JPH06226353A - Method and device for preventing interference on bender butting gage device - Google Patents

Abstract

PURPOSE:To surely prevent collision of a butting gage and a metallic die by calculating and deciding whether or not the gage collies with the metallic die for which a work is finished from information of the metallic die, butting gage and a metal plate to be worked, CONSTITUTION:Dimensional information of the punching metallic die 7 and metallic die 11, dimensional information and regular size positioning information of a back gage 23 and thickness information and bending angle information of the metal plate to be worked are inputted in an information inputting part 35. The limit position of non-collision position of the back gage 23 and the punching metallic die 7 after bending is calculated and whether the back gage 23 collides with the punching metallic die 7 or not is calculated and decided by an afterbending interference calculating part 37 based on the inputted information in the information inputting part 35. When a collision is judged not to be caused, regular size positioning by the back gage 23 is permitted by a regular size positioning permission part 39. Whether collision of the back gage at the regular size position and the punching metallic die 7 clamping the metal plate to be worked is occurent or not is calculated and decided by a metal plate clamping interference calculating part 41.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an interference prevention method and an interference prevention control device for a vendor contact gauge device.
In particular, the present invention relates to an interference prevention method and an interference prevention control device for preventing interference between the butting gauge and the mold.

[0002]

2. Description of the Related Art An abutting gauge device for a bender, which is known as a back gauge device for sizing and positioning a work material with a press brake or the like, is moved by a servo mechanism or the like in a direction orthogonal to a bending line of the bender. It has an abutting gauge that can be installed, and the workpiece plate is abutted against the abutting surface of the abutment gauge located at the sizing positioning position (measurement position), so that the sizing of the processed plate material is performed. It is a thing.

In this abutting gauge device, when the sizing positioning position is close to the mold, in other words, when the measuring distance is short, the abutting gauge and the mold interfere with each other, and the mold May collide with the butting gauge and damage the butting gauge.

Therefore, conventionally, the limit position sensor such as a limit switch fixedly arranged near the position of the mold detects that the abutting gauge has approached the mold by a predetermined value or more, and the limit position sensor is activated. In this case, the machine is stopped for safety confirmation, and the bending process cannot be continued unless the operator confirms that the die does not collide with the abutting gauge.

[0005]

The limit position sensor is fixedly arranged near the position where the die is arranged, while the limit approach position where the abutting gauge does not collide with the die is the shape of the die and the abutting gauge ( However, depending on the type of the mold, the limit position sensor may be activated even if the mold does not clearly collide with the abutment gauge, and troublesome confirmation work may be required.

Further, depending on the plate thickness and bending angle of the processed plate material, even if the die collides with the abutting gauge at the time of completion of bending, the upper die (punch die) is attached to the processed plate material on the lower die (die die). The die may not collide with the abutting gauge at the time of clamping the plate to be machined, and in this case, if the abutting gauge is retracted and moved at the time of clamping the plate to be machined, the abutting gauge will position the machined plate at a fixed size. However, since this has not been taken into consideration in the past, it has been said that the sizing gauge cannot perform the dimensional positioning of the processed plate material.

The present invention has been made by paying attention to the above-mentioned problems in the conventional vendor abutment gauge device, and the die can be attached to the abutment gauge without requiring a troublesome confirmation work. An abutting gauge for a bender that reliably prevents collision and expands the sizing position range of the processed plate material that can be used by the abutting gauge so that the abutting gauge can be used as effectively as possible. An object of the present invention is to provide a device interference prevention method and an interference prevention control device used for implementing the method.

[0008]

According to the present invention, the above-mentioned object is provided so as to be movable in the direction orthogonal to the bending line of the bender, and the processed material is abutted against the abutting surface. In the interference prevention method of the abutment gauge device for the vendor, which prevents the abutment gauge that positions the processed material from interfering with the die, the dimension information of the die and the dimension information of the abutment gauge and the abutment. Enter the gauge's sizing positioning position information, the plate thickness information of the processed plate and the bending angle information, and check whether the abutting gauge located at the sizing positioning position collides with the die in the bending completed state based on these information. If there is no collision in this calculation determination, the sizing gauge performs a sizing positioning operation, and if there is a collision, the sizing gauge located at the sizing positioning position is based on the above information If the collision does not occur in this calculation judgment, place the abutting gauge at the fixed positioning position until the machined plate is clamped and place it in the machined plate clamped state. This is achieved by a method of preventing interference in a vendor abutment gauge device, which is characterized in that the abutment gauge is retracted and moved, and in the case of a collision, fixed size positioning by the abutment gauge is prohibited.

Further, in order to achieve the above-mentioned object, the interference preventing device of the bender gauge for a bender according to the present invention is provided so as to be movable in a direction orthogonal to the bending line of the bender, and has an abutting surface. In the interference prevention control device of the abutting gauge device for the vendor, which prevents the abutting gauge that positions the processed material at a fixed size when the abutting material is abutted, the die size information and Information input part for inputting dimensional information of butting gauge, sizing and positioning position of butting gauge, thickness information of work plate and bending angle information, and sizing based on the information input by the information input part Positioned at the fixed positioning position by the bending completion state interference calculation unit and the bending completion state interference calculation unit that makes a calculation to determine whether the abutting gauge located at the position collides with the mold in the bending completion state. Based on the information input by the above-mentioned information input section, and the fixed-size positioning operation permission section that permits fixed-size positioning by the butting gauge when it is determined that the butting gauge does not collide with the die in the bending completed state. Dimensioning is performed by the interference calculation unit when the workpiece plate is clamped and the interference calculation unit when the workpiece plate is clamped to determine whether or not the abutment gauge located at the dimensional positioning position collides with the mold in the clamped plate material. Since it is determined that the abutting gauge located at the position does not collide with the mold in the bending completed state, the abutting gauge is positioned at the sizing positioning position until the machined plate material clamp state and the abutment gauge is clamped at the machined plate material clamp state. The retracting movement with fixed retracting operation permitting the fixed positioning operation with retracting movement Notifying that the abutting gauge located at the sizing positioning position collides with the die in the clamped state of the work plate by the computing unit, and the sizing gauge cannot notify the sizing positioning. It is characterized by having a notification unit.

[0010]

According to the above-mentioned structure, the dimensional positioning is performed based on the dimensional information of the die, the dimensional information of the abutting gauge, the dimensional positioning position information of the abutting gauge, the thickness information of the processed plate and the bending angle information. Whether or not the abutting gauge located at the position will collide with the die in the bending completed state is calculated. If no collision is found in this calculation determination, the abutting gauge will perform the sizing positioning at that sizing positioning position. If the collision is permitted and a collision occurs, it is calculated based on the above information whether or not the abutting gauge located at the sizing positioning position collides with the die in the clamped state of the work plate material. If not, move the abutting gauge to the sizing position until the work plate is clamped, and then move the abutment gauge to retract when the work plate is clamped. Sizing positioning by the gauge is prohibited.

[0011]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 shows an embodiment in which a vendor contact gauge device incorporating an interference prevention device according to the present invention is applied to a press brake as a back gauge device. The press brake has an upper apron 1 and a lower apron 3. In this embodiment, the upper apron 1 is a movable apron which is vertically driven by a drive device (not shown), and the lower apron 3 is It is a fixed apron.

A punch die 7 having a V-shaped tip portion 5 is fixedly mounted on the upper apron 1 by a fastener not shown, and a die die 1 having a V-shaped groove 9 on the lower apron 3.
1 is fixedly mounted by a fastener not shown.

A back gauge device 13 is provided behind the upper apron 1 and the lower apron 3. The back gauge device 13 is screwed onto the ball screw shaft 15 and the ball screw shaft 15 extending in the direction orthogonal to the bending line, that is, the horizontal direction in FIG. 1, and is bent by the rotation of the ball screw shaft 15. A ball nut member 17 and a ball nut member 17 that move in a direction orthogonal to the processing line, that is, in the left-right direction in FIG.
Support rail member 19 fixed to the support rail member 19
And a cage support member 21 that is engaged and attached to a back support (abutting gauge) 23 is fixedly attached to the gauge support member 21.

The back gauge 23 has an abutting surface 25 at its tip.
The workpiece plate W is abutted against the abutting surface 25, and thereby the workpiece plate W is positioned at a fixed size.

The ball screw shaft 15 is drivingly connected to a servo motor 29 by a coupling 27, and the servo motor 2
It is rotationally driven by 9 to move the back nut 23 together with the ball nut member 17, the support rail member 19, and the cage support member 21 to an arbitrary moving position in a direction orthogonal to the bending line.

The servo operation of the servo motor 29 is controlled by a servo drive circuit 33 which receives an operation amount signal from an NC device 31.

The NC device 33 is of a computer type and has a built-in interference prevention control device with a software configuration.

As shown in FIG. 2, the interference prevention control device includes an information input section 35 and a bending completion state interference calculation section 3
7, a sizing / positioning operation permission unit 39, an interference calculation unit 41 in a clamped state of a plate material, a sizing / positioning operation permission unit 43 with a retracting operation, and a sizing / positioning impossible notification unit 45.

The information input section 35 uses the operation panel 47 (see FIG. 1), a machining program, and the like to determine the dimension information of the punch die 7 and die die 11, the dimension information of the back gauge 23, and the fixed dimension positioning of the back gauge 23. The position information, the plate thickness information of the processed plate material, and the bending angle information are input.

The bending completion state interference calculation unit 37 calculates the limit approach position at which the back gauge 23 does not collide with the punch die 7 in the bend completed state, based on the information input by the information input unit 35, and determines the limit approach position. A comparison calculation with the sizing positioning position of the back gauge 23 determines whether or not the back gauge 23 positioned at the sizing positioning position collides with the punch die 7 in the bending completed state.

The sizing / positioning operation permission unit 39 determines that the back gauge 23 located at the sizing / positioning position does not collide with the punching die 7 in the bending completed state by the interference calculation unit 37 in the bending completed state. The normal sizing operation by the back gauge 23 is permitted.

As a result, in this case, the back gauge 2
No. 3 is located at a fixed size positioning position in a stationary state throughout the bending process.

Interference calculation unit 41 when the work plate is clamped
Calculates the critical approach position at which the back gauge 23 does not collide with the punching die 7 in the clamped state of the work plate, based on the information input by the information input unit 35, and calculates the critical approach position and the sizing positioning position of the back gauge 23. By comparison calculation, it is determined whether or not the back gauge 23 located at the sizing positioning position collides with the punch die 7 in the clamped state of the plate material.

Sizing positioning operation permission unit 43 with retracting operation
Is determined that the back gauge 23 positioned at the sizing positioning position does not collide with the punch die 7 in the clamped state by the interference calculation unit 41 during the clamped state of the processed plate material, and thus the back gauge 23 is held until the clamped state of the processed plate material. The sizing positioning operation with the retreating operation for retracting and moving the back gauge 23 at the sizing positioning position and when the processed plate material is clamped is permitted.

As a result, in this case, the back gauge 2
No. 3 is located at the fixed-size positioning position until the processed plate material is clamped, and retracts to avoid interference with the punch die 7 when the processed plate material is clamped.

The sizing / positioning impossible notification section 45 determines that the back gauge 23 located at the sizing / positioning position collides with the punching die 7 in the sizing plate material clamping state by the interference calculating section 41 during the sizing plate material clamping state. Notifies that it is impossible to perform the fixed-size positioning by the back gauge 23.

As a result, in this case, the display provided on the operation panel 47, a warning light, and the like indicate that the back gauge 23 cannot perform the dimensional positioning.

FIG. 3 shows an example of a decision calculation processing flow for preventing the interference between the back gauge 23 and the punch die 7 when the NC device 33 executes the program.

In this determination calculation processing flow, first, various dimension information of the punch die 7 and the die die 11, height dimension information of the back gauge 23, fixed-size positioning position information of the back gauge 23, and the processed plate material W. The plate thickness information and the bending angle information are input (step 100).

As the information, information necessary for each of the following operations may be input each time each operation is performed.

After inputting the necessary information, the interference dimension X indicating the critical approach position where the back gauge 23 and the punch die 7 do not collide is calculated according to the following equation (step 110).

X = A · sin (θ / 2) As shown in FIG. 4, A is the tip edge width of the punch die 7, θ is the tip angle of the punch die 7, and the interference dimension X indicates the maximum deviation distance of the side portion of the punch die 7 on the back gauge 23 side with respect to the center of bending.

In FIG. 4 and also in FIGS. 5 and 6 below, L
Is a deviation distance from the center of bending of the tip surface (abutting surface 25) of the back gauge 23 located at a predetermined sizing position, that is, a length measurement distance for sizing positioning.

Next, it is determined whether or not the length measurement distance L of the back gauge 23, that is, the deviation distance L of the tip end surface of the back gauge 23 from the bending center is larger than the interference dimension X (step 120). When the deviation distance L> interference dimension X,
The back gauge 23 positioned at the sizing positioning position does not collide with the punch die 7. In this case, the normal sizing positioning operation by the back gauge 23 is permitted (step 130).

Thus, in this case, the back gauge 2
No. 3 is located at a fixed size positioning position in a stationary state throughout the bending process.

On the other hand, when the deviation distance L ≦ interference dimension X, the back gauge 23 positioned at the fixed dimension positioning position.
Is likely to collide with the punch die 7, and in this case, the back gauge 23 and the punch die 7 at the bending completion position as shown in FIG. The interference dimension Y at the time of completion of bending is calculated according to the following equation (step 140).

Y = (B + H) tan (θ / 2) H = (V / 2) tan (K / 2) -T Therefore,

## EQU1 ## Y = {B + (V / 2) .tan (K / 2)-
T} · tan (θ / 2) As shown in FIG. 5, B is the height dimension of the back gauge 23, and H is the distance from the upper surface of the die mold 11 to the tip of the punch mold when bending is completed. Where V is the maximum groove width dimension of the die die 11, K is the bending angle, and T is the plate thickness of the processed plate material. In this case, the interference dimension Y at the time of completion of bending indicates the deviation distance from the center of bending of the tip surface of the back gauge 23 when the back gauge 23 is in contact with the punch die 7 at the bending completion position.

Then, it is determined whether or not the length measurement distance L of the back gauge 23 is larger than the interference dimension Y at the completion of bending (step 150). When the deviation distance L> the interference dimension Y at the time of completion of bending, the back gauge 23 located at the sizing positioning position overlaps below the punch die 7, but the back gauge 23 is located at the bending completion position. There is no collision with the die 7, and in this case, the normal sizing positioning operation by the back gauge 23 is permitted (step 13).
0).

As a result, in this case as well, the back gauge 23
During the bending process, is always in a stationary position at the fixed positioning position.

On the other hand, when the deviation distance L ≦ interference dimension Y at the time of completion of bending, there is a possibility that the back gauge 23 located at the sizing positioning position may collide with the punch die 7 located at the bending completion position. In this case, further, the clamping interference dimension Z indicating the limit approaching position where the back gauge 23 and the punching die 7 at the working plate clamping position as shown in FIG. 6 do not collide is calculated according to the following equation. (Step 160).

Z = (B−T) · tan (θ / 2) Next, it is determined whether or not the length measurement distance L of the back gauge 23 is larger than the clamping interference dimension Z (step 17).
0). When the deviation distance L> the interference dimension Z during clamping, the back gauge 23 and the punch die 7 interfere with each other when the bending is completed, but the back gauge 23 does not collide with the punch die 7 in the clamp position. In this case, the back gauge 23 is positioned at the sizing positioning position until the processing plate material is clamped, and the sizing positioning operation with the retracting operation for retracting the back gauge 23 when the processing plate material is clamped is permitted (step 180). ).

As a result, in this case, the back gauge 2
3 is located at the sizing positioning position until the punch die 7 descends to the work plate clamp position, and the punch die 7 retreats while being stopped at the work plate clamp position. Therefore, in this case as well, although the lowering of the punch die 7 is temporarily stopped during the bending process, the back gauge 23 can perform the dimensional positioning of the processed plate material W without any trouble.

On the other hand, when the deviation distance L≤interference dimension Z during clamping, the back gauge 23 collides with the punching die 7 when the punching die 7 descends to the clamping position of the plate material. In this case, the fact that it is impossible to perform the sizing by the back gauge 23 is notified (step 190).

As a result, in this case, the display provided on the operation panel 47, a warning light, and the like indicate that it is impossible to perform the dimensional positioning by the back gauge 23, and the operator is informed of this fact. .

In the above, the present invention has been described in detail with respect to a specific embodiment, but the present invention is not limited to this, and various embodiments are possible within the scope of the present invention. It will be apparent to those skilled in the art.

[0047]

As can be understood from the above description, according to the interference prevention method and the interference prevention control device of the vendor abutment gauge device according to the present invention, the die size information, the abutment gauge size information, and the abutment gauge size information. Whether the abutting gauge located at the sizing positioning position will collide with the die in the completed bending state based on the sizing positioning position information of the backing gauge (back gauge), the plate thickness information of the processed plate and the bending angle information. If the collision is determined by calculation, and if there is no collision in this calculation, the sizing positioning by the abutting gauge is permitted at the sizing positioning position, and if a collision occurs, the sizing positioning is based on the above information. Whether or not the abutting gauge collides with the die in the clamped plate material is calculated, and if the collision does not occur in this calculation, the gauge is sized to the clamped plate material. The abutment gauge is moved to the set position and clamped when the work plate is clamped, and only when the abutment gauge collides with the die in the work plate clamped position, the fixed position is determined by the abutment gauge. Since it is prohibited, it is possible to reliably prevent the die from colliding with the abutting gauge without requiring troublesome confirmation work, and expand the sizing position range of the machined plate material that is possible with the abutting gauge. This allows the butting gauge to be used as effectively as possible.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment in which a bender contact gauge device incorporating an interference prevention device according to the present invention is applied to a press brake as a back gauge device.

FIG. 2 is a block diagram showing an embodiment of an interference prevention control device for a vendor contact gauge device according to the present invention.

FIG. 3 is a flowchart showing an example of an interference prevention determination calculation processing flow in an interference prevention control device of a vendor abutment gauge device according to the present invention.

FIG. 4 is an explanatory diagram showing a relationship between a mold and a back gauge.

FIG. 5 is an explanatory diagram showing a relationship between a back gauge and a mold in a bending completed state.

FIG. 6 is an explanatory diagram showing a relationship between a mold and a back gauge in a clamped state of a processed plate material.

[Explanation of symbols]

 7 Punch Die 11 Die Die 13 Back Gauge Device 15 Ball Screw Shaft 23 Back Gauge (Attack Gauge) 29 Servo Motor 31 NC Device 35 Information Input Section 37 Bending Completion Interference Calculation Section 39 Sizing Positioning Operation Permission Section 41 Interference calculation part when the work plate is clamped 43 Sizing positioning operation permission part with retracting operation 45 Sizing impossible notification part

Claims (2)

[Claims] 1. An abutment gauge, which is movably provided in a direction orthogonal to a bending line of a bender, and which positions a processed material by abutting the abutting surface, interferes with a mold. In order to prevent the interference of the abutting gauge device for the bender, the dimension information of the die, the dimension information of the abutting gauge, the fixed positioning position information of the abutting gauge, the thickness information of the processed plate and the bending Input the angle information, and based on this information, calculate whether or not the abutting gauge located at the sizing and positioning position will collide with the mold in the bending completed state. If there is no collision in this calculation determination, Performs a sizing positioning operation by the abutting gauge, and in case of collision, arithmetically determines whether or not the abutting gauge located at the sizing positioning position collides with the mold in the clamped plate material based on the above information. If there is no collision in the calculation judgment, place the abutting gauge at the fixed positioning position until the processed plate is clamped and move the abutting gauge retracted when the processed plate is clamped.If a collision occurs, use the abutting gauge. A method for preventing interference of a bump gauge device for a vendor, which is characterized by prohibiting fixed-size positioning. 2. An abutment gauge, which is provided so as to be movable in a direction orthogonal to a bending line of a bender, and which positions a processed material by abutting the abutting surface, interferes with a mold. In the interference prevention control device for the butting gauge device for the bender that prevents the occurrence of damage, the die dimension information, the butting gauge dimension information, the fixed dimension positioning position information of the butting gauge, and the plate thickness information of the processed plate An information input section for inputting bending angle information, and an arithmetic determination is made based on the information input by the information input section, whether or not the abutting gauge located at the sizing positioning position collides with the mold in the bending completed state. The bending calculation is performed by the interference calculation unit in the bending completed state and the interference calculation unit in the bending completed state determines that the abutting gauge positioned at the sizing positioning position does not collide with the mold in the bending completed state. The sizing positioning operation permitting unit that permits the sizing positioning operation, and whether the abutting gauge located at the sizing positioning position collides with the mold in the clamped plate material based on the information input by the information input unit. Processing Judgment Machining due to the interference calculation unit during clamping of the plate material and the interference calculation unit during clamping of the machining plate material, it is determined that the abutting gauge located at the sizing positioning position does not collide with the die in the bending completed state. Position the abutting gauge to the sizing position until the plate is clamped and move the abutting gauge to retract when the plate is clamped.Permit a sizing positioning with retract operation When the work plate is clamped, the abutting gauge positioned at the sizing positioning position collides with the mold in the work plate clamped state by the interference calculator. The interference prevention of the vendor's abutment gauge device is characterized by having a fixed-size-positioning-notification section for notifying that it is impossible to perform the fixed-size positioning by the abutment gauge. Control device.