JPH06163991A - Led for side surface light emission - Google Patents
Led for side surface light emissionInfo
- Publication number
- JPH06163991A JPH06163991A JP43A JP31152992A JPH06163991A JP H06163991 A JPH06163991 A JP H06163991A JP 43 A JP43 A JP 43A JP 31152992 A JP31152992 A JP 31152992A JP H06163991 A JPH06163991 A JP H06163991A
- Authority
- JP
- Japan
- Prior art keywords
- light
- led chip
- led
- emitted
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＬＥＤ（Ｌｉｇｈｔ
Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）チップからの光を片側
に放出させるようにした側面発光用ＬＥＤに関するもの
である。BACKGROUND OF THE INVENTION The present invention relates to an LED (Light).
The present invention relates to a side surface light emitting LED that emits light from an emitting diode chip to one side.
【０００２】[0002]
【従来の技術】従来、側面発光用ＬＥＤは図５に示すよ
うな構造になっており、１、２は表面に銀メッキが施さ
れた鉄製の平板状フレームで、一方のフレーム１の片側
の板面（マウント部１Ａ）にＬＥＤチップ３が配され、
即ちＬＥＤチップ３のアノード側が銀ペースト付けによ
りダイボンディングされ、そのカソード側が他方のフレ
ーム２のワイヤーボンディング部２ＡにＡｕ線４を用い
てワイヤーボンディングされている。2. Description of the Related Art Conventionally, an LED for side surface light emission has a structure as shown in FIG. 5, and reference numerals 1 and 2 are iron plate-like frames whose surfaces are plated with silver. The LED chip 3 is arranged on the plate surface (mounting section 1A),
That is, the anode side of the LED chip 3 is die-bonded by silver paste attachment, and the cathode side thereof is wire-bonded to the wire bonding portion 2A of the other frame 2 using the Au wire 4.
【０００３】そして、５はＬＥＤチップ３をフレーム
１、２の一部と共に、即ちフレーム１、２のリード部１
Ｂ、２Ｂを外部に露呈した状態で図示点線のようにモー
ルドするモールド樹脂（例えば、エポキシ樹脂）で、そ
の一部を砲弾形状５Ａにして、フレーム１の片側に放出
されるＬＥＤチップ３からの光をある程度集光させるよ
うにしている。Reference numeral 5 denotes the LED chip 3 together with a part of the frames 1 and 2, that is, the lead portions 1 of the frames 1 and 2.
B and 2B are exposed to the outside with a molding resin (for example, epoxy resin) that is molded as shown by the dotted line, and a part of the molding resin has a shell shape 5A. The light is focused to some extent.
【０００４】[0004]
【発明が解決しようとする課題】ところが、このような
従来構成の側面発光用ＬＥＤでは、モールド樹脂５の砲
弾形状５ＡにてＬＥＤチップ３からの光をある程度集光
させるようにしているものの、光が放出方向である片側
全体に広がって、そのＬＥＤチップ３からの光が図６に
示すように必要部分Ａ、Ｂ、Ｃ以外にフレーム板面に沿
った方向の不必要部分Ｄ、Ｅにも放出されることになる
ため、その分発光効率が低下していた。However, in the side surface light emitting LED having such a conventional structure, although the light from the LED chip 3 is focused to some extent by the shell shape 5A of the mold resin 5, Is spread over one side, which is the emission direction, and the light from the LED chip 3 is not only required portions A, B, and C but also unnecessary portions D and E in the direction along the frame plate surface as shown in FIG. Since it is released, the luminous efficiency is reduced accordingly.
【０００５】本発明はこのような点に鑑み成されたもの
であって、ＬＥＤチップからの光を片側に効率良く放出
させることができる側面発光用ＬＥＤを提供することを
目的とするものである。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a side surface emitting LED capable of efficiently emitting light from an LED chip to one side. .
【０００６】[0006]
【課題を解決するための手段】上記した目的を達成する
ため本発明では、平板状フレームの片側の板面にＬＥＤ
チップを配し、このＬＥＤチップからの光を片側に放出
させるようにした側面発光用ＬＥＤにおいて、ＬＥＤチ
ップからの不必要部分への光を反射して必要部分に導出
させるための導出部をフレームに形成したものである。In order to achieve the above object, in the present invention, the LED is provided on one plate surface of the flat frame.
In a side surface emitting LED in which a chip is arranged and light from the LED chip is emitted to one side, a lead-out portion for reflecting light to an unnecessary portion from the LED chip and leading it to a necessary portion is a frame. It was formed in.
【０００７】[0007]
【作用】このような構成によれば、不必要部分に放出さ
れるＬＥＤチップからの光が少なくなり、その分必要部
分に放出されることになる。そのため、必要部分での光
量が増し、可視光の場合には必要部分での明るさが増す
ことになる。According to this structure, the light emitted from the LED chip to the unnecessary portion is reduced, and the light is emitted to the necessary portion accordingly. Therefore, the amount of light in the required portion increases, and in the case of visible light, the brightness in the required portion increases.
【０００８】[0008]
【実施例】以下、本発明の一実施例について図面と共に
説明する。尚、従来と同一部品については同一符号を付
すと共にその説明を省略する。本実施例では、ＬＥＤチ
ップからの不必要部分への光を反射して必要部分に導出
させるための導出部をフレームに一体に形成するように
したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. It should be noted that the same parts as those of the related art are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, a lead-out portion for reflecting the light from the LED chip to the unnecessary portion and leading it to the necessary portion is formed integrally with the frame.
【０００９】具体的には、図１に示すようにＬＥＤチッ
プ３が配される一方のフレーム１のマウント部１Ａ上方
の端部を、ＬＥＤチップ３の光を放出する側に湾曲させ
て、導出部６としたものである。More specifically, as shown in FIG. 1, one end of the frame 1 on which the LED chip 3 is arranged, which is located above the mount portion 1A, is curved toward the light emitting side of the LED chip 3 and is led out. This is part 6.
【００１０】このようにすると、ＬＥＤチップ３から上
方の不必要部（図６に示すＥ）に放出されていた光が導
出部６にて遮られ、且つその銀メッキ表面による鏡面作
用により反射されて必要部分側に導出されることにな
る。そのため、必要部分への光量が増し、ＬＥＤチップ
３からの光を効率良く放出させることができる。In this way, the light emitted from the LED chip 3 to the upper unnecessary portion (E in FIG. 6) is blocked by the lead-out portion 6 and is reflected by the mirror effect of the silver-plated surface. Will be derived to the necessary part side. Therefore, the amount of light to the necessary portion is increased, and the light from the LED chip 3 can be efficiently emitted.
【００１１】次に、図２では一方のフレーム１のマウン
ト部１Ａ上方及び左右の端部と、そのマウント部１Ａ下
方に位置する他方のフレーム２のワイヤーボンディング
部２Ａ端部を、夫々ＬＥＤチップ３の光を放出する側に
湾曲させて、導出部７、８としたものである。Next, in FIG. 2, the LED chip 3 is connected to the upper and left and right end portions of the mount portion 1A of one frame 1 and the end portions of the wire bonding portion 2A of the other frame 2 located below the mount portion 1A. The lead-out portions 7 and 8 are formed by curving the light-emitting side.
【００１２】このようにすると、ＬＥＤチップ３から上
下、左右の不必要部分に放出されていた光のほとんどが
導出部７、８にて遮られ、且つその銀メッキ表面による
鏡面作用により反射されて必要部分側に導出されること
になる。そのため、必要部分への光量が大幅に増し、Ｌ
ＥＤチップ３からの光をより効率的に放出させることが
できる。In this way, most of the light emitted from the LED chip 3 to the upper, lower, left and right unnecessary portions is blocked by the lead-out portions 7 and 8 and reflected by the mirror effect of the silver-plated surface. It will be derived to the necessary part side. As a result, the amount of light to the necessary parts is greatly increased, and L
The light from the ED chip 3 can be emitted more efficiently.
【００１３】そして、このような構造の側面発光用ＬＥ
Ｄは図３に示すようにプリント基板９上に横置きし、そ
の状態でフレームのリード部１Ｂ、２Ｂを基板９上面側
に形成された銅製のパターンＰに、或いはホーミングし
て基板９下面側の銅製のパターンＰ’に半田付けして使
用されることになる。ここで、１０は半田付け部であ
る。Then, the LE for side emission having such a structure
As shown in FIG. 3, D is placed horizontally on the printed circuit board 9, and in that state, the lead portions 1B and 2B of the frame are formed on the copper pattern P formed on the upper surface side of the substrate 9 or on the lower surface side of the substrate 9 by homing. It is used by being soldered to the copper pattern P ′. Here, 10 is a soldering part.
【００１４】尚、上記したような導出部６、７、８はフ
レーム１、２のプレス加工時に形成することができるた
め、側面発光用ＬＥＤの製造工程やコストを増加させる
ことはない。Since the lead-out portions 6, 7, and 8 as described above can be formed when the frames 1 and 2 are pressed, the manufacturing process and cost of the side surface light emitting LED are not increased.
【００１５】以上、図１、図２ではＬＥＤチップ３の光
を放出する側にフレーム１、２の端部を湾曲させるよう
にしたが、図４に示すようにフレーム１のマウント部１
Ａを光を放出させる側とは反対方向に大きく窪ませてパ
ラボラ形状の導出部１１にし、その凹面状の板面側にＬ
ＥＤチップ３を配するようにしても略同等の効果が得ら
れることになる。As described above, in FIGS. 1 and 2, the ends of the frames 1 and 2 are curved to the side of the LED chip 3 which emits light, but as shown in FIG.
A is largely recessed in a direction opposite to the side from which light is emitted to form a parabola-shaped lead-out portion 11, and L is provided on the concave plate surface side.
Even if the ED chip 3 is arranged, substantially the same effect can be obtained.
【００１６】但し、このようにするとプリント基板９上
に横置きして使用する際に、マウント部が光放出方向と
は反対側にふくらんでいる構造上、その厚みが少し増す
（Ｔ２＞Ｔ１）と共に、フレーム１、２のリード部１
Ｂ、２Ｂが基板９に対して浮いた格好になるので、その
半田付けが不便でリード部１Ｂ、２Ｂに余計な応力が加
わる虞れがある。また、ＬＥＤチップ３のマウント時
に、そのフレーム１、２を載置固定して加熱、超音波処
理するための台座を、そのパラボラ形状の導出部１１を
吸収できる構造にする、例えば凹みを有する構造にする
必要がある。However, in this way, when the device is placed horizontally on the printed circuit board 9 and used, the thickness thereof is slightly increased due to the structure in which the mount portion is bulged on the side opposite to the light emitting direction (T2> T1). Together with the lead portions 1 of the frames 1 and 2
Since B and 2B are floated with respect to the substrate 9, soldering may be inconvenient and extra stress may be applied to the lead portions 1B and 2B. Further, when mounting the LED chip 3, the pedestal for mounting and fixing the frames 1 and 2 for heating and ultrasonic treatment has a structure capable of absorbing the parabolic lead portion 11, for example, a structure having a recess. Need to
【００１７】[0017]
【発明の効果】上述した如く本発明に依れば、ＬＥＤチ
ップからの光をフレームの形状を一部変更するだけで効
率良く放出させることができるので、製造工程やコスト
を増加させることなく、簡単に発光効率の高い側面発光
用ＬＥＤを実現することができる。As described above, according to the present invention, the light from the LED chip can be efficiently emitted by only partially changing the shape of the frame, so that the manufacturing process and the cost are not increased. It is possible to easily realize an LED for side light emission with high luminous efficiency.
【図１】 本発明を実現するためのフレーム形状の一例
を示す図。FIG. 1 is a diagram showing an example of a frame shape for realizing the present invention.
【図２】 その他の形状例を示す図。FIG. 2 is a view showing another shape example.
【図３】 プリント基板への実装例を示す図。FIG. 3 is a diagram showing an example of mounting on a printed circuit board.
【図４】 その他の実施例を示す図。FIG. 4 is a diagram showing another embodiment.
【図５】 従来例を示す図。FIG. 5 is a diagram showing a conventional example.
【図６】 その光の放出方向を示す図。FIG. 6 is a diagram showing the light emission direction.
１、２ フレーム ３ ＬＥＤチップ ６、７、８、１１ 導出部 1, 2 frame 3 LED chip 6, 7, 8, 11 Derivation part
Claims (1)
ップを配し、このＬＥＤチップからの光を片側に放出さ
せるようにした側面発光用ＬＥＤにおいて、ＬＥＤチッ
プからの不必要部分への光を反射して必要部分に導出さ
せるための導出部をフレームに形成したことを特徴とす
る側面発光用ＬＥＤ。1. In a side surface light emitting LED in which an LED chip is arranged on a plate surface on one side of a flat frame and the light from the LED chip is emitted to one side, the light from the LED chip to an unnecessary portion is emitted. An LED for side surface light emission, characterized in that a lead-out portion for reflecting and leading out to a necessary portion is formed on a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP43A JPH06163991A (en) | 1992-11-20 | 1992-11-20 | Led for side surface light emission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP43A JPH06163991A (en) | 1992-11-20 | 1992-11-20 | Led for side surface light emission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06163991A true JPH06163991A (en) | 1994-06-10 |
Family
ID=18018336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP43A Pending JPH06163991A (en) | 1992-11-20 | 1992-11-20 | Led for side surface light emission |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06163991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001024281A1 (en) * | 1999-09-30 | 2001-04-05 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic component that comprises a reflector and method for producing said component |
| EP2329538B1 (en) * | 2008-09-22 | 2019-02-20 | OSRAM Opto Semiconductors GmbH | Housing for an optoelectronic component |
-
1992
- 1992-11-20 JP JP43A patent/JPH06163991A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001024281A1 (en) * | 1999-09-30 | 2001-04-05 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic component that comprises a reflector and method for producing said component |
| EP2329538B1 (en) * | 2008-09-22 | 2019-02-20 | OSRAM Opto Semiconductors GmbH | Housing for an optoelectronic component |
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