JPH062223Y2 - Electrical connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an electrical connector, and more particularly to an electrical connector used for a socket connector for high-density mounting.

[Prior Art and Problems to be Solved] In a conventional electric connector of this type, a contact portion was made of a spring metal. However, in the case of using a spring metal, miniaturization and high density could not be realized due to the problem of stress of metal.

Therefore, an electric connector using a low melting point solder socket has come to be used. This socket simply fills the contactor on the cup with low-melting-point solder, melts the low-melting-point solder by heating, and cools and fixes after inserting the terminal.

In such a low melting point solder socket, since the low melting point solder adheres to the terminals of the mating contact to be connected,
By the insertion and removal, the low melting point solder was gradually taken out and disappeared from the inside of the cup, and there was a drawback that the insertion and removal could not be performed many times. Further, when the low melting point solder is melted in the mounted state lying down, there is also a drawback that the low melting point solder flows out.

[Means for Solving Problems] In the electrical connector of the present invention, the insulating plate is provided with a plurality of recesses in which a metal coating portion is formed on the inner wall surface and low melting point solder is stored,
In the electrical connector formed by projecting a connection terminal from the metal coating portion, each recess is filled with a metal fiber having better wettability than a terminal which is inserted into the recess storing the low melting point solder and electrically connected, It is characterized by containing a low melting point solder.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, showing an electric connector 2
An example of connecting the lead terminals 4 of the multi-chip 1 on which a large number of LSIs 3 are mounted is shown in FIG. In the figure, reference numeral 5 denotes an insulating plate, which is composed of a plurality of concave cups 6 and terminals 10 extending to the lower surface side of each cup 6.

FIG. 2 is a sectional view taken along the line AA of the cup 6 shown in FIG. The low melting point solder 8 and the metal fiber mass 7 are accommodated in the cup 6. A metal coating film 9 is formed on the inner wall surface of the cup 6. It is connected to a terminal 10 for connecting to a printed board (not shown). The metal fiber lump 7 may be one obtained by rolling one metal fiber into a lump or a plurality of metal fibers having an appropriate length collected into a lump. The wettability of the metal fibers forming the metal fiber lump 7 is made better than that of the lead terminals 4 by the surface treatment. Therefore, even if the lead terminal 4 is inserted and removed, the amount of the low melting point solder that adheres to the lead terminal 4 and is carried out to the outside is reduced.

Reference numeral 11 in the drawing denotes a guide board for the lead terminal 4, and by providing this, the metal fiber block 7 is prevented from falling off.

FIG. 3 shows a state where the low melting point solder 8 is melted by externally applying heat to the cup 6 of FIG. 2 and connected to the lead terminal 4 of the multichip 1. In this state after cooling, a stable connection is maintained as in soldering.

[Effects of the Invention] As described above, the present invention is configured by providing a plurality of cups whose inner wall surfaces are coated with a metal on an insulator, filling the cups with metal fibers having good wettability, and containing a low melting point solder. As a result, even if the number of times of insertion and removal is large, the carry-out of low melting point solder is small, and there is an effect that it is possible to supply an electrical connector that can cope with high density multiple insertion and removal.

Further, since the metal fiber contains the low-melting point solder, there is an effect that the low-melting point solder can be prevented from flowing out even when the low-melting point solder is melted with the electric connector lying down.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG.
FIG. 3 is a sectional view taken along line AA of FIG. 3, and FIG. 3 is a sectional view corresponding to FIG. 2: Electrical connector, 4: Lead terminal 5: Insulator, 6: Cup (recess) 7: Metal fiber lump, 8: Low melting point solder 9: Metal coating film, 10: Connection terminal

Front page continued (72) Inventor Takeshi Aoki 3-9-11 Midoricho, Musashino City, Tokyo Inside Nippon Telegraph and Telephone Corporation Electronic Engineering Laboratory (72) Inventor Shuichiro Inagaki 3-9-11 Midoricho, Musashino City, Tokyo Nippon Telegraph and Telephone Corporation Electronic Engineering Laboratory

Claims (1)

[Scope of utility model registration request] 1. An electrical connector in which a metal coating portion is formed on an inner wall surface of an insulating plate and a plurality of recesses storing low melting point solder are provided, and a connection terminal is projected from the metal coating portion. An electrical connector characterized in that each of the recesses is filled with a metal fiber having a better wettability than a terminal which is inserted into the recess in which solder is stored and electrically connected, and the low melting point solder is contained therein.