JPH06184746A - Vacuum treatment device - Google Patents

Vacuum treatment device

Info

Publication number
JPH06184746A
JPH06184746A JP34075692A JP34075692A JPH06184746A JP H06184746 A JPH06184746 A JP H06184746A JP 34075692 A JP34075692 A JP 34075692A JP 34075692 A JP34075692 A JP 34075692A JP H06184746 A JPH06184746 A JP H06184746A
Authority
JP
Japan
Prior art keywords
shaped substrate
gate
valve
strip
vacuum processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34075692A
Other languages
Japanese (ja)
Inventor
Kazumasa Takatsu
和正 高津
Masaya Kobayashi
雅也 小林
Tsugiko Komata
亜子 小俣
Takeshi Kurokawa
岳 黒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP34075692A priority Critical patent/JPH06184746A/en
Publication of JPH06184746A publication Critical patent/JPH06184746A/en
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To additionally enhance the shutting off performance of a band-shaped substrate housing chamber and a film forming treatment chamber. CONSTITUTION:A gate valve 1 is so formed as to close a gate 5 through which gases and a band-shaped substrate pass by intermeshing of a valve moving part 2 and opposite surfaces 4, 4a of valve moving parts opposing this gate moving part. Rubber elastic bodies 6 made of 'Viton(R)' are mounted to these opposite surfaces 4, 4a of the gate moving parts. The rubber elastic body 3 made of 'Viton(R)' is also mounted to one end face of the valve moving part 2 opposing the opposite surfaces 4, 4a of the of the gate moving parts. The hardness of these rubber elastic bodies 3 and 6 are <=80Hs.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、帯状基板をロールロー
ルトゥロール式にて搬送しながら所定の処理を施す真空
処理装置、特に真空処理室と帯状基板収容室とを気密遮
断するゲートバルブを有する真空処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus for carrying out a predetermined process while transporting a band-shaped substrate in a roll-roll-to-roll system, and more particularly to a gate valve for hermetically shutting off a vacuum processing chamber and a band-shaped substrate accommodating chamber A vacuum processing apparatus having

【0002】[0002]

【従来の技術】従来、帯状基板に所定の処理を施すロー
ルトゥロール式の真空処理装置では、特開平3−304
19号公報に示されているように、ボビンに巻かれてい
る帯状基板を、帯状基板収容室と真空処理室とを接続す
るガスゲート入口あるいは出口においてパイトン製ロー
ラーにより帯状基板を挟みながら帯状基板収容室と真空
処理室との間を気密分離し、真空状態である帯状基板収
容室内を排気した後に大気に戻して交換することが知ら
れている。
2. Description of the Related Art Conventionally, a roll-to-roll type vacuum processing apparatus for performing a predetermined processing on a belt-shaped substrate is disclosed in Japanese Patent Laid-Open No. 3-304.
As disclosed in Japanese Patent Publication No. 19, a strip-shaped substrate wound on a bobbin is housed while sandwiching the strip-shaped substrate with a pieton roller at a gas gate inlet or outlet connecting the strip-shaped substrate storage chamber and the vacuum processing chamber. It is known that the chamber and the vacuum processing chamber are hermetically separated, the band-shaped substrate accommodating chamber in a vacuum state is evacuated, and then returned to the atmosphere for replacement.

【0003】また、上述のようなパイトン製ローラーを
用いた方法の他に、ボビンに巻かれている帯状基板や、
あるいは真空処理室の部品を交換するときは、大気中に
さらされる帯状基板収容室と真空状態である真空処理室
との接続通路内を通る帯状基板を挟みながらそれらの間
を遮断するゲートバルブが知られている。このゲートバ
ルブを有する従来の真空処理装置について図7をもとに
説明する。
In addition to the method using the Paiton roller as described above, a strip-shaped substrate wound on a bobbin,
Alternatively, when exchanging the parts of the vacuum processing chamber, a gate valve that cuts between the strip-shaped substrate housing chamber exposed to the atmosphere and the strip-shaped substrate that passes through the connection passage between the vacuum processing chamber and the vacuum processing chamber is sandwiched between them. Are known. A conventional vacuum processing apparatus having this gate valve will be described with reference to FIG.

【0004】この図に示すような従来の真空処理装置に
は、帯状基板収容室101と真空処理室102との間が
接続されるとともに帯状基板103が通過可能なゲート
104が設けられており、このゲート104には帯状基
板103を挟みながら帯状基板収容室101と真空処理
室102とを気密分離できるゲートバルブ105が設け
られている。
The conventional vacuum processing apparatus as shown in this figure is provided with a gate 104 which is connected between the strip-shaped substrate accommodating chamber 101 and the vacuum processing chamber 102 and through which the strip-shaped substrate 103 can pass. The gate 104 is provided with a gate valve 105 capable of hermetically separating the belt-shaped substrate accommodating chamber 101 and the vacuum processing chamber 102 while sandwiching the belt-shaped substrate 103.

【0005】ゲートバルブ105は、ゲート104の図
面上側の壁部に上下移動可能に設けられたバルブ可動部
105aと、そのバルブ可動部105aを移動駆動する
バルブ駆動機構105bとから基本的に構成されてお
り、バルブ可動部105bの帯状基板103に当接する
先端部には弾性部材105cが取り付けられている。
The gate valve 105 is basically composed of a valve movable portion 105a provided on the upper wall of the gate 104 in the drawing so as to be vertically movable, and a valve drive mechanism 105b for moving and driving the valve movable portion 105a. An elastic member 105c is attached to a tip end portion of the valve movable portion 105b that abuts the belt-shaped substrate 103.

【0006】上記構成のゲートバルブ105により気密
分離するには、バルブ駆動機構105bによりゲート1
04の図面下側の壁部に取り付けられている弾性部材1
06にバルブ可動部105aとともに帯状基板103を
押し付けることで行われている。
In order to perform the airtight separation by the gate valve 105 having the above-mentioned structure, the gate 1 is operated by the valve drive mechanism 105b.
No. 04 elastic member 1 attached to the lower wall of the drawing
This is performed by pressing the belt-shaped substrate 103 together with the valve movable portion 105a onto the substrate 06.

【0007】[0007]

【発明が解決しようとしている課題】しかしながら、近
年の半導体の集積化の進歩により反応時のガスの不純物
成分を下げる必要性から真空対大気のより高い遮断性能
が求められており、従来の真空処理装置では反応時のガ
スの不純成分を無視できない問題があった。
However, due to the recent progress in the integration of semiconductors, it is necessary to reduce the impurity component of the gas at the time of reaction, and therefore a higher vacuum-to-atmosphere shutoff performance is required. The device had a problem that the impure component of the gas during the reaction cannot be ignored.

【0008】また、基板を挟みながら大気対真空に仕切
る構造をとることにより処理された基板へのコンタミネ
ーションによる膜質低下が問題となっている。
Further, there is a problem that the film quality is deteriorated by contamination of the processed substrate by adopting a structure in which the substrate is sandwiched and divided into air and vacuum.

【0009】本発明は、上記従来技術の問題点に鑑みて
なされたものであって、帯状基板収容室と真空処理室と
間の遮断性能をより高くする真空処理装置を提供するこ
とを目的としている。
The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to provide a vacuum processing apparatus which further enhances the blocking performance between the belt-shaped substrate accommodating chamber and the vacuum processing chamber. There is.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
の本発明は、内部が大気圧または真空にされる帯状基板
収容室と、内部が真空状態にされ、連続的に帯状基板が
投入されつつ所定の処理が施される真空処理室とを接続
する通路に、該通路内を通る前記帯状基板の一面と相対
する前記通路の内壁面に第1の弾性体が取り付けられて
おり、前記内壁面と対向する側壁に、前記帯状基板の一
面に対して垂直移動可能に設けられ、前記第1の弾性体
との間で前記帯状基板を挟持し前記真空処理室と前記帯
状基板収容室との間を遮断する第2の弾性体を含むゲー
トバルブが備えられた真空処理装置において、前記第1
および第2の弾性体がゴム弾性体とされ、該ゴム弾性体
の硬度が80Hs以下であることを特徴とする。
In order to achieve the above object, the present invention is directed to a strip-shaped substrate accommodating chamber whose inside is at atmospheric pressure or a vacuum, and an inside which is vacuumed so that the strip-shaped substrates are continuously loaded. A first elastic body is attached to an inner wall surface of the passage, which faces a surface of the strip-shaped substrate passing through the passage and is connected to a vacuum processing chamber in which a predetermined treatment is performed. A side wall facing the wall surface is provided so as to be vertically movable with respect to one surface of the strip-shaped substrate, and the strip-shaped substrate is sandwiched between the first elastic body and the vacuum processing chamber and the strip-shaped substrate accommodating chamber. In the vacuum processing apparatus provided with a gate valve including a second elastic body that interrupts the space,
The second elastic body is a rubber elastic body, and the hardness of the rubber elastic body is 80 Hs or less.

【0011】[0011]

【作用】上記構成の本発明の真空処理装置では、帯状基
板収容室から帯状基板を真空処理室に送り出し、または
真空処理室から帯状基板を帯状基板収容室にて巻き取り
ながら、真空処理室にて帯状基板に所定の処理が施され
る。そして、成膜処理の途中に帯状基板を交換する必要
や、あるいは真空処理室の部品を交換する必要があると
き、ゲートバルブにて帯状基板を挟みながら帯状基板収
容室と真空処理室を気密遮断する。このとき、帯状基板
と当接される第1および第2の弾性体がゴム弾性体とさ
れ、該ゴム弾性体の硬度が80Hs以下とされること
で、真空処理室と帯状基板収容室との間に圧力差がある
状態において従来よりもさらに気密遮断性能が向上す
る。
In the vacuum processing apparatus of the present invention having the above structure, the belt-shaped substrate is fed from the belt-shaped substrate accommodating chamber to the vacuum processing chamber, or the belt-shaped substrate is taken up from the vacuum-treatment chamber in the belt-shaped substrate accommodating chamber while being placed in the vacuum processing chamber. The strip-shaped substrate is subjected to a predetermined process. When it is necessary to replace the band-shaped substrate during the film formation process or when it is necessary to replace the parts of the vacuum processing chamber, the band-shaped substrate is sandwiched between the gate valves and the vacuum processing chamber is hermetically closed. To do. At this time, the first and second elastic bodies that come into contact with the strip-shaped substrate are rubber elastic bodies, and the hardness of the rubber elastic body is set to 80 Hs or less, so that the vacuum processing chamber and the strip-shaped substrate accommodating chamber are separated from each other. In the state where there is a pressure difference between them, the airtight blocking performance is further improved as compared with the conventional case.

【0012】[0012]

【実施例】次に本発明の実施例について図面を参照して
説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0013】図1は本発明の真空処理装置の有するゲー
トバルブの一実施例の詳細な構成を示す斜視図である。
この図に示すように、ゲートバルブ1は、従来公知のも
のと同様にバルブ可動部2およびこれと対向するゲート
可動部対向面4,4aがそれぞれ噛み合ってガスおよび
帯状基板が通るゲート5を塞ぐように形成されている。
ゲート可動部対向面4,4aにはバイトン製のゴム弾性
体6が取り付けられ、また、そのゲート可動部対向面
4,4aと対向するバルブ可動部2の一端面にもバイト
ン製のゴム弾性体3が取り付けられている。
FIG. 1 is a perspective view showing the detailed construction of an embodiment of a gate valve included in the vacuum processing apparatus of the present invention.
As shown in this figure, in the gate valve 1, the valve movable portion 2 and the gate movable portion facing surfaces 4 and 4a that face the valve movable portion 2 mesh with each other to block the gate 5 through which the gas and the strip-shaped substrate pass, as in the case of the conventionally known one. Is formed.
A rubber elastic body 6 made of Viton is attached to the facing surfaces 4 and 4a of the gate moving part, and a rubber elastic body made of viton is also attached to one end surface of the valve moving part 2 facing the facing surfaces 4 and 4a of the gate moving part. 3 is attached.

【0014】図2は、図1に示したゲートバルブでの遮
断性能を実験するための実験装置の概略構成図である。
FIG. 2 is a schematic block diagram of an experimental apparatus for testing the shutoff performance of the gate valve shown in FIG.

【0015】本実施例のゲートバルブ1を用いた実験装
置は、バルブ駆動機構13によりバルブ可動部2をゲー
ト可動部対向面4,4aに向けて移動駆動し、ゲート可
動部対向面4,4aのゴム弾性体6にバルブ可動部2の
ゴム弾性体3を押し付けることで、大気と密閉する密閉
室14が形成されるように構成されている。その密閉室
14には、密閉室14内を真空排気するための排気ポン
プ12が図2に示すようにバルブ8、9、11および圧
力計10を設けた管を介して接続してある。
In the experimental apparatus using the gate valve 1 of this embodiment, the valve driving mechanism 13 moves the valve movable portion 2 toward the gate movable portion facing surfaces 4 and 4a to drive the gate movable portion facing surfaces 4 and 4a. By pressing the rubber elastic body 3 of the valve movable portion 2 against the rubber elastic body 6, the closed chamber 14 that is closed to the atmosphere is formed. An exhaust pump 12 for evacuating the inside of the closed chamber 14 is connected to the closed chamber 14 through a pipe provided with valves 8, 9, 11 and a pressure gauge 10 as shown in FIG.

【0016】ここでは、本実施例のゲートバルブ1を用
いた実験装置で、図2に示すような帯状基板7を挟んだ
状態における大気と真空状態との遮断性能の実験を行っ
た。まず、実験の手順について説明する。
Here, an experiment was conducted with the experimental apparatus using the gate valve 1 of the present embodiment to isolate the atmosphere and the vacuum state from each other while sandwiching the strip substrate 7 as shown in FIG. First, the procedure of the experiment will be described.

【0017】図2に示す実験装置において、帯状基板7
を挟んだ状態におけるもれ量を測定する前には、初めに
バルブ8を閉じ、バルブ11を開いてポンプ12で排気
しながらバルブ9より所定の流量のエアーを流入する。
このときの圧力を圧力計10で測定し、この系の流量と
圧力の関係におけるグラフを図3に示すように作成す
る。
In the experimental apparatus shown in FIG. 2, the strip-shaped substrate 7
Before measuring the amount of leak in the state of sandwiching, the valve 8 is first closed, the valve 11 is opened, and a predetermined flow rate of air is introduced from the valve 9 while exhausted by the pump 12.
The pressure at this time is measured by the pressure gauge 10, and a graph showing the relationship between the flow rate and pressure of this system is prepared as shown in FIG.

【0018】そして、実際のもれ量を測定するにはバル
ブ9を閉じバルブ8を開いて密閉室を排気する。このと
きの圧力計10の圧力を読み取り、図3のグラフによっ
て圧力からエアーのもれ量を換算する。
To measure the actual amount of leakage, the valve 9 is closed and the valve 8 is opened to exhaust the closed chamber. The pressure of the pressure gauge 10 at this time is read, and the leak amount of air is converted from the pressure according to the graph of FIG.

【0019】以上のような実験手順に基づいて、帯状基
板7の厚さを0.127mm、本実施例において設けら
れたゴム弾性体3,6の厚さを0.5mm、その硬度
(スプリング硬さ)を50Hs,60Hs,70Hs,
80Hs,90Hsとし、ゲートバルブ1の押し付け力
を変化させてもれ量を測定した。図4は、その結果のグ
ラフである。
Based on the above-described experimental procedure, the thickness of the belt-shaped substrate 7 is 0.127 mm, the thickness of the rubber elastic bodies 3 and 6 provided in this embodiment is 0.5 mm, and the hardness (spring hardness) 50Hs, 60Hs, 70Hs,
The amount of leak was measured by changing the pressing force of the gate valve 1 to 80 Hs and 90 Hs. FIG. 4 is a graph of the result.

【0020】図4に示すように、ゲートバルブは押し付
け力を増加させていくると各硬度とももれ量は減少する
が、硬度差においてももれ量の差が生じていることが判
る。特に、硬度差におけるもれ量の差は80Hsを超え
るともれ量が多くなり、大気との遮断性をより良くする
ためにはゲートバルブのゴム弾性体の硬度が80Hs以
下である必要があることが判る。
As shown in FIG. 4, when the pressing force of the gate valve is increased, the leak amount decreases with each hardness, but it is understood that there is a difference in the leak amount in the hardness difference. In particular, the difference in the amount of leakage in the hardness difference exceeds 80 Hs, and the amount of leakage increases, and the hardness of the rubber elastic body of the gate valve must be 80 Hs or less in order to improve the barrier property against the atmosphere. I understand.

【0021】次に本発明の他の実施例について説明す
る。
Next, another embodiment of the present invention will be described.

【0022】図5は本発明の真空処理装置の有するゲー
トバルブの他の実施例の詳細な構成を示す斜視図であ
る。この図に示すように、ゲートバルブ1は、従来公知
のものまたは上述の実施例と同様にバルブ可動部2およ
びこれと対向するゲート可動部対向面4,4aがそれぞ
れ噛み合ってガスおよび帯状基板が通るゲート5を塞ぐ
ように形成されている。ゲート可動部対向面4にはバイ
トン製のゴム弾性体14が段差の無いように埋め込まれ
ており、また、そのゲート可動部対向面4,4aと対向
するバルブ可動部2の一端面にもバイトン製のゴム弾性
体3が取り付けられている。
FIG. 5 is a perspective view showing the detailed construction of another embodiment of the gate valve of the vacuum processing apparatus of the present invention. As shown in this figure, the gate valve 1 is similar to the conventionally known one or the above-mentioned embodiment, and the valve movable portion 2 and the gate movable portion facing surfaces 4 and 4a facing the valve movable portion 2 are engaged with each other so that the gas and the strip-shaped substrate are not formed. It is formed so as to close the passing gate 5. A rubber elastic body 14 made of Viton is embedded in the facing surface 4 of the gate movable portion so that there is no step, and one end surface of the valve movable portion 2 facing the facing surfaces 4 and 4a of the movable gate portion also has a viton. Made of rubber elastic body 3 is attached.

【0023】上記のゲート可動部対向面4の構成におい
ても、上述の実施例と同様の実験手順に基づいて、帯状
基板7の厚さを0.127mm、本実施例において設け
られたゴム弾性体3,15の厚さを0.5mm、その硬
度(スプリング硬さ)を50Hs,60Hs,70H
s,80Hs,90Hsとし、ゲートバルブ1の押し付
け力を変化させてもれ量を測定した。図6は、その結果
のグラフである。
Also in the above-mentioned structure of the facing surface 4 of the movable gate portion, the thickness of the belt-shaped substrate 7 is 0.127 mm, and the rubber elastic body provided in this embodiment is based on the same experimental procedure as in the above-mentioned embodiment. The thickness of 3,15 is 0.5 mm, and the hardness (spring hardness) is 50 Hs, 60 Hs, 70 H
s, 80Hs, 90Hs, and the amount of leak was measured by changing the pressing force of the gate valve 1. FIG. 6 is a graph of the result.

【0024】図6に示すように、ゲートバルブは押し付
け力を増加させていくると各硬度とももれ量は減少する
が、上述の実施例と同様に硬度差においてももれ量の差
が生じていることが判る。特に、硬度差におけるもれ量
の差は80Hsを超えるともれ量が多くなり、大気との
遮断性をより良くするためにはゲートバルブのゴム弾性
体の硬度が80Hs以下である必要があることが判る。
As shown in FIG. 6, when the pressing force of the gate valve is increased, the leakage amount with each hardness decreases. However, as in the above-described embodiment, the difference in hardness also occurs. You can see that In particular, the difference in the amount of leakage in the hardness difference exceeds 80 Hs, and the amount of leakage increases, and the hardness of the rubber elastic body of the gate valve must be 80 Hs or less in order to improve the barrier property against the atmosphere. I understand.

【0025】[0025]

【発明の効果】以上説明したような本発明の装置は、ゲ
ートバルブにより帯状基板収容室と真空処理室との間を
気密分離する場合、ゲートバルブにより帯状基板を挟ん
だときに当接される第1および第2の弾性体をゴム弾性
体とし、該ゴム弾性体の硬度を80Hs以下と限定する
ことでより高い真空遮断性能を得ることができる。
According to the apparatus of the present invention as described above, when the band-shaped substrate accommodating chamber and the vacuum processing chamber are hermetically separated by the gate valve, the band-shaped substrate is contacted when the band-shaped substrate is sandwiched by the gate valve. Higher vacuum cutoff performance can be obtained by using rubber elastic bodies as the first and second elastic bodies and limiting the hardness of the rubber elastic bodies to 80 Hs or less.

【0026】このため、真空処理室にて帯状基板に所定
の処理を施す際の反応時のガスへ不純物成分を下げるこ
とができ、良質の膜処理が施せる。
Therefore, the impurity component can be reduced to the gas at the time of the reaction when the predetermined treatment is performed on the belt-shaped substrate in the vacuum treatment chamber, and the high-quality film treatment can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の真空処理装置の有するゲートバルブの
一実施例の詳細な構成を示す斜視図である。
FIG. 1 is a perspective view showing a detailed configuration of an embodiment of a gate valve included in a vacuum processing apparatus of the present invention.

【図2】図1に示したゲートバルブでの遮断性能を実験
するための実験装置の概略構成図である。
FIG. 2 is a schematic configuration diagram of an experimental device for testing the shutoff performance of the gate valve shown in FIG.

【図3】図2に示す実験装置を用いた場合の、エアーの
もれ量を換算するグラフである。
FIG. 3 is a graph for converting an air leakage amount when the experimental apparatus shown in FIG. 2 is used.

【図4】図2に示す実験装置を用い、ゴム弾性体の各硬
度のゲートバルブの押し付け力を変化させてもれ量を測
定した結果を示すグラフである。
FIG. 4 is a graph showing the results of measuring the amount of leakage using the experimental apparatus shown in FIG. 2 while changing the pressing force of the gate valve for each hardness of the rubber elastic body.

【図5】本発明の真空処理装置の有するゲートバルブの
他の実施例の詳細な構成を示す斜視図である。
FIG. 5 is a perspective view showing a detailed configuration of another embodiment of the gate valve included in the vacuum processing apparatus of the present invention.

【図6】図2に示す実験装置を用い、ゴム弾性体の各硬
度のゲートバルブの押し付け力を変化させてもれ量を測
定した結果を示すグラフである。
FIG. 6 is a graph showing the results of measuring the amount of leakage when the pressing force of the gate valve of each hardness of the rubber elastic body is changed using the experimental apparatus shown in FIG.

【図7】従来のゲートバルブを有する真空処理装置を示
す概略構成図である。
FIG. 7 is a schematic configuration diagram showing a vacuum processing apparatus having a conventional gate valve.

【符号の説明】[Explanation of symbols]

1 ゲートバルブ 2 バルブ可動部 3,6,15 ゴム弾性体 4,4a ゲート可動部対向面 5 ゲート 7 帯状基板 8,9,11 バルブ 10 圧力計 12 排気ポンプ 13 バルブ駆動機構 14 密閉室 DESCRIPTION OF SYMBOLS 1 Gate valve 2 Valve movable part 3,6,15 Rubber elastic body 4,4a Gate movable part facing surface 5 Gate 7 Strip substrate 8,9,11 Valve 10 Pressure gauge 12 Exhaust pump 13 Valve drive mechanism 14 Closed chamber

───────────────────────────────────────────────────── フロントページの続き (72)発明者 黒川 岳 東京都大田区下丸子3丁目30番2号 キヤ ノン株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Gaku Kurokawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 内部が大気圧または真空にされる帯状基
板収容室と、内部が真空状態にされ、連続的に帯状基板
が投入されつつ所定の処理が施される真空処理室とを接
続する通路に、該通路内を通る前記帯状基板の一面と相
対する前記通路の内壁面に第1の弾性体が取り付けられ
ており、 前記内壁面と対向する側壁に、前記帯状基板の一面に対
して垂直移動可能に設けられ、前記第1の弾性体との間
で前記帯状基板を挟持し前記真空処理室と前記帯状基板
収容室との間を遮断する第2の弾性体を含むゲートバル
ブが備えられた真空処理装置において、 前記第1および第2の弾性体がゴム弾性体とされ、該ゴ
ム弾性体の硬度が80Hs以下であることを特徴とする
真空処理装置。
1. A strip-shaped substrate accommodating chamber, the inside of which is at atmospheric pressure or a vacuum, and a vacuum processing chamber, in which the inside is evacuated and a predetermined process is performed while continuously introducing the strip-shaped substrates. A first elastic body is attached to an inner wall surface of the passage facing the one surface of the belt-shaped substrate passing through the passage, and a side wall facing the inner wall surface is provided with respect to the one surface of the belt-shaped substrate. A gate valve including a second elastic body that is provided so as to be vertically movable and that sandwiches the strip-shaped substrate with the first elastic body and shuts off between the vacuum processing chamber and the strip-shaped substrate accommodating chamber is provided. In the vacuum processing apparatus described above, the first and second elastic bodies are rubber elastic bodies, and the hardness of the rubber elastic body is 80 Hs or less.
JP34075692A 1992-12-21 1992-12-21 Vacuum treatment device Pending JPH06184746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34075692A JPH06184746A (en) 1992-12-21 1992-12-21 Vacuum treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34075692A JPH06184746A (en) 1992-12-21 1992-12-21 Vacuum treatment device

Publications (1)

Publication Number Publication Date
JPH06184746A true JPH06184746A (en) 1994-07-05

Family

ID=18340010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34075692A Pending JPH06184746A (en) 1992-12-21 1992-12-21 Vacuum treatment device

Country Status (1)

Country Link
JP (1) JPH06184746A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014162952A (en) * 2013-02-25 2014-09-08 Choshu Industry Co Ltd Gate valve and vacuum treatment apparatus provided with the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014162952A (en) * 2013-02-25 2014-09-08 Choshu Industry Co Ltd Gate valve and vacuum treatment apparatus provided with the same

Similar Documents

Publication Publication Date Title
JP2825172B2 (en) Reduced pressure processing apparatus and reduced pressure processing method
US6432838B1 (en) Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method, and method of optimizing recipe of cleaning process for process chamber
TWI238856B (en) Buffer chamber and method for integrating physical and chemical vapor deposition chambers together in a processing system
TWI386572B (en) Halogen gas or a halogen compound gas
KR20010087350A (en) Apparatus and method for processing a substrate, and method for manufacturing an electronic device
US6171104B1 (en) Oxidation treatment method and apparatus
JPH06132224A (en) Apparatus for manufacturing semiconductor device and load lock chamber, and manufacture of semiconductor device using such apparatus for manufacturing semiconductor device
JP3199162B2 (en) Continuous vacuum processing equipment
JP2000120992A (en) Gas charging method to gas cylinder and gas charging device
EP0382985A1 (en) Gas purge system
JPH06184746A (en) Vacuum treatment device
JP3480280B2 (en) Vertical processing equipment
JPH06314678A (en) Hermetically sealed cleaning apparatus
JPH0783011B2 (en) Decompression treatment method and device
JP3470701B2 (en) Load lock device and its operation method
JPH11230034A (en) Evacuating system and its operating method
JP2013124659A (en) Vacuum exhauster
JPH01215343A (en) Method and device for evaluating capacity of gas refiner
JPS63285924A (en) Device for manufacturing semiconductor
JP2023520932A (en) High temperature vacuum sealed
JP2849772B2 (en) Sealing device and sealing method
JPH0572015A (en) Device for measuring amount of released gas
JPH07280099A (en) Vacuum device
JPH0513002Y2 (en)
TW202237997A (en) Dual vacuum seal