JPH06187912A - Gas discharge display panel - Google Patents

Abstract

PURPOSE:To reduce the fluctuation of a resistance value and at the same time to increase the density of arrangement of a display cell in a gas discharge display panel in which a current-limiting resistor is provided for each display cell. CONSTITUTION:An anode bus 42, a resistor 40 and a display anode 38 are so provided on a substrate 34 as to be sequentially in superposition from a plane point of view. Thereby, the density of arrangement of the display anode 38 is increased, so that the density of arrangement of a display cell is increased. The resistor 40 is a thick-film resistor and for the formation thereof, a thick-film paste is used in which a power of indium tin oxide, a powder of low melting- point glass and a vehicle are mixed to be made into a paste. The contents of indium tin oxide particles in the paste are increased, thereby uniformizing the distribution of the particles in the paste to reduce the dispersion of resistance value in each display cell. Also, since indium tin oxide particles are used, even when the contents of the particles are increased, the resistor 40 having a high resistance value desired in a gas discharge display panel can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge display panel.

[0002]

2. Description of the Related Art Conventionally, a pulse memory method has been known as a driving method for a DC type gas discharge display panel, which can obtain a high display brightness even if the display area is large. In order to prolong the panel life when driven by this method, for example, reference: 1990 Proceedings of the Annual Conference of the TV Society of Japan p4
9-54 In the panel structure disclosed in IPU 92-32 and IDY 92-88, a current limiting resistor is provided for each display cell.

FIG. 8 is a partially cutaway plan view showing the structure of a main part of a conventional DC type gas discharge display panel disclosed in the above document.

The conventional panel shown in FIG. 1 has one substrate 10 and the other substrate 12 sealed with a discharge gas, and a display anode 14, a resistor 16 and an anode bus bar provided between these substrates 10 and 12. 18, an auxiliary anode 20, and a cathode 22.

A plurality of display anodes 14 are arranged in a matrix. An anode bus 18 is provided for each column and a resistor 16 is provided for each display anode 14, and the display anode 14 is connected to the anode bus 18 of the corresponding column via the resistor 16. Further, the anode bus 18, the auxiliary anode 20, and the resistor 16 are provided on the same substrate surface 10 a of the one substrate 10. Then, a plurality of auxiliary anodes 20 are arranged in parallel, and two anode bus lines 18 are provided between adjacent auxiliary anodes 20. Further, the display anodes 14 and the resistors 16 are provided in two rows between the adjacent anode buses 18 without sandwiching the auxiliary anode 20.

Further, the cathodes 22 are provided on the other substrate 12 for each row, and the display anodes 14 are arranged so as to face the cathodes 22 of the corresponding rows. A display discharge space (display cell) 23 for one pixel is formed between each display anode 14 and each cathode 22. By providing the resistor 16, the display cell 23
Since the discharge current can be reduced, the panel life can be extended.

Further, the resistor 16, the anode bus 18 and the auxiliary anode 20 are covered with an insulating layer 24, and a phosphor 26 and a partition 28 are provided on the insulating layer 24. The phosphor 26 is provided separately for each display anode 14. The display anode 14 is exposed without being covered with the insulating layer 24 and the phosphor 26. Further, each display cell 23 is separated by the partition wall 28. Then, a portion of the auxiliary anode 20 facing the cathode 22 is exposed without being covered with the insulating layer 24, and a discharge space (auxiliary cell) 30 for a pilot fire discharge is formed between the facing portions of the auxiliary anode 20 and the cathode 22. . The partition 28 is provided with a priming slit 32 that connects the display cell 23 and the auxiliary cell 30.

The resistance value of the resistor 16 (the resistance value of the resistor 16 between the display anode 14 and the anode bus 18) is desired to be, for example, several kΩ to several MΩ. When the resistor 16 having such a high resistance value is formed, the length of the resistor 16 may be increased, the width may be decreased, or the thickness may be decreased. However, in the production of the gas discharge display panel, the resistor 16 is generally formed by the screen printing method. Therefore, there is a limit in reducing the width or the thickness of the resistor 16. Therefore, in order to form the high resistance resistor 16, it is necessary to increase the length of the resistor 16.

[0009]

However, in the above-mentioned conventional gas discharge display panel, the resistor 16 is used as the substrate surface 1.
It is provided so as to extend along 0a. Therefore, in order to increase the length of the resistor 16, it is necessary to increase the cell interval,
As a result, the display cells 23 cannot be formed with high precision (the arrangement density of the display cells 23 cannot be increased).

Further, the resistor 16 by the screen printing method
What is commercially available as a thick film paste used in the formation of the present invention is one in which the conductive particles are ruthenium oxide particles. The resistor 16 using this thick film paste is composed of a plurality of ruthenium oxide particles and glass that bonds these particles to each other. Therefore, in order to shorten the length of the resistor 16 required to obtain a desired high resistance, the resistor 16
It suffices to reduce the content of ruthenium oxide particles therein and thereby increase the resistance value per unit length of the resistor 16.

However, since the specific resistance of ruthenium oxide is as low as about 10 ^-5 Ωcm, it is necessary to reduce the content of ruthenium oxide particles in the resistor 16 in order to shorten the length of the resistor 16. is there. When the content is reduced, it is difficult to uniformly disperse the ruthenium oxide particles in the resistor 16, and as a result, the resistance value of the resistor 16 in each display cell 23 varies widely. Therefore, it is difficult to reduce the length of the resistor 16 sufficiently by reducing the content of ruthenium oxide particles.

An object of the present invention is to solve the above-mentioned conventional problems and to provide a gas discharge display panel capable of forming a display cell with high precision even if the resistance value of a resistor is increased.

[0013]

In order to achieve this object, one and the other substrates sealed by a discharge gas,
A first display electrode provided between these substrates, a resistor, a first electrode bus bar and a second display electrode are provided, a plurality of first display electrodes are arranged in a matrix, and a resistor is provided for each first display electrode. A first electrode busbar is provided for each column, the first display electrode is connected to the first electrode busbar of the corresponding column through a resistor, a second display electrode is provided for each row, and a first display electrode is provided for the corresponding row. In a gas discharge display panel arranged facing the second display electrode of, the first electrode bus bar, the resistor and the first display electrode are superposed in plan view, and one of the substrates is sequentially arranged. It is characterized by being provided above.

[0014]

According to this structure, the first electrode bus bar, the resistor, and the first display electrode are sequentially provided on one of the substrates so that they are superposed on each other when seen in a plan view. The resistance value of the resistor can be increased by increasing the height of the resistor in the direction perpendicular to the plane. Therefore, even if the installation space of the resistor is narrowed in plan view, the length of the resistor between the first electrode bus bar and the first display electrode is increased to reduce the resistance value of the resistor. Can be increased.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the drawings are only schematically illustrated to the extent that the invention can be understood, and the invention is not limited to the illustrated examples.

FIG. 1 is a plan view schematically showing a partial cutout of the essential structure of an embodiment of the present invention. In FIG. 1, a plan view of the one substrate 34 viewed from the other substrate 36 side is shown, and the other substrate 36 and the cathode 44 are shown by alternate long and two short dashes lines.

The gas discharge display panel of this embodiment is a DC type color display panel, and as shown in FIG. 1, one and the other substrates 34 sealed by a discharge gas G (see FIG. 2). And 36, and the first display electrode 38, the resistor 40, and the first electrode bus bar 42 provided between the substrates 34 and 36.
And a second display electrode 44. Here, the first display electrode 38 is a display anode (hereinafter referred to as the display anode 38), the first electrode busbar 42 is an anode busbar (hereinafter referred to as the anode busbar 42), and the second display electrode 44 is a cathode. (Hereinafter referred to as the cathode 44).

When viewed two-dimensionally, a plurality of display anodes 38 are arranged in a matrix, and thus a plurality of display anodes 38 are arranged at predetermined intervals in the row direction Q and the column direction P, respectively. A resistor 40 is provided for each display anode 38 and an anode bus 42 is provided for each column of the matrix array, and the display anode 38 is provided through the resistor 40 and the anode bus 4 of the corresponding column is provided.
Connect with 2. Further, a cathode 44 is provided for each row of the matrix array, and the display anode 38 is arranged so as to face the cathode 44 of the corresponding row.

FIG. 2 is a sectional view schematically showing the structure of the essential part of an embodiment of the present invention, showing a section taken along the line II--II in FIG. As shown in FIGS. 2 and 1, the anode bus bar 42, the resistor 40, and the display anode 38 are sequentially provided on one of the substrates 34 so as to be overlapped with each other when seen in a plan view.

In this embodiment, the anode bus 42 is arranged in the column direction P.
A plurality of anode buses 42 arranged in parallel and provided on one substrate 34. Then, a plurality of resistors 40 are arranged in a matrix so as to correspond to the display anodes 38, and each resistor 40 is provided on the anode bus 42 of the corresponding column. The resistor 40 is a columnar protrusion protruding from the anode bus 42. The display anode 38 is provided on each resistor 40, and the display anode 38 is electrically connected to the anode bus 42 via the resistor 40. A region where the display anode 38 and the cathode 44 face each other is a display cell (display discharge space for one pixel) 46.

The resistor 40 is a thick film resistor including a plurality of conductive particles and glass that bonds these particles to each other. The conductive particles contained in the resistor 40 are one type of indium tin oxide particles.

Further, an inter-anode fill 48 is provided on the substrate 34 between the anode bus lines 42, and a space between these bus lines 42 is filled with an inter-anode fill 48. The inter-anode fill 48 has an insulating property. Further, the anode bus bar 4 in the portion where the resistor 40 is not provided
The inter-anode fill 48 is provided on the upper surface 2 and the space between the adjacent resistors 40 is also filled with the inter-anode fill 48.

Then, a phosphor 50 and a partition wall 52 are provided on the inter-anode fill 48. The phosphor 50 is arranged in the vicinity of the display anode 38 and provided individually for each display anode 38. Display anode 3
8 is exposed without being covered with the phosphor 50. Further, each display cell 64 is separated by the partition wall 52.

On the other hand, the cathode 44 is a striped electrode extending in the row direction Q, and a plurality of cathodes 44 are provided in parallel on the other substrate 36. The cathode 44 faces the display anode 38, and the other substrate 36
And one substrate 34 is sealed. The partition wall 52 keeps the distance between the substrates constant, and the discharge gas G is sealed between the substrates.

Next, the manufacturing process of this embodiment will be described. 6 to 7 are plan views of relevant parts for explaining the manufacturing process of the embodiment of the present invention, in which the main manufacturing process when the gas discharge display panel of the embodiment is manufactured by the screen printing method is stepwise. Shown in.

First, the anode bus 42 is formed on one substrate 34, for example, a glass substrate (FIG. 3). Here, an Al thick film paste (DS-5002 manufactured by Okuno Seiyaku Co., Ltd.) is used as a material for forming the anode bus bar 42, and this bus bar thick film paste is printed and laminated on the substrate 34 to form a bus bar thick film pattern. Next, this pattern is dried at 150 ° C. for 10 minutes and then heated and baked at 580 ° C. for 10 minutes to obtain an Al thick film electrode having this pattern as the anode bus 42.

Next, an inter-anode fill 48 filling the space between the adjacent anode buses 42 is formed on the substrate 34 (FIG. 4).
Here, a dielectric thick film paste (# 9741 manufactured by DuPont) is used as a material for forming the inter-anode fill 48. This thick film paste for fill is printed and laminated on the substrate 34 in the region where the anode bus 42 is not formed to form a thick film pattern for fill. This pattern is then 1
After being dried for 0 minutes, it is heated and baked at 530 ° C. for 10 minutes to obtain a dielectric layer (insulating layer) having this pattern as an inter-anode fill 48. At this time, the anode fill 48
Is formed at a height substantially equal to the height at which the anode bus bar 42 projects from the substrate 34, and the fill 48 and the bus bar 42 form a substantially flat surface H1.

Next, the resistor 40 and the inter-anode fill 48 filling the space between the adjacent resistor 40 are formed on the substantially flat surface H1 (FIG. 5). Here, the thick film paste for resistors described below is used as the forming material of the resistor 40. This paste is indium tin oxide powder (Kyodo International Co., Ltd. indium tin oxide fine powder: This fine powder is an alloy powder of indium oxide and tin oxide, and the weight of indium oxide and tin oxide is 95 wt% and 5 wt% respectively. The powder particle size is 0.1 μm or less.
Low melting point glass (OC-530 manufactured by Okuno Pharmaceutical Co., Ltd.), and a vehicle for adjusting viscosity (Screen Oil # 6 manufactured by Okuno Pharmaceutical Co., Ltd.)
009) and a thick film paste. In preparing the paste, 40 g of indium tin oxide powder, 40 g to 120 g of low melting point glass, and 100 to 200 vehicles.
These powders, glass and vehicle are mixed in a weight ratio of g. Then, the mixed mixture is sufficiently mixed and stirred so that the indium tin oxide particles and the low melting point glass are uniformly dispersed. The material for forming the inter-anode fill 48 is the same as the above-mentioned fill-forming paste.

In forming the resistor 40 and the inter-anode fill 48 filling the space between the adjacent resistor 40, the resistor and fill thick film pastes are printed alternately a plurality of times to dry the resistor paste. Firing, drying and firing of the filling paste are performed for each printing. By performing printing a plurality of times, the laminated thickness of the resistor 40 (thickness in the direction perpendicular to the substrate surface of the substrate 34) is increased. By forming the resistor 40 having a large laminated thickness, the resistance value of the resistor 40 between the anode bus 40 and the display anode 38 is increased. For example, in order to set the resistance value of the resistor 40 to about 200 kΩ, printing is repeated 5 to 10 times to make the resistor 4
The laminated thickness of 0 may be about 30 to 50 μm.

As for the resistor 40, the resistor thick film paste is printed and laminated on the anode bus 42 in the region where the resistor 40 is to be formed to form a resistor thick film pattern. Next, this pattern is dried at 150 ° C. for 10 minutes and then heated and baked at 580 ° C. for 10 minutes to obtain a thick film resistor having this pattern as the resistor 40. The resistor 40 obtained by firing the thick film pattern is composed of a plurality of indium tin oxide particles and a low melting point glass that bonds these particles to each other.

As for the fill 48, the fill forming paste is applied on the surface H1 of the region excluding the region where the resistor 40 is to be formed (on the anode bus 42 and the inter-anode fill 48 filling the space between the adjacent anode buses 42). Then, a thick film pattern for filling is formed by printing and laminating. Then change this pattern to 1
After drying at 50 ° C. for 10 minutes and then heating at 530 ° C. for 10 minutes and baking, a dielectric layer having this pattern is obtained as fill 48.

Next, the display anode 38 is formed on the resistor 40 (FIG. 6). Here, a Ni thick film paste (Electro Science) is used as a material for forming the display anode 38.
This thick film paste for display anodes is printed and laminated on the resistor 40 by using Laboratories # 2554) to form a thick film pattern for display anodes. The pattern is then dried at 150 ° C. for 10 minutes and then 580.
The Ni thick film electrode having this pattern is obtained as the display anode 38 by heating and firing at 10 ° C. for 10 minutes.

Next, the phosphor 50 and the partition wall 52 are formed on the inter-anode fill 48 (FIG. 7). Here, the thick film paste described below is used as a forming material of the phosphor 50 that generates green, blue, and red lights. The thick film paste for the green phosphor is phosphor powder P1G1 manufactured by Kagaku Optonix Co., Ltd. and a vehicle for adjusting viscosity (Screen oil # 60 manufactured by Okuno Pharmaceutical Co., Ltd.).
09) and a thick film paste for a blue phosphor are phosphor powder KX-5 manufactured by Kagaku Optonix Co., Ltd.
01A and a viscosity control vehicle (Okuno Pharmaceutical Co., Ltd. screen oil # 6009) are mixed to form a paste. The thick film paste for red phosphor is a chemical powder KX-504A manufactured by Kagaku Optonix and a viscosity control vehicle ( This is a paste prepared by mixing with screen oil # 6009 manufactured by Okuno Seiyaku. Then, these phosphor thick film pastes are printed and laminated on the inter-anode fill 48 while exposing the display anode 38 and the partition forming region to form green, blue and red phosphor thick film patterns. Then, these phosphor patterns are dried at 150 ° C. for 10 minutes. Next, a dielectric thick film paste (# 9741 manufactured by DuPont) is used as a material for forming the partition walls 52, and the thick film paste for partition walls is applied to the inter-anode fill 48 by 200 to 3
A thick film pattern for a partition is formed by printing and stacking up to a height of about 00 μm. Then, the partition pattern is formed at 150 ° C.
To dry for 10 minutes. After that, these phosphor and partition patterns are heated and baked at 530 ° C. for 10 minutes to obtain green, blue and red phosphors 50 composed of the phosphor patterns, and partition patterns as partition 52. To obtain a dielectric layer.

On the other hand, although not shown, the cathode 44 is formed on the other substrate 36, for example, a glass substrate. Here, the cathode 44
Ni thick film paste (ElectroS
Science Laboratories # 255
4) is used to print and stack the cathode thick film paste on the substrate 36 to form a cathode thick film pattern. The pattern is then dried at 150 ° C. for 10 minutes and then 5
The Ni thick film electrode having this pattern is obtained as the cathode 44 by heating and baking at 80 ° C. for 10 minutes.

After that, the other substrate 36 and one substrate 3 are arranged so that the cathode 44 faces the display anode 38.
4 is sealed, and the discharge gas G is sealed between these substrates.

The present invention is not limited to the above-described embodiments, and therefore, the size, shape, arrangement position, forming material, forming method, numerical conditions and the like of each component can be arbitrarily changed.

For example, the structure of the gas discharge display panel is not limited to that shown in the above-described example, and therefore the panel structure is such that the first display electrode is the display cathode, the first electrode busbar is the cathode busbar, and the second display electrode is the anode. Can be changed to any suitable structure.

In order to facilitate understanding of the description in the manufacturing process of the above-mentioned embodiment, the forming conditions (for example, the forming material of the thick film paste, the firing temperature and the drying temperature of the thick film paste, and the weight ratio of the components contained in the thick film paste are used. Thickness of thick film paste)
Although specific materials and numerical values have been described as above, these are merely examples and can be arbitrarily changed.

Further, the resistor is a thick film resistor including a plurality of conductive particles and glass which binds these particles to each other. In this case, the conductive particles are indium oxide,
One kind of particles or a plurality of kinds of particles selected from tin oxide and indium tin oxide may be used. Alternatively, the resistor may be a thick film resistor comprising a plurality of zinc oxide particles and glass that binds these particles together,
The resistor may be a thick film resistor including a plurality of alloy particles and glass that bonds these particles to each other, and the alloy particles may be particles of an alloy of zinc oxide and alumina. In the case of, since the specific resistance of the conductive particles is higher than that of ruthenium oxide, even if the content of the conductive particles in the thick film resistor is increased, a high resistance value desired in the gas discharge display panel is obtained. A resistor can be formed. Therefore, since the content of the conductive particles in the resistor thick film paste can be increased when forming the resistor, it becomes easy to make the distribution of the conductive particles uniform in the paste. As a result, it is easier to reduce the variation in the resistance value of the thick film resistor formed for each display cell, as compared with the case of the conventional thick film resistor that uses ruthenium oxide particles as the conductive particles. Becomes In this case, therefore, it is possible to increase the content of the conductive particles and reduce the variation in the resistance value of each display cell, and to obtain a resistor having a high resistance value desired in the gas discharge display panel.

In the cases of and, the specific resistance of the zinc oxide particles and the alloy particles as the conductive particles is larger than that of the case of ruthenium oxide. Therefore, as in the cases of and, the content of the conductive particles should be increased. It is possible to obtain a resistor having a high resistance value desired in a gas discharge display panel while reducing the variation in resistance value for each display cell. According to the experiments conducted by the inventors of the present application, a powder of alloy particles containing zinc oxide and alumina at a weight ratio of 99.5 wt% and 0.5 wt%, a low melting point glass powder, and a vehicle were mixed. To form a paste (however, 45 g of the alloy powder, 90 g of the low melting point glass powder and 120 g of the vehicle were mixed in a weight ratio), and a thick film resistor was formed using this paste, and the resistance value in the thickness direction was 30 μm in the laminated thickness. Is 400
It was possible to form a thick film resistor having a high resistance of about 500 kΩ.

[0041]

As is apparent from the above description, according to the gas discharge display panel of the present invention, the first electrode bus bar, the resistor and the first display electrode are superposed in a plan view, Since the resistors are sequentially provided on one substrate, the resistance value of the resistor can be increased by increasing the height of the resistor in the direction perpendicular to the surface of the one substrate. Therefore, even if the installation space of the resistor is narrowed in plan view, the length of the resistor between the first electrode bus bar and the first display electrode is increased to reduce the resistance value of the resistor. Can be increased.

Therefore, by increasing the arrangement density of the first electrode bus bar, the resistor, and the first display electrode, it is possible to form a resistor having a high resistance even if the display cell is formed with high precision.

[Brief description of drawings]

FIG. 1 is a plan view schematically showing a partial cutout of a main part configuration of an embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically showing a main part configuration of an embodiment of the present invention.

FIG. 3 is a cutaway plan view of an essential part for explaining a manufacturing process of an embodiment of the present invention.

FIG. 4 is a cutaway plan view of an essential part for explaining a manufacturing process of an embodiment of the present invention.

FIG. 5 is a cutaway plan view of an essential part for explaining a manufacturing process of an embodiment of the present invention.

FIG. 6 is a cutaway plan view of an essential part for explaining a manufacturing process of an embodiment of the present invention.

FIG. 7 is a cutaway plan view of an essential part for explaining a manufacturing process according to an embodiment of the present invention.

FIG. 8 is a plan view schematically showing a partial configuration of a main part of a conventional gas discharge display panel.

[Explanation of symbols]

 34: One substrate 36: Other substrate 38: Display anode 40: Resistor 42: Anode bus bar 44: Cathode

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hideo Sawai 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (72) Ichiro Koiwa 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (4)

[Claims] 1. A plurality of first and second substrates sealed with a discharge gas and a first display electrode, a resistor, a first electrode bus bar and a second display electrode provided between the substrates are provided. One display electrode is arranged in a matrix, the resistor is provided for each first display electrode, the first electrode bus bar is provided for each column, and the first display electrode is provided in the corresponding column through the resistor. Connected to a bus bar, the second display electrode is provided for each row,
In a gas discharge display panel in which the first display electrodes are arranged so as to face the second display electrodes in a corresponding row, the first electrode bus bar, the resistor and the first display electrode are superposed in a plan view. In this way, the gas discharge display panel is characterized in that it is provided on one of the substrates in order. 2. The resistor is a thick film resistor including a plurality of conductive particles and glass binding these particles to each other, and the conductive particles are made of indium oxide, tin oxide and indium tin oxide. The gas discharge display panel according to claim 1, wherein one kind or a plurality of kinds of particles selected from the above are used. 3. The gas discharge display panel according to claim 1, wherein the resistor is a thick film resistor including a plurality of zinc oxide particles and glass bonding these particles to each other. 4. The resistor is a thick film resistor including a plurality of alloy particles and glass that bonds these particles to each other, and the alloy particles are particles of an alloy of zinc oxide and alumina. The gas discharge display panel according to claim 1, wherein: