JPH06151091A - High frequency power source matching device in plasma polymerizing device - Google Patents

Abstract

PURPOSE:To provide a high frequency power source matching device in plasma polymerizing device capable of smoothly and surely matching an impedance, preventing inconveniences such as generation of noise, simplifying and miniaturizing a matching equipment, and making the whole device compact. CONSTITUTION:According to the current of the reflected wave component measured by a mutual reactor LM, the electrostatic capacity of a variable type capacitor VC is controlled only in increasing direction by the current-carrying heating type shape memory alloy actuator (wire) SMW of a control mechanism S. The electrode load impedance is matched to the output impedance of a high frequency power source.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency power supply matching device capable of efficiently matching impedance when supplying high-frequency power for plasma generation to a hollow fiber plasma polymerization device.

[0002]

2. Description of the Related Art Generally, when a plasma polymerization apparatus of this kind is used for industrial production, it is necessary to increase the capacity of the apparatus and increase the number of electrodes in order to obtain a wide polymerization space. In a plasma generation high frequency power supply system corresponding to this, the output impedance of the power supply and the load impedance of each electrode must be efficiently matched.

[0003]

By the way, in the case of realizing a large capacity and a large number of electrodes of the above-mentioned device, simultaneous excitation with a plurality of power sources and a plurality of electrodes in the same polymerization container is necessary for the occurrence of interaction. It is practically impossible. Further, the adoption of a multi-terminal output type power supply device with a single oscillation source causes a large scale, which is disadvantageous in terms of cost. Moreover, the attachment of a conventional auto-matching device to the individual electrodes is very unreasonable in terms of structure and cost as a whole polymerization apparatus.

On the other hand, it is not practical to install the automatic matching device by connecting the electrodes in parallel to some extent without installing the distributor and mounting the automatic matching device. (1) It is practically difficult to supply electric power to each electrode evenly because each circuit including the electrode and the electric path must have a uniform impedance. (2) Since the conductor connecting between the respective electrodes becomes long, high frequency resistance and reactance increase, causing a decrease in efficiency, and leakage of high frequency causes a noise source of another control system. (3) Impedance matching becomes difficult because the impedance of the entire load decreases as parallel connection is made.
Also, in this case, since a high voltage is generated in the matching box,
The withstand voltage of the components must be high. (4) Since the matching box has a large capacity and low efficiency, a large amount of heat is generated and cooling measures are required.

The present invention has been made in view of the above circumstances. An object of the present invention is to smoothly and surely match impedances and to prevent problems such as noise generation. Another object of the present invention is to provide a high-frequency power supply matching device in a plasma polymerization device, which can simplify and downsize the matching device and downsize the entire device.

[0006]

In order to achieve the above object, the first aspect of the present invention is that a matching device is provided between a high frequency power source and an electrode, and by this matching device, an electrode load impedance at the time of superposition is obtained. A high frequency power source matching device in a plasma polymerization device for matching the output impedance of a high frequency power source, wherein the electrode load impedance at the time of the polymerization is measured in advance and has a limited adjustment range according to the measured value, and at the time of the polymerization. And an electrostatic capacity control means for controlling the electrostatic capacity only in the increasing direction according to the impedance change. According to a second aspect of the present invention, the capacitance control means comprises an electric heating type shape memory alloy actuator.

[0007]

According to the first aspect of the high frequency power source matching device in the plasma polymerization apparatus of the present invention, the electrostatic capacitance control means controls the electrostatic capacitance only in the increasing direction in accordance with the change in the electrode load impedance during superposition. By doing so, the electrode load impedance and the output impedance of the high frequency power supply are matched. In this case, the impedance on the matching box side at the matching point during polymerization (the relationship between the polymerization time and the impedance) is measured in advance, and the characteristic change of the electrode load corresponding to this is obtained in advance. Aim to be compact by specifying the constants of parts. Further, according to the second aspect of the present invention, the capacitance is increased and the impedance is matched by supplying a current to the electric heating type shape memory alloy actuator to heat the actuator.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a schematic block diagram showing an embodiment of the present invention, in which RF is a high frequency power supply device. A large number of matching devices IM are connected to the high-frequency power supply device RF via a coaxial cable (characteristic impedance of 50 ohms) CA and a fixed-type simplified distributor D. Each of these matching devices IM has two matching devices IM. Two electrodes EL are connected. As shown in FIG. 2, the electric circuit section of each matching unit IM has a capacitor (fixed type ceramic capacitor) connected to the input terminal IN side of the inductance coil L.
C1 and the output terminal OUT of the inductance coil L
A capacitor (fixed type ceramic capacitor) C2 and a variable type capacitor (varicon) VC connected to the side, a mutual reactor LM which is provided on the output side of the inductance coil L and detects a current of a reflected wave component, A resistor R11 connected to the reactor LM, a rectifier RE connected to the mutual reactor LM, a capacitor C11 connected to the rectifier RE, and a variable resistor VR.
1, a limit switch LMS connected to the variable terminal of the variable resistor VR1, a transistor TR having a base terminal connected to the limit switch LMS, and a resistor R12 connected to the emitter terminal of the transistor TR.
And the collector terminal of the transistor TR and the DC power source D
The control mechanism S is connected between C and C, and is composed of an electric heating type shape memory alloy actuator (wire) SMW of a control mechanism S that controls the variable capacitor VC. Then, as shown in FIGS. 3 and 4, the control mechanism S is in the energized heating type shape memory alloy actuator which is energized to be heated and contracted when a voltage is applied to the base terminal of the transistor TR. SMW, a pulley PU around which the electric heating type shape memory alloy actuator SMW is wound, and one end of the electric heating type shape memory alloy actuator SMW wound around the pulley PU and the electric heating type Spring SP pulling the actuator SMW made of shape memory alloy
And a ratchet mechanism RA that is connected to the pulley PU and rotates the variable capacitor VC in one direction.
And a lever LV that is connected to the ratchet mechanism RA and releases the function of the ratchet mechanism RA, and a cylinder CY that is connected to the lever LV and that is operated by the air flow AIR during the vacuum break of the polymerization container. The limit switch LMS detects the contraction of the energization heating type shape memory alloy actuator SMW, and therefore, the energization heating type shape memory alloy actuator SM is detected.
It is provided near W. Further, as shown in FIGS. 5 and 6, the matching unit IM and the electrode EL are arranged in aluminum cases C installed on the upper and lower portions of the polymerization container A, respectively. In FIG. 6, reference numeral DR is a door of the polymerization container A.

Since the hollow fiber plasma polymerization apparatus equipped with the high frequency power source matching apparatus configured as described above is a batch process, the variable capacitor VC is preliminarily set to have a capacitance of 0 at the start of polymerization. Capacitors C1 and C2
Set the capacity of. In this state, when the polymerization is started, the matching point moves with the passage of time and a reflected wave is generated. The reflected wave is detected by the mutual reactor LM, and a voltage is applied to the variable resistor VR1 via the rectifier RE. , This voltage is applied to the base terminal of the transistor TR via the limit switch LMS. As a result, the electric current heating type shape memory alloy actuator S from the DC power source DC
A current flows through the MW, the transistor TR, and the resistor R12, and the energization heating type shape memory alloy actuator SMW is energized and heated to contract against the biasing force of the spring SP. As a result, the pulley PU rotates in one direction, and the variable capacitor VC is rotated in the capacitance increasing direction via the ratchet mechanism RA. When the electric heating type shape memory alloy actuator SMW contracts, the limit switch LMS detects the contraction and stops applying the voltage to the base terminal of the transistor TR. Therefore, the electric heating type shape memory alloy actuator. The SMW returns to its original shape. At this time, the pulley PU rotates in the opposite direction to the above, but the variable capacitor VC holds its position by the ratchet mechanism RA. The above operation is repeated as long as the reflected wave is detected. Further, when one batch of the polymerization process is completed, the vacuum state of the polymerization container A is released, the air flow AIR at this time is supplied to the cylinder CY, and the ratchet mechanism RA is released via the lever LV to release the variable capacitor VC. Rotate in the opposite direction to return to the original position (reset).

In this way, the plasma polymerization of the hollow fiber is smoothly carried out. At this time, the capacitors C1 and C2
Can specify the load impedance of the electrode EL in advance, so that it can be a fixed type (conventional variable capacitor), and the variable type capacitor VC corrects the change in impedance during superposition (static. Since it is only necessary to control in the direction of increasing the capacitance), it is possible to simplify and miniaturize the matching device IM (in the past, a motor was used for position control of the variable capacitor, and preset and auto tuning were used together). I used a complicated control device).
Therefore, since the components can be downsized and reduced, the matching unit IM can be integrated into the electrode EL,
As shown in FIG. 6, all the devices except the high frequency power supply device RF can be incorporated in the polymerization device. Further, since all the devices except the high frequency power supply device RF can be incorporated in the polymerization device, the electric path after the matching unit IM can be shortened, and all of them are housed inside the electrode part (aluminum case C), and the reflected wave is kept. Since it was eliminated and the leakage of high frequency was prevented, the control system of the polymerization device was not disturbed.

[0012]

As described above, according to the first aspect of the present invention.
Is a high-frequency power supply matching device in a plasma polymerization apparatus in which a matching device is provided between a high-frequency power supply and an electrode, and the matching load matches the electrode load impedance during superposition and the output impedance of the high-frequency power supply. A matching device is provided between the electrode and the electrode, and the matching device matches the electrode load impedance during superposition with the output impedance of the high frequency power source. Impedance is measured in advance, which has a limited adjustment range according to the measured value, and is composed of a capacitance control means for controlling the capacitance only in the increasing direction according to the impedance change during polymerization. Therefore, according to the change of the electrode load impedance during the polymerization, the capacitance control means By controlling only the increasing direction, it is possible to smoothly and reliably align the output impedance of the electrode load impedance and a high frequency power source,
Besides being able to prevent problems such as the generation of noise,
The matching device can be simplified and downsized, and the entire device can be downsized. Further, according to claim 2 of the present invention, since the capacitance control means is composed of an electric heating type shape memory alloy actuator, a current is supplied to the electric heating type shape memory alloy actuator to heat the actuator. The capacitance can be easily increased to match the impedance.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

FIG. 2 is a circuit diagram showing an example of an electric circuit unit of a matching device.

FIG. 3 is a front view showing an example of a control mechanism section.

FIG. 4 is a side view of FIG.

FIG. 5 is an explanatory diagram of a matching unit.

FIG. 6 is an explanatory diagram of a polymerization container to which a matching unit is attached.

[Explanation of symbols]

RF High-frequency power supply device IM Matching device EL electrode VC Variable capacitor (varicon) LM Mutual reactor (measuring means) S Control mechanism (capacitance control means) SMW Electric heating type shape memory alloy actuator (wire) A Polymerization container

Claims (2)

[Claims] 1. A high frequency power supply matching device in a plasma polymerization apparatus, wherein a matching device is provided between a high frequency power supply and an electrode, and the matching device matches the electrode load impedance during polymerization and the output impedance of the high frequency power supply. Capacitance control in which the electrode load impedance during the polymerization is measured in advance, has a limited adjustment range according to the measured value, and the capacitance is controlled only in the increasing direction according to the impedance change during the polymerization. And a high-frequency power supply matching device in a plasma polymerization device. 2. The high frequency power source matching device in the plasma polymerization apparatus according to claim 1, wherein the capacitance control means is composed of an electric heating type shape memory alloy actuator.