JPH06152107A - Buff for polishing printed wiring board - Google Patents

Abstract

PURPOSE:To check the damage, the abrasion condition, etc., of an abrasive material layer by sight easily and accurately and to make it possible to do the required polishing for a smooth surface at all times by dividing the abrasive material layer by coloring concentrically into several layers of the same thickness and different color. CONSTITUTION:This is a buff for polishing a printed wiring board 6 having an abrasive material layer 5 that is made by winding and laminating, for example, blue-colored nonwoven cloth layers 5a and yellow-colored nonwoven cloth layers 5b, both in nearly the same thickness, alternately and concentrically. When the required polishing for a smooth surface is conducted by rotating and sliding the buff for polishing 6, the surface of a primary slide region 6a is worn away with the progress of the polishing and then another new colored surface 5a is exposed. According to the kind and position of the newly exposed colored layer 5a, the degree of abrasion and damage condition of the abrasive material 5 can be known visually even in the polishing work for a smooth surface. Without interrupting the polishing for a smooth surface, therefore, it is easily decided whether any fine adjustments are required for the polishing pressure condition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a buff (brush) for polishing a printed wiring board, which is used when the surface of the printed wiring board is surface-polished.

[0002]

2. Description of the Related Art In the process of manufacturing a printed wiring board, for example, when a copper foil of a copper clad laminate is selectively etched to form a desired circuit pattern, the circuit pattern is masked on the copper foil by screen printing or the like. And
In this masking, as a pretreatment, the copper layer surface is surface-polished with a polishing buff so that the masking can be performed with good accuracy. That is, in order to obtain a high quality printed wiring board in the miniaturization (fineness) of the circuit pattern, highly accurate masking is required, and as a precondition, a good surface condition, in other words, the surface copper layer alignment is required. Surface polishing is essential. As a pretreatment to meet such a request, as shown in FIG.
As shown in cross-sections, the long core 1 that functions as a rotation shaft, for example, a cylinder made of Al, and the polishing that is concentrically coated and arranged (wrapped) on the outer peripheral surface of the long core 1. Polishing with a buff (brush) 3 composed of a material layer 2, for example, abrasive grains such as Al ₂ O ₃ , that is, a carrier layer on which abrasive particles are applied (attached) and carried, for example, a polyamide resin nonwoven fabric layer Using the equipment, the copper foil surface of the copper clad laminate being conveyed is rotated and swept, and the surface is mechanically polished. Here, the abrasive layer 2 of the polishing buff 3 is
The polishing buff 3 may be colored in any one of the colors and classified (classified).

[0003]

However, in the case of the printed wiring board polishing buff 3 having the above structure, the following inconvenient problems are recognized in practical use. That is, since the polishing material layer 2 of the polishing buff 3 has a function of surface polishing by rotating / sliding (or rotating / sweeping) the surface of the copper clad laminate, it is inevitable that the surface to be polished is to be polished. The abrasive material layer 2 in the central region (usually the polishing buff 3 is longer than the width of the copper clad laminate) corresponding to the above is damaged and worn, and the long core 1
The outer diameter of the abrasive layer 2 concentrically covered and arranged on the outer peripheral surface is gradually reduced. As the outer diameter decreases, the state of the abrasive pressure on the surface of the copper-clad laminate changes, so that the required surface-polishing cannot be sufficiently performed (polishing property or cutting force decreases). Therefore, poor adhesion between the copper clad laminate surface and the pattern resist ink is caused, resulting in difficulty in high-precision masking, and the occurrence of etching defects due to the difficulty of masking, resulting in a fine circuit pattern. It becomes difficult to form

In order to solve the above-mentioned inconvenient problem, in other words, in order to keep the polishing pressure state of the polishing buff 3 against the surface of the copper clad laminate constant, the damage / wear state of the polishing material layer 2 of the polishing buff 3 is kept. Inspect appropriately and, if necessary, finely adjust the polishing pressure of the polishing buff 3 with a dial gauge or a pulse motor, or scrape both ends of the polishing buff 3 abrasive layer 2 with a so-called dresser, or polish. There is no choice but to attach and detach the buff 3 for use. However, the polishing buff 3
Since the criteria for checking the damage / wear state of the abrasive layer 2 and the criteria for attaching / detaching / removing the polishing buff 3 are not clear, in order to perform these operations, the surface-polishing process is appropriately stopped and checked. -It is necessary to check and attach / detach, which results in waste of operating time or a decrease in productivity.

The present invention has been made in view of the above circumstances, and a printed wiring capable of easily and surely visually confirming the damage / wear state of an abrasive layer and always achieving a required surface-polishing process. The purpose is to provide a buff (brush) for polishing a plate.

[0006]

A printed wiring board polishing buff according to the present invention comprises a long core and an abrasive layer concentrically wound around and arranged on the outer peripheral surface of the long core. And
At least a part of the abrasive layer is concentrically color-coded with different hues with respect to the elongated core body.

[0007]

According to the present invention, the abrasive layer is concentrically formed,
Since the color is divided into different colors according to a certain thickness, the surface of the copper-clad laminated plate is rotated and slid (swept), and when the abrasive layer is damaged or worn, Even during the surface polishing process, it is possible to visually check (or visually check) the degree or state of damage / wear due to the position of the newly exposed hue. That is, by visually observing the hue of the abrasive layer as a reference, without stopping the surface-polishing process,
Since it is possible to easily determine whether or not the fine adjustment of the grinding pressure state is required, and whether or not the polishing buff needs to be attached / detached / replaced, it greatly contributes to the improvement of yield and productivity.

[0008]

Embodiments of the present invention will be described below with reference to FIGS.

1 and 2 are a perspective view (FIG. 1) and a sectional view (FIG. 2) of a structural example of a printed wiring board polishing buff according to the present invention. Where 4
Is a long core, for example, a cylinder made of metal such as Al, or made of fiber reinforced synthetic resin, with a diameter of about 60 mm and a length of about 60 cm,
Reference numeral 5 denotes an abrasive material layer concentrically wound around and arranged on the outer peripheral surface of the elongated core body 4, for example, a polyamide resin nonwoven fabric layer coated with (adhered to) and carrying abrasive particles such as Al ₂ O ₃ and SiC. Is. Then, the abrasive layer 5 is composed of a non-woven fabric layer 5a colored in blue with a coloring agent (pigment) and a non-woven fabric layer 5b colored in yellow with another coloring agent (pigment), which are almost equal in thickness. Are concentrically wound and laminated.

The buff for polishing a printed wiring board having the above-mentioned structure is
For example, it can be manufactured as follows. First, as the elongated core body 4, for example, a cylinder made of Al metal is prepared.
Prepare a blue-colored polyamide resin nonwoven fabric and a yellow-colored polyamide resin nonwoven fabric on which abrasive particles such as ₂ O ₃ and SiC are applied and supported and which are colored. Then, the polyamide resin nonwoven fabric is alternately wound and arranged (laminated),
If necessary, the shrinkage due to heating is integrated to integrate the hues 5a and 5b concentrically with the elongated core body 4.
It is possible to obtain a buff 6 for polishing a printed wiring board, which is provided with the abrasive layer 5 that is color-coded by.

In the manufacturing process of the printed wiring board polishing buff 6, the polyamide resin non-woven fabric on which abrasive particles are applied (attached) and supported is colored in stripes alternately in different colors, which are continuously colored. May be wound and arranged (laminated), or a polyamide resin non-woven fabric coated with and carrying abrasive particles may be used as an original fabric, and the original fabric may be punched into discs having different diameters, and the discs may be lengthened. It is also possible to adopt a means of fitting them into the shank type core body 4 in a laminated manner and further stacking and fitting concentrically discs of different colors having a larger diameter. In short, it may be appropriately selected depending on the material of the abrasive, for example, rigidity or softness.

The printed wiring board polishing buff 6 configured as described above is mounted on a polishing device as a conventional means,
For example, when the polishing pressure of the polishing buff 6 with respect to the surface of the copper clad laminate is adjusted (adjusted) to a constant level, and the polishing buff 6 is rotated and slid to perform the required surface polishing, the surface polishing is performed. When the main sliding area surface 6a is worn away as the processing progresses, another new colored surface (colored layer) 5a is exposed, as shown in a sectional view in FIG. 3, for example. Therefore, depending on the type and position of the new exposed colored layer 5a (or 5b), the wear / damage state or degree of the abrasive layer 5 can be visually confirmed even during the surface polishing processing by rotating / sliding.・ It will be possible to judge. For this reason, the polishing buff 6 for the copper clad laminate surface
Fine adjustment to keep the grinding pressure state constant, dresser for the polishing layer 5 or attachment / detachment / replacement of the polishing buff 6 can be efficiently performed (avoidance of waste of working time), and abrasion of the abrasive layer 5 -The problem of defective or insufficient surface-polishing processing due to damage is reliably solved, enabling highly precise and fine masking.

In the above description, the abrasive layer 5 of the printed wiring board polishing buff 6 is formed in multiple layers concentrically with different hues 5a and 5b. However, in this case, different colors may be used. . Further, it may be configured as shown in FIGS. 4 (a), 4 (b) and 5 in cross section and in FIG. 6 in perspective. That is, the abrasive layer 5 has a two-layer structure of colored layers 5a and 5b (FIG. 4A), and only the main part of the abrasive layer 5 has a different hue.
Layer structure (Fig. 4 (b)), multi-layer structure of different hues 5a, 5b, 5c (Fig. 5), or concentric layers of the abrasive layer 5 are not colored, but some regions are different in a band shape. A structure having hues 5a and 5b (FIG. 6) may be used.

[0014]

As exemplified above, in the printed wiring board polishing buff according to the present invention, the abrasive layer is concentrically formed, and at least a part of the buff has a different color for each thickness. There is. Then, the surface of the copper clad laminate is rotated and slid (swept), and the polishing layer damages the abrasive layer.
When abrasion occurs, it is possible to visually check (or visually confirm) the degree or state of damage or abrasion due to the position of the newly exposed hue even during the surface-polishing process. Therefore, by visually observing the hue of the abrasive layer, it is easy to determine whether or not fine adjustment of the grinding pressure state is necessary and whether or not the polishing buff needs to be attached / detached without stopping the surface polishing. Therefore, it greatly contributes to the improvement of yield and productivity.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structural example of a printed wiring board polishing buff according to the present invention.

FIG. 2 is a cross-sectional view showing a structural example of a printed wiring board polishing buff according to the present invention.

FIG. 3 is a schematic view showing a state in which when the abrasive layer of the printed wiring board polishing buff according to the present invention is damaged or worn, the degree of damage or wear can be visually recognized even during the surface polishing process. Sectional drawing to show.

4 (a) and 4 (b) are cross-sectional views showing other different structural examples of the printed wiring board polishing buff according to the present invention.

FIG. 5 is a sectional view showing still another structural example of the printed wiring board polishing buff according to the present invention.

FIG. 6 is a perspective view showing another structural example of the printed wiring board polishing buff according to the present invention.

FIG. 7 is a perspective view showing the structure of a conventional printed wiring board polishing buff.

FIG. 8 is a cross-sectional view showing the structure of a conventional printed wiring board polishing buff.

[Explanation of symbols]

1, 4 ... Long core (driving shaft) 2, 5 ... Abrasive layer
3, 6 ... Buffs for polishing printed wiring boards 5a, 5b, 5c ...
Colored layer 6a in the abrasive layer ... Sliding / wear area of buff for polishing printed wiring board

Claims (1)

[Claims] 1. An elongated core body, and an abrasive layer concentrically coated and arranged on the outer peripheral surface of the elongated core body, wherein the abrasive layer is at least partially elongated A buff for polishing a printed wiring board, characterized in that the core is concentrically colored with different hues.