JPH0621412A - Manufacture of shading cap glass of solid-state image sensing device - Google Patents

Abstract

PURPOSE:To prevent a malfunction based on unnecessary light and to prevent oxygen from entering the surface of a solid-state image sensing element by performing printing with ink on a transparent substrate and baking the ink, thereafter by providing a light filter layer and then by forming a sealer layer. CONSTITUTION:First, a light absorption layer 18 is printed on a glass substrate 12 with silk screen ink mainly composed of glass. Then, AR coat is applied to both faces of the glass substrate 12 so that a light filter layer 14 is formed. Further, silk screen printing is performed on the outermost periphery of the glass substrate 12 other than the light filter layer 14 so that a sealer layer is printed. After printing, the sealer layer 16 is formed by baking so that a shading cap glass 10 is manufactured. Thus, it is possible to obtain the shading cap glass, which can prevent a malfunction based on unnecessary light and can be tightly bonded to the surface of a solid-state image sensing element to surely prevent oxygen from entering and further can stably maintain properties of the light absorption layer at the time of heat bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a photoelectric semiconductor element for detecting an incident light beam and converting it into an electric signal and an electric wiring arranged around the photoelectric semiconductor element, and thermally bonding it to the outer peripheral portion of the surface of a solid-state imaging device. The present invention relates to a method for producing a light-shielding cap glass that prevents entry of oxygen and blocks rays of unnecessary wavelengths such as ultraviolet rays and infrared rays. More specifically, it can be produced inexpensively and easily, and a ray incident from an end portion. The present invention relates to a method of manufacturing a light-shielding cap glass capable of preventing malfunction due to unnecessary light rays such as the above and tightly adhering to the surface of a solid-state image sensor to reliably prevent oxygen from entering.

[0002]

2. Description of the Related Art As is well known, in a solid-state image pickup device, a photoelectric semiconductor element for detecting an incident light beam and converting it into an electric signal on a substantially central surface thereof and a wiring for transmitting the electric signal thus generated are provided around the photoelectric semiconductor element. Generally, a recess is provided in the central portion of the semiconductor package to accommodate the photoelectric semiconductor and the electric wiring in the recess, and a cap glass is further laid on the surfaces of the photoelectric semiconductor and the electric wiring. By heat-sealing airtightly at the outer peripheral portion to prevent the entry of external oxygen, the photoelectric semiconductor element is prevented from being deteriorated by external oxygen.

As described above, the cap glass of the solid-state image pickup device is used for the purpose of preventing the invasion of external oxygen and extending the life of the photoelectric semiconductor device. In addition to this purpose,
It may also have the purpose of blocking rays of unnecessary wavelengths such as ultraviolet rays and infrared rays and of preventing unnecessary rays such as rays incident from the ends from entering the photoelectric semiconductor element and causing malfunction. is there.

In order to block rays of unnecessary wavelengths such as ultraviolet rays, an optical filter layer for blocking such rays is provided on the transparent substrate of the light shielding cap.

Further, it is generally known that unnecessary light rays such as light rays incident from the ends are generated by two causes.
That is, one of the causes is that a light ray is incident on the photoelectric semiconductor element in an oblique direction, and an unnecessary electric signal is generated from the photoelectric semiconductor element by the light ray incident in an oblique direction. A second cause is that incident light rays are reflected on the surface of the photoelectric semiconductor element, the reflected light rays are reflected again on the surface of the cap glass, and the multiple reflected light rays thus generated are incident on the photoelectric semiconductor element again. Similarly, an unnecessary electric signal is generated from the photoelectric semiconductor element.

A light-shielding cap glass provided with a light-shielding layer at the wiring portion of the solid-state image pickup device is known in order to block the obliquely incident light rays constituting the first cause. Further, a light-shielding cap glass provided with a light absorbing layer on the above wiring portion is also known in order to block the obliquely incident light rays constituting the first cause and absorb the multiple reflected light rays constituting the second cause. There is, for example, a light-shielding layer or a light-absorbing layer formed of a metal or metal oxide vapor-deposited film (JP-A-63-62358), or a light-absorbing layer formed by disposing a black molded article ( (Japanese Patent Laid-Open No. 62-249103), or a sealer layer for thermal adhesion is formed by coating a thermosetting resin containing a black pigment, and the sealer layer also has the function of a light absorbing layer ( Japanese Patent Laid-Open No. 2-177568).

Among these prior arts, those having a sealer layer formed by coating a thermosetting resin containing a black pigment were excellent in that they were easy to manufacture and were inexpensive.

[0008]

However, in the above-mentioned prior art, since the thermosetting resin forming the sealer layer contains a black pigment, the adhesive force when heat-bonded to the solid-state image pickup device is weak, and the durability is low. There was a problem that it was inferior in sex.

On the other hand, the respective functions of the sealer layer and the light absorbing layer are separated, and a thermosetting resin containing a black pigment is applied on the transparent substrate to form the light absorbing layer. Although the sealer layer can be formed by printing a thermosetting resin that does not exist, in such a case, there is a problem that air bubbles are generated in the light absorbing layer when the sealer layer is heated and dried, and its performance is deteriorated. It was

Further, when the light absorbing layer is printed and baked with an ink containing glass powder, a light absorbing layer having excellent durability can be formed. However, the baking of the ink requires a temperature at which the glass powder melts. Therefore, there is a problem that the optical filter layer is deteriorated.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, can be manufactured inexpensively and easily, prevents malfunctions caused by unnecessary light rays, and adheres tightly to the surface of a solid-state image pickup device to inject oxygen. It is an object of the present invention to provide a method for manufacturing a light-shielding cap glass capable of reliably preventing the above.

[0012]

That is, according to the method of manufacturing a light-shielding cap for a solid-state image pickup device of the present invention, a photoelectric semiconductor element for detecting an incident light beam and converting it into an electric signal and a photoelectric semiconductor element arranged around the photoelectric semiconductor element. A transparent substrate which is hermetically heat-bonded to the outer peripheral portion of the surface of a solid-state imaging device including electric wiring, and which transmits the incident light beam and makes it enter the optical semiconductor element,
An optical filter layer provided on this transparent substrate, which blocks light rays of unnecessary wavelengths, and a light absorption layer which absorbs light rays incident on the electric wiring portion from the outside and light rays reflected on the photoelectric semiconductor element surface, A method of manufacturing a light-shielding cap glass, comprising: a sealer layer provided on the outer circumference of the light absorption layer and thermally bonded to the outer circumference of the surface of the solid-state imaging device, the method comprising: After printing and printing a printing ink containing glass powder and black pigment,
The above-mentioned optical filter layer is provided, and then the above-mentioned sealer layer is formed.

In the present invention, the optical filter layer is used to prevent light of unnecessary wavelengths such as ultraviolet rays and infrared rays from entering the photoelectric semiconductor element, and various materials used for such purpose are used. Used.

The light absorbing layer prevents the incident light from entering the electrical connection portion on the outer periphery of the photoelectric semiconductor element and reflecting it to cause flare and the like. Therefore, the light absorbing layer has a transmission window and a sealer on the outermost periphery. Except for the portion where the layer is formed, light is prevented from entering.

[0015]

According to the present invention, a printing ink containing glass powder and a black pigment is printed on a transparent substrate, and an optical filter layer is provided after firing, so that the characteristics of the optical filter layer are not impaired and adhesion is achieved. There is no adverse effect on the photoelectric semiconductor element due to alteration or gas generation due to the previous firing.

Further, since the sealer layer is formed separately from the light absorbing layer, it is possible to select one having an excellent adhesive sealing property and obtain an excellent adhesive sealing property.

That is, since the light absorbing layer is first formed on the transparent substrate as in the present invention, the light absorbing layer having excellent characteristics can be obtained without impairing the function of each layer.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the method of the present invention.

According to FIG. 1, first, as in (a), the light absorbing layer 18 is printed on the glass substrate 12 by a silk screen printing machine with a silk screen ink containing glass as a main component. As a silk screen ink, glass frit as a main component, mixed with a black pigment B
1-6H (H) (KK Noritake Company Limited)
Use the ink obtained by mixing the solvent and the solvent. After printing, the light absorption layer 18 is formed by baking at 585 ° C. for 2 hours.

Next, as shown in (b), the glass substrate 12
AR coating is applied to both surfaces of the above to form the optical filter layer 14.

Further, as shown in (c), a curing agent and a solvent are mixed into ST-1235A (manufactured by Okuno Chemical Industry Co., Ltd.) as a sealer to obtain a silk screen ink, and the outermost glass other than the optical filter layer is obtained. Silk screen printing is performed on the substrate to print a sealer layer, and after printing, the sealer layer 16 is formed by baking at 80 ° C. for 2 hours to form the light shielding cap glass 10. The sealing agent has a sealing temperature of 200 ° C.

FIG. 2 is a schematic sectional view of a solid-state image pickup device using a light-shielding cap glass obtained by the method of the present invention.

Light-shielding cap glass 1 obtained as described above
0, the photoelectric semiconductor element 60 is stored in the CCD groove,
Wire-bonded solid-state imaging device package 5
It was placed in a light-shielding glass groove of 0, heated and pressed under the conditions of 200 ° C. and 1.5 kg / cm ² , and adhesively sealed to complete the solid-state imaging device as shown in FIG.

[0025]

As described above, according to the manufacturing method of the present invention, malfunctions due to unnecessary light rays are prevented, and the solid image pickup device surface is tightly adhered to surely prevent the invasion of oxygen. It is possible to provide a light-shielding cap glass that can stably maintain the performance of the light absorption layer when the above is performed.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view showing an embodiment of the method of the present invention.

FIG. 2 is a cross-sectional view of a solid-state imaging device using a light-shielding cap glass obtained by the method of the present invention.

FIG. 3 is a perspective view showing a state in which a light shielding cap glass is removed from a solid-state imaging device using the light shielding cap glass obtained by the method of the present invention.

[Explanation of symbols]

 10 Light-shielding cap glass 12 Glass substrate 14 Optical filter layer 16 Sealer layer 18 Light absorption layer 20 Transmission window 50 Solid-state image pickup device package 52 Pins 54 Wiring 60 Photoelectric semiconductor element 62 Color filter

Claims (1)

[Claims] 1. A solid-state image pickup device comprising an optoelectronic semiconductor element for detecting an incident light beam and converting it into an electric signal, and an electric wiring arranged around the optoelectronic semiconductor element, which is airtightly heat-bonded to an outer peripheral portion of a surface, and A transparent substrate which transmits the incident light and makes it enter the optical semiconductor element, and an optical filter layer which is provided on the transparent substrate and blocks light having an unnecessary wavelength,
A light absorbing layer that absorbs a light ray incident on the electric wiring portion from the outside and a light ray reflected on the photoelectric semiconductor element surface,
A method of manufacturing a light-shielding cap glass, comprising: a sealer layer provided on the outer circumference of the light absorption layer and thermally bonded to the outer circumference of the surface of the solid-state imaging device, the method comprising: A method for manufacturing a light-shielding cap for a solid-state imaging device, comprising: printing a printing ink containing glass powder and a black pigment, firing the ink, providing the optical filter layer, and then forming the sealer layer.