JPH06143131A - Part carrier - Google Patents

Abstract

PURPOSE:To prolong the life of a part carrier by improving the abrasion- resistive strength and effectively prevent the contamination of a worked part by a part carrier. CONSTITUTION:A part carrier 8 is constituted so that a plurality of holding holes 5b for accommodating and holding a plurality of worked parts 4 one by one are formed on a carrier body 6, and the worked parts 4 are transported successively toward the working machine in the held state in the holding hole 5b, and the worked parts are transported after working. An abrasion-resistive layer 7 made of ceramics material is formed at least on the surface of the carrier body 6 including the inside surface of the holding hole 5b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component carrier for transporting a component to be machined in a processing machine such as a double-headed grinder, and in particular, it improves wear resistance strength of the component carrier to prolong its service life. The present invention relates to a component carrier that can effectively prevent contamination of a component to be processed by the carrier.

[0002]

2. Description of the Related Art Conventionally, a double-sided grinder 1 as shown in FIG. 3 has been widely used as an apparatus for continuously polishing the surfaces of many ceramics sintered body parts. This double-headed grinder 1 is a pair of disc-shaped disc wheels (grinding wheels) 2a, 2b arranged facing each other and rotating in opposite directions, and a disc-shaped disc wheel rotatably arranged between the disc wheels 2a, 2b. The component carrier 3 of FIG.

Many of the component carriers 3 are mainly made of iron-based metallic materials, and other materials are FRP.
There are various plastic materials such as (fiber reinforced plastic). The main body of the component carrier 3 is provided with a large number of holding holes 5 for accommodating and holding the workpiece (work) 4 along the circumferential direction of rotation.

The workpiece 4 housed in the holding hole 5 of the component carrier 3 is sequentially fed between the disc wheels 2a and 2b by the rotating operation of the component carrier 3 and, after undergoing a predetermined polishing process, further components. By the rotation of the carrier 3, the disc wheels 2a and 2b are continuously ejected.

[0005]

However, in the case of continuously polishing a workpiece made of a ceramic sintered body by using a conventional iron-based metal component carrier, the holding hole of the component carrier is high. Since the ceramic material having hardness is repeatedly contacted, wear progresses quickly, and the holding hole is deformed, which makes it difficult to hold the workpiece in a correct position. As a result, the processing accuracy of the parts to be machined deteriorates sharply and the product yield deteriorates, while it is necessary to constantly monitor the degree of deformation of the holding holes, and it is necessary to replace the deformed part carrier with high frequency. However, there was a problem that the maintenance management of the above became complicated and the operation efficiency was easily lowered.

Further, when the work part is made of a white ceramic material such as AlN or Al ₂ O ₃ , carrier constituents such as Fe adhere to the side surfaces of the work part to cause contamination, There is also a problem that the product yield is reduced.

Further, even when a component carrier is made of various plastic materials, there is a similar problem that the holding holes are rapidly worn.

The present invention has been made to solve the above-mentioned problems, and it is possible to improve wear resistance strength and prolong the life of the component carrier, while effectively preventing contamination of the component to be processed by the component carrier. The purpose is to provide.

[0009]

In order to achieve the above object, in the component carrier according to the present invention, a plurality of holding holes for accommodating and holding a plurality of workpieces one by one are formed in the carrier body. A wear-resistant layer made of a ceramic material is formed on the surface of the carrier body, including at least the inner surface of the holding hole, in a component carrier that sequentially carries the workpiece in the holding hole in the direction of the processing machine and then carries it out after processing. It is characterized by having done.

Since the carrier body is subjected to a high impact force during the carrying operation, the SS has a certain mechanical strength.
It is desirable to form it with a metal material such as 41, and its thickness is preferably about 0.8 to 2 mm. If the thickness of the carrier body is less than 0.8 mm, warping or deformation is likely to occur due to the heating operation when forming the wear resistant layer, which will be described later. This is because the effect of improving the holding accuracy of is small.

As the shape of the holding holes, as shown in FIG. 1, various shapes such as holding holes 5a and 5b having a circular cross section and holding holes 5c having a rectangular shape can be taken according to the shape and size of the workpiece.

As the ceramic material constituting the wear resistant layer, general-purpose oxides such as Al ₂ O ₃ and Si ₃ N ₄ ,
Any of non-oxide ceramics such as SiC and AlN may be used and is not particularly limited, but ceramic materials such as Si ₃ N ₄ , SiC, TiN and TiC which are easily formed by the plasma CVD method may be used. It is advisable to use one or a mixture of two or more materials.

The wear resistant layer made of the above ceramic material is P
Although it may be formed by a VD method or an electroless plating method, it is particularly preferable to form by a plasma CVD method (chemical vapor deposition method) in order to form a dense layer with excellent adhesion to the carrier body. In the plasma CVD method, the ceramic material forming the wear resistant layer is once decomposed into a gaseous substance by plasma, and the gaseous substance is transferred by an inert gas such as argon or a carrier gas such as nitrogen to a predetermined temperature (300 to 10).
It is a method of forming a thin film by depositing it on the surface of a base material such as a component carrier body heated to about 00 °. The thickness of the wear resistant layer is preferably set to 2 to 6 μm, depending on the CVD conditions. If the thickness is less than 2 μm, the wear-resistant layer is likely to have unevenness, and the wear resistance characteristics of the holding hole portion may be deteriorated. The effect of improving the property is small, and the processing time of CVD becomes long. In particular, when the thickness is 10 μm or more, the abrasion resistant layer is likely to peel off. Therefore, the thickness of the wear resistant layer is preferably set within the above range.

[0014]

According to the component carrier having the above structure, since the wear-resistant layer made of the ceramic material is formed on at least the inner surface of the holding hole, the hardness of the portion is greatly improved, and the wear resistance to the workpiece is improved. Abrasion is greatly improved. Further, since the holding hole is less worn or deformed, the machining accuracy of the component to be machined is increased, and the maintenance of the machining apparatus using the component carrier is facilitated.

Further, since the metal carrier body is coated with the wear resistant layer, it is possible to effectively prevent the metal components constituting the carrier body from being transferred to the work piece and causing contamination, thereby significantly increasing the product yield. Can be improved.

[0016]

An embodiment of the present invention will now be described with reference to the accompanying drawings.

Examples 1 to 3 The material is JIS standard structural steel (SS41), a carrier body 6 having a thickness of 1 mm and a diameter of 500 mm is prepared, and a predetermined interval is provided on the outer peripheral edge thereof as shown in FIG. Diameter 3
A 4.5 mm holding hole 5b was formed. Next, on the entire surface of the carrier body 6 including the inner surface of the holding hole 5b, the average thickness is 2 μm, 4 μm, and 1 by plasma CVD.
A wear resistant layer 7 made of Si ₃ N ₄ was formed so as to have a thickness of 0 μm, and component carriers 8 according to Examples 1 to 3 as shown in FIG. 2 were prepared.

Examples 4 to 6 Further, a carrier body 6 of JIS standard structural steel (SS41) having a thickness of 1 mm and a diameter of 500 mm is prepared, and a predetermined interval is provided on the outer peripheral edge thereof as shown in FIG. Then, a holding hole 5b having a diameter of 34 mm was formed. Next, on the entire surface of the carrier body 6 including the inner surface of the holding hole 5b, the average thickness is 2 μm, 4 μm, and 1 by plasma CVD.
The wear resistant layer 9 made of SiC is formed so as to have a thickness of 0 μm.
The component carrier 10 according to Examples 4 to 6 as shown in FIG.

Examples 7 to 9 According to the PVD method, the average thickness was 2 μm and 4 μm, respectively.
m and 10 μm, respectively, and the component carriers 10 according to Examples 7 to 9 having the same dimensions were prepared in the same manner as in Example 1 except that the wear-resistant layer made of Si ₃ N ₄ was formed.

Comparative Examples 1 and 2 On the other hand, as Comparative Example 1, Example 1 was performed without forming any wear resistant layer.
Similarly to the above, a component carrier was prepared using the carrier body with holding holes formed as it was. Further, as Comparative Example 2, a component carrier having the same dimensions was prepared by treating under the same conditions as in Example 1 except that the thickness of the wear resistant layer was 1 μm.

The above Examples 1 to 9 and Comparative Examples 1 to 1
The component carrier according to No. 2 is interposed between the disc wheels 2a and 2b of the double-headed grinder as shown in FIG.
A disk-shaped white aluminum nitride sintered body having a thickness of 2.5 mm and a thickness of 2.5 mm was sequentially loaded and subjected to polishing. Then, after polishing 1000 pieces of white aluminum nitride sintered bodies as the parts to be processed, the wear amount of the holding hole of each part carrier is measured and the average value is calculated, and the parts carrier is transferred to the part to be processed. The number of parts having one or more stain points was counted and the results shown in Table 1 below were obtained.

[0022]

[Table 1]

As is clear from the results shown in Table 1, according to Examples 1, 2, 4, 5, 7, and 8 in which the wear-resistant layer of Si ₃ N ₄ or SiC having a predetermined thickness was formed on the carrier body. Comparative Example 1 in which the component carrier does not form any wear resistant layer
It was confirmed that the wear amount of the holding hole was smaller than that of the component carrier and the durability was extremely excellent. It was also confirmed that since the constituent metal material of the carrier body is covered with the wear resistant layer, the metal component is less likely to be transferred and contaminated to the parts, and the manufacturing yield of the parts to be processed can be significantly improved. In the component carriers according to Examples 3, 6 and 9, the wear resistant layer was too thick and peeling occurred, and the number of contaminated components increased. Therefore, the thickness of the wear resistant layer is preferably set in the range of 2 to 6 μm.

On the other hand, in the component carrier of Comparative Example 2 in which the average thickness of the wear-resistant layer was set to 1 μm, the amount of wear of the holding holes was small, but the thickness of the wear-resistant layer was uneven, resulting in a partial structure. Since the metal material is exposed, it is impossible to completely prevent contamination.

[0025]

As described above, according to the component carrier of the present invention, since the wear resistant layer made of the ceramic material is formed at least on the inner surface of the holding hole, the hardness of the portion is significantly improved. However, the wear resistance of the work piece is significantly improved. Further, since the holding hole is less worn or deformed, the machining accuracy of the component to be machined is increased, and the maintenance of the machining apparatus using the component carrier is facilitated.

Further, since the metal carrier body is covered with the wear resistant layer, it is possible to effectively prevent the metal components constituting the carrier body from transferring to the parts to be processed and causing the contamination, thereby significantly increasing the product yield. Can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing the shape of an embodiment of a component carrier according to the present invention.

FIG. 2 is a sectional view taken along the line II-II in FIG.

FIG. 3 is a perspective view showing a polishing operation by a double-headed grinder using a component carrier.

[Explanation of symbols]

 1 Double-headed grinder 2a, 2b Disc wheel (grinding wheel) 3 Part carrier 4 Work piece (work) 5, 5a, 5b, 5c Holding hole 6 Carrier body 7 Wear resistant layer 8 Parts carrier 9 Wear resistant layer 10 Parts carrier

Claims (1)

[Claims] 1. A plurality of holding holes for accommodating and holding a plurality of workpieces, one by one, are formed in a carrier body, and the workpieces are sequentially conveyed in a state in which the workpieces are held in the holding holes, A component carrier which is carried out after processing, wherein a wear resistant layer made of a ceramic material is formed on the surface of the carrier body including at least the inner surface of the holding hole.