JPH0618228B2 - Probe device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a probe device.

(Prior Art) A probe device reduces the cost by measuring the electrical characteristics of each of IC chips formed in large numbers on an object to be measured, for example, a semiconductor wafer, and eliminating chips determined to be defective before the assembly process. It is a device that contributes to the improvement of productivity.

In recent years, due to the high integration of IC chips and the increase in the number of types of products, the number of small-quantity and type-of-manufacturing processes has increased, and the number of operations by the operator has increased greatly. In particular, it is necessary to replace the probe card with each type of symmetrical IC chip to be measured and each time the arrangement pattern of the electrode pads is different, and the replacement has been performed appropriately. For this replacement, the operator manually loosens the screws or the like at about eight locations on the probe card attachment portion to remove the probe card, and then attaches another probe card.

Further, this probe card fixing device is disclosed in JP-A-59-189641.
And Japanese Patent Laid-Open No. 60-1840.

(Problems to be Solved by the Invention) However, in the conventional technique described above, the operator has to attach and detach the probe card with screws at about eight places, which is troublesome and poor in workability. there were.

In addition, if the screw fastening order is incorrect, the probe card may be distorted. Attach the probe card by IC
Since the chip's electrode pad is extremely small, the probe card must be installed and replaced with high accuracy in order to obtain highly reliable measurement results. Since the electrode pads of the IC chip do not contact accurately and contact failure or the like occurs, it takes a lot of time to adjust the accuracy, which is an obstacle to shortening the working time.

Furthermore, in the probe card fixing method disclosed in the above publicity,
Since the pin serves both for electrical connection and fixing, there is a problem that the fixing force is weak and displacement occurs.

The present invention has been made in consideration of the above points, and provides a probe device capable of simplifying the work by replacing the probe card with one touch, shortening the replacement time, and preventing distortion of the probe card. It is what

[Structure of Invention]

(Means for Solving the Problems) The present invention is a probe device for replacing a probe card corresponding to each type of the object to be measured and measuring the object to be measured, which is attached to a peripheral portion of the probe card. And a probe card adapter having a positioning mechanism for the probe device main body, which is configured to be adjustable in relative position to the probe card, and arranged at a predetermined position of the probe device main body by rotating a lever to A probe characterized in that the probe card is detachably supported by the probe device main body by a plurality of support mechanisms configured to be capable of pressing and supporting the probe card adapter at a predetermined position of the probe device main body. You get the device.

(Function and Effect) By exchanging the probe card with the probe card change lever, the probe card can be accurately exchanged with one touch, and the work can be simplified and the exchange time can be shortened. Also, due to work mistakes that occur when fixing the probe card with screws etc., the card may drop,
Further, it becomes easy to prevent distortion.

Further, it is possible to easily cope with automation of replacement of the probe card.

(Embodiment) An embodiment of the device of the present invention will be described below with reference to the drawings.

First, the configuration of the probe device will be described.

The probe device (1) is provided with a wafer cassette (2),
In this cassette (2), for example, 25 wafers (3) can be installed at a predetermined interval so that 25 wafers (3) can be installed. The wafer cassette (2) is provided in the cassette storage section (4) and can be carried to the preliminary positioning stage (5) by a carrying mechanism (not shown). The pre-positioning stage (5) is configured to rotate and pre-position to an accuracy of about ± 1 ° with reference to the orientation flat of the wafer (3). A transfer mechanism such as a hand arm (not shown) is provided so that the wafer (3) can be transferred from the preliminary positioning stage (5) to the measurement stage (6). The measurement stage (6) is capable of holding, for example, sucking and holding the wafer (3) transferred by the hand arm, and in this holding state, the wafer (3) is configured to be movable in X, Y, and Z directions. There is. Measurement stage above (6)
A probe card (8) having a probe needle (7) for measuring the wafer (3) held on the substrate is attached to a head plate (9) arranged on the upper surface of the probe device (1). As shown in FIG. 2, the probe card (8) is attached to the probe card change lever (11) which supports the periphery of the probe card adapter (10) in which the probe card (8) is fitted at a plurality of places, for example, three places. ), The probe card is detachably provided. As shown in FIG. 3, the probe card change lever (11) moves the gripping part (13) in the direction of the arrow (14) with the rotary shaft (12) pivotally supported on the lower surface of the head plate (9) as a fulcrum. Then, in conjunction with this, the support part (15) moves toward the arrow (17) around the rotary shaft (16) as a fulcrum, and the rotary shaft (12) side end part of the gripping part (13), The end portion of the support portion (15) on the rotary shaft (16) side is provided in the shape of a gear, and by rotating the grip portion (13) in the direction of the arrow (14) and in the opposite direction, a meshing action is achieved. Above support
(15) is configured to rotate and move in the direction of arrow (17) and in the opposite direction. A claw (18) is provided on the tip side surface of the support portion (15) which is a part of the probe card change lever (11), and the probe card adapter (10) in which the probe card (8) is fitted The probe card adapter (10) can be positioned and fixed by inserting the claw (18) into the fixing groove (19) provided. The probe card adapter (10) and the probe card (8) are mounted and fixed by overlapping the screw holes provided on the probe card (8) with the screw holes provided on the probe card adapter (10) and screwing them from above and below. It is fixed with a nut. At this time, the screw hole of the probe card adapter (10) is configured so that the rotation (θ direction) of the probe card (8) can be adjusted. In order to hold the probe card adapter (10) with the probe card (8) attached and fixed in this manner, the probe card adapter (10) is attached to the attachment groove formed at a predetermined position on the lower surface of the head plate (9). Insert this probe card adapter (10) at multiple locations, for example at three locations.
It is configured to be positioned and supported by 1). At the time of this support, the probe card change lever (11) is configured to be locked, which means that the grip (13) is indicated by the arrow (1).
4) It is rotated in the opposite direction, that is, to the head plate (9) side, and the gripping part (13) and the supporting part (15) are parallel, that is, the head plate (9).
A lock mechanism (20) is provided that locks upon contact with. In this lock mechanism (20), one end of the arm (21a) is pivotally attached to the rotary shaft (22) provided in the gripping part (13), and the other end is pivotally attached to the rotary shaft (23). The other end of the arm (21b), one end of which is attached to the shaft (23), is attached to the rotary shaft (24) which is pivotally supported by the head plate (9). Above arm (2
A protrusion is formed on the grip (13) side at one end of the rotating shaft (23) side of 1b), and the hemispherical protrusion (25b) is formed at the tip of this protrusion.
Is provided on the arm (21a) side, and the gripping portion (13) is attached to the hemispherical recess (25a) provided corresponding to the arm (21a) by the arrow (1
4) It is configured to fit and lock by moving in the direction 4). Further, a hemispherical convex portion (26b) is provided near the rotary shaft (24) of the arm (21b), and the gripping portion (13) is provided in the hemispherical concave portion (26a) provided corresponding to the arm (21a). ) Arrow
When the head plate (9) is moved in the direction opposite to the direction (14) and comes into contact with the head plate (9), the head plate (9) is fitted and locked. In this way, the probe card change lever (11) is used to attach the probe card adapter (1)
0) can be attached and detached and supported and fixed.

Next, a method for measuring a semiconductor wafer and a method for replacing a probe card with the above-described probe device will be described.

In FIG. 1, the wafer (3) is sucked and held from a wafer cassette (2) accommodating a plurality of wafers (3) by a transfer mechanism (not shown), such as vacuum suction tweezers, and inserted. The inserted wafer (3) is transferred to the preliminary positioning stage (5) by a transfer arm (not shown) rotatable about one end. The pre-positioning stage (5) detects the orientation flat of the wafer (3) by a transmissive sensor (not shown) such as a photo interrupter, and pre-positions up to an accuracy of ± 1 ° with reference to the orientation fla. The wafer (3) for which this preliminary positioning has been completed is transferred to and placed on the measurement stage (6) by the transfer arm. The measurement stage (6) holds the wafer (3), for example, sucks and holds it, and the wafer (3) is held by an optical system bridge (not shown).
After performing alignment with the scribe line or the like formed above as a reference, it is moved to the measuring section immediately below the probe card (8). Then, needle alignment is performed to align the electrode pads of a plurality of chips formed on the wafer (3) and the probe needle (7) of the probe card (8), and the probe needle (7) is attached to the electrode pad. The chips are brought into contact with each other and the above-mentioned chips are measured.

Then, the above measurement is performed until the necessity of measuring different types of wafers occurs, when different types of wafers are generated, or when the probe card (8) is damaged, etc.
A probe card corresponding to the wafer is determined by automatically recognizing the wafer ID code, etc., for the wafer type.
Exchange with (8) by the following means. This exchange can be performed, for example, by changing the probe card change lever as shown in FIG.
When (11) is used to move the gripping part (13) in the direction of the arrow (14), the support part (15) moves in the direction of the arrow (17) by the interlocking action with this, and the locking mechanism Arm in (20) (21
a) hemispherical recess (25a) and arm (21b) hemispherical projection (25a)
The probe card change lever (11) is fixed when (b) is fitted. At this time, the arrow (17) of the support (15)
Appropriate measures are taken in advance in order to prevent the probe card adapter (10) to which the probe card (8) is attached and fixed from dropping during movement in the direction. Then, remove the probe card adapter (10) to which the probe card (8) is attached and fixed, and attach the probe card adapter (10) to which the probe card (8) corresponding to another type of wafer to be measured is attached and fixed. The probe card adapter (10) is inserted into an insertion groove formed at a predetermined position on the lower surface of the head plate (9), and the probe card adapter (10) is provided at a plurality of places, for example, three places. Positioned and fixed by the probe card change lever (11). For this positioning and fixing, for example, a conical claw (18) provided on the tip side surface of the support part (15) which is a part of the probe card change lever (11) is provided with an arrow (17) of the support part (15). ) Is inserted into a fixing groove (19) of the same shape as the claw (18) provided in the probe card adapter (10) by moving in the opposite direction, and the supporting portion (15) is the lower surface of the head plate (9). When they come into contact with each other, they are fitted and positioned and fixed.

In this way, the gripping part (13) of the probe card change lever (11) is rotationally moved in the direction of the arrow (14), and the support part (15) that operates in conjunction with this movement is engaged in the direction of the arrow (17). Rotate to release the probe card adapter (10) and replace it with a probe card adapter (10) to which another probe card (8) is attached and fixed. Return (11) to finish replacing the probe card (8). This exchanged probe card (8) is configured so that the probe needle (7) and the head plate (9) can be electrically connected by a connection mechanism (not shown) when fixed by the change lever (11). Electrical measurements can be performed with the probe needle (7). For replacement of the probe card adapter (10) to which this probe card (8) is attached and fixed, the head plate (9) is opened and closed for replacement, or the opening / closing mechanism of only the probe card adapter (10) is previously set. By providing it and opening and closing it for replacement, this replacement can be performed easily and the replacement time can be shortened. In the case of replacement by such an opening / closing mechanism, in the case of a high-frequency measuring probe device, the test head is located above the opening / closing mechanism. Therefore, if the test head is retracted to perform the opening / closing operation, there is no problem in replacement. .

Further, although the above replacement is a case where it is manually replaced by an operator, this may be performed automatically. As shown in Fig. 4, this automatic exchange method begins with a probe card accurately positioned on the probe card adapter (10).
A plurality of (8) are loaded in parallel on the storage rack (27) at a predetermined interval. Here, the probe card (8) corresponding to the wafer type is selected based on the wafer type information programmed in advance in the memory mechanism of the prober CPU, and the transfer arm (8) is selected on the lower surface of the selected probe card (8). Insert 28). A disc-shaped probe card mounting plate (29) is attached to the tip of the transfer arm (28), and a probe card support pin (30) is provided on the peripheral edge thereof at an interval of, for example, 120 degrees. Is projected. Such a transfer arm
The probe card (8) is mounted on the probe card mounting plate (23) by raising (28). Then, the probe card adapter (10) holding the probe card (8) is temporarily placed on a probe card adapter (10) alignment mechanism (not shown) to perform alignment. After this alignment is completed, the probe card (8) is mounted again together with the probe card adapter (10), and the transfer arm (28) is rotated to transfer the probe card (8) to the lower surface of the head plate (9). Then this transfer arm (28)
Vertically, e.g. probe card adapter
After inserting and positioning the guide pin (31) of the head plate (9) in the guide hole (not shown) of (10), drive the probe card chez lever with an air cylinder etc. to move the probe card (8) to the probe card adapter (10). ) Hold.
As the above-mentioned transfer arm, for example, an expandable arm having a structure in which a large number of rings are connected to each other in an X shape by pivot pins is conceivable. However, the transfer arm is not limited to this, and for example, a scalar robot is used to transfer the probe card. It doesn't matter. Furthermore, by installing such a probe card automatic exchange mechanism in the probe device, complete automation of the probe device can be achieved.

In the above embodiment, the probe card was replaced for each probe card adapter, but the probe card alone can be replaced.

In the above embodiment, the probe card change lever is used at three places, but it may be used at a plurality of places. For example, it may be used at one place and a hooking mechanism having an L-shaped cross section on one side. Alternatively, the probe card may be exchanged by operating the probe card change lever at one of the above positions.

As described above, according to this embodiment, the replacement time of the probe card can be shortened. In addition, it is possible to prevent the card from dropping or being distorted due to a work error that occurs when the probe card is fixed with a screw or the like when it is attached.

[Brief description of drawings]

FIG. 1 is a block diagram of a probe device for explaining an embodiment of the device of the present invention, FIGS. 2 and 3 are illustrations of an embodiment of the probe card change lever of FIG. 1, and FIG. 4 is a probe. It is an explanatory view of automatic card exchange. 7 ... Probe needle, 8 ... Probe card, 9 ... Head plate, 10 ... Probe card adapter, 11 ... Probe card change lever 20 ... Lock mechanism.

Claims (1)

[Claims] 1. A probe device for measuring the object to be measured by replacing with a probe card corresponding to each kind of object to be measured, the probe device being attached to a peripheral portion of the probe card, and the relative position to the probe card. And a probe card adapter having a positioning mechanism with respect to the probe device main body, the probe card adapter being arranged at a predetermined position of the probe device main body, and rotating the lever to move the probe card adapter to the probe device main body. A probe device, wherein the probe card is detachably supported by the probe device main body by a plurality of support mechanisms configured to be pressed and supported at a predetermined position.