JPH06170574A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH06170574A
JPH06170574A JP4319866A JP31986692A JPH06170574A JP H06170574 A JPH06170574 A JP H06170574A JP 4319866 A JP4319866 A JP 4319866A JP 31986692 A JP31986692 A JP 31986692A JP H06170574 A JPH06170574 A JP H06170574A
Authority
JP
Japan
Prior art keywords
gib
laser
laser processing
stoppers
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4319866A
Other languages
Japanese (ja)
Other versions
JP2751766B2 (en
Inventor
Mineto Okazaki
峰人 岡崎
Akio Inoue
秋雄 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4319866A priority Critical patent/JP2751766B2/en
Publication of JPH06170574A publication Critical patent/JPH06170574A/en
Application granted granted Critical
Publication of JP2751766B2 publication Critical patent/JP2751766B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the reliability and safety for positioning a working head by providing stoppers mutually abutting with each other in the moving direction on a fixed part and a movable part respectively and moving one of the stoppers to shift the abutting position. CONSTITUTION:A cylinder 20 is driven to slide a second gib 19, a first gib 18 (movable stopper) is contacted with the second gib 19 to be slid in a direction orthogonally crossing the sliding direction of the second gib 19 and the surface 16a is positioned. A movable part 15 is lowered and approaching of a stopper 16 is detected by a sensor 21 to reduce the moving speed of the movable part 15 and the abutting surface 16a is abutting with 18a. Making the position as the irradiating position of the working head 12 and the machining is begun. The positioning of the working head 12 is also made by operating the first and second gibs after contacting the stoppers.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、レーザ加工装置に関
するものであり、特に加工ヘッドの位置決めに関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus, and more particularly to positioning of a processing head.

【0002】[0002]

【従来の技術】図4は従来のレーザ加工装置で例えば加
工ヘッド移動をチェン駆動でするようにした構成を示す
模式図である。図において、1はテーブル2に装着され
た加工へッド、3はテーブル2のガイド部、4はガイド
部3と係合したチェン、5はチェン4をガイドするスプ
ロケット、6はチェン4に装備されたカウンタウェイ
ト、7はサーボモータ8からの動力をチェン4に伝達す
るドライブスプロケット、9はサーボモータ8に直結さ
れ回転角を計測するPLG、10は指令ユニット11か
らの指令値をPLG9からのデータと比較しサーボモー
タ8をコントロールするサーボアンプである。
2. Description of the Related Art FIG. 4 is a schematic view showing a structure of a conventional laser processing apparatus in which a machining head is moved by a chain drive. In the figure, 1 is a processing head mounted on a table 2, 3 is a guide part of the table 2, 4 is a chain engaged with the guide part 3, 5 is a sprocket for guiding the chain 4, and 6 is provided on the chain 4. The counter weight, 7 is a drive sprocket that transmits the power from the servo motor 8 to the chain 4, 9 is a PLG that is directly connected to the servo motor 8 to measure the rotation angle, and 10 is a command value from the command unit 11 from the PLG 9. It is a servo amplifier that controls the servo motor 8 by comparing it with data.

【0003】次に動作について説明する。指令ユニット
11からの指令値がサーボアンプ10に入力されサーボ
モータ8がコントロールされる。サーボモータ8より回
転させられるドライブスプロケット7はチェン4を回し
ガイド部3に沿ってテーブル2が移動するようになって
いる。このテーブル2と加工ヘッド1と釣り合わせる方
向にカウンタウェイト6を入れてサーボモータ8にかか
る負荷を軽減し加工ヘッド1がずり落ちることを防止し
ている。なお、位置決め又は停止保持はサーボモータ8
に直結されているディスクブレーキの作動によって行っ
ている。
Next, the operation will be described. The command value from the command unit 11 is input to the servo amplifier 10 to control the servo motor 8. The drive sprocket 7 rotated by the servo motor 8 rotates the chain 4 so that the table 2 moves along the guide portion 3. A counter weight 6 is inserted in the direction in which the table 2 and the machining head 1 are balanced with each other to reduce the load on the servo motor 8 and prevent the machining head 1 from sliding down. Servo motor 8 is used for positioning and holding.
This is done by operating the disc brake directly connected to.

【0004】[0004]

【発明が解決しようとする課題】従来の装置は以上のよ
うに構成されているので、加工ヘッドの位置決めした状
態で突然の停電のためブレーキの反応の遅さから加工ヘ
ッドがずり落ちたり、ノイズなどの外乱による誤動作お
よびセンサの故障などにより加工ヘッドの先端に付いて
いる精密機器を破損あるいは狂いを生じさせるなどの問
題点があった。
Since the conventional apparatus is constructed as described above, the machining head slides down due to the slow reaction of the brake due to a sudden power failure while the machining head is positioned, and noise is generated. There has been a problem that the precision equipment attached to the tip of the processing head is damaged or out of order due to malfunction due to external disturbances or sensor failure.

【0005】この発明は上記のような問題点を解消する
ためになされたもので、加工ヘッドの位置決めについて
信頼性と安全性の向上を図ったレーザ加工装置を得るこ
とを目的とする。
The present invention has been made to solve the above problems, and an object of the present invention is to obtain a laser processing apparatus with improved reliability and safety in positioning a processing head.

【0006】[0006]

【課題を解決するための手段】この発明に係るレーザ加
工装置における加工ヘッドの位置決めは固定部と稼動部
に移動方向で互いが当接するストッパを備え且つストッ
パのいずれか一方を当接位置が変位する移動可能に構成
したものである。
The positioning of the machining head in the laser machining apparatus according to the present invention is provided with a stopper that abuts against the fixed portion and the operating portion in the moving direction, and one of the stoppers is displaced in the abutting position. It is configured to be movable.

【0007】[0007]

【作用】この発明におけるレーザ加工装置は、移動可能
なストッパが加工ヘッドの照射位置を調整するとともに
両ストッパの当接が加工ヘッドのずり落ちを防ぐ。
In the laser processing apparatus according to the present invention, the movable stopper adjusts the irradiation position of the processing head, and the abutment of both stoppers prevents the processing head from slipping off.

【0008】[0008]

【実施例】【Example】

実施例1.以下、この発明の実施例1を図を基に説明す
る。図1はこの発明の実施例1におけるレーザ加工装置
の構成を示す斜視図である。図において、12はレーザ
ユニット13に装着された加工ヘッド、14はレーザユ
ニット13を移動させるためのモータでこれら12ない
し13で稼動部15を形成する。16は稼動部15に取
り付けられ当接面16aを有するストッパ。17は稼動
部15のガイド17aとガイド17bを有する固定部、
18は当接面18aを有し背面側をテーパ状18bに形
成しガイド17bに沿ってスライド可能なストッパの第
1ギブ、19は第1ギブのテーパ状の背面18bと当接
するテーパ面19aを有しシリンダ20の駆動力により
テーパ面19aが摺接する方向にスライドする第2ギブ
でこれら19〜20で移動可能なストッパを構成する。
21は第1ギブの当接面18aに隣接されストッパ16
の近接を感知するセンサである。
Example 1. Embodiment 1 of the present invention will be described below with reference to the drawings. 1 is a perspective view showing the configuration of a laser processing apparatus according to a first embodiment of the present invention. In the figure, 12 is a machining head mounted on the laser unit 13, 14 is a motor for moving the laser unit 13, and these 12 to 13 form an operating part 15. Reference numeral 16 is a stopper attached to the moving part 15 and having a contact surface 16a. Reference numeral 17 denotes a fixed portion having a guide 17a and a guide 17b of the operating unit 15,
Reference numeral 18 denotes a first gib of a stopper having a contact surface 18a and having a tapered back surface 18b and slidable along a guide 17b. Reference numeral 19 denotes a tapered surface 19a that abuts the tapered back surface 18b of the first gib. The second gib that slides in the direction in which the tapered surface 19a slides by the driving force of the cylinder 20 constitutes a stopper that can be moved by these 19 to 20.
21 is adjacent to the contact surface 18a of the first gib and is a stopper 16
It is a sensor that senses the proximity of.

【0009】次に動作について説明する。まず、シリン
ダ20を駆動して第2ギブ19をスライドさせ第1ギブ
18との摺接で第2ギブ19のスライド方向と直角方向
に第1ギブ18をスライドさせて当接面16aの位置を
決定する。次に稼動部15を下降させるがストッパ同志
が近づいてきたことをセンサ21で検知し稼動部15の
移動速度を減速させ各当接面16aと18aを当接させ
る。この位置が加工ヘッドの照射動作位置でありレーザ
加工を開始するものである。
Next, the operation will be described. First, the cylinder 20 is driven to slide the second gib 19, and the first gib 18 is slid in contact with the first gib 18 in the direction perpendicular to the sliding direction of the second gib 19 to move the position of the contact surface 16a. decide. Next, the operating part 15 is lowered, but the sensor 21 detects that the stoppers are approaching each other, and the moving speed of the operating part 15 is reduced to bring the contact surfaces 16a and 18a into contact with each other. This position is the irradiation operation position of the processing head, and the laser processing is started.

【0010】なお、最初にストッパ同志を当接させてか
ら次に第1,第2のギブ18,19を操作して加工ヘッ
ドの位置決めをする方法としても良い。
It is also possible to first bring the stoppers into contact with each other and then operate the first and second gibs 18 and 19 to position the machining head.

【0011】実施例2.また、実施例1では固定部側に
変位可能なストッパを設けた構成を示したがこれを稼動
部に設けるようにしても良い。
Embodiment 2. Further, in the first embodiment, the structure in which the displaceable stopper is provided on the fixed portion side is shown, but this may be provided in the operating portion.

【0012】実施例3.また、実施例1では、加工ヘッ
ドの位置決めをするストッパの当接面の移動をテーパギ
ブの組み合わせで作用させていたが図2に示すように偏
心した外周を当接面21aとする偏心カム21と、駆動
モータ22と、偏心カム21と駆動モータ22に介在す
る歯車23で構成し偏心カム21の停止位置によりスト
ッパ16との当接面を変位するようにしても良い。な
お、この場合加工ヘッド12が位置決めされる直前の稼
動部の減速には、図示するように例えばばね24aの伸
縮を利用した緩衝装置24を設け、ストッパ16と偏心
カム21が当接する直前に緩衝装置24が稼動部15に
当接するようにしたものである。
Embodiment 3. Further, in the first embodiment, the movement of the contact surface of the stopper for positioning the machining head is made to act by the combination of the taper gib, but as shown in FIG. 2, an eccentric cam 21 having an eccentric outer circumference as the contact surface 21a is used. Alternatively, the drive motor 22, the eccentric cam 21, and the gear 23 interposed between the drive motor 22 may be used to displace the contact surface with the stopper 16 depending on the stop position of the eccentric cam 21. In this case, for decelerating the moving part immediately before the machining head 12 is positioned, as shown in the figure, for example, a shock absorber 24 utilizing expansion and contraction of the spring 24a is provided, and the shock absorber is shocked immediately before the stopper 16 and the eccentric cam 21 come into contact with each other. The device 24 is adapted to come into contact with the moving part 15.

【0013】実施例4.実施例1,3では加工ヘッドの
位置決めが無段階で可能なものを示したが、加工ヘッド
の位置を数段階に限定可能なものであれば、図3にその
ストッパ部を示すように当接面25bを有する位置決め
ストッパ25側にあらかじめセット穴25aを複数設け
対向面にセットされたスプリング27付のピン26が選
択挿入されることによりストッパ25が位置決め固定さ
れる。28はストッパ25を変位させる移動手段であ
る。
Embodiment 4. In the first and third embodiments, the machining head can be positioned steplessly, but if the machining head can be limited to several steps, the stopper portion is contacted as shown in FIG. A plurality of setting holes 25a are provided in advance on the side of the positioning stopper 25 having the surface 25b, and the stopper 26 is positioned and fixed by selectively inserting the pin 26 with the spring 27 set on the opposite surface. 28 is a moving means for displacing the stopper 25.

【0014】[0014]

【発明の効果】以上のように、この発明によれば加工ヘ
ッドの位置決めは固定部と稼動部に移動方向で互いが当
接するストッパを備え且つストッパのいずれか一方を当
接位置が変位する移動可能に構成したので加工ヘッドの
位置決めとずり落ち防止が同時にされ信頼性と安全性を
効果的に高めたレーザ加工装置が得られる効果がある。
As described above, according to the present invention, the positioning of the machining head is provided with the stoppers which come into contact with the fixed portion and the moving portion in the moving direction, and one of the stoppers is moved so that the abutting position is displaced. Since the configuration is made possible, there is an effect that the positioning of the processing head and the prevention of the slipping off are performed at the same time, and the laser processing apparatus which effectively enhances the reliability and safety is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施例1におけるレーザ加工装置の
構成を示す斜視図である。
FIG. 1 is a perspective view showing a configuration of a laser processing apparatus according to a first embodiment of the present invention.

【図2】この発明の実施例3におけるレーザ加工装置の
構成を示す斜視図である。
FIG. 2 is a perspective view showing a configuration of a laser processing apparatus according to a third embodiment of the present invention.

【図3】この発明の実施例4におけるレーザ加工装置の
構成を示す部分断面図である。
FIG. 3 is a partial cross-sectional view showing a configuration of a laser processing apparatus according to a fourth embodiment of the present invention.

【図4】従来のレーザ加工装置の構成を示す模式図であ
る。
FIG. 4 is a schematic diagram showing a configuration of a conventional laser processing apparatus.

【符号の説明】[Explanation of symbols]

12 加工ヘッド 15 稼動部 16 ストッパ 16a 当接面 17 固定部 18 第1ギブ(移動可能なストッパ) 18a 当接面(当接位置) 19 第2ギブ 21 偏心カム 21a 当接面(外周面) 12 machining head 15 moving part 16 stopper 16a contact surface 17 fixed part 18 first gib (movable stopper) 18a contact surface (contact position) 19 second gib 21 eccentric cam 21a contact surface (outer peripheral surface)

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 先端にレーザを照射する加工ヘッドを有
する稼動部が固定部のガイドに沿って上記レーザ軌道方
向で移動し上記加工ヘッドの位置決めをしてレーザ加工
をするレーザ加工装置において、上記固定部と上記稼動
部に上記移動方向で互いが当接するストッパを備え且つ
上記ストッパのいずれか一方を上記当接位置が変位する
移動可能なストッパとして上記加工ヘッドの位置決めを
するようにしたことを特徴とするレーザ加工装置。
1. A laser processing apparatus for performing laser processing by moving a moving part having a processing head for irradiating a laser at a tip thereof along a guide of a fixed part in the laser orbit direction to position the processing head and perform laser processing. The fixed portion and the operating portion are provided with stoppers that come into contact with each other in the moving direction, and one of the stoppers is used as a movable stopper that displaces the contact position to position the machining head. Characteristic laser processing equipment.
【請求項2】 移動可能なストッパは当接面を有しその
背面側をテーパ状に形成しレーザ軌道方向でスライド可
能にガイドされた第1ギブと、上記背面側と摺接するテ
ーパ面を有し上記レーザ軌道方向と直角方向で自在にス
ライドする第2ギブとで構成し上記第2ギブのスライド
により上記当接面を変位するようにしたことを特徴とす
る請求項1に記載のレーザ加工装置。
2. The movable stopper has a first abutment which has an abutment surface and has a tapered rear surface and is slidably guided in the laser orbit direction, and a tapered surface slidably contacting the rear surface. 2. The laser processing according to claim 1, further comprising a second gib that freely slides in a direction perpendicular to the laser orbital direction, and the abutment surface is displaced by sliding the second gib. apparatus.
【請求項3】 移動可能なストッパは偏心した外周を当
接面として自在に回転可能な偏心カムで構成し上記偏心
カムの停止位置により上記当接面を変位するようにした
ことを特徴とする請求項1に記載のレーザ加工装置。
3. The movable stopper is composed of an eccentric cam which is freely rotatable with an eccentric outer periphery as an abutting surface, and the abutting surface is displaced by a stop position of the eccentric cam. The laser processing apparatus according to claim 1.
JP4319866A 1992-11-30 1992-11-30 Laser processing equipment Expired - Lifetime JP2751766B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4319866A JP2751766B2 (en) 1992-11-30 1992-11-30 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4319866A JP2751766B2 (en) 1992-11-30 1992-11-30 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPH06170574A true JPH06170574A (en) 1994-06-21
JP2751766B2 JP2751766B2 (en) 1998-05-18

Family

ID=18115113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4319866A Expired - Lifetime JP2751766B2 (en) 1992-11-30 1992-11-30 Laser processing equipment

Country Status (1)

Country Link
JP (1) JP2751766B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015182117A (en) * 2014-03-25 2015-10-22 ファナック株式会社 Laser processor retracting processing nozzle on power source failure
CN116713590A (en) * 2023-08-02 2023-09-08 大匠激光科技(苏州)有限公司 Focusing control device and method for laser three-dimensional galvanometer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5887375B2 (en) 2014-03-24 2016-03-16 ファナック株式会社 Laser processing equipment that retracts the processing nozzle when a power failure is detected

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109888U (en) * 1985-12-27 1987-07-13
JPS62199283A (en) * 1986-02-28 1987-09-02 Anritsu Corp Positioning device for laser head
JPS63184684U (en) * 1987-05-15 1988-11-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109888U (en) * 1985-12-27 1987-07-13
JPS62199283A (en) * 1986-02-28 1987-09-02 Anritsu Corp Positioning device for laser head
JPS63184684U (en) * 1987-05-15 1988-11-28

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015182117A (en) * 2014-03-25 2015-10-22 ファナック株式会社 Laser processor retracting processing nozzle on power source failure
US10092978B2 (en) 2014-03-25 2018-10-09 Fanuc Corporation Laser processing apparatus capable of retracting processing nozzle upon power failure
US10335898B2 (en) 2014-03-25 2019-07-02 Fanuc Corporation Laser processing apparatus capable of retracting processing nozzle upon power failure
CN116713590A (en) * 2023-08-02 2023-09-08 大匠激光科技(苏州)有限公司 Focusing control device and method for laser three-dimensional galvanometer
CN116713590B (en) * 2023-08-02 2024-02-02 大匠激光科技(苏州)有限公司 Focusing control device and method for laser three-dimensional galvanometer

Also Published As

Publication number Publication date
JP2751766B2 (en) 1998-05-18

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