JPH06236825A - Electronic part - Google Patents

Abstract

PURPOSE:To obtain an accurate fixing state for an electronic part by improving the mountability of a mounting leg to the mounting part of an electronic part, to prevent discontinuity of a wire, to miniaturize the machine, and to cut down the cost production. CONSTITUTION:An outward protrusion 6 is provided on the circumference of an electronic part 1. The outward protrusion 6 is constituted in such a manner that its one end is allowed to be engaged by one end of the first mounting leg to be inserted by insulation-coating the circumference of the electronic part l. Besides, the outward protrusion of the electronic part is engaged from the other end side to the second mounting leg 3 which is inserted to the circumference of the first mounting leg 2, integrally assembled and insulation-coating the electronic part, and an inward protrusion 12, which is inserted to the first mounting leg 2, is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suitable for use in fixing an electronic component such as a capacitor to a mounted portion such as a chassis with an insulating state by screwing.

[0002]

2. Description of the Related Art For example, an electronic component such as an aluminum electrolytic capacitor usually has a structure in which a capacitor element is housed in a cylindrical aluminum case, and a lid is put on and sealed. In addition, the aluminum case of such an electronic component is insulation-coated with an exterior material such as a thin insulating tube in order to ensure insulation.

In order to mount this kind of electronic component on a mounting substrate such as a chassis, conventionally, mounting legs made of metal bands have been used. At that time, use a jig or the like to assemble the mounting leg at a predetermined position such as the bottom or center of the electronic component, either directly or with a thick insulating cylinder inside and mount with this mounting leg. It was fixed on the substrate.

[0004]

However, when the conventional mounting leg using the metal band described above is used, positioning is troublesome because a special jig is required to mount the electronic component at a predetermined position. However, there is a drawback that the mounting work is complicated and difficult.

Further, when the electronic component as described above is mounted in a place where it is susceptible to vibration such as a vehicle or an automobile, it moves due to the vibration and changes its position in relation to the mounting leg, and as a result, other It has been unavoidable that problems such as defective connection such as disconnection or disconnection of electronic parts and the like will occur. Therefore, vibration resistance is also a problem when the above-mentioned electronic component is mounted and fixed on a mounting substrate and then mounted on a component such as a vehicle that is placed under a vibration condition.

Further, in the conventional structure, the insulating exterior wound on the outside of the case is thin. Aluminum electrolytic capacitors that are normally mounted using this type of metallic band are practically 600
It may be used at a voltage of about V. When the outer side of this capacitor is attached and fixed using the conventional mounting leg made of a metal band, sufficient withstand voltage cannot be obtained, and there is a risk of insulation failure.

Moreover, in such a conventional structure, since the mounting legs are made of metal, when a plurality of electronic components are mounted side by side on a mounting substrate such as a chassis, they are sufficiently separated for insulation. There is also a drawback that it hinders miniaturization of the device. Further, there is a problem in that the cost is increased when the insulating cylindrical body is interposed inside the mounting leg.

Particularly, in such a conventional structure, since the mounting leg is made of a metal band, it is conceivable to use an insulating substrate in place of the metal chassis in order to maintain the insulating property. The substrate causes high cost and heavy weight. Moreover, when a plurality of electronic components are arranged in parallel and connected in series, there is a drawback that a sufficient creepage distance must be maintained so that the metal mounting legs do not come into direct contact with each other.

The present invention has been made in view of the above circumstances, and when the electronic parts are attached and fixed to the attached portion in consideration of the insulation and vibration resistance.
It does not require troublesome positioning and mounting work, and it can be mounted and fixed very easily and securely, and can be installed side by side on the board while maintaining a reliable insulating state, and it is not susceptible to adverse effects such as vibration. The purpose of the present invention is to obtain an electronic component that can prevent disconnection defects and the like, and can also reduce the size and cost of the device.

[0010]

In order to meet such a demand, an electronic component according to the present invention is an electronic component provided with an outward projection on the periphery thereof, and the periphery thereof is fitted with an insulating coating and An insulative first mounting leg that locks the outward projection of the electronic component from one end at one end, and the first mounting leg is fitted around the first mounting leg and integrally assembled to insulate the electronic component. And a second mounting leg having an inward protrusion on one end side for locking the outward protrusion of the electronic component from the other end side to the one end portion of the first mounting leg. Is.

Further, the electronic component according to the present invention has a plurality of elastically deformable pieces which are elastically deformable by forming a plurality of slits in the one end portion of the first mounting leg in the axial direction. A split portion is formed, and the outer side of the slit portion of the first mounting leg is formed by a tapered surface whose diameter decreases toward the end side, and the second mounting leg of the second mounting leg fitted on the outer side is formed. The inner wall portion is formed in a tapered surface shape in which each elastic deformation piece is brought into close contact with the electronic component side.

[0012]

According to the present invention, the outward protrusion provided around the electronic component is sandwiched between the one end portion of the first mounting leg and the inward protrusion on the one end side of the second mounting leg to form the electronic component. Since it is locked and held and these mounting legs are integrally assembled, vibration resistance,
It is mounted and fixed to the mounted part while maintaining positional accuracy. Further, since the first mounting leg and the second mounting leg are fitted so as to cover the electronic component with insulation, the insulation property is also excellent.

Further, according to the present invention, a first mounting leg is formed with a plurality of slits at one end thereof and a tapered surface on the outer side thereof, and the second mounting leg is opposed thereto. Since the first mounting leg is pressed against and covered by the electronic component by the tapered inner wall portion of, the elastic deformation piece in the slit portion of the first mounting leg is strongly pressed against and held by the electronic component to prevent vibration. Is secured and there is no problem such as disconnection defect, it is mounted and fixed to the mounted part.

[0014]

1 to 4 show an embodiment of an electronic component according to the present invention. In these drawings, in this embodiment, an electronic component 1 having a substantially cylindrical shape, such as an aluminum electrolytic capacitor, is shown in FIG. A case of mounting and fixing the mounting substrate 4 as the mounted portion via the first and second mounting legs 2 and 3 will be described.

Here, reference numeral 5 in FIG. 1 denotes a bottomed cylindrical metal case of the electronic component 1. Reference numeral 6 is a continuous outward projection having a substantially R-shaped cross section, which is provided along the circumferential direction on the outer peripheral surface near the center of the metal case 5. In addition,
The outward protrusions 6 may be provided intermittently around the metal case 5 at predetermined intervals in the circumferential direction. Further, 7 is an exterior made of an insulating tube covering the metal case 5, 8
Is a thin insulating plate material pressed against the bottom of the metal case 5 by the end of the exterior 7.

As is apparent from FIGS. 1 and 2 (a) and (b), the first mounting leg 2 is an insulating resin member having a substantially cylindrical shape as a whole, and an end portion 9 on the upper end side. Is fitted and attached to the electronic component 1 in a state of being arranged so as to face the vicinity of one end side of the outward projection 6, and the electronic component 1 is insulated and coated.

Here, the end portion 9 of the first mounting leg 2 is
The inner surface of the end portion is formed as a curved inclined surface so as to come into contact with one end side of the outward projection 6 on the electronic component 1 side and hold and hold it. Further, flanges 10 and 10 are formed at two places facing each other around the substantially central portion of the first mounting leg 2, and these flanges 10 and 10 have through holes for screwing screws to be described later. 10a, 10a are formed.

As is apparent from FIGS. 1 and 3, the second mounting leg 3 is formed as an insulating resin member having a substantially cylindrical shape, and its inner diameter is substantially the same as the outer diameter of the first mounting leg 2. Match. The second mounting leg 3 is fitted on the upper end side of the flanges 10 of the first mounting leg 2, and the end 11 on the upper end side is the other end of the outward projection 6 of the electronic component 1. The first mounting leg 2 is mounted so as to cover the first mounting leg 2.

An inward projection 12 is provided on the inner wall portion of the end portion 11 on the upper end side of the second mounting leg 3. As shown in FIG. 1 and FIG. 3B, the inward projection 12 is sandwiched between the outward projection 6 of the electronic component 1 and the end 9 of the first mounting leg 2. In addition, it has a substantially trapezoidal shape and is formed with a height substantially the same as the thickness of the first mounting leg 2. That is, inside the upper end portion 11 of the second mounting leg 3, a curved recess 13 is formed in conformity with the shape of the other end surface of the outward projection 6, and the outward projection 6 is formed.
It comes into contact with the other end side of.

It should be noted that collars 14 and 14 are provided at the positions facing each other around the second mounting leg 3 so that the collar 1
Numerals 4 and 14 are rooted from the lower part to the central part of the second mounting leg 3, and the upper surface 15 is inclined and drawn from the central part to the lower part. Further, through holes 16 and 16 are provided in these collars 14 and 14 at positions corresponding to the through holes 10a, as in the first mounting leg 2 side.

In order to mount the electronic component 1 on the mounting substrate 4 in such a structure, first, a part of the first mounting leg 2 is inserted into the hole 18 formed in the substrate 4, and the collars 10 and 10 are mounted on the substrate. Place on the surface of 4. At this time, the positions of the through holes 10a, 10a provided in the collars 10, 10 are aligned with the positions of the screw holes 19 provided in the substrate 4 in advance.

Next, the electronic component 1 is inserted into the first mounting leg 2 through the hole 18, and the outward projection 6 is brought into contact with the upper end 9 to be supported. Further, the second mounting leg 3 is passed through the electronic component 1 to be fitted on the first mounting leg 2 to cover the first mounting leg 2. The collars 14, 14 of the second mounting leg 3 are aligned with the positions of the collars 10, 10 of the first mounting leg 2.

In addition, the inward projection 12 of the second mounting leg 3,
12 is brought into contact with the other end side of the outward projection 6 of the electronic component 1. Then, after covering the first mounting leg 2 with the second mounting leg 3, the electronic component 1 is mounted on the substrate 4 by screwing the screw 20 through the through holes 16 and 10a and screwing the screw 20 into the screw hole 19. After fixing, the mounting of the electronic component 1 on the substrate 4 is completed.

According to such an embodiment structure, the outward projection 6 provided on the metal case 5 is provided on the one end portion 9 of the first mounting leg 2 and the upper end portion 11 of the second mounting leg 3. The structure is such that it is sandwiched by the inward projection 12 and is retained by locking.

Therefore, according to this structure, the first mounting leg 2 and the second mounting leg 3 can be easily positioned. Further, the electronic component 1 can be securely held and fixed against vibration such as vertical movement. In particular, the outward projection 6 of the electronic component 1 has the end portion 9 of the first mounting leg 2 that sandwiches it.
Further, since the second mounting leg 3 is held by the in-plane protrusion 12 of the second mounting leg 3 in the state of surface contact with the inclined surface, the second mounting leg 3 can be more reliably held and fixed. And the first mounting leg 2
Also, since the second mounting leg 3 is made of an insulating resin, it is possible to secure an insulating state between the electronic component 1 and the mounting substrate 4 made of metal.

FIGS. 5 to 7 show another embodiment of the present invention. In these figures, the same or corresponding parts as those in FIGS. 1 to 4 described above are designated by the same reference numerals and their description is omitted. To do.

Now, in this embodiment, a plurality of slits 30 are formed in the upper end portion of the first mounting leg 2 in the axial direction as substantially U-shaped notches so that a plurality of elastically deformable slots 30 can be formed. The slot portion 32 having the elastically deformable piece 31 is formed.

Further, the outer side of the slotted portion 32 of the first mounting leg 2 is formed with a tapered surface 33 having a diameter reduced toward the end side, and a second surface fitted to the outer side. When the inner wall portion 35 of the mounting leg 3 is mounted, each elastic deformation piece 3
1 is formed in a tapered surface shape so as to be in close contact with the electronic component 1 side.

Here, the tapered surface 33 of the first mounting leg 2 described above is formed in a tapered shape in which the outer peripheral surface of the upper end portion becomes thinner from the middle to the upper end. Further, the tapered inner wall portion 35 of the second mounting leg 3 is formed in such a shape that the inner wall of the upper end portion becomes thicker toward the upper end.
In this embodiment, an R-shaped recess 13 is provided immediately below the inward projection 12 on the inner wall of the upper end portion of the second mounting leg 3 so that the outward projection 6 of the electronic component 1 engages with the recess 13. However, the recess 13 may be omitted.

Also with the above-described structure, as in the above-described embodiment, the first mounting leg 2 is inserted into the hole 18 of the board 4, the collars 10 and 10 are placed on the surface of the board 4, and the through holes are formed. The positions of 10a and 10a are aligned with the positions of the screw holes 19 of the substrate 4. Next, the electronic component 1 is inserted into and retained in the first mounting leg 2 that is retained through the hole 18, and the outward projection 6 thereof is provided on the upper end side of the first mounting leg 2. The elastic deformation piece 31 of the split portion 32 is brought into contact with and supported by the upper end side of the elastic deformation piece 31, and the second mounting leg 3 is passed through the electronic component 1 to make the first
It is fitted and covered on the mounting leg 2 of the
To the positions of the collars 10 and 10 of the first mounting leg 2.

In addition, the inward projection 12 of the second mounting leg 3,
12 is brought into contact with the other end side of the outward projection 6 of the electronic component 1, the first mounting leg 2 is covered with the second mounting leg 3, and then the screw 20 is passed through the through holes 16 and 10a. By screwing into the screw hole 19, the electronic component 1 is fixed to the substrate 4 which is the mounted portion, and the mounting is completed.

According to the structure of this embodiment,
The tip of the slot 32 of the first mounting leg 2 and the inward projection 12 of the second mounting leg 3 are located on both ends of the outwardly projecting projection 6 provided on the metal case 5, and are sandwiched by these. In the closed state, the electronic component 1 is locked and held, and is screwed and fixed onto the mounting substrate 4 by the mounting legs 2 and 3. By this last screwing, the tip of the first mounting leg 2 and the protrusion 6 of the case 5
There is a slight gap between and.

In particular, by fitting the second mounting leg 3 to the first mounting leg 2 and fixing the second mounting leg 3 on the mounting substrate 4 with the screw 20, the end of the first mounting leg 2 which is elasticized. The slotted portion 32 of the portion is the tapered inner wall portion 3 of the second mounting leg 3.
An inward tightening force is applied by 5 and each elastic deformation piece 31 is strongly pressed against the outer periphery of the electronic component 1, so that the first mounting leg 2 and the electronic component 1 are integrated. Further, the first mounting leg 2 and the second mounting leg 3 are also integrated by the tapered portion and are completely fixed. And
The mounting legs 2 and 3 and the outward projections 6 of the electronic component 1 not only enable the mounting position of the electronic component 1 on the substrate 4 to be performed accurately, but also prevent the electronic component from vibrating vertically. 1 can be securely fixed.

Further, according to the electronic component 1 as described above, the electronic component 1 is mounted on the mounting substrate only by sequentially fitting the first and second mounting legs 2 and 3 around the electronic component 1 from one direction. 4 can be attached and fixed to the electronic component 4, the installation work is easy, and a reliable attached and fixed state can be obtained.
The insulation of can be secured.

The present invention is not limited to the structure of the embodiment described above, and it is needless to say that the shape, structure, etc. of each part can be appropriately modified and changed. For example, the first and second mounting legs 2 and 3 can be used.
Various modified examples can be considered, including the structure of the mounting portion to the mounting substrate 4 as the mounted portion in FIG. Further, in the above-mentioned embodiment, the aluminum electrolytic capacitor is exemplified as the electronic component 1, but it goes without saying that the invention is not limited to this.

[0036]

As described above, according to the electronic component of the present invention, the electronic component, which is provided with the outward protrusions on the periphery thereof, is fitted so as to insulate, and the one end portion of the electronic component faces outward. Insulating first that locks the protrusion from one end
Between the mounting leg and the first mounting leg and integrally assembled to insulate and cover the electronic component, and the outward projection of the electronic component is provided between the other end side and one end of the first mounting leg. Since it has a second mounting leg having an inward projection that is inserted into and locked at one end side,
It has various excellent effects listed below.

That is, the outward protrusion of the electronic component is sandwiched by the one end portion of the first mounting leg and the inward protrusion on the one end side of the second mounting leg that are fitted to insulate the electronic component. By inserting it, it becomes possible to easily and surely hold and hold it, and it is possible to attach and fix it to the attached portion via these attachment legs.

In particular, since the electronic parts can be fixed at the two places of the outwardly projecting portion and the main body portion, they are strong against vibration and impact and can be stably mounted even under vibration conditions such as a vehicle. A fixed state can be secured.

Further, the outward projections provided around the electronic component can be used as a reference for mounting the first and second mounting legs, and the positioning of the electronic component and the mounting leg can be facilitated. Assembly and installation work is also easy.

Further, according to the electronic component of the present invention, the first mounting leg has a plurality of elastically deformable pieces which are elastically deformable at one end thereof and are formed with a plurality of slits in the axial direction. A split portion is formed, and the outside of the slit portion of the first mounting leg is formed with a tapered surface that reduces its diameter toward the end side, and the second mounting is fitted to the outside. Since the inner wall of the leg is formed with a tapered surface shape that allows each elastic deformation piece to be in close contact with the electronic component side, despite the simple structure, in addition to the effects described above, the following excellent effects are listed. Play.

That is, when the second mounting leg is fitted and covered with the first mounting leg, the elastic deformation piece in the slit portion of the first mounting leg can be strongly pressed against the electronic component. Since the end portions of the first and second mounting legs are placed on both ends of the outward protrusion and sandwiched, the electronic component is positioned at the position of the outward protrusion at the position of the outward protrusion even when vibrating. It can be fixed while maintaining the relationship, which eliminates problems such as disconnection defects.

In particular, when it is tightened and held by the elastically deformable piece of the slotted portion, it is strong against vibration and impact under the vibration condition mounted on the vehicle, etc., and secures a stable mounting and fixing state. You can

Further, according to the present invention, both the first mounting leg and the second mounting leg have an insulating property and coat them around the electronic component, so that a reliable insulating property is obtained. It is possible to secure a plurality of series and parallel circuits even with a circuit of several thousand volts. For example, when arranging a plurality of electronic parts side by side, they can be arranged close to each other, and the size of the device can be reduced. The cost can be reduced. this is,
It is also advantageous in that no metal band is required.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an attachment state of an electronic component according to an embodiment of the present invention to a mounting substrate as a mounted portion.

FIG. 2 shows the first mounting leg used in FIG. 1, (a) is a schematic plan view, and (b) is a schematic sectional view.

FIG. 3 shows a second mounting leg used in FIG. 1, (a) is a schematic plan view, and (b) is a schematic sectional view.

FIG. 4 is a schematic perspective view showing an assembled state of a suitable electronic component and mounting leg to which the present invention is applied.

FIG. 5 is a schematic cross-sectional view showing a mounting state of the electronic component according to another embodiment of the present invention on a mounting substrate as a mounted portion.

FIG. 6 shows the first mounting leg used in FIG. 5, (a) is a schematic plan view, and (b) is a schematic sectional view.

FIG. 7 shows the second mounting leg used in FIG. 5, (a) is a schematic plan view, and (b) is a schematic sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 1st mounting leg 3 2nd mounting leg 4 Mounting board (attached part) 6 Inward protrusion 9 Upper end side edge 10 Collar 10a Through hole 11 Upper end side 12 Inward protrusion 13 Indent 14 Collar 16 Through hole 18 Hole 19 Screw hole 20 Screw 30 Slot 31 Elastic deformation piece 32 Slot portion 33 Tapered surface 35 Tapered inner wall portion

Front page continued (72) Inventor Seiji Yamaguchi 1065 Kushita, Ninomiya-cho, Haga-gun, Tochigi Prefecture Hitachi AIC Co., Ltd. (72) Inventor Hitoshi Kudo Tokyo Fuchu-shi, Toshiba No. 1 Toshiba Fuchu Factory Co., Ltd.

Claims (3)

[Claims] 1. An electronic component provided with an outward protrusion on the periphery thereof, and an electronic component is fitted around the periphery of the electronic component by insulation coating, and one end portion of the electronic component locks the outward protrusion of the electronic component from one end side. An insulative first mounting leg and a first mounting leg are fitted around the first mounting leg to be integrally assembled to insulate and cover the electronic component, and the outward projection of the electronic component is engaged from the other end side. A second end having an inward protrusion that is stopped and sandwiched between the first end and one end of the first mounting leg.
An electronic component having a mounting leg of. 2. The electronic component according to claim 1, wherein a plurality of slits are formed in one end portion of the first mounting leg in the axial direction so as to be elastically deformable. Electronic components to do. 3. The electronic component according to claim 2, wherein the outer side of the elastically deformable piece forming the slotted portion of the first mounting leg is formed with a tapered surface that reduces its diameter toward the end side. An electronic component, wherein an inner wall portion of the second mounting leg fitted on the outer side of the second mounting leg is formed in a tapered surface shape for closely contacting each of the elastic deformation pieces with the electronic component.