厚み管理の困難
さ、ピンホール等の不良の発生が危虞されるが。第２基
板２にＰｉ（ポリイミド）等の高分子樹脂を用いれば、
弾性係数がＮｉ等と比べ、極めて小さいため、厚みを厚
くでき、フィルムの厚みを管理し易くなる。Further, since a metal such as Ni has a large elastic coefficient, it is necessary to make it extremely thin in order to efficiently convert the displacement of the piezoelectric element 7 into a deformation. Although there is a risk that defects will occur. If a polymer resin such as Pi (polyimide) is used for the second substrate 2,
Since the elastic modulus is extremely smaller than that of Ni or the like, the thickness can be increased and the thickness of the film can be easily controlled.
【００２６】次に、本発明の第４実施例を述べる。本実
施例が第１実施例と異なる点は、第２突起６が流路壁８
と一体成形もしくは、同時成形される点である。Next, a fourth embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that the second protrusion 6 has a flow path wall 8
The point is that they are integrally molded with or simultaneously molded.
【００２７】図７（ａ）に示すように、Ｓｉ（シリコ
ン）板を流路壁８の途中までエッチングし、次に流路壁
８と第２突起６を２度目のエッチングによって形成する
（図７（ｂ））。尚、２度目のエッチングの時は、同時
に第１突起５と、第２基板２をもエッチングする。この
ように流路壁８と第２突起６を一体成形する。第２基板
２、第１突起５、第２突起６を形成する材料は、第２実
施例で記述したエッチングできる材料は、すべて適用で
きる。As shown in FIG. 7 (a), a Si (silicon) plate is etched halfway through the flow path wall 8 and then the flow path wall 8 and the second protrusion 6 are formed by the second etching (FIG. 7 (b)). At the time of the second etching, the first protrusion 5 and the second substrate 2 are also etched at the same time. In this way, the flow path wall 8 and the second protrusion 6 are integrally formed. As the material for forming the second substrate 2, the first protrusions 5, and the second protrusions 6, all the etchable materials described in the second embodiment can be applied.
【００２８】また、別の方法として図８に示すように、
流路壁８の形成に感光性樹脂を使用し、第２基板２側に
流路壁８と同時に第２突起６を感光性樹脂で形成する。
ニッケル薄膜に第１突起を予め電鋳法によって形成した
第２基板２を用いた。第２基板２は高分子樹脂、金属等
の薄膜で予め、第１突起５が形成されていればよい。ま
た、第１突起５は、エッチング、もしくは電鋳法により
形成される。As another method, as shown in FIG.
A photosensitive resin is used to form the flow path wall 8, and the second protrusion 6 is formed on the second substrate 2 side simultaneously with the flow path wall 8 by the photosensitive resin.
The second substrate 2 in which the first protrusions were previously formed on the nickel thin film by electroforming was used. The second substrate 2 may be a thin film of polymer resin, metal or the like, and the first protrusions 5 may be formed in advance. The first protrusion 5 is formed by etching or electroforming.
【００２９】あるいは、高分子樹脂、金属等の薄膜第２
基板２の、両面に感光性樹脂をラミネートし、第１突起
５、流路壁８、第２突起６を形成すると言う手法も挙げ
られる。Alternatively, a thin film of polymer resin, metal, etc.
A method of laminating a photosensitive resin on both surfaces of the substrate 2 to form the first protrusion 5, the flow path wall 8 and the second protrusion 6 can also be mentioned.
【００３０】本発明の実施例によれば、流路壁８と、第
２突起６を同時に形成することにより、流路壁８と第２
突起６の位置精度が極めて正確になり、加えて第１実施
例で記述した効果と合わせて、ヘッド組立によるヘッド
個体間のインク吐出特性バラツキが抑えられ、歩留まり
が向上するという効果がある。According to the embodiment of the present invention, the flow path wall 8 and the second projection 6 are simultaneously formed, so that the flow path wall 8 and the second projection 6 are formed at the same time.
The positional accuracy of the protrusions 6 becomes extremely accurate, and in addition to the effects described in the first embodiment, variations in ink ejection characteristics between individual heads due to head assembly are suppressed, and the yield is improved.
【００３１】[0031]
【発明の効果】以上の実施例によれば、 ・第１突起５と対向する第２突起６を、第２基板２のキ
ャビティ４内側に設ける事。According to the above-described embodiments, the second protrusion 6 facing the first protrusion 5 is provided inside the cavity 4 of the second substrate 2.
【００３２】・第２突起の剛性が第１突起の剛性よりも
大きい事。The rigidity of the second protrusion is greater than the rigidity of the first protrusion.
【００３３】・ダイヤフラムに対する前記第１突起の投
影面積が、前記ダイヤフラムに対する前記第２突起の投
影面積より小さい事。The projected area of the first projection on the diaphragm is smaller than the projected area of the second projection on the diaphragm.
【００３４】・キャビティ内側に、前記第１突起と対向
する第２突起と、前記キャビティを形成する壁が、同時
に形成される事。Inside the cavity, a second protrusion facing the first protrusion and a wall forming the cavity are formed at the same time.
【００３５】により、組立公差内で圧電素子と突起を接
合し、かつ突起の剛性を高めることが可能となり、ノズ
ルの高密度化および、インクジェット記録ヘッドの小型
化が実現できる。By this, it becomes possible to join the piezoelectric element and the protrusion within the assembly tolerance and increase the rigidity of the protrusion, and it is possible to realize high density of the nozzle and miniaturization of the ink jet recording head.
【図１】 第１実施例の斜視断面図。FIG. 1 is a perspective sectional view of a first embodiment.
【図２】 第１実施例のＡ−Ａ断面図。FIG. 2 is a sectional view taken along line AA of the first embodiment.
【図３】 第１実施例の上面及び側面図。FIG. 3 is a top view and a side view of the first embodiment.
【図４】 第１実施例の鳥観図。FIG. 4 is a bird's eye view of the first embodiment.
【図５】 第２実施例の断面図。FIG. 5 is a sectional view of the second embodiment.
【図６】 第３実施例の断面図。FIG. 6 is a sectional view of a third embodiment.
【図７】 第４実施例の工程毎断面図。FIG. 7 is a sectional view of each step of the fourth embodiment.
【図８】 第４実施例の断面図。FIG. 8 is a sectional view of a fourth embodiment.
【図９】 第１実施例の比較断面図。FIG. 9 is a comparative sectional view of the first embodiment.
【図１０】 従来例の分解斜視図。FIG. 10 is an exploded perspective view of a conventional example.
【図１１】 別の従来例の断面図。FIG. 11 is a sectional view of another conventional example.
【図１２】 別の従来例の断面図。FIG. 12 is a sectional view of another conventional example.
１ 第１基板 ２ 第２基板 ３ ノズル ４ キャビティ ５ 第１突起 ６ 第二突起 ７ 圧電素子 ８ 流路壁 ９ インク連絡流路 １０ インク供給路 １１ インク供給準備室 1 1st board 2 2nd board 3 Nozzle 4 Cavity 5 1st protrusion 6 2nd protrusion 7 Piezoelectric element 8 Flow path wall 9 Ink connection flow path 10 Ink supply path 11 Ink supply preparation chamber
Claims (4)
の各々に連通するキャビティと、前記ノズルから液滴を
飛翔させるために前記キャビティに体積変化を付加する
部材が、前記キャビティのダイヤフラムの外側に形成さ
れた第１突起に接続されているインクジェット記録ヘッ
ドにおいて、前記キャビティ内側に前記第１突起と対向
する第２突起が、前記ダイヤフラムに形成されているこ
とを特徴とするインクジェット記録ヘッド。1. A plurality of ink ejection nozzles, a cavity communicating with each of the nozzles, and a member for adding a volume change to the cavity for ejecting droplets from the nozzle are provided outside a diaphragm of the cavity. An inkjet recording head connected to the formed first protrusion, wherein a second protrusion facing the first protrusion is formed on the diaphragm inside the cavity.
性よりも大きいことを特徴とする請求項１記載のインク
ジェット記録ヘッド。2. The ink jet recording head according to claim 1, wherein the rigidity of the second protrusion is greater than the rigidity of the first protrusion.
の投影面積が、前記ダイヤフラムに対する前記第２突起
の投影面積より小さいことを特徴とする請求項１記載の
インクジェット記録ヘッド。3. The ink jet recording head according to claim 1, wherein a projected area of the first projection on the diaphragm is smaller than a projected area of the second projection on the diaphragm.
と、前記キャビティを形成する壁が、同時に形成される
ことを特徴とする請求項１記載のインクジェット記録ヘ
ッドの製造方法。4. The method of manufacturing an ink jet recording head according to claim 1, wherein the second protrusion and the wall forming the cavity are simultaneously formed inside the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17790192A JP3108775B2 (en) | 1992-07-06 | 1992-07-06 | Ink jet recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17790192A JP3108775B2 (en) | 1992-07-06 | 1992-07-06 | Ink jet recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0623982A true JPH0623982A (en) | 1994-02-01 |
| JP3108775B2 JP3108775B2 (en) | 2000-11-13 |
Family
ID=16039047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17790192A Expired - Fee Related JP3108775B2 (en) | 1992-07-06 | 1992-07-06 | Ink jet recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3108775B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7305764B2 (en) | 1999-11-11 | 2007-12-11 | Seiko Epson Corporation | Method of manufacturing an ink-jet recording head |
| JP2013022809A (en) * | 2011-07-20 | 2013-02-04 | Seiko Epson Corp | Liquid ejection head and liquid ejection apparatus |
-
1992
- 1992-07-06 JP JP17790192A patent/JP3108775B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7305764B2 (en) | 1999-11-11 | 2007-12-11 | Seiko Epson Corporation | Method of manufacturing an ink-jet recording head |
| US7867407B2 (en) | 1999-11-11 | 2011-01-11 | Seiko Epson Corporation | Method of manufacturing an ink-jet recording head |
| JP2013022809A (en) * | 2011-07-20 | 2013-02-04 | Seiko Epson Corp | Liquid ejection head and liquid ejection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3108775B2 (en) | 2000-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5754205A (en) | Ink jet recording head with pressure chambers arranged along a 112 lattice orientation in a single-crystal silicon substrate | |
| US7681987B2 (en) | Inkjet recording head | |
| JP3570495B2 (en) | Ink jet recording head | |
| JPH09277531A (en) | Ink-jet head | |
| WO1998042514A1 (en) | Ink jet head, its manufacturing method and ink jet recorder | |
| JP3231523B2 (en) | On-demand type inkjet head | |
| JP3108775B2 (en) | Ink jet recording head | |
| US20020140780A1 (en) | Ink-jet recording head | |
| JP4033371B2 (en) | Ink jet head, manufacturing method thereof, and image forming apparatus | |
| JP3125536B2 (en) | Inkjet head | |
| JPH10202871A (en) | Ink jet recording heat and manufacture thereof | |
| US7163279B2 (en) | Inkjet head having relay member interposed between piezoelectric element and diaphragm | |
| JPH09300635A (en) | Ink jet recording apparatus | |
| JPH07178906A (en) | Ink jet head | |
| JPH10278263A (en) | Ink jet recording head | |
| JP2001030483A (en) | Ink jet head | |
| JP2000218792A (en) | Ink jet head | |
| JP4670205B2 (en) | Inkjet head | |
| JP2005305827A (en) | Liquid ejection head | |
| JP3189575B2 (en) | Ink jet recording head | |
| JPH03121850A (en) | Ink jet printer head and its manufacture | |
| JP4055883B2 (en) | Droplet discharge head | |
| JP2000334949A (en) | Ink jet head | |
| JPH11992A (en) | Ink jet head | |
| JP2001179988A (en) | Nozzle forming member, ink jet head and ink jet recorder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20080914 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080914 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20090914 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20090914 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20100914 |
|
| LAPS | Cancellation because of no payment of annual fees |