JPH06188497A - Wavelength-tunable semiconductor light emitting device - Google Patents
Wavelength-tunable semiconductor light emitting deviceInfo
- Publication number
- JPH06188497A JPH06188497A JP4335825A JP33582592A JPH06188497A JP H06188497 A JPH06188497 A JP H06188497A JP 4335825 A JP4335825 A JP 4335825A JP 33582592 A JP33582592 A JP 33582592A JP H06188497 A JPH06188497 A JP H06188497A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- semiconductor laser
- semiconductor light
- external mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Semiconductor Lasers (AREA)
- Micromachines (AREA)
- Lasers (AREA)
Abstract
Description
【0001】[0001]
【産業上の技術分野】本発明は光通信や光情報処理、光
計測などのシステムに供する半導体光源のおいて、波長
可変半導体発光装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wavelength tunable semiconductor light emitting device in a semiconductor light source used for systems such as optical communication, optical information processing, and optical measurement.
【0002】[0002]
【従来の技術】光通信や光情報処理、光計測などのシス
テムに供するミラーを直接作動させて共振器長を可変と
する波長可変半導体発光装置としては、面発光半導体レ
ーザと外部ミラーを用いたものがすでに提案されている
(N.Yokouchi et al.IEEE Photonics Tochnology Letter
s,vol.4,no.7,701(1992)) 。図5に従来の波長可変半導
体発光装置の概略斜視を示す。2. Description of the Related Art A surface emitting semiconductor laser and an external mirror are used as a wavelength tunable semiconductor light emitting device in which a mirror used for a system such as optical communication, optical information processing, and optical measurement is directly operated to change a cavity length. Things have already been proposed
(N. Yokouchi et al. IEEE Photonics Tochnology Letter
s, vol.4, no.7,701 (1992)). FIG. 5 shows a schematic perspective view of a conventional wavelength tunable semiconductor light emitting device.
【0003】図5に示すように、基板101には面発光
の半導体レーザ102が形成されると共にこの基板10
1に取付けられたプラスチックプレート103には外部
ミラー104が形成されており、この半導体レーザ10
2の片方の面と外部ミラー104とにより共振器が形成
され、プラスチックプレート103をチューニングロッ
ド105により押圧して外部ミラー104を光軸方向に
変位させることにより、共振器長を変化させ、縦モード
制御を行うことができるようになっている。As shown in FIG. 5, a surface-emitting semiconductor laser 102 is formed on a substrate 101 and the substrate 10 is also formed.
An external mirror 104 is formed on the plastic plate 103 attached to the semiconductor laser 1.
A resonator is formed by one surface of No. 2 and the external mirror 104, and the plastic plate 103 is pressed by the tuning rod 105 to displace the external mirror 104 in the optical axis direction, thereby changing the resonator length and the longitudinal mode. It is possible to control.
【0004】[0004]
【発明が解決しようとする課題】このような従来の波長
可変半導体発光装置にあっては、外部ミラー104はバ
ルク部品で構成され、その調整はチューニングロッド1
05を介してピエゾ等で外部から行うようになってい
る。そのため、外部ミラー104を調整するための外部
駆動機構を必要とし、構造が複雑になると共に装置自体
が大形となってしまうという問題がある。In such a conventional wavelength tunable semiconductor light emitting device, the external mirror 104 is composed of a bulk component, and its adjustment is performed by the tuning rod 1.
It is designed to be performed externally by a piezo or the like via 05. Therefore, there is a problem that an external drive mechanism for adjusting the external mirror 104 is required, the structure becomes complicated and the device itself becomes large.
【0005】また、この波長可変半導体発光装置は全て
個別構成部品で構成されているため、その組立が量産性
を損ない、経済性に欠けるという問題がある。更に、前
述した外部ミラー104を調整するための外部駆動機構
を含む変調器全体が大きくなってスペース効率が悪く、
駆動機構のアクチュエータサイズによる高周波化にも制
限があった。Further, since this wavelength tunable semiconductor light emitting device is composed of individual components, there is a problem in that its assembly impairs mass productivity and lacks economy. Further, the entire modulator including the external drive mechanism for adjusting the external mirror 104 described above becomes large, resulting in poor space efficiency,
There was also a limitation in increasing the frequency depending on the actuator size of the drive mechanism.
【0006】本発明は上述した問題点を解決するもので
あって、従来の波長可変半導体レーザが持つ外部駆動機
構や個別部品構成による量産性、経済性、高周波化の制
限等の問題を解決し、小形で安価、且つ、高性能な波長
可変光源としての波長可変半導体発光装置を提供するこ
とを目的とするものである。The present invention solves the above-mentioned problems, and solves the problems such as mass production, economic efficiency, and limitation of high frequency due to the external drive mechanism and the individual component structure of the conventional wavelength tunable semiconductor laser. Another object of the present invention is to provide a wavelength tunable semiconductor light emitting device as a small, inexpensive, and high performance wavelength tunable light source.
【0007】[0007]
【課題を解決するための手段】上述の目的を達成するた
めの本発明の波長可変半導体発光装置は、半導体レーザ
と、外部ミラーと、該外部ミラーを前記半導体レーザ光
軸方向に駆動するマイクロアクチュエータとを有する波
長可変半導体発光装置において、前記外部ミラーと前記
マイクロアクチュエータとが前記半導体レーザを搭載し
た基板上に形成されていることを特徴とするものであ
る。A wavelength tunable semiconductor light emitting device of the present invention for achieving the above object is a semiconductor laser, an external mirror, and a microactuator for driving the external mirror in the optical axis direction of the semiconductor laser. In the wavelength tunable semiconductor light emitting device having :, the external mirror and the microactuator are formed on a substrate on which the semiconductor laser is mounted.
【0008】また、本発明の波長可変半導体発光装置
は、半導体レーザと、外部ミラーと、該外部ミラーを前
記半導体レーザ光軸方向に駆動するマイクロアクチュエ
ータとを有する波長可変半導体発光装置において、前記
半導体レーザと前記外部ミラーと前記マイクロアクチュ
エータとが同一の基板上に形成されていることを特徴と
するものである。The wavelength tunable semiconductor light emitting device of the present invention is a wavelength tunable semiconductor light emitting device having a semiconductor laser, an external mirror, and a microactuator for driving the external mirror in the optical axis direction of the semiconductor laser. The laser, the external mirror, and the microactuator are formed on the same substrate.
【0009】[0009]
【作用】マイクロマシニング技術により、同一基板上に
外部ミラーとその駆動機構とを一体形成することで、フ
ォトリソ技術のLSIプロセスと同様に、外部ミラーと
駆動機構及び基板、あるいは半導体レーザが一括生産で
き、従来のものに比べて組立工程が著しく削減され、素
子の量産性、経済性の大幅な向上が得られると共にアク
チュエータの超小形化による高周波化が得られる。By using the micromachining technology to integrally form the external mirror and its driving mechanism on the same substrate, the external mirror, driving mechanism and substrate, or semiconductor laser can be manufactured in a batch, as in the photolithographic LSI process. As compared with the conventional one, the assembling process is remarkably reduced, the mass productivity of the element and the economical efficiency are significantly improved, and the actuator is miniaturized to achieve the high frequency.
【0010】[0010]
【実施例】以下、図面に基づいて本発明の実施例を詳細
に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【0011】図1には本発明の一実施例に係る波長可変
半導体発光装置の概略斜視、図2には波長可変半導体発
光装置の製造方法を表す形成過程の概略を示す。FIG. 1 is a schematic perspective view of a wavelength tunable semiconductor light emitting device according to an embodiment of the present invention, and FIG. 2 is an outline of a forming process showing a method of manufacturing the wavelength tunable semiconductor light emitting device.
【0012】図1に示すように、本実施例の波長可変半
導体発光装置はハイブリッド型のものであって、ヒート
シンク用の約500μm×500μmの大きさのSi 基
板11上に半導体レーザ12がボンディングされて共振
器の一方を形成し、その一方の共振器面の近傍に外部ミ
ラー13を形成する可動の両持ち梁14が形成されてい
る。この両持ち梁14は部分的に形成された絶縁膜15
上にアンカー16を有し、その一方の側面は垂直で外部
ミラー13となっている。そして、他方の側面は少なく
とも1つ以上の凹凸形状の櫛形部17を有し、この櫛形
部17に対向して絶縁膜15上に凹凸形状の固定櫛形部
18が形成されている。このようにしてマイクロアクチ
ュエータ19が構成される。As shown in FIG. 1, the wavelength tunable semiconductor light emitting device of this embodiment is of a hybrid type, in which a semiconductor laser 12 is bonded on a Si substrate 11 having a size of about 500 μm × 500 μm for a heat sink. One of the resonators is formed as a resonator, and a movable doubly supported beam 14 that forms an external mirror 13 is formed near one of the resonator surfaces. The both-supported beam 14 is formed of an insulating film 15 that is partially formed.
It has an anchor 16 on its top, one side of which is vertical and serves as the external mirror 13. The other side surface has at least one or more uneven comb-shaped portions 17, and a fixed comb-shaped portion 18 having uneven shapes is formed on the insulating film 15 so as to face the comb-shaped portions 17. In this way, the microactuator 19 is constructed.
【0013】従って、半導体レーザ12に電極パッド2
0を形成し、また、この可動両持ち梁14と固定櫛形部
18にそれぞれ電極パッド21,22を貼着し、両者の
間に電圧を印加することにより、その静電力によって可
動両持ち梁14が駆動し、レーザ光を反射する外部ミラ
ー13が光軸方向に変位し、縦モードの制御を行うこと
ができるようになっている。Therefore, the electrode pad 2 is formed on the semiconductor laser 12.
0 is formed, and the electrode pads 21 and 22 are attached to the movable double-supported beam 14 and the fixed comb-shaped portion 18, respectively, and a voltage is applied between the two, so that the movable double-supported beam 14 is moved by its electrostatic force. Is driven and the external mirror 13 that reflects the laser light is displaced in the optical axis direction, and the longitudinal mode can be controlled.
【0014】このような波長可変半導体レーザ素子は、
例えば、以下に示すような方法で製造される。図2(a)
〜(g)に示すように、まず、Si 基板11上に絶縁膜1
5を形成後、半導体レーザ12をボンディングするため
の段差23を、例えば、異方向ウェットエッチングによ
り形成する。次に、可動する両持ち梁14を形成する位
置に犠牲層23を形成し、その後、この犠牲層24上及
び絶縁膜15上にa−Si (ポリシリコン、その他ポリ
アミド等他の材料でも可)のアクチュエータ層25,2
6を堆積して可動及び固定部分のパターニングを行う。
そして、犠牲層24のエッチングを行い、両持ち梁14
を可動形状とする。ここで、Si 基板11をチップ形状
にダイシングした後、一方の端面に反射防止コーティン
グ27を行った半導体レーザ12をボンティングする。Such a wavelength tunable semiconductor laser device is
For example, it is manufactured by the following method. Figure 2 (a)
As shown in (g), first, the insulating film 1 is formed on the Si substrate 11.
After forming 5, the step 23 for bonding the semiconductor laser 12 is formed by, for example, different direction wet etching. Next, a sacrifice layer 23 is formed at a position where the movable doubly supported beam 14 is formed, and then a-Si (polysilicon, other materials such as polyamide, etc. may be used) on the sacrifice layer 24 and the insulating film 15. Actuator layers 25, 2
6 is deposited and the movable and fixed parts are patterned.
Then, the sacrificial layer 24 is etched and the both-supported beam 14
Is a movable shape. Here, after dicing the Si substrate 11 into a chip shape, the semiconductor laser 12 having an antireflection coating 27 on one end face is bonded.
【0015】図3には本発明の別の実施例に係る波長可
変半導体発光装置の概略斜視を示す。FIG. 3 is a schematic perspective view of a wavelength tunable semiconductor light emitting device according to another embodiment of the present invention.
【0016】図3に示すように、本実施例の波長可変半
導体発光装置はモノリシック型のものであって、レーザ
層を形成するための半導体絶縁基板(GaAs,InP)
31上に、半導体レーザ32と、マイクロアクチュエー
タ49を構成する外部ミラー33が形成された可動両持
ち梁34及び固定電極35とがモノリシックに形成さ
れ、約500μm×500μmの大きさになっている。As shown in FIG. 3, the wavelength tunable semiconductor light emitting device of this embodiment is of a monolithic type, and is a semiconductor insulating substrate (GaAs, InP) for forming a laser layer.
A semiconductor laser 32, a movable double-supported beam 34 on which an external mirror 33 forming a microactuator 49 is formed, and a fixed electrode 35 are monolithically formed on the substrate 31, and have a size of about 500 μm × 500 μm.
【0017】このような波長可変半導体レーザ素子は、
例えば、次のようにして製造される。まず、半導体絶縁
基板31上に半導体レーザ32の下部導電層36となる
層を成長した後、通常の半導体レーザ層37を結晶成長
する。次に、アクチュエータ部49を構成する可動両持
ち梁34及び固定櫛形部(電極)35と半導体レーザ3
2のエッチドミラー38のパターニングを行い、反応性
ドライエッチングによって半導体絶縁基板31に達する
深さまでエッチングを行う。そして、エッチドミラー3
8の面に斜め蒸着法等により反射防止膜をコーティング
を施した後、半導体レーザ32の下部電極を形成するた
めの面をエッチングで表出させる。更に、半導体レーザ
32の上部及び下部の電極(P,N)パッド39,40
及びアクチュエータ用電極パッド41,42を形成後、
半導体レーザ32の部分をカバーして両持ち梁34の下
部犠牲層のエッチングを行い、最後に劈開によりチップ
を分割する。本実施例の波長可変半導体発光装置は前述
したものに比べてレーザと外部ミラーのアセンブリ工程
が一括して行える利点がある。Such a wavelength tunable semiconductor laser device is
For example, it is manufactured as follows. First, after a layer serving as the lower conductive layer 36 of the semiconductor laser 32 is grown on the semiconductor insulating substrate 31, a normal semiconductor laser layer 37 is crystal-grown. Next, the movable double-supported beam 34, the fixed comb-shaped portion (electrode) 35, and the semiconductor laser 3 which constitute the actuator portion 49.
The second etched mirror 38 is patterned, and reactive dry etching is performed to a depth reaching the semiconductor insulating substrate 31. And Etched Mirror 3
After coating an antireflection film on the surface 8 by an oblique deposition method or the like, the surface for forming the lower electrode of the semiconductor laser 32 is exposed by etching. Further, the upper and lower electrode (P, N) pads 39, 40 of the semiconductor laser 32
And after forming the actuator electrode pads 41, 42,
The lower sacrificial layer of the doubly supported beam 34 is etched to cover the semiconductor laser 32, and finally the chip is divided by cleavage. The wavelength tunable semiconductor light emitting device of this embodiment has an advantage over the above-described one that the process of assembling the laser and the external mirror can be performed at once.
【0018】図4にはマイクロアクチュエータのいろい
ろなパターンを表す平面視を示す。図4(a)に示すもの
は、最も単純な形状のものであり、基板41上の可動梁
42側に凹部を形成し、固定部43側にこの凹部に入り
込む凸部が形成されているものである。なお、44は半
導体レーザである。図4(b)に示すものは、印加電圧の
低減を図るために可動梁45側と固定部46側を、前述
したように、それぞれ櫛形形状にしたものである。FIG. 4 is a plan view showing various patterns of the microactuator. 4A shows the simplest shape, in which a concave portion is formed on the substrate 41 on the side of the movable beam 42, and a convex portion that enters the concave portion is formed on the side of the fixed portion 43. Is. Incidentally, 44 is a semiconductor laser. In the structure shown in FIG. 4B, the movable beam 45 side and the fixed portion 46 side are respectively comb-shaped as described above in order to reduce the applied voltage.
【0019】また、図4(c)に示すものは、可動梁の動
きを更に微調することができるように、可動梁47の両
側に固定部48,49を形成すると共に駆動電極50,
51,52を3つ形成したものであり、可動梁47を前
後駆動及び微量傾き調整することができる。なお、駆動
部の形状は上述したものに限定されるものではない。Further, in the structure shown in FIG. 4 (c), fixed portions 48 and 49 are formed on both sides of the movable beam 47 and drive electrodes 50 and 50 are formed so that the movement of the movable beam can be further finely adjusted.
Since three 51 and 52 are formed, the movable beam 47 can be driven back and forth and a small amount of tilt can be adjusted. The shape of the driving unit is not limited to the above.
【0020】[0020]
【発明の効果】以上、実施例を挙げて詳細に説明したよ
うに本発明の波長可変半導体発光装置によれば、外部ミ
ラーとマイクロアクチュエータとを半導体レーザが搭載
された基板上に形成するか、また、半導体レーザと外部
ミラーとマイクロアクチュエータとを同一の基板上に形
成したので、装置を構成する個別部品の組立が不要で、
素子の量産性、経済性を大幅に向上させることができる
と共にアクチュエータが非常に小形であるために高速駆
動が可能で素子の高周波化を得ることができ、更に、ア
クチュエータの駆動電力が少ないために装置全体の省力
化を図ることができる。As described above in detail with reference to the embodiments, according to the wavelength tunable semiconductor light emitting device of the present invention, the external mirror and the microactuator are formed on the substrate on which the semiconductor laser is mounted, or Further, since the semiconductor laser, the external mirror, and the microactuator are formed on the same substrate, it is not necessary to assemble the individual parts constituting the device,
The mass productivity and economic efficiency of the device can be greatly improved, and the actuator is very small, so high-speed drive is possible and high frequency operation of the device can be obtained. Moreover, the actuator drive power is low. Labor saving of the entire apparatus can be achieved.
【図1】本発明の一実施例に係る波長可変半導体発光装
置の概略斜視図である。FIG. 1 is a schematic perspective view of a wavelength tunable semiconductor light emitting device according to an embodiment of the present invention.
【図2】波長可変半導体発光装置の製造方法を表す形成
過程の概略図である。FIG. 2 is a schematic view of a forming process showing a method of manufacturing a wavelength tunable semiconductor light emitting device.
【図3】本発明の別の実施例に係る波長可変半導体発光
装置の概略斜視図である。FIG. 3 is a schematic perspective view of a wavelength tunable semiconductor light emitting device according to another embodiment of the present invention.
【図4】マイクロアクチュエータのいろいろなパターン
を表す平面図である。FIG. 4 is a plan view showing various patterns of a microactuator.
【図5】従来の波長可変半導体発光装置の概略斜視図で
ある。FIG. 5 is a schematic perspective view of a conventional wavelength tunable semiconductor light emitting device.
11,31 基板 12,32 半導体レーザ 13,33 外部ミラー 14,34 可動梁 15 絶縁膜 18,35 固定櫛形部 19,49 マイクロアクチュエータ 20,21,22,39,40,41,42 電極パッ
ド11, 31 Substrate 12, 32 Semiconductor laser 13, 33 External mirror 14, 34 Movable beam 15 Insulating film 18, 35 Fixed comb-shaped portion 19, 49 Microactuator 20, 21, 22, 39, 40, 41, 42 Electrode pad
Claims (2)
ミラーを前記半導体レーザ光軸方向に駆動するマイクロ
アクチュエータとを有する波長可変半導体発光装置にお
いて、前記外部ミラーと前記マイクロアクチュエータと
が前記半導体レーザを搭載した基板上に形成されている
ことを特徴とする波長可変半導体発光装置。1. A tunable semiconductor light emitting device having a semiconductor laser, an external mirror, and a microactuator for driving the external mirror in the optical axis direction of the semiconductor laser, wherein the external mirror and the microactuator are the semiconductor laser. A tunable semiconductor light emitting device, which is formed on a substrate on which is mounted.
ミラーを前記半導体レーザ光軸方向に駆動するマイクロ
アクチュエータとを有する波長可変半導体発光装置にお
いて、前記半導体レーザと前記外部ミラーと前記マイク
ロアクチュエータとが同一の基板上に形成されているこ
とを特徴とする波長可変半導体発光装置。2. A wavelength tunable semiconductor light emitting device having a semiconductor laser, an external mirror, and a microactuator for driving the external mirror in the optical axis direction of the semiconductor laser, wherein the semiconductor laser, the external mirror, and the microactuator are provided. A tunable semiconductor light emitting device characterized in that are formed on the same substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33582592A JP3196791B2 (en) | 1992-12-16 | 1992-12-16 | Tunable semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33582592A JP3196791B2 (en) | 1992-12-16 | 1992-12-16 | Tunable semiconductor light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06188497A true JPH06188497A (en) | 1994-07-08 |
JP3196791B2 JP3196791B2 (en) | 2001-08-06 |
Family
ID=18292828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33582592A Expired - Fee Related JP3196791B2 (en) | 1992-12-16 | 1992-12-16 | Tunable semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3196791B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1168243A (en) * | 1997-08-19 | 1999-03-09 | Nec Corp | Optical module and optical axis adjustment method |
WO2001022540A2 (en) * | 1999-09-20 | 2001-03-29 | Iolon, Inc. | Tunable laser with microactuator |
US6731471B1 (en) * | 1998-03-20 | 2004-05-04 | Seagate Technology Llc | Low mass microactuator and method of manufacture |
US6865195B2 (en) * | 2000-08-04 | 2005-03-08 | Avanex Corporation | Edge-emitting semiconductor tunable laser |
US6903486B2 (en) | 1999-11-29 | 2005-06-07 | Iolon, Inc. | Balanced microdevice |
US7639723B2 (en) | 2005-03-03 | 2009-12-29 | Nec Corporation | Tunable laser, optical module, and control method thereof |
US7664156B2 (en) | 2005-03-03 | 2010-02-16 | Nec Corporation | Wavelength tunable laser |
-
1992
- 1992-12-16 JP JP33582592A patent/JP3196791B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1168243A (en) * | 1997-08-19 | 1999-03-09 | Nec Corp | Optical module and optical axis adjustment method |
US6731471B1 (en) * | 1998-03-20 | 2004-05-04 | Seagate Technology Llc | Low mass microactuator and method of manufacture |
WO2001022540A2 (en) * | 1999-09-20 | 2001-03-29 | Iolon, Inc. | Tunable laser with microactuator |
WO2001022540A3 (en) * | 1999-09-20 | 2001-11-08 | Iolon Inc | Tunable laser with microactuator |
US6903486B2 (en) | 1999-11-29 | 2005-06-07 | Iolon, Inc. | Balanced microdevice |
US6865195B2 (en) * | 2000-08-04 | 2005-03-08 | Avanex Corporation | Edge-emitting semiconductor tunable laser |
US7639723B2 (en) | 2005-03-03 | 2009-12-29 | Nec Corporation | Tunable laser, optical module, and control method thereof |
US7664156B2 (en) | 2005-03-03 | 2010-02-16 | Nec Corporation | Wavelength tunable laser |
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