JPH06170806A - Adjustment of position of material thickness measuring optical sensor of planer - Google Patents

Adjustment of position of material thickness measuring optical sensor of planer

Info

Publication number
JPH06170806A
JPH06170806A JP35089192A JP35089192A JPH06170806A JP H06170806 A JPH06170806 A JP H06170806A JP 35089192 A JP35089192 A JP 35089192A JP 35089192 A JP35089192 A JP 35089192A JP H06170806 A JPH06170806 A JP H06170806A
Authority
JP
Japan
Prior art keywords
light
gauge
planer
optical sensor
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35089192A
Other languages
Japanese (ja)
Inventor
Hiromi Ozawa
広身 小沢
Kazunori Matsushita
寿徳 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Koki Haramachi Co Ltd
Original Assignee
Hitachi Koki Haramachi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Koki Haramachi Co Ltd filed Critical Hitachi Koki Haramachi Co Ltd
Priority to JP35089192A priority Critical patent/JPH06170806A/en
Publication of JPH06170806A publication Critical patent/JPH06170806A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To simply adjust the optical axis position of a light detection sensor until the incidence and blocking of the light from a light projection sensor with respect to the light detection sensor are confirmed by two measuring devices allowed to correspond to the height of a setting gauge by setting a lift frame so that the leading end of a dial gauge comes into contact with the edge of a planer blade by raising and lowering the lift frame. CONSTITUTION:The dial gauge preset to a predetermined height by a setting gauge is placed on the upper surface of a table 2 and a lift frame 19 is moved up and down until the leading end of the dial gauge comes into contact with the edge of the planer blade positioned just under a planer spindle 5 to set the height from the edge of the planer blade to the upper surface of the table 2 to the height of the setting gauge. Next, a measuring device A is placed on the upper surface of the table 2 and the incident of light on a light detection sensor is confirmed and, subsequently, the measuring device A is replaced with a measuring device B to confirm the blocking of light. The optical axis positions of the light detection sensor 13 and a light projection sensor 12 are adjusted in height until the incidence or blocking of light by detaching or attaching a liner 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、テーブル固定式のかん
な盤に用いる材料厚さ測定用光センサーにおいて、かん
な刃の刃先と光センサー光軸位置を一致させる調整方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adjusting method for aligning the optical axis position of an optical sensor with the cutting edge of a planer blade in an optical sensor for measuring material thickness used in a table-fixing planer.

【0002】[0002]

【従来の技術】従来の材料厚さ測定用光センサー位置調
整方法は、まず、かんな刃で材料を切削し、切削した材
料の寸法を曲尺、ノギス等で測定し、その測定した値に
なるように光センサーの位置を調整する作業を繰り返し
行うことにより、光センサーの光軸位置を調整してい
た。
2. Description of the Related Art The conventional method for adjusting the position of an optical sensor for measuring material thickness is to first cut the material with a planer blade, measure the size of the cut material with a tape measure, calipers, etc., and adjust it to the measured value. By repeating the work of adjusting the position of the optical sensor, the optical axis position of the optical sensor was adjusted.

【0003】[0003]

【発明が解決しようとする課題】従来の光センサー位置
調整方法は、材料を繰り返し切削し、寸法が合うまで何
回も光センサーの光軸位置を調整しなければならず、位
置調整に多大の時間を要していた。また、材料のそりや
うねり等により切削寸法にばらつきが生じている場合、
かんな刃の刃先と光センサー光軸位置を正確に合わせる
ことは困難であった。本発明の目的は、上記した従来技
術の欠点をなくし、かんな刃の刃先と光センサーの光軸
位置を簡単に、しかも正確に合わせることである。
In the conventional optical sensor position adjusting method, it is necessary to repeatedly cut the material and adjust the optical axis position of the optical sensor many times until the dimensions are matched, which is very difficult for the position adjustment. It took time. Also, if the cutting dimensions vary due to material warpage or undulation,
It was difficult to accurately align the cutting edge of the planer blade with the optical axis of the optical sensor. An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to easily and accurately align the cutting edge of the planer blade and the optical axis position of the optical sensor.

【0004】[0004]

【課題を解決するための手段】上記目的は、あらかじめ
セットゲージにより所定の高さ寸法に設定されたダイヤ
ルゲージをテーブル上に置き、昇降枠を昇降させて該ダ
イヤルゲージの先端とかんな刃の刃先が当接する位置に
昇降枠を設定し、セットゲージの高さ寸法に対応させた
2種類の測定具A,Bを用いて、測定具Aで前記投光用
光センサーが受光用光センサーに入光し、測定具Bで遮
光されていることを確認し、入光又は遮光していない場
合は入光又は遮光するまで前記投光用、受光用光センサ
ーの位置を調整手段で調整し、かんな刃の刃先位置と光
センサーの光軸を一致させることにより達成される。
The above-mentioned object is to place a dial gauge, which is set to a predetermined height by a set gauge, on a table, and to elevate and lower the elevating frame so that the tip of the dial gauge and the cutting edge of a planer blade. The elevating frame is set at the position where the abutment is made, and the two types of measuring tools A and B corresponding to the height dimension of the set gauge are used. It is confirmed that the light is emitted and is shielded by the measuring tool B. If the light is not received or is not shielded, the position of the light emitting and receiving light sensor is adjusted by the adjusting means until the light is received or the light is blocked. This is achieved by aligning the position of the cutting edge of the blade with the optical axis of the optical sensor.

【0005】[0005]

【作用】まず、セットゲージで所定の高さに設定された
ダイヤルゲージをかんな刃が位置するテーブル上面に置
き、ダイヤルゲージの先端がかんな刃の刃先に当接する
位置まで昇降枠を上下移動させ、かんな刃の刃先からテ
ーブル上面までの高さをセットゲージの高さ寸法に設定
する。所定値に設定した刃先からテーブル上面までの高
さに対し、投光用,受光用光センサーの位置を確認する
ために測定具Aをテーブル上面に置き、測定具Aの高さ
で光センサーの光が入光することを確認しする。次に、
測定具Aから測定具Aより微少量高さのある測定具Bに
取り換え、測定具Bの高さで光センサーの光が遮光され
ているかを確認し、入光又は遮光していない場合は入光
又は遮光するまで調整手段で、光センサー光軸位置を調
整し、光センサー位置を測定具A,Bの高さの差内にな
るようにする。
[Function] First, the dial gauge set to a predetermined height by the set gauge is placed on the table upper surface where the planer blade is located, and the elevating frame is moved up and down to the position where the tip of the dial gauge comes into contact with the blade tip of the planer blade. Set the height from the cutting edge of the planer blade to the table upper surface as the height dimension of the set gauge. With respect to the height from the cutting edge set to a predetermined value to the table top surface, the measuring tool A is placed on the table top surface in order to confirm the position of the light emitting and receiving light sensors, and the height of the measuring tool A Make sure the light comes in. next,
Replace the measuring tool A with a measuring tool B that is slightly smaller than the measuring tool A, and check whether the light of the optical sensor is blocked at the height of the measuring tool B. The position of the optical axis of the optical sensor is adjusted by the adjusting means until the light or the light is blocked so that the position of the optical sensor is within the difference in height between the measuring tools A and B.

【0006】[0006]

【実施例】本発明の実施例を図1〜図13に基づいて説
明する。図1はかんな盤の全体正面図、図2は図1の左
側面図である。図において、ベース1の上に材料を支持
するテーブル2を固定し、テーブル2上面に対向した位
置に切削ヘッド3が設けられている。切削ヘッド3内に
はかんな刃4を有するかんな胴5が設けられ、かんな胴
5の一端にプーリ6を嵌合させ、プーリ6にはかんな刃
4の位置を真下にさせる位置決め穴が形成されている。
かんな胴5はベアリングケース7に軸支され、ベアリン
グケース7にはかんな胴5を固定するためのストッパ8
が設けられている。かんな胴5の前後には送材ローラ
9,10を設け、切削ヘッド3の材料送入側(図1にお
いて右側)にはパネルボックス11を配設している。切
削ヘッド3はテーブル2の両側面のガイド17を案内に
上下動可能に嵌合させたサイドフレーム18に固定され
ることで門形の昇降枠19を形成している。パネルボッ
クス11の一端には投光用光センサー12、他端に受光
用光センサー13が取り付けられている。受光用光セン
サー13側にはモニタランプが付いており、入光時は点
灯、遮光時には消灯する。図3は図2のA部拡大図であ
る。図3において、受光用光センサー13はセンサホル
ダ14に固定され、センサホルダ14は取付ネジ15で
パネルボックス11に固定されている。センサホルダ1
4とパネルボックス11の間には図4のようなライナー
16を挿入している。ライナー16は光センサー12,
13の光軸位置を調整する調整手段の役目を果たし、1
枚当たり0.1mmの厚さで通常数枚挿入され、取付ネ
ジ15が位置する部分に切欠き部16aが形成されてい
る。なお、投光用光センサー12も同じくセンサホルダ
14に固定され、投光用光センサー12側のセンサホル
ダ14とパネルボックス11の間にもライナー16が挿
入されている。図5に示す20はコ字状に形成されたセ
ットゲージで、セットゲージ20は図6のダイヤルゲー
ジ21の高さを所定の値に設定するためのものである。
図7に示す22は測定具Aとなる入光ゲージ、図8に示
す23は測定具Bとなる遮光ゲージである。遮光ゲージ
23の高さは入光ゲージ22より0.2mm高く設定し
てある。上記構成において、本発明の光センサー12,
13の位置調整方法について説明する。まず、ストッパ
8をプーリ6の位置決め穴に挿入し、かんな刃4が真下
になるようにかんな胴5を固定する。図9に示すように
セットゲージ20の内面20aにダイヤルゲージ21を
入れ、ダイヤルゲージ21のゼロ位置を合わせ、ダイヤ
ルゲージ21の高さを所定の値(セットゲージ18の内
面18aの高さ寸法)に設定する。設定後、ダイヤルゲ
ージ21をセットゲージ20から取り出し、図10に示
すようにかんな刃4の下方に位置するようにテーブル2
上面に設置し、ダイヤルゲージ21のゼロ設定値まで
(ダイヤルゲージ21の先端にかんな刃4の刃先が当接
するまで)昇降枠19を上下移動させ、かんな刃4の刃
先とテーブル2上面間の高さ寸法をセットゲージ20の
内面20aの高さに設定し、設定後、ダイヤルゲージ2
1を取り出す。次に、図11に示すように投光用光セン
サー12端面付近に位置するようにテーブル2上面に入
光ゲージ22を置き、受光用光センサー13のモニタラ
ンプが点灯していることを確認する。モニタランプが点
灯していない場合は、ランプが点灯するまで受光側のラ
イナー16を一枚ずつ取り外す。点灯確認後、入光ゲー
ジ22を取り出し、入光ゲージ22と同様の位置に遮光
ゲージ23を置き、受光用光センサー13のモニタラン
プが消灯していることを確認する。モニタランプが点灯
している場合、消灯するまで受光側のセンサホルダ14
とパネルボックス11の間にライナー16を一枚ずつ追
加挿入する。図12に示すように受光用光センサー13
の端面付近でもゲージ22,23にて前記した調整を同
様に行ない、入光ゲージ22でモニタランプが点灯して
いることを確認し、遮光ゲージ23でモニタランプが消
灯していることを確認し、点灯又は消灯しない場合は、
投光側のライナー16を取り出し、又は追加送入する。
従って、入光ゲージ22を置いた時にはモニタランプが
点灯し、遮光ゲージ23を置いた時にはモニタランプが
消灯していれば、光センサー12,13の光軸はセット
ゲージ20の寸法差内に入ったことになり、これで光セ
ンサー12,13の位置調整が完了する。図13は光セ
ンサー12,13付近の拡大斜視図である。設定後、図
13において、位置調整後、テーブル2上の材料送入側
に材料24をセットし、昇降枠19を上下移動させ、光
センサー12,13が材料24の感知し、図示しない表
示装置を介して材料24の厚さを正確に表示する。
EXAMPLE An example of the present invention will be described with reference to FIGS. FIG. 1 is an overall front view of the planer, and FIG. 2 is a left side view of FIG. In the figure, a table 2 supporting a material is fixed on a base 1, and a cutting head 3 is provided at a position facing the upper surface of the table 2. A cutting cylinder 3 having a cutting blade 4 is provided in the cutting head 3, a pulley 6 is fitted to one end of the cutting cylinder 5, and a positioning hole is formed in the pulley 6 so that the position of the cutting blade 4 is directly below. There is.
The planer barrel 5 is axially supported by the bearing case 7, and a stopper 8 for fixing the planer barrel 5 to the bearing case 7 is provided.
Is provided. Material feeding rollers 9 and 10 are provided before and after the planer cylinder 5, and a panel box 11 is provided on the material feeding side (right side in FIG. 1) of the cutting head 3. The cutting head 3 is fixed to a side frame 18 fitted with guides 17 on both side surfaces of the table 2 so as to be vertically movable as guides, thereby forming a gate-shaped lifting frame 19. An optical sensor 12 for projecting light is attached to one end of the panel box 11, and an optical sensor 13 for receiving light is attached to the other end. A monitor lamp is provided on the light-receiving optical sensor 13 side, which is turned on when light is received and turned off when light is blocked. FIG. 3 is an enlarged view of part A of FIG. In FIG. 3, the light receiving optical sensor 13 is fixed to the sensor holder 14, and the sensor holder 14 is fixed to the panel box 11 with a mounting screw 15. Sensor holder 1
A liner 16 as shown in FIG. 4 is inserted between the panel 4 and the panel box 11. The liner 16 is an optical sensor 12,
It plays the role of adjusting means for adjusting the optical axis position of 13 and 1
Normally, several sheets each having a thickness of 0.1 mm are inserted, and a cutout portion 16a is formed in a portion where the mounting screw 15 is located. The light projecting light sensor 12 is also fixed to the sensor holder 14, and the liner 16 is also inserted between the sensor holder 14 on the light projecting light sensor 12 side and the panel box 11. Reference numeral 20 shown in FIG. 5 is a U-shaped set gauge, and the set gauge 20 is for setting the height of the dial gauge 21 of FIG. 6 to a predetermined value.
Reference numeral 22 shown in FIG. 7 is a light entrance gauge which becomes the measuring tool A, and 23 shown in FIG. The height of the light blocking gauge 23 is set to be 0.2 mm higher than that of the light entering gauge 22. In the above configuration, the optical sensor 12 of the present invention,
The position adjusting method of 13 will be described. First, the stopper 8 is inserted into the positioning hole of the pulley 6, and the planer barrel 5 is fixed so that the planer blade 4 is directly below. As shown in FIG. 9, the dial gauge 21 is inserted into the inner surface 20a of the set gauge 20, the zero position of the dial gauge 21 is aligned, and the height of the dial gauge 21 is set to a predetermined value (the height dimension of the inner surface 18a of the set gauge 18). Set to. After setting, take out the dial gauge 21 from the set gauge 20 and place the table 2 so that it is located below the planer blade 4 as shown in FIG.
Installed on the upper surface, the elevating frame 19 is moved up and down to the zero setting value of the dial gauge 21 (until the tip of the dial gauge 21 abuts the blade edge of the planer blade 4), and the height between the blade edge of the planer blade 4 and the upper surface of the table 2 is increased. Set the height to the height of the inner surface 20a of the set gauge 20, and after setting, set the dial gauge 2
Take 1 out. Next, as shown in FIG. 11, a light entering gauge 22 is placed on the upper surface of the table 2 so as to be positioned near the end face of the light projecting light sensor 12, and it is confirmed that the monitor lamp of the light receiving photosensor 13 is turned on. . When the monitor lamp is not lit, the liners 16 on the light receiving side are removed one by one until the lamp is lit. After confirming the lighting, the light incident gauge 22 is taken out, the light shielding gauge 23 is placed at the same position as the light incident gauge 22, and it is confirmed that the monitor lamp of the light receiving optical sensor 13 is turned off. If the monitor lamp is on, the sensor holder 14 on the light receiving side remains
The liner 16 is additionally inserted between the panel box 11 and the panel box 11. As shown in FIG. 12, the light receiving optical sensor 13
In the vicinity of the end face, the above-mentioned adjustment is similarly performed with the gauges 22 and 23, and it is confirmed that the monitor lamp is lit with the light entrance gauge 22 and that the monitor lamp is lit with the light shielding gauge 23. , If it does not turn on or off,
The liner 16 on the light projecting side is taken out or additionally fed.
Therefore, if the monitor lamp is lit when the light gauge 22 is placed and the monitor lamp is off when the light-shielding gauge 23 is placed, the optical axes of the optical sensors 12 and 13 are within the dimensional difference of the set gauge 20. That is, the position adjustment of the optical sensors 12 and 13 is completed. FIG. 13 is an enlarged perspective view around the optical sensors 12 and 13. After setting, in FIG. 13, after adjusting the position, the material 24 is set on the material feeding side on the table 2, the elevating frame 19 is moved up and down, the optical sensors 12 and 13 sense the material 24, and a display device (not shown) Accurately display the thickness of the material 24 via.

【0007】[0007]

【発明の効果】本発明によれば、刃先と光センサー光軸
位置を従来のように材料を切削し、材料の寸法をノギス
等で測定して、その寸法に光センサーの光軸位置を合わ
せる作業を繰り返し行う必要はなく、測定具A,Bによ
り、簡単、かつ正確に光センサーの光軸位置を調整でき
る。
According to the present invention, the blade tip and the optical sensor optical axis position are cut as in the conventional case, the dimension of the material is measured with a caliper, and the optical axis position of the optical sensor is adjusted to the dimension. It is not necessary to repeat the work, and the measuring tools A and B can easily and accurately adjust the optical axis position of the optical sensor.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すかんな盤の全体正面図
である。
FIG. 1 is an overall front view of a planer board showing an embodiment of the present invention.

【図2】図1の左側面図である。FIG. 2 is a left side view of FIG.

【図3】図2のA部拡大図である。FIG. 3 is an enlarged view of part A of FIG.

【図4】ライナーの斜視図である。FIG. 4 is a perspective view of a liner.

【図5】セットゲージの斜視図である。FIG. 5 is a perspective view of a set gauge.

【図6】ダイアルゲージの正面及び右側面図である。FIG. 6 is a front and right side view of the dial gauge.

【図7】入光ゲージの斜視図である。FIG. 7 is a perspective view of a light incident gauge.

【図8】遮光ゲージの斜視図である。FIG. 8 is a perspective view of a light shielding gauge.

【図9】セットゲージにダイアルゲージをセットした状
態図である。
FIG. 9 is a state diagram in which a dial gauge is set on a set gauge.

【図10】図2において、ダイアルゲージをセットした
状態図である。
10 is a state diagram in which a dial gauge is set in FIG.

【図11】図1において、投光側光センサー付近にゲー
ジをセットした状態図である。
11 is a state diagram in which a gauge is set in the vicinity of the light projecting side light sensor in FIG. 1. FIG.

【図12】図1において、受光側光センサー付近にゲー
ジをセットした状態図である。
FIG. 12 is a state diagram in which a gauge is set near the light-receiving side optical sensor in FIG.

【図13】光センサー付近の拡大斜視図である。FIG. 13 is an enlarged perspective view of the vicinity of an optical sensor.

【符号の説明】[Explanation of symbols]

2はテーブル、3は切削ヘッド、4はかんな刃、5はか
んな胴、11はパネルボックス、12は投光用光センサ
ー、13は受光用光センサー、14はセンサホルダ、1
6はライナー、19は昇降枠、20はセットゲージ、2
1はダイヤルゲージ、22は入光ゲージ、23は遮光ゲ
ージ、24は材料である。
2 is a table, 3 is a cutting head, 4 is a planer blade, 5 is a planer barrel, 11 is a panel box, 12 is an optical sensor for projecting light, 13 is an optical sensor for receiving light, 14 is a sensor holder, 1
6 is a liner, 19 is a lifting frame, 20 is a set gauge, 2
Reference numeral 1 is a dial gauge, 22 is a light entering gauge, 23 is a light shielding gauge, and 24 is a material.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ベース上に材料を支持するテーブルを固定
し、該テーブル上方にはかんな刃を有する昇降枠が設け
られ、該昇降枠の材料送入側に投光用光センサー及び受
光用光センサーを設け、前記昇降枠を昇降させ前記投光
用,受光用光センサーにより材料の上面を感知し、前記
テーブルからかんな刃の刃先までの間隔を表示し、その
数値により材料の厚みを測定するかんな盤において、あ
らかじめセットゲージにより所定の高さ寸法に設定され
たダイヤルゲージをテーブル上に置き、昇降枠を昇降さ
せて該ダイヤルゲージの先端とかんな刃の刃先が当接す
る位置に昇降枠を設定し、セットゲージの高さ寸法に対
応させた2種類の測定具A,Bを用いて、測定具Aで前
記投光用光センサーが受光用光センサーに入光し、測定
具Bで遮光されていることを確認し、入光又は遮光して
いない場合は入光又は遮光するまで前記投光用、受光用
光センサーの位置を調整手段で調整し、かんな刃の刃先
位置と光センサーの光軸を一致させるかんな盤の材料厚
さ測定用光センサー位置調整方法。
1. A table supporting a material is fixed on a base, and an elevating frame having a planer blade is provided above the table, and a light projecting light sensor and a light receiving light are provided on the material feeding side of the elevating frame. A sensor is provided, the elevating frame is moved up and down, the upper surface of the material is sensed by the light emitting and receiving light sensors, the distance from the table to the cutting edge of the planer blade is displayed, and the thickness of the material is measured by the numerical value. On the planer, place a dial gauge that has been set to a predetermined height by a set gauge on the table, raise and lower the lifting frame, and set the lifting frame at the position where the tip of the dial gauge and the cutting edge of the planer blade come into contact. Then, using two kinds of measuring tools A and B corresponding to the height dimension of the set gauge, the light projecting optical sensor of the measuring tool A enters the light receiving optical sensor, and the measuring tool B shields the light. hand If the light is not blocked or blocked, adjust the position of the light emitting and receiving light sensors with the adjusting means until the light is blocked or blocked, and the cutting edge position of the planer blade and the optical axis of the light sensor. A method for adjusting the position of an optical sensor for measuring the material thickness of a planing board.
JP35089192A 1992-12-04 1992-12-04 Adjustment of position of material thickness measuring optical sensor of planer Pending JPH06170806A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35089192A JPH06170806A (en) 1992-12-04 1992-12-04 Adjustment of position of material thickness measuring optical sensor of planer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35089192A JPH06170806A (en) 1992-12-04 1992-12-04 Adjustment of position of material thickness measuring optical sensor of planer

Publications (1)

Publication Number Publication Date
JPH06170806A true JPH06170806A (en) 1994-06-21

Family

ID=18413602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35089192A Pending JPH06170806A (en) 1992-12-04 1992-12-04 Adjustment of position of material thickness measuring optical sensor of planer

Country Status (1)

Country Link
JP (1) JPH06170806A (en)

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