JPH0613143U - Vacuum tweezers - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a vacuum tweezers capable of reliably and quickly gripping a fine object such as a semiconductor wafer. A vacuum tweezers of the present invention is provided with a cylindrical main body 1 having a through hole 1b capable of vacuum suction and a tip end of the main body, and is inclined at 15 degrees or less with respect to the axis of the main body.
At least the adsorption area is provided with an adsorption portion 1a colored in dark color, and is configured to be able to grip an object by performing vacuum suction from the main body. The second vacuum tweezers of the present invention are detachably attached to the cylindrical body having a through hole capable of vacuum suction and detachably attached to the body so as to communicate with the through hole of the body. A gripping part that is tilted at an angle of 15 degrees or less with respect to the heart and that has at least a suction part whose suction area is colored in dark color at the tip, and grips an object with the tip of the gripping part by performing vacuum suction from the main body. It is configured to be able to.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a vacuum tweezers, and more particularly to a vacuum tweezers for gripping a fine and shock-resistant object such as a semiconductor wafer.

[0002]

[Prior art]

 Since semiconductor wafers are the starting material for semiconductor devices, their quality is extremely strict, and not only physical properties but also slight scratches on the surface, cloudiness and dust have a great influence on device performance and yield. Therefore, before shipping, the method of visually inspecting the surface condition of each sheet by illuminating it with a condenser lamp is adopted.

For this reason, a method of adsorbing the back surface of the semiconductor wafer and visually observing from the front surface side is adopted, and vacuum tweezers are used for this back surface adsorption (Actual No. 3-17632, No. 2-60247).

For inspection, semiconductor wafers are lined up in the container at intervals of several millimeters one by one, and all the wafers are taken out or extracted, and after visual inspection, they are put in another container or the same container in a dark room. It takes place in a close atmosphere. This visual inspection is performed with the illuminance of the condenser lamp set at about 500,000 lux so that even slight surface defects can be detected.

[0005]

[Problems to be solved by the device]

 By the way, the conventional vacuum tweezers were made of colorless and transparent synthetic resin, but because the illuminance is close to about 500,000 lux in the dark room in this way, the conventional colorless and transparent vacuum tweezers adsorb the back surface. Then, when the surface is illuminated, the part of the vacuum tweezers close to the suction surface is also illuminated at the same time, and light is diffusely reflected from the vacuum tweezers. Due to this diffuse reflection, a part of the semiconductor wafer also shines white, and if there are occasional surface defects in the shining part, the surface defects cannot be detected, and the wafer becomes defective. Sometimes it was shipped to the process.

Further, in the conventional vacuum tweezers, as shown in FIG. 4, since the inclination of the suction surface 11a with respect to the axis is more than 15 degrees, the wafers arranged in the container at intervals of several mm can be quickly removed. When the wafer is taken out and put in the container again after the inspection, the vacuum tweezers may contact the wall of the container or the next wafer, or the whole suction surface may not fall on the wafer and the wafer may drop. was there.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a vacuum tweezers that can reliably and quickly grip a fine object such as a semiconductor wafer.

[0008]

[Means for Solving the Problems]

 The vacuum tweezers of the present invention are provided with a cylindrical main body having a through hole capable of vacuum suction, and are arranged at the tip of the main body and are tilted by 15 degrees or less with respect to the axis of the main body, and have at least a suction area It is provided with a dark colored adsorption portion, and is configured to be able to grasp an object by performing vacuum suction from the main body.

A second vacuum tweezers of the present invention is detachably attached to a main body of a cylinder having a through hole capable of vacuum suction, and detachably attached to the main body so as to communicate with the through hole of the main body. The gripping part is provided with a suction part that is inclined at an angle of 15 degrees or less with respect to the axis of the main body and has at least a suction part whose suction area is colored in dark color at the tip, and by performing vacuum suction from the main body, the tip of the gripping part. It is configured to be able to grip an object.

[0010]

[Action]

 According to the above configuration, since the adsorption area is colored in dark color, there is no irregular reflection even when exposed to light with an illuminance of 500,000 lux, so even when a wafer is held, it does not shine white. Since it can be gripped, it is possible to perform a good inspection without missing surface defects such as semiconductor wafers.

Further, since the suction portion is tilted at an angle of 15 degrees or less, the semiconductor wafer can be favorably sucked during the work of taking it out of the container or putting it in the container, and it is possible to prevent the semiconductor wafer from falling due to a suction failure.

Further, according to the second aspect of the invention, since the main body is detachably attached to the suction portion, it can be replaced with one having a different inclination angle as required, which greatly simplifies the operation.

[0013]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 (a), 1 (b) and 1 (c), the vacuum tweezers according to the first embodiment of the present invention has a through hole 1b with a radius of 2 mmφ integrally formed of black acrylic resin. In the main body 1, there is provided a hollow cylindrical main body 1 having a diameter of 6 mm and a suction surface 1a inclined at an end of the main body 1 such that θ = 7 to 8 degrees with respect to the axis of the main body. It is adapted to be connected to a vacuum suction section (not shown) through a through hole 1b formed in the. The black color of the acrylic resin constituting the main body and the suction portion of the tip portion means that the lightness V according to JIS Z 8721 is 0. Here, FIGS. 1 (b) and 1 (c) are a sectional view taken along the line AA and a sectional view taken along the line BB in FIG. 1 (a).

As described above, according to the vacuum tweezers, the semiconductor wafer can be satisfactorily and surely sucked in the work of taking out or putting in the semiconductor wafer from the container, and the drop due to the suction failure can be prevented.

Further, since it is made of black acrylic resin, it does not undergo diffuse reflection even when exposed to light with an illuminance of 500,000 lux, and it can be reliably held without shining white in the vicinity of the wafer. Good inspection can be performed without overlooking surface defects.

Next, a second embodiment of the present invention will be described.

As shown in FIGS. 2 (a), 2 (b) and 2 (c), this vacuum tweezer is provided with a suction surface 2a which is inclined so that θ = 14 degrees with respect to the axial center at the tip. Also, a 6 mm diameter dark synthetic resin grip 2 having a through hole 2b with a radius of 2 mmφ and a male screw 2c formed at the other end and a male screw 2c is engaged with the female screw 3b. , And a main body 3 made of a colorless and transparent synthetic resin formed so that the through hole 3a communicates with the through hole 2b of the adsorption portion.

Then, it is adapted to be connected to a vacuum suction section (not shown) through a through hole 3 a formed in the main body section 3. Here, FIGS. 2B and 2C are a sectional view taken along the line AA and a sectional view taken along the line BB of FIG. 2A, respectively.

As described above, even with the vacuum tweezers of the first embodiment, the vacuum tweezers can perform good and reliable suction of the semiconductor wafer in the work of taking out or putting in the semiconductor wafer from the container. It is possible to prevent falling due to defects. Further, if a plurality of suction portions 2 at the tip are formed so that the inclination angles of the suction surfaces are different, and the suction portions 2 are replaced depending on the usage condition, that is, how closely the semiconductor wafers are arranged, it is easier to handle. Becomes

FIG. 3 is an explanatory diagram showing the whole including colors.

Although the main body 3 is made of colorless and transparent synthetic resin in the above embodiment, it goes without saying that other materials may be used. Further, regarding the material of the adsorption portion, the lightness V according to JIS Z8721 may be 4 or less, and the material is not limited to acrylic resin, and fluororesin or polyacetal resin may be used.

Further, it is needless to say that the suction portion is not limited to being screwed and may be attached by screwing the body or by another method such as fitting the body. .

Further, the suction surface is formed so as to be 15 degrees or less with respect to the axial center, but it is most preferable to be 7 degrees to 8 degrees.

[0025]

[Effect of device]

 As described above, according to the present invention, it is an object of the present invention to provide a vacuum tweezer which can suppress reflection and is easy to handle.

[Brief description of drawings]

FIG. 1 is a view showing a vacuum tweezers according to a first embodiment of the present invention.

FIG. 2 is a view showing a vacuum tweezers according to a second embodiment of the present invention.

FIG. 3 is a view showing a vacuum tweezers according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a conventional vacuum tweezers.

[Explanation of symbols]

 1 Main Body 1a Adsorption Surface 1b Through Hole 2 Grip 2a Adsorption Surface 2b Through Hole 2c Male Screw 3 Main Body 3b Female Screw 3a Through Hole

Claims (2)

[Scope of utility model registration request] 1. A cylindrical main body having a through hole capable of vacuum suction and a tip end of the main body, which is inclined at an angle of 15 degrees or less with respect to the axis of the main body, and at least the adsorption area is colored dark. Vacuum tweezers configured to hold an object by performing vacuum suction from the main body. 2. A cylindrical main body having a through hole capable of vacuum suction, and a body detachably attached to the main body so as to communicate with the through hole of the main body, and 15 degrees with respect to the axis of the main body. It has a gripping part that is inclined below and has at least a suction part whose suction area is colored in dark color at its tip, and is configured to be able to grip an object with the tip of the gripping part by performing vacuum suction from the main body. Vacuum tweezers characterized in that.