JPH06151129A - Formation for bond magnet, and bond magnet - Google Patents

Abstract

PURPOSE:To raise flexural strength of a bond magnet by making it contain magnetic powder with an anisotropic field of a specific value or more, and a resin binder containing solidlike epoxy resin, solidlike imidosilicon resin, and specific added compounds. CONSTITUTION:This formation for bond magnet contains magnetic powder having an anisotropic magnetic field of 50kOe or more, and a resin binder containing epoxy resin being in a solid state at 25 deg.C, imidosilicon resin being in a solid state at 25 deg.C, and at least one kind of specific compound chosen from an organic compound containing fluorine, isocyanuric acid ester, an organic phosphorus compound, a reactive diluent, a vinyl benzyl compound, epoxy resin having polysulphide bonds in its principal chains, organosiloxane having reactive radicals at both ends, and polybutadiene. As a result, it becomes possible to mass produce bond magnets excellent in magnetic characteristics and flexural strength with good productivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition which gives a bonded magnet excellent in magnetic properties and bending strength.

[0002]

2. Description of the Related Art Rare earth-based permanent magnets are being applied in a wide range of fields such as general home appliances, communication / audio equipment, medical equipment, and general industrial equipment due to their excellent magnetic properties. Among them, the bond-type magnet is made by mixing magnetic powder with a resin binder and press-molding, so (1) dimensional accuracy is high and it can be molded into a complicated shape compared to a sintered-type magnet. , (2) High uniformity of quality and performance, (3) Good yield, good machinability, etc.

However, if the compounding ratio of the resin binder is increased in order to increase the mechanical strength of the obtained bonded magnet, for example, the bending strength, the ratio of the magnetic powder decreases correspondingly, so that the magnetic characteristics of the bonded magnet deteriorate. There is. On the other hand, in recent years, bond magnets used in small motors, audio equipment, OA equipment, etc. have high magnetic properties due to the demand for downsizing of equipment, and also have excellent mechanical strength, especially bending strength, which does not cause cracks or chips during assembly. What is required is required.

In order to satisfy such conflicting requirements of improving the magnetic properties and the mechanical strength of the magnet, it has been proposed to perform press molding using a liquid epoxy resin as a binder at room temperature. . That is, when the epoxy resin is used, the bending strength can be maintained high even if the ratio of the resin is kept low and the magnetic characteristics of the magnet are improved.

[0005]

However, when an epoxy resin which is liquid at room temperature is used as a binder, the powder flow characteristics are remarkably deteriorated and press molding tends to be difficult.
There is another new problem that mass productivity is greatly impaired.

In view of the above circumstances, an object of the present invention is to obtain not only excellent magnetic properties and bending strength of the obtained magnet, but also good powder flow properties even if the ratio of the binder resin is kept low. And a bond magnet obtained by the composition.

[0007]

[Means for Solving the Problems] In order to achieve the above object, the present inventors have conducted various studies on resins used as binders for bond magnets. It was found that a composition was obtained, and the present invention was completed.

That is, the present invention includes (A) a solid epoxy resin at 25 ° C., (B) (b-1) a fluoroalkyl group in one molecule, and an epoxy group and / or a hydroxyl group. Fluorine organic compound; (b-2) isocyanuric acid ester obtained by substituting a hydrogen atom of at least one imino group of isocyanuric acid with an alkenyl group or an alkynyl group; (b-3) general formula (1):

[Chemical 7] (In the formula, R ₁ is an acyl group containing an olefinic unsaturated bond, R ₂ is an alkylene group or an alkenylene group, Ar is a hydrogen atom or an aryl group, and n is 1 or 2
An organic phosphorus compound represented by the formula: (b-4) a reactive diluent having at least two epoxy groups in one molecule; (b-5) a general formula (2):

[Chemical 8] (Wherein A is a divalent organic group); (b-6) Epoxystyrene; (b-7) Epoxy resin having a polysulfide bond in the main chain; (b-8) General formula (3):

[Chemical 9] (Here, R ₃ and R _{5, which} may be the same or different, are an alkyl group or a cycloalkyl group, R ₄ is a reactive organic group, and n is an average of 0 to 20) An organosiloxane having a reactive group at both ends; and (b-9) general formula (4): R ₆ — (X _a —Y _b —Z _c ) _n —R ₇ (4) (wherein , R ₆ and R _{7, which} may be the same or different, are a glycidyloxyalkyl group, a hydroxyl group or a hydroxyalkyl group; a and b are integers of 0 or more and a + b ≠ 0.
And c and n are positive integers; when X is plural, they may be the same or different, and the formula (5):

[Chemical 10] Alternatively, it is a group represented by the formula (6): —CH ₂ —CH═CH—CH ₂ — (6), and Y is Y when there are plural groups.
May be the same or different, and formula (7):

[Chemical 11] Or, formula (8):

[Chemical 12] Z is a group represented by the formula (9): —CH ₂ —CH═CH—CH ₂ — (9), and X, Y and Z are randomly arranged. Good. ) Polybutadiene, at least one compound selected from the group consisting of, and (C) a resin binder containing an imide silicone resin solid at 25 ° C., and an anisotropic magnetic field of 50 kOe or more. The present invention provides a composition for a bonded magnet containing a magnetic powder. Furthermore, the present invention provides a bond magnet obtained by curing the composition for a bond magnet. Hereinafter, the present invention will be described in detail.

Magnetic Powder The magnetic powder used in the present invention has an anisotropic magnetic field (H _A ) of
Any magnetic powder of 50 kOe or more can be used without particular limitation. Therefore, as long as this condition is satisfied, it is possible to use a magnetic powder that is usually used in bonded magnets, for example, rare earth cobalt-based such as SmCo ₅ , Sm ₂ (CoFeZrV) ₁₇ ,
Rare earths such as Nd-Fe-Co-B system, Nd-Dy-Fe-B system, Nd-Fe-B system-iron-boron system, Sm-Fe-N system, Nd-Fe-Ti-
Examples include magnetic powders such as N type and Nd-Fe-VN type.

When the magnetic powder is the rare earth-iron-boron system exemplified above, it is particularly preferable to use the alloy powder by the liquid quenching method. That is, according to the liquid quenching method, the alloy of the required composition is melted by a method such as high frequency induction heating, and the resulting molten metal is sprayed onto a high-speed rotating copper or aluminum roll to be rapidly cooled to a thickness of several tens of microns. It is a ribbon. Magnetic powder is obtained by subjecting this ribbon to an appropriate heat treatment to reduce the average crystal grain size to 3000 liters or less, and then subjecting it to dry or wet pulverization with a stamp mill, ball mill or the like. Generally, the particle size of the magnet powder is preferably 35 mesh (JIS) or less.

As the epoxy resin as the resin binder (A), any epoxy resin can be used without limitation as long as it is solid at 25 ° C., for example, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin. , Linear aliphatic epoxide type epoxy resin, aliphatic epoxide type epoxy resin and the like, and these may be used alone or in combination of two or more kinds.

The amount of the epoxy resin (A) compounded in the resin binder is usually 5 to 50% by weight, preferably 10 to 30% by weight. If the amount is too small or too large, it is difficult to obtain sufficient bending strength.

The compound used as the component (B) will be described below. (b-1) Fluorine-containing organic compound The fluoroalkyl group contained in the fluorine-containing organic compound preferably has 1 to 20 carbon atoms. In addition, a part of the hydrogen atoms of the corresponding alkyl group may be replaced with fluorine atoms or all the hydrogen atoms may be replaced,
A perfluoroalkyl group in which all hydrogen atoms are substituted is preferred. Further, the fluorine compound needs to have at least one of an epoxy group and a hydroxyl group. Examples of such a fluorine-containing organic compound include 3- (2-perfluorohexyl) ethoxy-1,2-dihydroxypropane, N
-N-propyl-N-2,3-dihydroxypropyl perfluorooctyl sulfonamide, 3- (2-perfluorohexyl) ethoxy-1,2-epoxypropane, N
-N-propyl-n-2,3-epoxypropyl perfluorooctylsulfonamide and the like are mentioned, and these are
They can be used alone or in combination of two or more.

(B-2) Isocyanuric acid ester The organic group of the ester moiety of isocyanuric acid ester is, for example, an alkenyl group such as vinyl, propenyl, butenyl, pentenyl, an alkynyl group such as ethynyl, an arylalkenyl such as styryl and cinnamyl. Groups and the like. Specific examples of the isocyanuric acid ester include mono-, di-, triallyl isocyanurate, mono-, di-, trimetallyl isocyanurate, mono-, di-, trivinyl isocyanurate, mono-, di-, tri-. 1-
Propenyl isocyanurate, mono-, di-, triisopropenyl isocyanurate, mono-, di-, tri-1
-Butenyl isocyanurate, mono-, di-, tri-2
-Butenyl isocyanurate, mono-, di-, tripentene isocyanurate, mono-, di-, triethynyl isocyanurate, mono-, di-, tristyryl isocyanurate, mono-, di-, tricinnamyl isocyanurate, etc. Is mentioned. These can be used alone or in combination of two or more.

(B-3) Organophosphorus Compound In the general formula (1) representing the organophosphorus compound, examples of the acyl group R ₁ containing an olefinic unsaturated bond include an acryloyl group, a methacryloyl group, a cinnamoyl group, and oleoyl. Examples of the alkylene group represented by R ₂ include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group and a heptylene group, and examples of the alkenylene group include a propenylene group and a vinylene group. Examples of the aryl group represented by include a phenyl group, a tolyl group, a xylyl group, and a naphthyl group. Specific examples of the organic phosphorus compound include mono (2-acryloyloxyethyl) dihydrogen phosphate, mono (2-methacryloyloxyethyl) dihydrogen phosphate, di (2-acryloyloxyethyl) monohydrogen phosphate, and di (2-acryloyloxyethyl) dihydrogen phosphate. (2-methacryloyloxyethyl) monohydrogen phosphate, diphenyl (2-acryloyloxyethyl) phosphate, diphenyl (2-methacryloyloxyethyl) phosphate and the like can be mentioned, and these can be used alone or in combination of two or more. be able to.
Examples of the organic phosphorus compound include AR-100, AR-200, MR-100, MR-200, and AR-26 manufactured by Daihachi Chemical Industry Co., Ltd.
0, MR-260 commercially available products may be used.

(B-4) Reactive Diluent The reactive diluent can be used without particular limitation as long as it has at least two epoxy groups in one molecule. Examples of such reactive diluents include cyclohexanedimethanol diglycidyl ether, trimethylolethane triglycidyl ether, trimethylolpropane triglycidyl ether, aliphatic polyol polyglycidyl ether, polyglycol diepoxide, castor oil polyglycidyl ether. , 1,4
-Butanediol diglycidyl ether and the like,
These can be used alone or in combination of two or more.

(B-5) Vinyl Benzyl Compound The vinyl benzyl compound represented by the general formula (2) is characterized by having vinyl benzyl groups at both ends in one molecule. As the methylene group, an alkylene group such as an ethylene group, a phenylene group, a naphthylene group, a divalent carbon hydrogen group such as an arylene group such as a phenanthrylene group,
Divalent ether groups such as methylenedioxy group and ethylenedioxy group, divalent acyl groups such as malonyl group, glutaryl group and phthalosol group, divalent groups such as imino group, hydrazo group, azoxy group and ureyl group. Examples thereof include nitrogen organic groups and the like, or mixtures thereof.

(B-6) Epoxy Styrene Epoxy styrene can be used without particular limitation as long as it has a purity of 85% by weight or more.

(B-7) Polysulfide Bond-Containing Epoxy Resin The epoxy resin having a polysulfide bond (-(S) _n- , n is an integer of 2 or more) in the main chain was produced by a known polymerization method. It is possible to use, for example, Flep 10 and Flep 5 manufactured by Toray Thiokol Co., Ltd.
Commercially available products such as 0 and Flep 60 (trade name) can be used.

(B-8) Organosiloxane Alkyl group R contained in the organosiloxane of the general formula (3)
Examples of R ₃ and R ₅ include a methyl group, ethyl group, propyl group, butyl group, etc., examples of the cycloalkyl group include cyclohexyl group, and examples of the reactive organic group R ₄ include glycidyl ether group. , Vinyl group, methacryloxy group, halogen group, alkoxy group, amide group,
Imide group, carboxyl group, amino group, ester group, etc.,
Further, an organic group such as a methacryloxy group, a vinylbenzyl group, a hydroxyphenyl group, an epoxidized cyclohexyl group, or an alicyclic epoxy group having these reactive groups can be mentioned. N in the formula is a number of 0 to 20, preferably 4 to 10
Is the range. These organosiloxanes may be used either individually or in combination of two or more.

(B-9) Polybutadiene Polybutadiene can be used without particular limitation as long as it is a compound represented by the above formula (4), but in order to obtain better bending strength or a resin is used in the composition. In order to facilitate uniform dispersion in the above, it is preferable that in formula (4), 500 ≦ n ≦ 4000 and the epoxy equivalent is 200 or more.
These can be used alone or in combination of two or more. The polybutadiene can be produced by a known polymerization method, and can be produced by Denarex R-45EPI.
, Which are commercially available under the trade names such as Denalex R-45EPT (manufactured by Nagase & Co., Ltd.) can be used. The compound (b-
1) to (b-9) can be used alone or in combination of two or more.

The blending amount of the component (B) is the epoxy resin (A) 10
Generally, 0.2 to 600 parts by weight is preferable per 0 part by weight. However, if the component (B) is not solid at 25 ° C, 0.2
-100 parts by weight is preferred. If the blending amount of the component (B) is too small, sufficient bending strength cannot be obtained, and if it is too large, the heat resistance and bending strength are significantly reduced.

The imide silicone resin as the component (C) is a kind of thermosetting special polyimide resin which is synthesized by a reaction between an organosiloxane and an imide monomer and has an imide group and an organosiloxane moiety in one molecule. For example, it is available under the trade name Sumiresin Excel manufactured by Sumitomo Bakelite Co., Ltd. The imide silicone resin has the general formula:

[Chemical 13] Or

[Chemical 14] [In the formula, n, m and p are integers of 1 or more, and R _{1 to} R ₄ are alkyl groups, and may be the same or different. X and Y are organic functional groups containing an epoxy group, an amino group, a vinyl group and the like. ] And an organosiloxane represented by the general formula:

[Chemical 15] [In the formula, n is an integer of 0 or more, and m is an integer of 1 or more. ] And an imide-based monomer represented by, for example, polymerization or heat treatment in the presence of a catalyst to cause a reaction. This resin remains solid at 25 ° C,
Alternatively, it is used in a state of being dispersed in, for example, diglyme. The amount of component (C) is usually 4 per 100 parts by weight of component (A).
0 to 2,000 parts by weight. If the amount of component (C) is too small or too large, sufficient bending strength cannot be obtained. The content of the binder resin in the composition of the present invention is preferably 0.5 to 5 parts by weight, more preferably 1 to 3 parts by weight, based on 100 parts by weight of the magnetic powder.

Other Components In addition to the above magnetic powder and binder resin, the composition for bonded magnets of the present invention may be a known Si-based, Ti-based or
An Al-based coupling agent, a resin curing agent, a curing accelerator (curing catalyst), etc. can be added alone or in combination. Examples of Si-based, Ti-based, and Al-based coupling agents include vinyltriethoxysilane, γ-aminopropyltriethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane, and N-
(Β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane,
γ-glycidoxypropylmethyldimethoxysilane, γ
-Methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, isopropyltriisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate,
Isopropyltri (N-aminoethyl-aminoethyl)
Typical examples include titanate, tetraoctyl bis (ditridecyl phosphite) titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylisostearoyl titanate, isopropyl tridecyl benzene sulfonyl titanate and acetoalkoxy aluminum diisopropylate. By mixing these by a dry method, a wet method, an integral blending method, or the like, the adhesion of the obtained bonded magnet to the substrate can be improved. As the resin curing agent, for example, a single polyamine type curing agent, a modified polyamine type curing agent, an acid anhydride type curing agent, a polyphenol type curing agent, a polymercaptan type curing agent, an anionic polymerization type curing agent, a cationic polymerization type A hardening agent etc. are mentioned. As the curing accelerator, tertiary amines, imidazoles,
Examples thereof include organic metal salts, chlorides and organic peroxides. Two or more kinds of resin curing agents and curing accelerators may be used in combination as required.

Preparation of Composition The composition of the present invention is obtained by mixing the required components. The mixing method is not particularly limited, and for example, a wet method for dissolving the above resin and other organic components in an organic solvent such as methyl ethyl ketone, mixing with magnetic powder, and then drying to obtain a composition, for example, a ribbon blender, a tumbler, and now. Any of a dry method in which required components are collectively mixed in a mixer such as a termixer, a Henschel mixer, or a super mixer may be used. The composition thus obtained is in the form of powder having high fluidity.

Manufacture of Bonded Magnet In the manufacture of a magnet, the composition obtained is press-molded by various compression molding devices, and then heat treatment is applied to cure the binder resin. After that, a bonded magnet is obtained by magnetizing in a magnetic field. Press molding of the composition is usually 4
It carried out under a pressure of ~8t / cm ^2, curing of the binder resin 1
It may be heated at a temperature of about 20 to 190 ° C for about 0.5 to 3 hours.

Uses The bonded magnet obtained by curing the composition of the present invention is useful in a wide range of fields such as general home appliances, communication equipment, audio equipment, medical equipment and general industrial equipment.

[0028]

The binder resin used in the composition of the present invention is composed of an epoxy resin (A), an additive (B) and an imide silicone resin (C). When each of these resins is used alone, In comparison, a higher crosslinking rate is obtained when the resin is cured, and the adhesive strength between the magnetic powder and the resin layer is significantly increased. Therefore, it is considered that excellent bending strength can be obtained with a resin amount smaller than the conventional resin amount. Further, both of the resins (A) and (C) are solid at 25 ° C,
Some of the organic compounds (B) are liquid at 25 ° C., but the composition is not tacky and shows good powder flowability.

[0029]

EXAMPLES The present invention will be described in more detail with reference to examples.

Materials The materials used in the following examples are as follows. Magnetic powder Magnetic powder I: Nd-Fe-B type magnetic powder (trade name: MQP-B, manufactured by General Motors, USA), anisotropic magnetic field: 70.4 kOe Magnetic powder II: Sm-Co ₅ type magnetic powder (trade name) : RCo ₅ alloy, manufactured by Sumitomo Metal Mining Co., Ltd., anisotropic magnetic field: 246 kOe, average particle size 10 μm Epoxy resin Epoxy resin I: Cresol novolac type epoxy resin, solid at 25 ° C. (trade name: EOCN-1025, Nippon Kayaku Co., Ltd.) Epoxy resin II ^* : Bisphenol A type epoxy resin,
Liquid at 25 ° C (trade name: Epikote 828, manufactured by Yuka Shell Epoxy Co., Ltd.) Imide silicone resin Sumiresin Excel CRC-7030 M-40 (trade name: manufactured by Sumitomo Bakelite Co., Ltd.), solid at 25 ° C. -(1) Fluorine-containing organic compound Nn-propyl-n-2,3-epoxypropyl perfluorooctyl sulfonamide (trade name: MF-130,
(Produced by Tochem Products Co., Ltd.). -(2) Isocyanuric acid ester Triallyl isocyanurate (trade name: TAIC, manufactured by Nippon Kasei Co., Ltd.)-(3) Organophosphorus compound Organophosphorus compound I: Diphenyl (2-acryloyloxyethyl) phosphate (trade name: AR -260, manufactured by Daihachi Chemical Industry Co., Ltd. Organic phosphorus compound II: a mixture of mono (2-acryloxyethyl) dihydrogen phosphate and di (2-acryloxyethyl) monohydrogen phosphate (trade name: AR -200, manufactured by Daihachi Chemical Industry Co., Ltd .- (4) Reactive Diluent Reactive Diluent I: Cyclohexanedimethanol diglycidyl ether (trade name: Herooxy 107, manufactured by Rhone Poulenc (France)) Reactive Diluent Agent II: Aliphatic polyol polyglycidyl ether (trade name: Heroxy 84, manufactured by Rhone Poulin (France))-(5) Vinyl Ben Zir compound Vinylbenzyl compound: Trade name: V-300, manufactured by Showa Highpolymer Co., Ltd., solid at 25 ° C. -(6) Epoxystyrene Epoxystyrene (manufactured by Merck GmbH (Germany))-(7) Epoxy resin having a polysulfide bond in the main chain Epoxy resin I: Flep 10 (Toray Thiokol Ltd.)
Epoxy resin II: FREP 60 (Toray Thiokol Co., Ltd.)
-(8) Organosiloxane Organosiloxane I: α, ω-bis (3-glycidoxypropyl) polydimethylsiloxane (the above general formula
In (3), n = 4, trade name: TSL-9946, manufactured by Toshiba Silicone Co., Ltd. Organosiloxane II: α, ω-bis (vinyl) polydimethylsiloxane (n = 4 in the general formula (3),
Product name: TSL-9646, manufactured by Toshiba Silicone Co., Ltd. Organosiloxane III: α, ω-bis (3-glycidoxypropyl) polydimethylsiloxane (the above general formula)
In (3), n = 8, product name: TSL-9986, manufactured by Toshiba Silicone Co., Ltd .- (9) Glycidyl group-containing polybutadiene Product name: Denarex R-45 EPI, manufactured by Nagase & Co., Ltd. Curing agent: dicyandiamide Used only when the binder resin did not contain imide silicone resin. Curing accelerator: 3-hydroxypyridine (manufactured by Kanto Chemical Co., Inc.) However, it was used only when the binder resin did not contain an imide silicone resin.

Preparation of Composition As shown in Tables 1 to 13, 100 parts by weight of the magnetic powder in each Example and Comparative Example was compounded with the components shown in the table in the indicated amounts. In the comparative example in which the resin content is only the epoxy resin, a solution obtained by diluting a curing accelerator in an amount of 3% by weight with respect to the total amount of the resin and a curing agent in an amount of 10% by weight of the epoxy resin with diglyme or methyl ethyl ketone 10 times Was added. After mixing and stirring, diglyme or methyl ethyl ketone was completely evaporated under reduced pressure (10 ^-1 Torr) at 30 ° C to obtain a composition. The powder flow characteristics of each composition were evaluated as follows. The results are shown in Tables 1 to 13.

Evaluation of powder flow characteristics : The composition was molded into a mold (outer diameter
20mmφ, inner diameter 18mmφ, depth 35mm)
The amount of powder in the mold was weighed. 2 or more when the amount of powder is 2g or more
Less than g was evaluated as x. In general, the compositions rated ◯ were smooth, while the compositions rated x showed tackiness that was prone to agglomeration.

The compositions of Examples and Comparative Examples obtained in the manufacture and evaluation of magnets were fed into a press mold and press-molded at a molding surface pressure of 5.7 tons / cm ² (however, SmCo ₅ magnetism was used). Molding was performed in a magnetic field only when powder was used) to obtain a plate-like sample composed of a compact having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm. Then, each of the plate-like samples was heat-treated in the air at 185 ° C. for 3 hours to cure the binder resin in the samples to obtain bonded magnet samples. The bending strength and magnetic properties of these samples were evaluated by the following methods. The results are shown in Tables 1 to 13.

Bending strength : Bending strength was obtained and evaluated according to ASTM D-790.

Magnetic properties : Measured at room temperature with a Thiophie type self-recording magnetometer.

[0036]

[Table 1]

[0037]

[Table 2]

[0038]

[Table 3]

[0039]

[Table 4]

[0040]

[Table 5]

[0041]

[Table 6]

[0042]

[Table 7]

[0043]

[Table 8]

[0044]

[Table 9]

[0045]

[Table 10]

[0046]

[Table 11]

[0047]

[Table 12]

[0048]

[Table 13]

[0049]

As is clear from the above description, the composition for bonded magnets of the present invention is excellent not only in the magnetic properties and bending strength of the obtained magnet but also in the powder flow properties. , Molding workability is good and high productivity can be realized,
Suitable for mass production.

Claims (3)

[Claims] 1. (A) a solid epoxy resin at 25 ° C., (B) (b-1) a fluorine-containing organic compound having a fluoroalkyl group in one molecule and having an epoxy group and / or a hydroxyl group; (b-2) Isocyanuric acid ester in which at least one hydrogen atom of an imino group of isocyanuric acid is substituted with an alkenyl group or an alkynyl group; (b-3) General formula (1): (In the formula, R ₁ is an acyl group containing an olefinic unsaturated bond, R ₂ is an alkylene group or an alkenylene group, Ar is a hydrogen atom or an aryl group, and n is 1 or 2
An organic phosphorus compound represented by the formula: (b-4) a reactive diluent having at least two epoxy groups in one molecule; (b-5) the general formula (2): A vinylbenzyl compound represented by the formula (wherein A is a divalent organic group) and solid at 25 ° C .; (b-6) epoxy styrene; (b-7) epoxy having a polysulfide bond in the main chain. Resin; (b-8) General formula (3): (Wherein R ₃ and R ₅ are alkyl groups or cycloalkyl groups which may be the same or different, R ₄ is a reactive organic group, and n is an average number of 0 to 20) The
An organosiloxane having reactive groups at both ends; and (b-9) general formula (4): R _6- (X _a -Y _b -Z _c ) _n -R ₇ (4) (wherein R ₆ And R ₇ may be the same or different and each is a glycidyloxyalkyl group, a hydroxyl group or a hydroxyalkyl group; a and b are integers of 0 or more and a + b ≠ 0.
And c and n are positive integers; when X is plural, they may be the same or different and are represented by the formula (5): Alternatively, it is a group represented by the formula (6): —CH ₂ —CH═CH—CH ₂ — (6), and Y is Y when there are plural groups.
May be the same or different and have the formula (7): Alternatively, formula (8): Z is a group represented by the formula (9): —CH ₂ —CH═CH—CH ₂ — (9), and X, Y and Z are randomly arranged. Good. ) Polybutadiene, at least one compound selected from the group consisting of, and (C) a resin binder containing an imide silicone resin solid at 25 ° C., and an anisotropic magnetic field of 50 kOe or more. A composition for a bonded magnet, which comprises a magnetic powder. 2. The composition according to claim 1, wherein the resin binder is 0.2 to 60 parts by weight of component (B) per 100 parts by weight of component (A).
0 parts by weight, (C) component 40 to 2,000 parts by weight,
The resin binder is 0.5 per 100 parts by weight of the magnetic powder.
~ 5 parts by weight of the composition. 3. A bonded magnet obtained by curing the composition according to claim 1 or 2.