JPH06229765A - Angular speed sensor - Google Patents

Angular speed sensor

Info

Publication number
JPH06229765A
JPH06229765A JP5018874A JP1887493A JPH06229765A JP H06229765 A JPH06229765 A JP H06229765A JP 5018874 A JP5018874 A JP 5018874A JP 1887493 A JP1887493 A JP 1887493A JP H06229765 A JPH06229765 A JP H06229765A
Authority
JP
Japan
Prior art keywords
solder
driving
electrode
soldering
angular velocity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5018874A
Other languages
Japanese (ja)
Inventor
Katsuyoshi Mizumoto
元 克 芳 水
Toru Watanabe
辺 徹 渡
Akihiro Kobayashi
林 聡 宏 小
Masayuki Sato
藤 雅 之 佐
Koji Kajino
野 浩 司 梶
Hideya Kurachi
知 秀 哉 倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP5018874A priority Critical patent/JPH06229765A/en
Publication of JPH06229765A publication Critical patent/JPH06229765A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate fluctuation in the soldered area and the quantity of solder by adding a component for accelerating soldering to the wiring parts of driving and detecting electrodes thereby facilitating the soldering work. CONSTITUTION:When a component, e.g. zinc, tin or nickel, is added to the wiring parts 11a, 12a of driving and detecting electrodes 11, 12, soldering work is facilitated and the strength of solder is enhanced. Furthermore, the solder is constricted within the wiring parts 11a, 12a by the surface tension thereof and the soldering range is specified thus suppressing fluctuation in the quantity of solder. Furthermore, the solder is not fed to unrequired part and thereby has no adverse effect on the oscillation of an oscillator 10 thus preventing the accuracy of sensor from lowering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業状の利用分野】本発明は、角速度センサに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an angular velocity sensor.

【0002】[0002]

【従来の技術】従来、この種の角速度センサにおいて、
駆動用及び検出用電極は、振動体の外周に金属粉を含ん
だペーストを印刷して着設される。このとき、公知の技
術においてペーストにフリット成分を加えることによっ
て、振動体とペーストとの密着性を向上させている。そ
して、GB2154739Bに開示されるように、電極
に直接リード線をはんだ付けして結線する。
2. Description of the Related Art Conventionally, in this type of angular velocity sensor,
The drive and detection electrodes are attached by printing a paste containing metal powder on the outer periphery of the vibrating body. At this time, the adhesion between the vibrating body and the paste is improved by adding a frit component to the paste by a known technique. Then, as disclosed in GB2154739B, the lead wire is directly soldered to the electrode for connection.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記した従来
の技術では、フリット成分を含む電極に直接はんだ付け
をして結線を行うが、フリット成分を含む電極ははんだ
が付きにくいために結線作業が困難で、且つ、はんだ強
度が低いという問題がある。更に、電極の表面は一様な
平面であり、はんだ付け後のはんだ量にばらつきが大き
いためにインピーダンスのばらつきが大きく、センサの
出力に悪影響を及ぼしてセンサ精度の低下に繋がる。
又、電極の表面が一様な平面であることにより、はんだ
が必要以上に付いてしまって振動体の振動に影響を及ぼ
すようなことがあると、振動体の振動に影響を及ぼす。
この従来の角速度センサは、振動部の振動の変化による
検出用電極からの出力電圧の変化により検知物体の回転
の角速度を検知するため、はんだが振動部の振動に影響
を及ぼすと、出力電圧にも影響が及び、センサ精度の低
下に繋がる。
However, in the above-mentioned conventional technique, the electrode containing the frit component is directly soldered for connection, but since the electrode containing the frit component is less likely to be soldered, the connection work is difficult. There is a problem that it is difficult and the solder strength is low. Furthermore, the surface of the electrode is a uniform flat surface, and the variation in the amount of solder after soldering is large, resulting in a large variation in impedance, which adversely affects the output of the sensor and leads to a decrease in sensor accuracy.
Further, if the surface of the electrode is a flat surface, if the solder adheres more than necessary and affects the vibration of the vibrating body, the vibration of the vibrating body is affected.
This conventional angular velocity sensor detects the angular velocity of the rotation of the sensing object by the change in the output voltage from the detection electrode due to the change in the vibration of the vibrating part. Also affects the accuracy of the sensor.

【0004】本発明は、はんだが付きやすく、はんだ付
け後のはんだの量をほぼ一定にでき、所定範囲内ではん
だ付けが行われるようにすることを技術的課題とする。
It is a technical object of the present invention to make it easy to attach solder, to make the amount of solder after soldering substantially constant, and to perform soldering within a predetermined range.

【0005】[0005]

【課題を解決するための手段】上記した技術的課題を解
決するため本発明において講じた技術的手段は、円筒形
状を呈し圧電材料からなる振動体と、振動体の主要面に
夫々付着される駆動用及び検出用電極と、駆動用電極に
電圧を印加する電源と、検出用電極からの出力電圧から
角速度を演算する演算装置と、駆動用及び検出用電極に
はんだ付けにより接合され駆動用電極と電源並びに検出
用電極と演算装置を電気的に導通するリード線とを有す
る角速度センサにおいて、駆動用及び検出用電極上に設
けられはんだが付きやすい成分を含んでリード線がはん
だ付けされる結線部を備えたことである。
The technical means taken in the present invention for solving the above-mentioned technical problems are a vibrating body having a cylindrical shape and made of a piezoelectric material, and attached to a main surface of the vibrating body, respectively. Driving and detecting electrodes, a power supply that applies a voltage to the driving electrodes, an arithmetic unit that calculates the angular velocity from the output voltage from the detecting electrodes, and a driving electrode that is joined to the driving and detecting electrodes by soldering. In an angular velocity sensor having a power source, a detection electrode, and a lead wire that electrically connects the arithmetic device to each other, in the angular velocity sensor, the lead wire is soldered with a component that is provided on the driving and detection electrodes and that easily attaches solder. Is to have a section.

【0006】[0006]

【作用】本発明の作用を説明する。結線部にははんだが
付きやすい成分が含まれているので、はんだが付きやす
くはんだ付け作業が容易である。又、はんだは表面張力
を有し、且つ、電極上に結線部をそなえているために、
はんだは結線部からはみ出しにくくなり、はんだ付けの
範囲が特定されることによって、はんだ付け後のはんだ
面積のばらつきが小さくなり、それと同時にはんだ量の
ばらつきが小さくなる。更に、はんだが振動部の振動に
影響を及ぼす所にまで付かなくなるので、センサ精度の
低下が防止される。
The function of the present invention will be described. Since the connection portion contains a component to which solder easily attaches, it is easy to attach solder and the soldering work is easy. Further, since the solder has a surface tension and has a connecting portion on the electrode,
The solder is less likely to stick out from the connection portion, and the solder area after the soldering is reduced by specifying the soldering range, and at the same time, the variation in the solder amount is reduced. Further, since the solder does not reach the place that affects the vibration of the vibrating portion, the sensor accuracy is prevented from being degraded.

【0007】[0007]

【実施例】本発明に係る一実施例を図面に基づいて説明
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings.

【0008】図1は、本実施例の角速度センサの半断面
図である。同図において、10は圧電材料よりなる円筒
形状を呈した振動体であり、この振動体10の外周に
は、駆動用電極11及び検出用電極12が交互に8つ印
刷され、並びに、これらの図中上方に分極処理をするた
めの上部外周電極13が印刷され、並びに、振動体10
の内側の全面にわたりアース電極15が印刷されてい
る。駆動用及び検出用電極11、12、上部外周電極1
3、アース電極15は、それぞれフリット成分を含有し
ており、振動体10との密着性が高くなっている。振動
体10は、下端を金属製の固定体14に固定され、上に
行くほど振動が大きくなる。固定体14は、円柱状の支
持部14aにおいて検知物体(図示省略)に固定され、
振動体10の振動の変化による検出用電極12からの出
力電圧で検知物体の回転角速度を測定するようになって
いる。駆動用及び検出用電極11、12上にはそれぞ
れ、例えば亜鉛、すず、ニッケル等を含有した結線部1
1a、12aが印刷されている。
FIG. 1 is a half sectional view of the angular velocity sensor of this embodiment. In the figure, reference numeral 10 is a cylindrical vibrating body made of a piezoelectric material, and eight driving electrodes 11 and detection electrodes 12 are alternately printed on the outer periphery of the vibrating body 10, and An upper peripheral electrode 13 for performing a polarization process is printed on the upper side in the drawing, and the vibrating body 10 is also provided.
The ground electrode 15 is printed on the entire inner surface of the. Driving and detecting electrodes 11 and 12, upper peripheral electrode 1
3 and the ground electrode 15 each contain a frit component, and have high adhesion to the vibrating body 10. The lower end of the vibrating body 10 is fixed to a metal fixed body 14, and the vibration increases as it goes upward. The fixed body 14 is fixed to a detection object (not shown) at the cylindrical support portion 14a,
The rotational angular velocity of the detection object is measured by the output voltage from the detection electrode 12 due to the change in the vibration of the vibrating body 10. A connection portion 1 containing, for example, zinc, tin, nickel, or the like, is provided on each of the driving and detection electrodes 11 and 12.
1a and 12a are printed.

【0009】駆動用電極11上の結線部11aは、リー
ド線(図示省略)を介して電源(図示省略)と電気的に
導通可能である。又、検出用電極12上の結線部12a
は、リード線を介して演算装置(図示省略)と電気的に
導通可能である。
The connection portion 11a on the driving electrode 11 can be electrically connected to a power source (not shown) via a lead wire (not shown). In addition, the connection portion 12a on the detection electrode 12
Can be electrically connected to an arithmetic unit (not shown) via a lead wire.

【0010】次に本発明の作用を説明する。Next, the operation of the present invention will be described.

【0011】駆動用及び検出用電極11、12の結線部
11a、12aにはそれぞれ、亜鉛、すず、ニッケル等
の成分が含有されているために、結線部11a、12a
にはんだが付きやすく、はんだ付け作業が容易で、且つ
はんだ強度が大きい。又、はんだは表面張力により結線
部11a、12aからはみ出しにくく、且つ、はんだ付
けの範囲が特定されるために、はんだ付け後のはんだ量
のばらつきが小さい。
Since the connecting portions 11a and 12a of the driving and detecting electrodes 11 and 12 respectively contain components such as zinc, tin and nickel, the connecting portions 11a and 12a.
Solder is easy to attach, soldering work is easy, and solder strength is high. Further, the solder is less likely to protrude from the wire connection portions 11a and 12a due to the surface tension, and the range of soldering is specified, so that the variation in the amount of solder after soldering is small.

【0012】更に、はんだが不要なところに付いたりし
ないので、振動部10の振動に影響を及ぼすようなとこ
ろに付かないので、振動体10の振動に悪影響を及ぼす
ことがなくなり、センサ精度の低下が防止される。
Further, since the solder is not attached to unnecessary portions, it is not attached to a portion that affects the vibration of the vibrating portion 10, so that the vibration of the vibrating body 10 is not adversely affected and the sensor accuracy is reduced. Is prevented.

【0013】[0013]

【発明の効果】本発明の効果を説明する。円筒形状を呈
し圧電材料からなる振動体と、振動体の主要面に夫々付
着される駆動用及び検出用電極と、駆動用電極に電圧を
印加する電源と、検出用電極からの出力電圧から角速度
を演算する演算装置と、駆動用及び検出用電極にはんだ
付けにより接合され駆動用電極と電源並びに検出用電極
と演算装置を電気的に導通するリード線とを有する角速
度センサにおいて、駆動用及び検出用電極上に設けられ
はんだが付きやすい成分を含んでリード線がはんだ付け
される結線部を備えたことを特徴とする角速度センサに
おいて、結線部の幅がはんだ付けされない部位において
任意に狭く形成されていることを特徴とする角速度セン
サであって、結線部にははんだが付きやすい成分が含ま
れているので、はんだが付きやすくはんだ付け作業が容
易である。又、はんだは表面張力を有し、且つ、電極上
に結線部をそなえているために、はんだは結線部からは
み出しにくくなり、はんだ付けの範囲が特定されること
によって、はんだ付け後のはんだ面積のばらつきが小さ
くなり、それと同時にはんだ量のばらつきが小さくな
る。更に、はんだが振動部の振動に影響を及ぼす所にま
で付かなくなるので、センサ精度の低下が防止される。
The effects of the present invention will be described. A vibrating body that has a cylindrical shape and is made of a piezoelectric material, drive and detection electrodes that are attached to the main surfaces of the vibrating body, a power supply that applies a voltage to the drive electrode, and an angular velocity based on the output voltage from the detection electrode. In an angular velocity sensor having an arithmetic unit for calculating the following, and a drive electrode and a power source that are joined to the driving and detecting electrodes by soldering and a lead wire that electrically connects the detecting electrode and the arithmetic unit, In the angular velocity sensor, which is provided on the electrode for use and has a connecting portion to which the lead wire is soldered, which includes a component to which solder easily attaches, in the angular velocity sensor, the width of the connecting portion is arbitrarily narrowed in a portion not to be soldered. The angular velocity sensor is characterized in that the wiring part contains a component that easily attaches solder, so soldering is easy and soldering work is easy. That. In addition, since the solder has surface tension and the wire connection part is provided on the electrode, it is difficult for the solder to protrude from the wire connection part, and the soldering area after the soldering is specified by specifying the soldering range. Of the solder amount is reduced, and at the same time, the amount of solder is also reduced. Further, since the solder does not reach the place that affects the vibration of the vibrating portion, the sensor accuracy is prevented from being degraded.

【図面の簡単な説明】[Brief description of drawings]

【図1】本実施例の角速度センサの半断面図である。FIG. 1 is a half sectional view of an angular velocity sensor of this embodiment.

【符号の説明】[Explanation of symbols]

10・・・振動体 11・・・駆動用電極 11a・・・結線部 12・・・検出用電極 12a・・・結線部 13・・・上部外周電極 14・・・固定体 15・・・アース電極 10 ... Vibrating body 11 ... Driving electrode 11a ... Connection part 12 ... Detection electrode 12a ... Connection part 13 ... Upper peripheral electrode 14 ... Fixed body 15 ... Ground electrode

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐 藤 雅 之 愛知県刈谷市朝日町2丁目1番地 アイシ ン精機株式会社内 (72)発明者 梶 野 浩 司 愛知県刈谷市朝日町2丁目1番地 アイシ ン精機株式会社内 (72)発明者 倉 知 秀 哉 愛知県刈谷市朝日町2丁目1番地 アイシ ン精機株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masayuki Sato 2-1-1 Asahi-cho, Kariya City, Aichi Aisin Seiki Co., Ltd. (72) Inventor Hiroshi Kajino 2-chome, Asahi-cho, Kariya City, Aichi Prefecture Address: Aisin Seiki Co., Ltd. (72) Inventor, Hideya Kurachi, 2-1-1 Asahi-cho, Kariya City, Aichi Aisin Seiki Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 円筒形状を呈し圧電材料からなる振動体
と、該振動体の主要面に夫々付着される駆動用及び検出
用電極と、前記駆動用電極に電圧を印加する電源と、前
記検出用電極からの出力電圧から角速度を演算する演算
装置と、前記駆動用及び検出用電極にはんだ付けにより
接合され前記駆動用電極と前記電源並びに前記検出用電
極と前記演算装置を電気的に導通するリード線とを有す
る角速度センサにおいて、 前記駆動用及び検出用電極上に設けられはんだが付きや
すい成分を含んで前記リード線がはんだ付けされる結線
部を備えたことを特徴とする角速度センサ。
1. A vibrating body having a cylindrical shape and made of a piezoelectric material, driving and detecting electrodes attached to respective main surfaces of the vibrating body, a power source for applying a voltage to the driving electrode, and the detecting means. An arithmetic unit for calculating the angular velocity from the output voltage from the working electrode, and electrically connected between the driving electrode and the power source and the detecting electrode and the arithmetic unit by being soldered to the driving and detecting electrodes. An angular velocity sensor having a lead wire, the angular velocity sensor comprising a connecting portion which is provided on the driving and detecting electrodes and to which the lead wire is soldered, including a component that easily attaches solder.
JP5018874A 1993-02-05 1993-02-05 Angular speed sensor Pending JPH06229765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5018874A JPH06229765A (en) 1993-02-05 1993-02-05 Angular speed sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5018874A JPH06229765A (en) 1993-02-05 1993-02-05 Angular speed sensor

Publications (1)

Publication Number Publication Date
JPH06229765A true JPH06229765A (en) 1994-08-19

Family

ID=11983698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5018874A Pending JPH06229765A (en) 1993-02-05 1993-02-05 Angular speed sensor

Country Status (1)

Country Link
JP (1) JPH06229765A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19609107A1 (en) * 1995-03-09 1996-09-12 Toshiba Ceramics Co Prodn. of silicon@ wafers with defect-free surface layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19609107A1 (en) * 1995-03-09 1996-09-12 Toshiba Ceramics Co Prodn. of silicon@ wafers with defect-free surface layer
DE19609107B4 (en) * 1995-03-09 2006-07-27 Toshiba Ceramics Co., Ltd. Method for producing silicon wafers

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