JPH06162545A - Optical head - Google Patents

Abstract

PURPOSE:To provide the satisfactory optical disk, which is made compact, thin and light in weight and enables high-speed access, for the optical disk device of a CD (compact disk) player, LD (laser disk) player and optical memory device for computer or the like. CONSTITUTION:A light emitting element 1 and a light receiving element 6 are formed on a semiconductor base 21, and leads 22a-22h for inputting/ outputting electric signals to these light emitting element 1 and light receiving element 6 are provided at the side part of this semiconductor base 21. This semiconductor base 21 is fitted to an optical head casing 23 to which an objective lens 3, reflection mirror 29 and triangular prism 30 are fixed, and these leads 22a-22h are directly fixed to this optical head casing 23. Thus, the optical head can be made compact, thin and light in weight, and the satisfactory optical head enabling high-speed access can be provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in optical disk devices such as CD (compact disk) players, LD (laser disk) players, and optical memory devices for computers. The present invention relates to an optical head that collects light on an information recording medium and reproduces or records information.

[0002]

2. Description of the Related Art In recent years, an optical head has been technically considered important as a basic constituent element of an optical disk device. An optical head used in an optical disk device includes an optical base on which a light emitting element and a light receiving element are arranged, and an objective lens driving device that drives an objective lens in two directions of a focus direction and a tracking direction by, for example, an electromagnetic drive method. The light emitted from the optical disc is narrowed down by the objective lens, and the objective lens driving device is driven to irradiate the information pits on the optical disc with a light spot while controlling the position of the objective lens with respect to the surface deflection eccentricity of the optical disc. The reflected light from is converted into an electric signal by the light receiving element to reproduce the pits on the optical disk.

FIG. 14 is a block diagram of a conventional integrated drive type optical head, and 1 is a light emitting element. Reference numeral 2 denotes a light emitting device package made of a metal that surrounds the light emitting device 1, and serves to prevent oxidation and dust of the light emitting device 1. Reference numeral 3 is an objective lens for converging the light emitted from the light emitting element 1 on the optical disk 4, and 5 is a half mirror for guiding the light emitted from the light emitting element 1 to the objective lens 3. Reference numeral 6 denotes a light receiving element that receives the reflected light from the optical disc 4. Since the light receiving element 6 is usually made of a semiconductor, it is enclosed in a light receiving element package 7 made of resin to prevent oxidation and dust.

Light emitting device package 2, half mirror 5,
The light receiving element package 7 is fixed to the optical base 8, and the objective lens 3 is fixed to the actuator 9. This actuator 9 has four parallel support members 10a.
The one end is held by an actuator base 11 mounted on the optical base 8 by ˜d so as to be movable in the focus direction and the tracking direction, and the two-dimensional direction according to the surface deflection eccentricity of the optical disk 4 by the drive means 12 composed of an electromagnetic circuit. In addition, the position of the objective lens 3 can be moved.

The basic operation of the optical head having the above structure will be described below. The light emitted from the light emitting element 1 changes its direction by the half mirror 5 and enters the objective lens 3. The objective lens 3 has a role of condensing the light from the light emitting element 1 on the optical disc 4, collecting the reflected light whose light amount is modulated by the information pits on the optical disc 4, and returning it to the half mirror 4. The reflected light from the optical disk 4 emitted from the objective lens 3 passes through the half mirror 5 and enters the light receiving element 6. Since the light receiving element 6 is formed of a plurality of dividing elements, the control signal of the actuator 9, that is, the position control of the objective lens 3 is performed by receiving the reflected light whose light amount is modulated by the information pits on the optical disc 4. Signal and information signal can be taken out. Drive means 1 is provided with a current based on this position control signal.
When the flow rate is set to 2, the focus control and tracking control of the objective lens 3 can be performed.

[0006]

However, in the above-mentioned conventional structure, the light emitting device package 2, the light receiving device package 7 and the optical base 8 are separate packages, and the actuator 9 including the objective lens 3 is also separate. Since the body is a body, not only the shape of the optical head becomes large, but also the weight becomes large, so that there is a problem that high-speed access is difficult.

The present invention solves the above-mentioned problems of the prior art and provides a compact and lightweight optical head capable of high-speed access.

[0008]

In order to solve the above-mentioned problems, an optical head of the present invention comprises an optical element in which a light emitting element and a light receiving element are integrally formed, an objective lens and an actuator. is there.

[0009]

With this structure, the optical head can be made smaller, thinner, and lighter in weight, so that high-speed access becomes possible.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the optical head of the present invention, FIG. 1 is a side sectional view of a basic portion of the optical head, and FIG. 2 is a side view of the entire structure of the optical head.

The same reference numerals are given to constituent members having the same functions as those of the conventional example. 1 and 2, 1 is a light emitting element and 6 is a light receiving element. The light emitting element 1 and the light receiving element 6 are formed on a semiconductor base 21. The semiconductor base 21 is fitted into an optical head housing 23 to which an objective lens 3, a reflection mirror 29, and a triangular prism 30 are fixed, and each optical element of the optical head is enclosed. 22a ~
Reference numeral h is a lead for conducting the light-emitting element 1 and the light-receiving element 6, which is adhered to the side surface of the optical head housing 23 and has substrates 24a, 24 on which an electrical conduction pattern is formed.
It is electrically connected to b by a method such as soldering and constitutes a basic part of the optical head.

Further, one end is fixed to the substrates 24a and 24b, and the other end is fixed to a supporting member fixing portion 26, which supports the basic portion of the optical head so as to be movable in the focus direction and the tracking direction, and receives light from the light emitting element 1. Support materials 25a to 25h for conducting to the element 6 and optical head driving means 28a, 28 for driving the basic portion of the optical head in the focus direction and the tracking direction by a method such as electromagnetic driving.
b sandwiches the optical head housing 23 and faces them. The optical head driving means 28a and 28b and the support material fixing portion 26 are fixed to a base 27.

The operation of the optical head of the present invention will be described below. The light emitted from the light emitting element 1 changes its direction by the reflection mirror 29, and further changes its direction by the triangular prism 30, and enters the objective lens 3. The objective lens 3 has a role of condensing the light from the light emitting element 1 on an optical disk (not shown), collecting the reflected light whose light amount is modulated by the information pits on the optical disk, and returning it to the half mirror 4. . The reflected light from the optical disk emitted from the objective lens 3 passes through the triangular prism 30 and enters the light receiving element 6. Since the light receiving element 6 is formed of a plurality of dividing elements, a signal for controlling the position of the objective lens 3 and an information signal can be taken out by receiving the reflected light whose light amount is modulated by the information pits on the optical disk. Will be possible. The focus control and tracking control of the objective lens 3 can be performed by applying a current to the optical head driving means 28a and 28b based on this position control signal.

In this embodiment, the light emitting element 1 and the light receiving element 6 are formed on the semiconductor base 21 and integrated with the optical head housing 23 including the objective lens 3, so that the optical head is small, thin and lightweight. You can

Further, in the present embodiment, the leads 22a to 22h extending from the semiconductor base 21 were adhered to the optical head housing 23, but by fixing them by ultrasonic fusion, the reliability of the fixed portion is improved. .

A second embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a top view of the overall structure of an optical head showing a second embodiment of the present invention. 3, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from that shown in FIG. 2 in that it has a patterned optical head housing 123 having an electrically conductive pattern and a land portion formed on its side surface, and the leads 22a to h are directly attached to the land portion.
And the supporting members 25a to 25h are fixed by a method such as soldering.

The operation is the same as that of the first embodiment, and will be omitted. As described above, the patterned optical head housing 12 having the electrically conductive pattern and the land portion formed on the side surface thereof
3, the leads 22a to h and the support members 25a to 25h are directly fixed to the land portion by a method such as soldering, so that the substrates 24a and 24b can be eliminated, and in addition to the effect of the first embodiment, Cost can be reduced.

A third embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a top view of the overall configuration of the optical head showing the third embodiment of the present invention, and FIG. 5 is a side view of the overall configuration of the optical head. 4 and 5, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from that shown in FIG. 2 in that a stepped optical head housing 223 having a step on the side surface is provided, and leads 22a to 22h from the semiconductor base 21 are fixed to the stepped side surface portion of the stepped optical head housing 223. Then, the support member 2 is attached to the leads 22a to 22h.
5a to 5h are directly fixed by a method such as soldering.

The operation is the same as that of the first embodiment and will not be repeated. As described above, the stepped optical head housing 223 having a step on the side surface is provided, and the leads 22a to 22h from the semiconductor base 21 are fixed to the side stepped part of the stepped optical head housing 223, and the leads are attached. 22a to h support material 2
By directly fixing 5a to 5h by a method such as soldering, the number of steps can be reduced and a substrate or an electrical conduction pattern is not required between the leads 22a to h and the support members 25a to 25h. In addition to the effect of, the cost can be significantly reduced.

A fourth embodiment of the present invention will be described below with reference to the drawings. 6 is a top view of the overall configuration of an optical head showing a fourth embodiment of the present invention, and FIG. 7 is a side view of the overall configuration of the optical head. 6 and 7, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from the configuration of FIG. 2 in that it has different thickness leads 122a to 122h having different thicknesses from the semiconductor base 21, and these different thickness leads 122a to 122h are fixed to the side surface of the optical head housing 23. Support materials 25a to 25h on the thick leads 122a to h
Is fixed directly by a method such as soldering.

The operation is the same as that of the first embodiment and will not be repeated. As described above, different thickness leads 1
22a-h, and these different-thickness leads 122a-h are fixed to the side surface of the optical head housing 23.
By directly fixing the support members 25a to 25h to 2a to h by a method such as soldering, the lateral width of the optical head housing 23 can be reduced, that is, the optical head housing 23 can be miniaturized. Optical head housing 23, semiconductor base 21
The rigidity of the movable part composed of the above components is improved, and stable servo characteristics can be obtained in addition to the effects of the first and third embodiments.

A fifth embodiment of the present invention will be described below with reference to the drawings. FIG. 8 is a top view of the overall configuration of an optical head showing a fifth embodiment of the present invention, and FIG. 9 is a side view of the overall configuration of the optical head. 8 and 9, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from the configuration of FIG. 2 in that different length leads 222a to h of different lengths from the semiconductor base 21 are provided, and the different length leads 222a to 222h are fixed to the optical head housing 23.
This is that the support members 25a to 25h are directly fixed to the different length leads 222a to 222h by a method such as soldering.

The operation is the same as that of the first embodiment and will not be repeated. As described above, different length leads 2
22a to h, and these different length leads 222a to 222h are fixed to the side surface of the optical head housing 23.
By directly fixing the support members 25a to 25h to 2a to h by a method such as soldering, the thickness of a plurality of leads can be made the same, and in addition to the effects of the first, third and fourth embodiments, the assembly can be performed. The property is improved.

A sixth embodiment of the present invention will be described below with reference to the drawings. FIG. 10 is a side view of the overall structure of an optical head showing a sixth embodiment of the present invention. 10, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from the configuration of FIG. 2 in that different lengths of leads from the semiconductor base 21 are provided and grooved different-length leads 322a-h having positioning grooves at the ends are provided. Is fixed to the optical head housing 23, and the support member 25a is provided in the groove portions of the grooved different length leads 322a to 322h.
This is a point that the to h are directly fixed by a method such as soldering.

The operation is the same as that of the first embodiment, and will be omitted. As described above, the grooved different-length leads 322a to 322a having different lengths and the positioning grooves at the ends are provided, and these grooved different-length leads 322a to 322h are fixed to the optical head housing 23, and Different length lead with groove 322a ~
The support members 25a to 25h can be easily positioned by directly fixing the support members 25a to 25h in the groove portion of h by a method such as soldering, so that the assemblability is improved.

Further, since the positioning of the supporting members 25a to 25h can be performed with high accuracy, there is no unnecessary resonance due to the variation of the mounting position of the supporting members, and stable servo characteristics can be obtained.

The seventh embodiment of the present invention will be described below with reference to the drawings. 11 is a top view of the overall configuration of an optical head showing a seventh embodiment of the present invention, and FIG. 12 is a side view of the overall configuration of the optical head. 11 and 12, constituent members having the same functions as those in FIG. 2 are designated by the same reference numerals. 2 is different from the configuration of FIG. 2 in that different lengths from the semiconductor base 21 are provided and different-length leads 422a to 422b with bending portions having bent portions at the ends are provided. Is fixed to the optical head housing 23, and the supporting member 2 is provided in the groove portions of the different length leads 422a to 422h with bent portions.
5a to 5h are directly fixed by winding. The different-length leads 422a to 422b with bent portions may not have bent portions at their ends.

The operation is the same as that of the first embodiment, and will be omitted. As described above, the different-length leads 422a to 422a with bent portions having different lengths and the bent portions at the ends are provided, and the different-length leads 422a to 422h with bent portions are fixed to the optical head housing 23. Different length lead 42 with the bent portion
By directly fixing the support members 25a to 25h in the groove portions 2a to h by winding, in addition to the effects of the first and third embodiments, the different length leads 422a to 422b with bent portions and the support members 25a to 25h are provided. Improves the reliability of fixing.

An eighth embodiment of the present invention will be described below with reference to the drawings. FIG. 13 is a side view of the overall structure of an optical head showing an eighth embodiment of the present invention. In FIG. 13, constituent members having the same functions as those in FIG. 9 are designated by the same reference numerals. 9 is different from the configuration of FIG. 9 in that it includes a stepped support material fixing portion 126 having a step, and a plurality of support materials 25a to 25a.
This is the point where the lengths of h are made equal.

As described above, by providing the stepped support material fixing portion 126 having steps, and by making the lengths of the plurality of support materials 25a to 25h equal, the objective lens 3 and the optical head housing 23 are provided. Since the movable part composed of the semiconductor base 21 and the like can be moved in parallel in the focus direction without inclination, stable servo characteristics can be obtained.

[0031]

As described above, according to the present invention, the light emitting element and the light receiving element are integrally formed, and the optical element having the lead for inputting and outputting the electric signal to and from the light receiving and emitting element, the objective lens, the prism and the like are provided. By fixing the lead to the lens holder by fitting it to the lens holder described above, the overall size and weight of the optical head can be reduced, and an excellent optical head capable of high-speed access can be realized.

[Brief description of drawings]

FIG. 1 is a side sectional view of a basic portion of an optical head according to an embodiment of the present invention.

FIG. 2 is a side view showing the overall configuration of an optical head according to an embodiment of the present invention.

FIG. 3 is an overall configuration top view of an optical head according to a second embodiment of the present invention.

FIG. 4 is an overall configuration top view of an optical head according to a third embodiment of the present invention.

FIG. 5 is a side view showing the overall configuration of an optical head according to a third embodiment of the present invention.

FIG. 6 is an overall configuration top view of an optical head according to a fourth embodiment of the present invention.

FIG. 7 is a side view showing the overall configuration of an optical head according to a fourth embodiment of the present invention.

FIG. 8 is an overall configuration top view of an optical head according to a fifth embodiment of the present invention.

FIG. 9 is a side view showing the overall configuration of an optical head according to a fifth embodiment of the present invention.

FIG. 10 is a side view showing the overall structure of an optical head according to a sixth embodiment of the present invention.

FIG. 11 is an overall configuration top view of an optical head according to a seventh embodiment of the present invention.

FIG. 12 is a side view showing the overall configuration of an optical head according to a seventh embodiment of the present invention.

FIG. 13 is a side view showing the overall configuration of an optical head according to a seventh embodiment of the present invention.

FIG. 14 is an overall side view of an optical head in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light emitting element 3 Objective lens 6 Light receiving element 21 Semiconductor base 22a-h lead 23 Optical head housing 24a, 24b Substrate 25a-h Support material 26 Support material fixing part 27 Base 28a, 28b Optical head drive means 29 Reflection mirror 30 Triangular prism 123 Optical head housing with pattern 223 Optical head housing with steps 122a to h Different thickness leads 222a to h Different length leads 322a to h Different length leads with groove 422a to h Different length leads with bend 126 Support material with step Fixed part

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akira Matsubara 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] 1. An optical element having at least a light emitting means and a light receiving means integrally formed therein, and having a lead for inputting and outputting an electric signal of the light emitting means and the light receiving means, and light emitted from the optical element as an information recording medium. An optical head comprising an objective lens for irradiating the optical recording medium and condensing reflected light from the information recording medium onto the optical element again, and a lens holder on which the objective lens is mounted and leads of the optical element are directly fixed. 2. An optical element having at least a light emitting means and a light receiving means integrally formed, and having a lead for inputting and outputting an electric signal of the light emitting means and the light receiving means, and light emitted from the optical element. An objective lens for irradiating the optical element to collect the reflected light from the information recording medium again on the optical element, a lens holder on which the objective lens is mounted and the leads of the optical element are directly fixed, and a side surface of the lens holder. An optical head, which is fixed to a support member that holds the lens holder so as to be drivable in the focus direction and the tracking direction, and a support member fixing portion that fixes the support member. 3. The optical head according to claim 1, wherein the leads of the optical element are fixed to the lens holder by ultrasonic fusion. 4. The method according to claim 2, wherein an electrode pattern having a plurality of lands is formed on the side surface of the lens holder, a lead of an optical element is fixed to one end, and a conductive support material is fixed to the other end. Optical head. 5. The optical head according to claim 2, wherein a support member capable of conducting is directly fixed to the lead of the optical element. 6. A plurality of steps is provided on the side surface of the lens holder,
The optical head according to claim 5, wherein a plurality of leads coming out of the optical element are fixed to these steps. 7. The optical head according to claim 5, wherein a plurality of leads coming out from the optical element have different thicknesses. 8. The optical head according to claim 5, wherein a plurality of leads extending from the optical element have different lengths. 9. A guide groove is provided in a lead end portion of an optical element,
The optical head according to claim 5, wherein a supporting material is fixed thereto. 10. The optical head according to claim 5, wherein a support member is wound around and fixed to the lead of the optical element. 11. The optical head according to claim 2, wherein a step is provided at a support material mounting portion of the support material fixing portion, and a plurality of support materials have a constant length.