JPH0621159A - Tab tape - Google Patents
Tab tapeInfo
- Publication number
- JPH0621159A JPH0621159A JP17537192A JP17537192A JPH0621159A JP H0621159 A JPH0621159 A JP H0621159A JP 17537192 A JP17537192 A JP 17537192A JP 17537192 A JP17537192 A JP 17537192A JP H0621159 A JPH0621159 A JP H0621159A
- Authority
- JP
- Japan
- Prior art keywords
- burn
- tab tape
- tab
- test
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣ実装技術のＴＡＢ
テープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to IC mounting technology TAB.
It's about tape.
【０００２】[0002]
【従来の技術】従来のＴＡＢテープでは、ＩＣへの信号
の取り込みが困難なためバーイン試験が行なわれず、広
範囲な品質保証が出来ない。2. Description of the Related Art In a conventional TAB tape, since it is difficult to take a signal into an IC, a burn-in test is not performed, and a wide range of quality cannot be guaranteed.
【０００３】[0003]
【発明が解決しようとする課題】そこで、本発明はＴＡ
Ｂテープを渦巻に巻く事により、ＴＡＢテープをバーイ
ン装置のチャンバーに入るようにし、ＴＡＢテープより
信号ピンを突出させ、そこに信号ピンソケットを取り付
ける事ににより、バーイン試験を可能としたＴＡＢテー
プを提供する事を目的とする。Therefore, according to the present invention, the TA
By winding the B tape in a spiral, the TAB tape enters the chamber of the burn-in device, the signal pin is projected from the TAB tape, and the signal pin socket is attached to the TAB tape to enable the burn-in test. The purpose is to provide.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明はＴＡＢテープを渦巻に巻く事により、バー
イン装置のチャンバーに入るようにし、ＴＡＢテープよ
り信号ピンを突出させ、そこに信号ピンソケットを取り
付ける事を特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention allows a TAB tape to be wound into a chamber of a burn-in device so that the signal pin protrudes from the TAB tape. It is characterized by attaching a socket.
【０００５】[0005]
【作用】本発明は上記の手段により、ＴＡＢ実装品にお
いてもバーイン試験を可能としたＴＡＢテープを提供す
る事が出来る。By the above means, the present invention can provide a TAB tape which enables a burn-in test even in a TAB mounted product.
【０００６】[0006]
【実施例】以下に本発明の実施例を図面にもとづいて説
明する。Embodiments of the present invention will be described below with reference to the drawings.
【０００７】図１は、本発明においてバーイン装置のチ
ャンバーに入るようにＴＡＢテープを渦巻に巻いた図、
図２は、本発明においてＴＡＢテープより信号ピンを突
出させ、そこに信号ピンソケットを取り付けた図であ
る。FIG. 1 is a view in which a TAB tape is spirally wound so as to enter a chamber of a burn-in apparatus according to the present invention.
FIG. 2 is a view in which the signal pin is projected from the TAB tape and the signal pin socket is attached thereto in the present invention.
【０００８】図１において、バーイン・チャンバーに多
数のＴＡＢ実装品を入れる事を可能にするため、ＴＡＢ
テープ１を渦巻状に巻く。In FIG. 1, in order to allow a large number of TAB mounted products to be put in the burn-in chamber,
Wrap tape 1 in a spiral.
【０００９】また、これによりＴＡＢテープ１全体の大
きさが縮小され、バーイン・チャンバーに複数個のＴＡ
Ｂテープ１を入れる事が可能となる。As a result, the size of the TAB tape 1 as a whole is reduced, and a plurality of TAs are placed in the burn-in chamber.
It is possible to insert B tape 1.
【００１０】よって、バーイン・チャンバーに多数のＴ
ＡＢ実装品を入れる事ができ、バーイン試験にかかるラ
ンニング・コストの低減になる。Therefore, a large number of T's are provided in the burn-in chamber.
The AB mounting product can be inserted, and the running cost for the burn-in test can be reduced.
【００１１】図２において、バーイン試験に必要な信号
をＴＡＢ実装のＩＣパッケージ２に与えるため、ＴＡＢ
テープ１に実装された各ＩＣパッケージ２より信号ピン
３を突出させる。In FIG. 2, in order to apply a signal necessary for the burn-in test to the TAB-mounted IC package 2,
The signal pin 3 is projected from each IC package 2 mounted on the tape 1.
【００１２】その信号ピン３に信号ピンソケット４を取
り付けてバーイン装置からの信号をＩＣパッケージ２に
伝達し、バーイン試験を行う。A signal pin socket 4 is attached to the signal pin 3 to transmit a signal from the burn-in device to the IC package 2 to perform a burn-in test.
【００１３】この方法により、多数のＴＡＢ実装品をバ
ーイン試験し、現状では無かった広範囲な品質を保証す
る事が可能である。By this method, it is possible to perform a burn-in test on a large number of TAB-mounted products and guarantee a wide range of quality which has not been available at present.
【００１４】[0014]
【発明の効果】以上述べたように本発明によれば、ＴＡ
Ｂ実装品においてもバーイン試験を可能としたＴＡＢテ
ープを提供する事が出来る。As described above, according to the present invention, TA
It is possible to provide a TAB tape that enables a burn-in test even for a B-mounted product.
【図１】本発明においてバーイン装置のチャンバーに入
るようにＴＡＢテープを渦巻に巻いた図である。FIG. 1 is a view in which a TAB tape is wound so as to enter a chamber of a burn-in device in the present invention.
【図２】本発明においてＴＡＢテープより信号ピンを突
出させ、そこに信号ピンソケットを取り付けた図であ
る。FIG. 2 is a view in which a signal pin is projected from a TAB tape and a signal pin socket is attached thereto in the present invention.
１・・・ＴＡＢテープ ２・・・ＩＣパッケージ ３・・・信号ピン ４・・・信号ピンソケット ５・・・ケーブル 1 ... TAB tape 2 ... IC package 3 ... Signal pin 4 ... Signal pin socket 5 ... Cable
Claims (1)
ＡＢテープをバーイン装置のチャンバーに入るように
し、ＴＡＢテープより信号ピンを突出させ、そこに信号
ピンソケットを取り付ける事によりバーイン試験を可能
としたことを特徴とするＴＡＢテープ。1. By winding a TAB tape in a spiral, T
A TAB tape that allows a burn-in test by allowing the AB tape to enter the chamber of the burn-in device, projecting the signal pin from the TAB tape, and attaching the signal pin socket thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17537192A JPH0621159A (en) | 1992-07-02 | 1992-07-02 | Tab tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17537192A JPH0621159A (en) | 1992-07-02 | 1992-07-02 | Tab tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0621159A true JPH0621159A (en) | 1994-01-28 |
Family
ID=15994931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17537192A Pending JPH0621159A (en) | 1992-07-02 | 1992-07-02 | Tab tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621159A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265525B1 (en) | 1997-11-28 | 2001-07-24 | Hitachi, Ltd. | Method and device for manufacturing polycarbonate |
| US6399739B1 (en) | 2001-08-22 | 2002-06-04 | General Electric Company | Preparation of polycarbonate having a predetermined molecular weight and level of endcapping |
| US6753403B2 (en) | 1997-11-28 | 2004-06-22 | Hitachi, Ltd. | Process and apparatus for producing polycarbonate |
-
1992
- 1992-07-02 JP JP17537192A patent/JPH0621159A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265525B1 (en) | 1997-11-28 | 2001-07-24 | Hitachi, Ltd. | Method and device for manufacturing polycarbonate |
| US6329495B2 (en) | 1997-11-28 | 2001-12-11 | Hitachi, Ltd. | Process and apparatus for producing polycarbonate |
| US6753403B2 (en) | 1997-11-28 | 2004-06-22 | Hitachi, Ltd. | Process and apparatus for producing polycarbonate |
| US6399739B1 (en) | 2001-08-22 | 2002-06-04 | General Electric Company | Preparation of polycarbonate having a predetermined molecular weight and level of endcapping |
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